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Heat conducting adhesive tape and preparation method thereof

A technology of thermally conductive adhesives and tapes, applied in the direction of adhesives, non-polymer adhesive additives, film/sheet adhesives, etc. , to achieve the effect of easy large-scale mass production, convenient operation and excellent physical properties

Inactive Publication Date: 2014-10-08
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And graphite is conductive, which limits the application in insulating occasions
The thermally conductive tape has the function of heat conduction and bonding and fixing, and can completely replace mechanical fixing. The patented thermally conductive tape is only coated with thermal conductive adhesive on one side, and does not have the function of bonding and fixing, which further limits its application in electronic products.

Method used

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  • Heat conducting adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Pretreatment: Put 0.01mm thick aluminum foil in the pretreatment equipment for corona treatment for 40 minutes.

[0035] (2) Glue compounding: first dissolve 0.1 part of titanate coupling agent in 10 parts of toluene, add it to 100 parts of acrylic pressure-sensitive adhesive (solid content: 50% by weight, viscosity: 10000 cps), and stir for 5 minutes. Then, divide 200 parts of alumina (70% with a particle size of 5-15 μm and 30% with a particle size of 0.5-1 μm) into 3 parts, and add it to the acrylic pressure-sensitive In the glue solution, add once every 20 minutes. After all the thermal conductive fillers are added, stir for 10 minutes and add 1.5 parts of isocyanate, and then stir for 80 minutes;

[0036] (3) Coating: Put the corona-treated aluminum foil on the coating machine, apply glue on one side, and pass the temperature at a speed of 15m / min at 60°C, 70°C, 80°C, 90°C, 80°C, Dry in a six-section oven at 70°C to obtain a thermally conductive adhesive layer...

Embodiment 2

[0038] (1) Pretreatment: Put 0.05mm thick silver foil in the pretreatment equipment for ion source treatment, and the treatment time is 20min.

[0039] (2) Glue compounding: first dissolve 1.5 parts of titanate coupling agent in 4 parts of xylene, add them together to 100 parts of acrylic pressure-sensitive adhesive (solid content is 55% by weight, viscosity is 5000cps), and stir for 20 minutes . Then, divide 100 parts of aluminum nitride into 3 parts (70% of the particle size is 5-15μm, 30% of the particle size is 0.5-1μm), and add it to the acrylic press under the condition of constant stirring. In the sensitive glue solution, add once every 15 minutes. After all the thermal conductive fillers are added, stir for 5 minutes and add 0.1 part of tetraisopropoxytitanium, and then stir for 60 minutes;

[0040] (3) Coating: Put the silver foil treated by the ion source on the coating machine, apply glue on one side, and pass the temperature at 20m / min at a speed of 60°C, 70°C, 80...

Embodiment 3

[0042] (1) Pretreatment: Place the 0.03mm thick copper foil in the pretreatment equipment for plasma treatment, and the treatment time is 50min.

[0043] (2) Glue compounding: first dissolve 0.9 parts of titanate coupling agent in 5 parts of ethyl acetate, and add them to 100 parts of acrylic pressure-sensitive adhesive (solid content: 60% by weight, viscosity: 14000cps), stir 10min. Then divide 100 parts of alumina (particle size 5-15 μm, 70% by weight) and silicon carbide (particle size 0.5-1 μm, 30% by weight) into 3 parts, and keep stirring In the case of the acrylic pressure-sensitive adhesive solution, add it every 15 minutes. After all the thermal conductive fillers are added, stir for 15 minutes and add 0.8 parts of isocyanate and titanium tetraisopropoxide, and then stir for 100 minutes;

[0044] (3) Coating: Put the plasma-treated copper foil on the coating machine, apply glue on one side, and pass the temperature at a speed of 18m / min at 70°C, 80°C, 90°C, 100°C, 90°C...

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Abstract

The invention discloses a heat conducting adhesive tape and a preparation method thereof. The heat conducting adhesive tape adopts a metal foil as the substrate, the upper surface and the lower surface of the substrate are coated with a high performance heat conducting glue, and the outer layer of the heat conducting glue is release paper. The high performance heat conducting glue is composed of the following substances by weight part: 100 of an acrylic pressure-sensitive adhesive, 50-200 of a heat conducting filler, 0.1-1.5 of a coupling agent, 0.1-1.5 of a cross-linking agent, and 4-10 of a solvent. The preparation method includes the steps of pretreatment, glue preparation, coating, drying and the like. The heat conducting adhesive tape provided by the invention has the characteristics of good heat conducting uniformity, high heat conducting coefficient, high bonding strength, high temperature resistance and insulation, etc., and can be widely applied in bonding of LED, flexible circuit boards, microprocessors, printed circuit boards and the like with heat radiating devices.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to a thermally conductive adhesive tape, and also relates to a preparation method of the thermally conductive adhesive tape. Background technique [0002] With the development of science and technology, electronic components and logic circuits tend to be denser and miniaturized. There is an urgent need for materials with excellent comprehensive properties, which can not only reliably dissipate heat for electronic components, but also play the role of insulation and shock absorption. Good processing performance must be ensured. [0003] The traditional method to solve the heat dissipation of electronic components is to put a layer of insulating heat-conducting material between the heating body and the heat sink, such as mica, polytetrafluoroethylene, beryllium oxide ceramics, etc. This method has certain effects, but there are Poor thermal conductivity, poor me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00C09J11/04C09J11/06
Inventor 朱焰焰郭涵郑杰郭丽丽马苹苹张茂功
Owner TIANNUO PHOTOELECTRIC MATERIAL
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