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86 results about "Thermal adhesive" patented technology

Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

A glass insulating assembly

ActiveCN224532560ULow emissivityBuilding energy
The utility model relates to building energy -saving technical field solves the problem that traditional hollow glass depends on air layer heat insulation, but the heat conductivity coefficient is higher, and the energy -conserving effect is limited, and low emissivity coated glass needs to cooperate inert gas filling, and the process is complex and the durability is insufficient. Specifically, a glass heat insulation assembly, including outer glass, the front of outer glass is equipped with the snap -groove, the inside of snap -groove is provided with first adhesive layer, the front of first adhesive layer is provided with heat insulation assembly, the front of heat insulation assembly is provided with second adhesive layer, heat insulation assembly includes fixedly connected in first adhesive layer target flexible heat insulation core layer, the front of flexible heat insulation core layer is fixedly connected with reflection film layer, the front of second adhesive layer is fixedly installed with toughened glass, the outer surface of second adhesive layer is fixedly connected with first elastic heat conduction adhesive tape, the edge of outer glass is fixedly connected with second elastic heat conduction adhesive tape, and second elastic heat conduction adhesive tape is used for the edge of outer glass seal.
Owner:HEFEI OULIDA GLASS DECORATION CO LTD

A heating cigarette reconstituted tobacco low-temperature flavor-releasing heat-conducting adhesive and a preparation method thereof

The present application relates to a kind of heating cigarette reconstituted tobacco low-temperature flavor releasing heat-conducting glue and its preparation method, it is related to tobacco manufacturing technical field.Heat-conducting glue includes the following weight parts of component: low-temperature catalytic material 2~6 parts, heat-conducting filler 0.8~1.2 parts and matrix glue 100 parts;Wherein, low-temperature catalytic material is organic metal salt modified titanium-silicon molecular sieve, heat-conducting filler is silane coupling agent modified metal oxide powder.Low-temperature catalytic material can effectively catalyze tobacco aroma precursor material cracking in lower temperature range, significantly reduce the activation energy of aroma release, thereby improve aroma release efficiency, solve the problem of traditional reconstituted tobacco aroma release deficiency, tasteless.Using the metal oxide modified by silane coupling agent as heat-conducting filler, while improving the overall thermal conductivity of reconstituted tobacco, effectively reduce the interface thermal resistance between heat-conducting filler and tobacco matrix, make heat transfer more efficient and uniform, enhance the stability of smoke release.
Owner:CHINA TOBACCO SHANDONG IND

Compact unmanned aerial vehicle flight control board core component layout and efficient connection method

This invention discloses a compact UAV flight control board core component layout and efficient connection method, belonging to the field of UAV flight control design technology. The layout scheme centers on the main control module, achieving a radial and compact arrangement of various functional modules on a flight control board body with an area not exceeding 50cm²: sensor modules surround the main control module with a spacing not exceeding 5mm, power management and communication modules are diagonally distributed at the edges, and interface expansion modules are dispersed in the remaining edge areas. Independent digital and analog ground copper foils are provided, using single-point grounding. The connection method utilizes surface mount technology for direct soldering of core chips. The power link employs a tree topology and array filtering, while the signal link optimizes impedance matching and wiring. Connection detection and thermal adhesive reinforcement ensure reliability. This invention significantly reduces the size and weight of the flight control board, effectively reduces signal interference and transmission loss, improves connection stability and flight control accuracy, and is suitable for the needs of miniaturized UAVs.

A heat sink for electronic devices

This invention discloses a heat dissipation cover for electronic devices, relating to the field of thermal conductivity technology, and applicable to heat dissipation systems for high-power electronic devices. Addressing the problems of high sealing risk, complex installation, low thermal conductivity, and high maintenance costs associated with existing through-tube designs, the technical solution of this invention is as follows: the heat dissipation cover includes a plate-shaped body and a metal tube; the plate-shaped body has a first surface, a second surface, and a groove disposed on the first surface; the metal tube is fixed within the groove, with its inlet and outlet ends extending from the first surface; optionally, thermally conductive adhesive can be used to fill the gaps in the groove, or the tube body can be welded for sealing. The beneficial effects of this invention are: improved sealing reliability, optimized thermal conductivity, reduced manufacturing and maintenance costs, and adaptability to different equipment layout requirements.
Owner:YUANJU ELECTRON BEAM TECHNOLOGY (SHENZHEN) CO LTD

Sodium-ion battery structure and battery pack

This utility model belongs to the field of electrical component technology, specifically relating to a sodium-ion battery structure and battery pack. The sodium-ion battery structure includes a battery pack comprising a plurality of batteries arranged in an array, each battery being surrounded by a support sleeve. An upper limit cover is provided above the battery pack, and a lower limit cover is provided below the battery pack. Thermally conductive adhesive is filled between the support sleeves. Both the upper and lower limit covers have a plurality of first limiting grooves. When replacing the battery, the battery is removed from the support sleeve by removing the upper limit cover. This sodium-ion battery structure and battery pack, by using support sleeves, ensures that the thermally conductive adhesive adheres to each support sleeve, avoiding direct contact and adhesion between the battery and the thermally conductive adhesive. That is, when replacing the battery, only the upper limit cover needs to be removed first, and then the battery can be removed from the support sleeve to complete the replacement, eliminating the need to melt the thermally conductive adhesive, greatly improving the convenience of operation.
Owner:WUXI SHENGBAO VEHICLE MFG

Eco-friendly thermally conductive adhesive and method for producing same

A method of manufacturing an eco-friendly thermally conductive adhesive, includes: a first step of mixing zinc oxide and water to prepare an aqueous zinc oxide solution, and sequentially adding zinc acetate, water, urea, and a defoamer to the aqueous solution followed by stirring to prepare a first mixture; a second step of sequentially adding casein protein and a base aqueous solution to the first mixture followed by stirring to prepare a second mixture; a third step of adding ammonia water to the second mixture and then raising temperature followed by stirring to prepare a third mixture; and a fourth step of adding conductive graphite and a dispersant to the third mixture, followed by stirring and cooling.
Owner:FOUND OF SOONGSIL UNIV IND COOP

A thermally conductive adhesive fixing structure for chip packaging

This utility model relates to the field of chip processing technology and discloses a thermally conductive adhesive fixing structure for chip packaging, including a substrate: a chip body is mounted on the top of the substrate, a thermally conductive adhesive filling groove is formed on the top of the substrate, the chip body is placed inside the thermally conductive adhesive filling groove, four connecting plates are mounted on the top of the substrate, and elastic retaining rings are mounted on the top of the connecting plates, with the bottom end of the elastic retaining rings abutting against the top of the chip body. This thermally conductive adhesive fixing structure for chip packaging, through its ability to precisely fix the position of the chip body, forms a stable limiting structure when the thermally conductive adhesive contacts the chip body. This effectively prevents displacement such as shifting or sliding of the adhesive due to incomplete curing, fundamentally avoiding poor contact problems caused by adhesive displacement during packaging, and significantly improving the overall stability and long-term reliability of the chip body during packaging.
Owner:SHENZHEN SHISHIYUZHIYUAN TECHNOLOGY CO LTD

High-temperature-resistant heat-conducting rubber base

The utility model provides a kind of heat-conducting rubber base of high temperature resistance, it is related to heat-conducting rubber base technical field to solve the problem that the heat-conducting performance of heat-conducting rubber base is difficult to realize uniform conduction due to uneven internal heat source distribution of electronic equipment in actual application scene, especially in local high temperature area, heat cannot be effectively and quickly conducted out, leading to the problem of significantly reduced heat dissipation efficiency, including base layer. By equidistantly opening air-permeable groove in the inside of base layer, the air-permeable groove penetrates the side end of base layer, while facilitating heat dissipation of base layer itself, it can promote uniform conduction of heat in the base layer, effectively solve the problem of poor heat dissipation in local high temperature area of electronic equipment, improve overall heat dissipation efficiency, the heat dissipation grooves staggered on the top layer greatly increase the contact area with air, form more heat dissipation channels, further accelerate heat dissipation, ensure that heat can be quickly conducted out from high temperature area, realize more efficient and uniform heat dissipation effect.
Owner:JIAXING GUANGJIE PLASTIC IND CO LTD

A potting heat dissipation structure

The utility model relates to a heat dissipation technical field, concretely relates to a pouring and sealing heat dissipation structure. A pouring and sealing heat dissipation structure, include: shell, the shell upper end opening, the opening place forms the flanging, element, the element is placed in the shell, the upper surface of element with the opening of shell is flush, the clearance between element and shell pours into the heat conducting glue, top heat conducting pad, top heat conducting pad is bonded and fixed in the flanging, the lower surface of top heat conducting pad is bonded with the upper surface of element. The technical problem of increasing cost and weight of pouring and sealing heat dissipation mode in the prior art to put the magnetic piece completely in the complex structure mounting groove pouring and sealing needs a large number of heat conducting glue.
Owner:WANBANG DIGITAL ENERGY CO LTD

Two-component addition type silicone heat-conducting adhesive and preparation method thereof

PendingCN122381769APolymer sciencePtru catalyst
The application relates to the technical field of organic technical materials, in particular to a two-component addition type silicone heat-conducting adhesive and a preparation method thereof. The two-component addition type silicone heat-conducting adhesive comprises an A component and a B component; the A component comprises composite vinyl silicone oil, end-modified vinyl silicone oil, first heat-conducting powder, third heat-conducting powder, flame-retardant powder and a catalyst; the B component comprises composite vinyl silicone oil, end-modified vinyl silicone oil, second heat-conducting powder, third heat-conducting powder, flame-retardant powder, boron nitride, a polymerization inhibitor and hydrogen-containing silicone oil; the first heat-conducting powder, the second heat-conducting powder and the third heat-conducting powder are respectively selected from at least one of spherical alumina and modified spherical alumina for compounding. The flame-retardant powder is selected from at least one of aluminum hydroxide and magnesium hydroxide. The base material adopted in the application is composite vinyl silicone oil and trimethoxy end-modified vinyl silicone oil, the capacity of containing the heat-conducting powder is increased, and the heat-conducting performance is effectively improved.
Owner:SHENZHEN YOURONG NEW MATERIAL TECH CO LTD

Circuit board heat dissipation assembly, preparation method thereof and energy storage system

ActiveCN122121047ASmall reboundReduced risk of deformationPrinted circuit detailsCell component detailsThermodynamicsLiquid state
The present application relates to the technical field of energy storage, in particular to a circuit board heat dissipation assembly, a preparation method thereof, and an energy storage system, the circuit board heat dissipation assembly comprising a circuit board, a frame, a heat-conducting glue, and a functional component; the circuit board has a heat dissipation area and a connecting area, and the connecting area is arranged around the heat dissipation area; the frame is formed with a heat dissipation cavity; the functional component covers a first open end of the heat dissipation cavity, the circuit board is arranged in the frame through the connecting area to cover a second open end of the heat dissipation cavity, and the heat dissipation area is communicated with the heat dissipation cavity; the heat dissipation area is provided with a glue pouring hole and a glue overflow hole communicated with the heat dissipation cavity; the heat-conducting glue is configured to be injected into the heat dissipation cavity through the glue pouring hole when in a liquid state and solidified, and the heat-conducting glue is fixed to the heat dissipation area and the functional component, respectively. Through the arrangement of the frame and the heat-conducting glue, a heat conduction path is formed between the circuit board and the functional component, heat generated by the circuit board or the functional component can be efficiently conducted and dissipated through the heat-conducting glue, and the operation reliability of the circuit board and the functional component is ensured.
Owner:SHENZHEN POWEROAK NEWENER CO LTD

Manufacturing method of display device frame heat dissipation with composite heat conduction structure

The application relates to a display device frame heat dissipation manufacturing method with a composite heat conduction structure and relates to the technical field of display device frame preparation. S1, frame pretreatment, a micron-level roughening layer is formed through a sand blasting machine; S2, a first heat conduction glue layer is grid-coated on the roughening layer and is semi-cured; S3, a composite heat conduction film composed of a graphene heat conduction layer, a three-dimensional carbon / metal composite wave absorption layer and a carbon fiber heat conduction layer is attached and is heat-pressed and cured; S4, a second heat conduction glue layer is secondarily grid-coated on the surface of the composite heat conduction film, and part of the surface is exposed; S5, frame assembly, the exposed part of the composite heat conduction film is directly contacted with a heating element, the second heat conduction glue layer provides adhesion, and a double direct contact heat conduction channel is formed. The application has the effects of low interface thermal resistance, high heat dissipation efficiency, electromagnetic shielding function, high sand material recycling rate, complete dust separation and high manufacturing process integration.
Owner:FUJIAN FUDA PRECISION TECH CO LTD

Camera temperature control device and system

This utility model relates to the field of semiconductor technology and discloses a camera temperature regulation device and system. The device includes: a cooling plate, a heat sink, a cooling chip, and a temperature sensor. The cooling plate is connected to an industrial camera. One side of the cooling chip is attached to the cooling plate with thermally conductive adhesive, and the other side of the cooling chip is attached to the heat sink. One end of the temperature sensor is installed in the cooling plate. When the industrial camera is working, its temperature rises, and the temperature is conducted to the cooling plate. The temperature sensor transmits the temperature measurement signal to a host computer, so that the host computer powers on the cooling chip. The side of the cooling chip attached to the cooling plate generates a low temperature, absorbing the heat on the cooling plate, thereby reducing the temperature of the industrial camera, thus reducing the camera's operating temperature and improving detection performance.
Owner:WUHAN LUOBO SEMICON TECH CO LTD

Anti-shatter PTC heater

The utility model is suitable for PTC heater technical field provides a kind of anti-cracking PTC heater, including PTC ceramic chip;Buffer layer is located in PTC ceramic chip periphery;Protective housing;Wherein, protective housing includes: outer protective layer, intermediate layer and inner heat conduction layer;Buffer layer includes: first elastic sheet, shock-absorbing spring group and second elastic sheet;The device utilizes elastic buffer layer, corrugated radiating fin, aluminium corrugated thin plate radiating fin and three layers of protective layer, synergic enhancement structure protection and heat management, effectively absorb mechanical stress, strengthen heat dissipation efficiency, and form gradient protection system, significantly improve the reliability and stability of chip under complex working conditions;On the other hand, copper foil and conductive foam composite electromagnetic shielding layer of protective housing inner side wall block electromagnetic interference, combined with the elastic heat-conducting glue bonding and fixing of second elastic sheet and protective housing inner wall, realize efficient heat conduction and real-time accurate monitoring, provide electromagnetic shielding and state monitoring double protection for chip safe operation.
Owner:YANGZHOU ASPRIANT ELECTRIC CO LTD

High-temperature-resistant power supply hybrid circuit module

This invention belongs to the field of oil and gas exploration and development technology, specifically relating to a high-temperature resistant power supply hybrid circuit module. It includes a housing, a modularly assembled power supply encapsulated within the housing, and a first thermally conductive adhesive. The modularly assembled power supply includes a motherboard and multiple thick-film encapsulated power modules connected to the motherboard. Each thick-film encapsulated power module is encapsulated with a second thermally conductive adhesive. This invention's hybrid circuit module, on the one hand, is small in size and can provide power to logging instruments with various voltages; on the other hand, it has the advantage of rapid heat conduction, enabling effective heat dissipation at high temperatures of 175℃ to 200℃, ensuring reliable and stable power output, and has a long service life.
Owner:CHINA NAT PETROLEUM CORP +1

Drip-proof flame-retardant film and method for manufacturing the same

The application discloses a kind of drip-proof flame-retardant films and its manufacturing method, belong to plastic film field.The drip-proof flame-retardant film includes: composite flame-retardant polyester film base film, at least one surface of the base film is equipped with thermal adhesive layer;The thermal adhesive layer is made of low-melting-point polyester material, the melting point of the low-melting-point polyester material is lower than 150 DEG C;The base film contains flame-retardant component;In the surface of the thermal adhesive layer, there is incombustible fiber layer.The flow ability of molten polyester film is limited under the physical hindering effect of incombustible fiber layer, and the occurrence of dripping phenomenon is effectively prevented.Experimental data show that when fiber length is greater than or equal to 8mm and the amount of addition is greater than or equal to 10 cm / cm 2 , no dripping can be achieved.The phosphorus flame retardant compounded in the base film can effectively inhibit combustion, and the physical barrier effect of the incombustible fiber layer can make the film reach a high flame-retardant grade.
Owner:ZHEJIANG YONGSHENG FILM TECH CO LTD

Display module and display device

The application provides a display module and a display device. The display module comprises a display panel and a heat dissipation structure. The heat dissipation structure comprises a first heat-conducting adhesive layer, a heat-conducting layer, a second heat-conducting adhesive layer and a heat dissipation layer which are stacked in sequence. The side of the first heat-conducting adhesive layer away from the heat-conducting layer is bonded to the back side of the display panel. The heat dissipation structure is provided with a heat-conducting block which penetrates the first heat-conducting adhesive layer, the heat-conducting layer and the second heat-conducting adhesive layer in sequence along a first direction. The first direction is perpendicular to the panel surface of the display panel, and the first direction is the direction in which the second heat-conducting adhesive layer points to the first heat-conducting adhesive layer. The heat can be rapidly diffused, the temperature rise of the display module is reduced, and the service life of the display screen is prolonged.
Owner:BOE TECHNOLOGY GROUP CO LTD +1

Prefabricated road pavement energy storage system

This invention belongs to the field of energy storage technology and provides a prefabricated road surface energy storage system, including several battery modules, a thermal management system, and an electrical connection system. The battery modules are disposed at the lower end of the road base layer and include two battery layers and a liquid-cooled plate layer located in the middle of the battery layers. The liquid-cooled plate layer includes a liquid-cooled plate with cooling liquid channels inside. The thermal management system includes thermally conductive adhesive connecting layers between the upper battery layer and the upper surface of the liquid-cooled plate, and between the lower battery layer and the lower surface of the liquid-cooled plate. The electrical connection system includes intra-layer busbars, inter-layer busbars, and outgoing busbars, connecting the individual battery cells of the two battery layers in series into a continuous link. Each end face of the entire battery module is equipped with an end plate, and the upper end plate is provided with an elastic element. An energy storage shell is provided on the outside of the end plate. This invention improves the feasibility and promotional value of prefabricated road surface energy storage systems in practical engineering.
Owner:SHANDONG UNIV

A three-axis moving mechanism for PCBA glue injection

ActiveCN224463103Uwell mixedFully quantitative glue applicationThermal adhesiveMechanical engineering
The application discloses a three-axis moving mechanism for PCBA glue injection, which comprises a moving assembly, a fixed end of the moving assembly being connected to a work station, a movable end of the moving assembly being configured to move a glue injection assembly to a coordinate position of a workpiece calibration; the glue injection assembly is connected to the moving assembly, an output end of the glue injection assembly being configured to carry out glue injection at the coordinate position of the workpiece calibration; a glue pusher assembly, a fixed end of the glue pusher assembly being connected to the moving assembly, an output end of the glue pusher assembly being connected to an input end of the glue injection assembly. The problems of low precision of manual glue injection, insufficient mixing of two-component heat-conducting glue and inaccurate control of glue injection amount in the prior art are solved, the technical effects of accurate mixing of two-component glue and quantitative glue injection are realized, and the position precision of workpiece glue injection is also improved, so that the production efficiency and product quality are significantly improved.
Owner:SHAANXI TLD ELECTRONICS & TECH CO LTD

PTC ceramic heating assembly with superhigh temperature resistance and preparation method thereof

ActiveCN116156684BUltrahigh temperature ceramicsThermal adhesive
The application relates to a super-high-temperature-resistant PTC ceramic heating assembly and a preparation method thereof. The super-high-temperature-resistant PTC ceramic heating assembly comprises a PTC ceramic column with a groove structure, a first metal electrode layer, a high-temperature-resistant wire, a second metal electrode layer for filling the groove structure and an anti-oxidation layer which are sequentially distributed on the surface of the groove structure of the PTC ceramic column; the super-high-temperature-resistant PTC ceramic heating assembly further comprises an outer shell and insulating heat-conducting glue which is distributed between the outer shell and the PTC ceramic column with the groove structure.
Owner:SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI

Temperature detection device and temperature detection system

This application provides a temperature detection device and a temperature detection system. The device includes: a first cover and a second cover, which together form a receiving space. The first cover is a portion close to the skin, and the second cover is a portion away from the skin. A first circuit board is disposed within the receiving space. A temperature detection device is disposed on the side of the first circuit board near the first cover and connected to the first circuit board. A metal bracket is disposed on the same side of the first circuit board as the temperature detection device and is thermally connected to the temperature detection device. Thermally conductive adhesive is filled in the gap between the first cover and the first circuit board and is in contact with at least a portion of the metal bracket. The temperature detection device and temperature detection system provided by this application can reduce the thermal resistance on the heat conduction path.
Owner:HUAWEI DEVICE CO LTD

A dense bus duct

The utility model discloses a kind of intensive bus ducts, including mounting frame, baffle and conducting plate, the mounting frame inner wall is filled with insulating heat-conducting adhesive, multiple baffles are fixedly installed in the insulating heat-conducting adhesive, conducting plate is fixedly installed in the baffle, the mounting frame left and right side and front and back side are respectively fixedly connected with first connecting plate and second connecting plate, the mounting frame front and back end is provided with heat dissipation structure, the bottom wall outside of the mounting frame is provided with equidistant auxiliary groove.The intensive bus duct, by insulating heat-conducting adhesive, the heat conduction performance of conducting baffle can be improved while inhibiting the eddy current generated by bus, to improve the transmission efficiency and service life of bus duct, by heat dissipation structure and hollow through groove, improve heat dissipation effect, further improve the transmission efficiency and service life of bus duct, by auxiliary groove, prevent hanger rod slip, increase the contact area of hanger rod and bus duct simultaneously, to improve overall stability.
Owner:NANJING DAQO ELECTRIC CO LTD

Multilayer structure high-efficiency filtration self-sterilization isolation gown

This invention discloses a multi-layered, high-efficiency filtering, self-sterilizing isolation gown, relating to the field of medical protective technology. It includes an isolation gown and a corrugated filter layer. The outermost layer of the isolation gown is a splash-proof layer, which is connected to the corrugated filter layer via an inner first thermal adhesive. A conductive carbon mesh is disposed between the corrugated filter layer and the splash-proof layer. The inner side of the corrugated filter layer is connected to a skin-friendly layer via a second thermal adhesive. A heat-absorbing layer and a moisture-absorbing layer are respectively disposed at the top and bottom of the splash-proof layer, the corrugated filter layer, and the skin-friendly layer. This invention, by incorporating the splash-proof layer, the corrugated filter layer, the skin-friendly layer, the conductive carbon mesh, the heat-absorbing layer, and the moisture-absorbing layer, achieves high-efficiency filtration, active sterilization, and static electricity elimination. The splash-proof layer and the corrugated filter layer perform graded filtration; the conductive carbon mesh eliminates static electricity and enhances interception; the corrugated filter layer eliminates microorganisms; and the heat-absorbing layer and the moisture-absorbing layer absorb heat and condensate through guiding grooves, improving the protective performance and wearing comfort of the isolation gown.
Owner:HAIAN MEDIGAUZE CO LTD

Thermal runaway protection material capable of rapidly absorbing heat and preparation method for thermal runaway protection material

PendingUS20260188789A1GraphiteThermal adhesive
A thermal runaway protection material capable of rapidly absorbing heat is provided. The material is of a laminated structure and sequentially includes a flame-retardant graphite heat-conducting film, heat-conducting glue, a high-heat-conductivity heat-absorbing material, heat-conducting glue and a flame-retardant graphite heat-conducting film from bottom to top. Peripheral side surfaces of the laminated structure are packaged by means of edge sealing glue. A preparation method for the thermal runaway protection material includes the following steps: brushing an upper surface and a lower surface of the high-heat-conductivity heat-absorbing material with the heat-conducting glue, then covering the heat-conducting glue on the two surfaces with the flame-retardant graphite heat-conducting films, performing flattening by means of a mold, after curing at a room temperature, cutting the high-heat-conductivity heat-absorbing material into a specified size, then brushing side surfaces with the edge sealing glue, and obtaining the thermal runaway protection material after drying.
Owner:YANGTZE OPTICAL THERMAL-CONTROL TECHNOLOGY CO LTD

A battery and an electric device

PendingCN122091862Aimprove securityImprove location reliabilitySecondary cellsThermodynamicsElectrical battery
This invention relates to the field of energy storage devices and discloses a battery and electrical equipment, including a battery housing, a cell assembly, a heat exchanger connecting the cell assembly terminals, a temperature regulating plate, and an enclosure assembly. The cell assembly is housed within the battery housing. The temperature regulating plate is mounted on one side of the cell assembly terminals, and thermally conductive adhesive is disposed between the temperature regulating plate and the heat exchanger. A set of enclosure assemblies surrounds at least one row of heat exchangers and forms a potting cavity with the cell assembly. At least one temperature regulating plate passes through the potting cavity. The structural adhesive poured into the potting cavity covers the top of the temperature regulating plate. The battery and electrical equipment of this invention can effectively improve the flatness of the battery's top cooling structure and effectively prevent condensation from forming on the top of the battery, preventing risks such as short circuits and leakage, and improving battery safety.
Owner:JIANGSU ZENIO NEW ENERGY BATTERY TECH CO LTD

A multi-segment spliced ​​metal heat sink

ActiveCN224439502UStable deliveryspeed up importInterference fitHeat stability
This utility model discloses a multi-segment spliced ​​metal heat sink, comprising multiple detachably connected metal heat sink segments. Each metal heat sink segment includes a main substrate and heat dissipation fins vertically disposed on the surface of the main substrate. Adjacent metal heat sink segments are connected by a convex-concave mating structure. The convex-concave mating structure includes a boss at the rear end of the preceding metal heat sink segment and a groove at the front end of the following metal heat sink segment. The boss and the groove form an interference fit. The contact surface between the boss and the groove is coated with a thermally conductive adhesive layer with a thickness of 0.05-0.2mm. The multi-segment detachable design allows for flexible combination of lengths to adapt to different needs, saves space during transportation, and reduces costs by requiring only the replacement of damaged segments during maintenance. The convex-concave mating structure combined with the thermally conductive adhesive layer, along with the snap-fit ​​mechanism working in tandem with the convex-concave structure, reinforces the connection from the vertical direction, preventing loosening due to vibration and ensuring stable heat dissipation.
Owner:DONGGUAN CHUNKE HARDWARE ELECTRONICS CO LTD