The invention discloses a
polyimide adhesive based on cooperation of double dynamic bonds and a preparation method thereof,
hydrogen bonds, dynamic disulfide bonds and flexible molecular chain segments are introduced into
polyimide through copolymerization of fluorinated dianhydride and two different diamines, and the obtained high-molecular-weight dynamic
polyimide adhesive is adjustable in rigidity and flexibility, and has the advantages of high-molecular-weight dynamic polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide and the like. Meanwhile, the
glass transition temperature is high (the maximum Tg is 265.4 DEG C), and the self-repairing capacity and the low-boiling-point
organic solvent rapid dissolving and recycling capacity are achieved. In addition, the
adhesive has excellent
tensile shear strength (as high as 12.54 MPa). Preferably,
graphene (GNP) is added into the double-dynamic polyimide matrix for ultrasonic mixing, and the polyimide-based heat-conducting adhesive is prepared through thermal imidization. When the content of GNP is 7.5 wt%, the in-plane heat
conductivity coefficient of the material is 3.32 W / (mK), and the
tensile shear strength of the heat-conducting adhesive can reach 8.49 MPa, so that the heat-conducting adhesive can be comparable with a high-performance commercial heat-conducting adhesive, and can be used as a reusable adhesive between
heat management material interfaces.