890 results about "Thermal adhesive" patented technology

The utility model provides a battery cell, battery pack and vehicle relates to automobile battery field, said battery cell includes shell, cover plate, pole core, pole post and heat conducting glue, pole core is provided in the shell, pole core is close to the end of cover plate and is equipped with pole ear, one end of pole post passes through cover plate and is connected with pole ear, the clearance between pole core and cover plate is filled with heat conducting glue, and the heat conducting glue is filled with heat conducting glue. And the heat-conducting glue is in contact with the pole and / or the tab, and is in contact with the cover plate and / or the shell. The heat-conducting glue is filled at the end part, close to the cover plate, of the pole core, namely the end part, provided with the pole lug, of the pole core, and the gap between the shell and the cover plate, so that heat generated by the pole lug and / or the pole column can be quickly transferred to the shell and / or the cover plate through the heat-conducting glue in the working process of the battery cell until reaching the external environment; the heat dissipation effect of the end part of the battery cell in the length direction is improved, the overall temperature difference of the battery cell is smaller, the performance of the battery cell is improved, and the service life of the battery cell is prolonged.

The invention relates to the technical field of defect detection, in particular to a heat-conducting adhesive tape defect detection method and system based on machine vision, and the method comprises the following steps: obtaining a surface image of a heat-conducting adhesive tape, extracting a texture trend and marking an aggregation block, adjusting the trend and offset of a connecting line segment, and analyzing the angle change of a sideband node. And recognizing a skeleton trend reverse section and closing a boundary, and extracting a continuous direction changing region to obtain a defect structure image annotation layer. According to the method, the turning position in the sideband region is extracted by constructing the direction aggregation graph of the texture aggregation block, enhancing the direction identification of the direction of the regional texture, combining the grouping organization and coordinate offset processing of the line segment path, enhancing the continuous association of the image structure, and by means of the repeated distribution characteristic of the angle mutation node; and through a skeleton trend reverse paragraph and boundary closing mode, an identification range of a structure disturbance block is expanded, and coherent tracking and multi-level labeling of a structure abnormal region are completed by combining a spatial relationship between a contour trend difference and a turning point.

The invention relates to an eddy current heating device for a thermoluminescence element and a heating method. The device comprises a heating disc, a copper coil assembly, a supporting frame, a temperature measuring sensor assembly and a control circuit, the heating disc is in a disc shape, and the copper coil assembly is composed of four multi-layer closely-wound fan-shaped copper coils which are arranged in four quadrant areas of the heating disc respectively; the temperature measuring sensor assembly is provided with four temperature sensors which are embedded into the bottom of the heating disc through heat-conducting glue and connected with the control circuit. The control circuit adopts a PID (Proportion Integration Differentiation) algorithm to independently adjust the current of each sector according to feedback signals of each temperature sensor, realizes rapid temperature rise and accurate temperature control through frequency adjustment and power compensation, and has an over-temperature protection function. According to the device, the temperature of the heating disc can be raised to 300 DEG C within 3 seconds, and the temperature deviation is controlled within + / -0.5 DEG C. Compared with traditional resistance heating, the device has the advantages of being fast in temperature rise, low in energy consumption, high in temperature uniformity, convenient to maintain and the like, and meets the high-precision temperature control requirement of thermoluminescence measuring and reading equipment.

The invention discloses a 3D multi-core chip dual-channel heat dissipation device based on TSV adapter plate flip-chip bonding. The 3D multi-core chip dual-channel heat dissipation device comprises a manifold micro-channel module, a multi-chip assembly, heat-conducting glue and a shell. The manifold micro-channel module comprises an upper cover plate, a manifold substrate and a micro-channel plate from top to bottom; the multi-chip assembly is packaged by flip-chip bonding and comprises a multi-core chip with a plurality of hot spot areas, a TSV adapter plate and a uniform heat source chip. According to the invention, the manifold micro-channel module with a mixed structure is adopted, the flow path and the pump work can be reduced, the multi-core chip with a plurality of hot spot areas can be effectively cooled, meanwhile, the micro-channels are directly etched on the TSV adapter plate, the contact thermal resistance is reduced, the embedded cooling is realized, the heat dissipation efficiency of the vertical interconnection chip is greatly improved, and the service life of the vertical interconnection chip is prolonged. The double heat dissipation channels solve the problem that the heat dissipation of the 3D multi-core chip packaged by flip chip bonding based on the TSV adapter plate is difficult.

The utility model discloses a single battery and a battery pack. The single battery comprises a core bag, a shell, electrodes and first heat-conducting glue, specifically, the shell comprises a shell sleeve and a cover plate, the core bag is contained in the shell sleeve, and the cover plate and the shell sleeve are connected to cover and seal the shell sleeve; the electrode comprises a pole and a pin which are electrically connected with each other, the pole is arranged on the cover plate, and one end, far away from the pole, of the pin extends to the length direction of the core package and is electrically connected with the core package; and the first heat-conducting glue is arranged between the pins and the inner surface of the shell sleeve. According to the single battery disclosed by the utility model, the heat of the core package can be quickly transferred to the shell through the first heat-conducting glue and then dissipated to the environment, so that the thermal runaway risk of the single battery is smaller.

The embodiment of the invention provides a battery shell, a preparation method and a battery, and relates to the technical field of batteries. The battery shell comprises a shell and an insulating heat-conducting coating coated in the shell, wherein the insulating heat-conducting coating consists of an insulating heat-conducting glue material and a high-heat-conductivity material. Through the insulating heat-conducting coating, the temperature rise in the rapid charging process of the battery is effectively reduced, electrolyte decomposition and safety risks caused by high temperature are prevented, and the heat management capability, the cycle performance and the safety of the battery are improved.

The invention relates to a liquid-cooled electronic water pump which is characterized in that a waterproof sleeve and a waterproof sleeve sealing ring are respectively arranged on a stator assembly and a pump body, the waterproof sleeve and the pump body are welded into a whole through plastic welding to form a pump body assembly, a rotor assembly and a wear-resistant gasket are sequentially arranged on a fixed shaft of the pump body assembly, and a pump head sealing ring is sleeved on the outer edge of a spigot of the waterproof sleeve; then the pump head and the pump body are welded into a whole through plastic welding to form a water pump assembly, a heat dissipation metal plate sealing ring and a heat dissipation metal plate are installed on the water pump assembly and sealed through the sealing ring to form a water pump assembly assembly, heat conduction glue is coated on the surface of the heat dissipation metal plate, and a driver assembly is placed on the heat conduction glue; the driver assembly is fixed to the water pump assembly combined part through screws, and meanwhile the pump body, the rear cover, the motor leading-out PIN and the plug PIN are welded into a whole to form the liquid-cooled electronic water pump. The effects of miniaturization, high performance, low cost and long service life of the electronic water pump are achieved, and the cooling requirements of various electronic devices in the high-temperature environment are met.

The utility model relates to the field of direct current guns, and discloses an air-cooled direct current gun, which comprises a main shell, a stop piece is fixed in the main shell, two DC terminals are fixedly inserted on the stop piece, a barrier plate is fixed on one side of the stop piece, a plurality of heat dissipation plates are fixed on the stop piece, and the heat dissipation plates are fixed on the stop piece. The DC terminals are arranged in the main shell, the heat dissipation plates are arranged in the main shell, sealing heat-conducting glue is filled between the DC terminals and the heat dissipation plates, the heat dissipation plates are distributed on the stop piece at equal intervals, a sliding folded plate is detachably arranged on the main shell, a heat dissipation fan is arranged in the sliding folded plate and located under the heat dissipation plates, and the heat dissipation plates are arranged in the sliding folded plate. And a plurality of ventilation holes are formed in the surface of the main shell. According to the utility model, the temperature of the DC terminal is increased along with charging, heat is transmitted to the heat dissipation plates through the heat-conducting glue, airflow generated when the heat dissipation fan works passes through the plurality of heat dissipation plates, the heat can be dissipated into the air, and the heat dissipation fan circulates all the time, so that the effect of cooling the DC terminal can be improved.

The invention relates to the technical field of electronic device assembly, and discloses a heat-conducting colloid evaluation method, device and equipment, a storage medium and a program product, and the method comprises the steps: carrying out the finite element modeling of a target heat-conducting colloid after the target heat-conducting colloid is determined, and obtaining an assembly model of the target heat-conducting colloid; performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target heat-conducting colloid; and determining whether the target heat-conducting colloid meets a preset design requirement or not according to the assembly response. By performing finite element simulation analysis on the heat-conducting colloid, whether the uniformity design of the heat-conducting colloid is reasonable or not can be quickly, efficiently, accurately and reliably determined in the initial stage of design, and adjustment is performed in time when the uniformity design is unreasonable, so that the optimal scheme is selected during assembly, the quality problem of later test verification is avoided, and the production efficiency is improved. And the problems of over-high temperature and serious thermal failure caused by non-uniform distribution of the heat-conducting colloid due to deformation of the heat-conducting colloid are effectively solved.

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a chip module and a heat dissipation piece, the chip module and the heat dissipation piece are stacked and arranged on the circuit board, the chip module and the circuit board are conducted through a solder ball, and the heat dissipation piece is in heat conduction connection with the chip module; the circuit board assembly further comprises heat-conducting glue and a heat-conducting piece, in the plane direction of the circuit board, a part of the heat-conducting glue is filled in the gap between the chip module and the circuit board and makes contact with the solder balls, the other part of the heat-conducting glue is located outside the chip module, and the heat-conducting piece extends in the thickness direction of the circuit board and makes contact with the solder balls. The heat-conducting piece is used for being in heat-conducting connection with the heat-dissipating piece and the other part of the heat-conducting glue. According to the circuit board assembly, through contact between the solder balls and the heat-conducting glue and contact between the heat-conducting glue and the heat-conducting piece, heat-conducting connection between the chip module and the heat-dissipating piece is achieved, thermal resistance between the chip module and the heat-dissipating piece is reduced through the heat-conducting piece and the heat-conducting glue, and therefore the heat-dissipating efficiency of the circuit board assembly is improved.

The invention relates to the technical field of chip packaging, and discloses a double-core stacked substrate packaging method, which comprises the following steps of: S100, arranging a plurality of preset positions on the top surface of a packaging substrate, and arranging a plurality of conductive connecting columns and outer circuits electrically connected with the conductive connecting columns on the peripheral sides of the preset positions; s200, mounting a first chip at the preset position on the top surface of the packaging substrate, wherein the first chip is electrically connected with the outer-layer circuit; s300, arranging heat-conducting glue on the top surface of the first chip; s400, a second chip is mounted on the top face of the heat-conducting glue, the bottom face of the second chip abuts against the conductive connecting columns, and the second chip is in signal conduction with the first chip through the conductive connecting columns and the outer layer circuit; and S500, filling the mounting areas of the first chip and the second chip with a plastic package member to complete packaging. The heat-conducting glue in the designed structure can absorb redundant heat and balance heat generated by the two chips, and the chips are prevented from being damaged due to heat accumulation.

The invention relates to a battery cell heat-conducting glue dosage verification tool and verification method, and the tool comprises a tool body, two ends of which are fixedly connected with a butt joint end used for butt joint with a battery pack box body cross beam; the verification plate is connected to the bottom of the tool body and is movably arranged in a first direction close to or far away from the tool body, and the area of the plate surface, far away from the tool body, of the verification plate is consistent with the bottom area of the battery cell; the driving assembly is connected to the tool body and comprises a driving part and a transmission part, and the driving part is in transmission connection with the verification plate through the transmission part so as to drive the verification plate to be close to or away from the tool body in the first direction through the driving part; and the identification piece is arranged on the tool body and is used for displaying the size of the distance between the verification plate and the tool body. When the tool body is placed in the battery pack box body, the driving assembly is used for adjusting the size of the gap between the verification plate and the cold plate in the battery pack box body, so that the accuracy of glue amount verification through glue coating is ensured, and finally the verification method is ensured to be carried out smoothly.

The utility model relates to the technical field of tire labels, in particular to a tire RFID label which comprises a shell and a flexible circuit board, the flexible circuit board is installed inside the shell, an antenna is fixedly connected to the upper surface of the flexible circuit board, a chip is fixedly connected to the upper surface of the antenna, heat-conducting glue is attached to the upper surface of the flexible circuit board, and the heat-conducting glue is attached to the lower surface of the flexible circuit board. A positioning frame is installed on the inner wall of the shell, the positioning frame is in contact with the upper surface of the flexible circuit board, a square hole is formed in the surface of the heat-conducting glue, the inner wall, located in the square hole, of the heat-conducting glue is fixedly connected with a protective cover, and the protective cover is connected with the surface of the chip in a sleeving mode. According to the utility model, the heat-conducting glue, the positioning frame, the protective cover and the buffer pad are arranged, so that the protection performance of the label on the internal structure is improved, the problem that the internal structure is easily damaged by external force due to the fact that the number of label protection structures is small is reduced, and the service life of the label is further prolonged.

The invention relates to a chip packaging structure and a packaging method thereof, and relates to the technical field of chip packaging, the chip packaging structure comprises a packaging substrate, a metal shell and a chip body; the packaging substrate is fixedly connected with the metal shell through a structural adhesive to form a packaging cavity; the chip body is located in the packaging cavity, the chip body is arranged on the upper surface of the packaging substrate, and the upper surface of the chip body is connected with the metal shell through heat-conducting glue; the packaging method comprises the following steps: providing a packaging substrate; arranging a chip body on the upper surface of the packaging substrate, and welding the chip body by using vacuum welding equipment; and coating heat-conducting glue on the upper surface of the chip body, coating structural glue on the packaging substrate, and covering a metal shell to complete chip packaging. According to the invention, the electromagnetic shielding effect is realized on the basis of chip miniaturization.

The invention provides a flexible packaging process of an AM glass-based small-spacing display screen, which comprises the following steps: substrate pretreatment: carrying out ultrasonic cleaning for 5 minutes by using a mixed solution of deionized water and isopropyl alcohol in a volume ratio of 3: 1 at 45-55 DEG C, washing for 2 minutes by using deionized water, drying, and activating the surface of the substrate by using plasma; transferring a large amount of LED chips: aligning the LED chips, transferring the LED chips to a preset position of the activated substrate, and fixing the LED chips on the substrate; coating high-thermal-conductivity packaging glue: carrying out plasma cleaning and 120 DEG C baking dehumidification on the substrate on which the chip is fixed, and then directionally coating the high-thermal-conductivity glue; curing the high-thermal-conductivity glue, namely pre-curing the substrate coated with the high-thermal-conductivity glue and then carrying out stepped curing; and optical film lamination: performing quantum dot film lamination and anti-reflection layer spraying on the surface of the cured substrate. The heat-conducting glue with polyurethane modified epoxy resin and AlN / BN / carbon fiber composite filler is adopted, so that the heat-conducting effect is effectively improved, and the service life of an LED is prolonged.

The invention relates to the technical field of fire-fighting unmanned aerial vehicles, and discloses a high-temperature-resistant closed space operation fire-fighting unmanned aerial vehicle with an active cooling system, the high-temperature-resistant closed space operation fire-fighting unmanned aerial vehicle comprises a shell, the interior of the shell is fixedly connected with an electronic element, the shell comprises an aluminum-plated film and porous vacuum silicon, the aluminum-plated film is located on the outer layer of the shell, and the porous vacuum silicon is located on the outer layer of the shell. The porous vacuum silicon is located on the inner layer of the shell, insulating heat-conducting glue is arranged between the porous vacuum silicon and the electronic element, the heat dissipation assembly dissipates heat of the electronic element in the shell through a coolant, a communication assembly is arranged in the shell, the communication assembly comprises an optical fiber, and the optical fiber is arranged in the shell. The outer wall of the optical fiber is fixedly connected to the interior of the shell, and the optical fiber is in communication connection with an electronic element in the shell. The aluminum-plated film and the porous vacuum silicon are matched with the insulating heat-conducting glue to achieve efficient heat insulation, the coolant is matched for heat dissipation, the service life of electronic elements is prolonged, data are transmitted through the optical fiber, and the communication stability is improved.

The invention belongs to the field of PCBs (printed circuit boards), and provides a PCB material with high heat dissipation performance and a preparation method thereof.The PCB material adopts a multi-layer composite structure design and comprises a circuit board layer, a heat conduction insulating layer, a metal bottom layer, a silica gel-based heat conduction glue layer, a heat dissipation layer and heat dissipation fins, wherein the heat conduction insulating layer is a polyimide composite material in which hexagonal boron nitride nanosheets are oriented in parallel, and the heat dissipation layer is formed by coating an aluminum nitride reinforced aluminum-based composite material with a titanium nitride transition layer and is integrally die-cast with the heat dissipation fins. Through key technologies such as surface modified boron nitride nanosheet suction filtration orientation, polyamide acid dipping curing, heat dissipation assembly preparation through a coating-in-situ nitriding-die casting process and overall hot pressing assembly, the excellent heat conduction performance of the heat conduction insulating layer in the plane direction is achieved; the problems of low heat dissipation efficiency, poor device reliability and the like caused by insufficient heat-conducting property and insulating property of a traditional PCB material are solved, and the material has wide application value.

A thermally conductive curable composition is dispensable to form a thin film and subsequently B-staged to reduce the flowability and to thereby prevent overflow of the composition during the die attach process. The thermally conductive curable composition includes a matrix precursor that is curable at a cure temperature, a thermally conductive particulate filler, and an organic solvent or solvent mixture. The thermally conductive particulate filler is sinterable at a sintering temperature that is equal to or lower than the cure temperature, and the organic solvent or solvent mixture has a flash point temperature equal to or less than 200 oC.

A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

The invention relates to the technical field of electronic heat dissipation, in particular to heat-conducting pouring sealant and electrical equipment, the heat-conducting pouring sealant comprises a heat-conducting framework and heat-conducting glue, the heat-conducting framework is composed of a plurality of heat-conducting fibers, and the heat-conducting glue is filled in the heat-conducting framework. In the heat-conducting pouring sealant, the heat-conducting framework is composed of the plurality of heat-conducting fibers, the plurality of heat-conducting fibers are mutually staggered and contacted to form the heat-conducting channel, and compared with a traditional spherical powder heat-conducting filler, the heat-conducting channel formed by the heat-conducting fibers is larger in space and lower in heat resistance, so that the heat-conducting property of the heat-conducting pouring sealant is more favorably improved; besides, the space of a heat transfer channel formed by the heat-conducting fibers is larger, so that the fluidity of the heat-conducting glue during potting is better, the narrow space is easier to caulk, the hardness of the cured heat-conducting potting glue is lower, the resistance is smaller when the heat-conducting potting glue is detached (taken out of the shell), the heat-conducting potting glue is easier to detach, and the maintenance convenience of the electrical equipment can be improved.

The present invention relates to the technical field of solar encapsulation films, and provides a heat-conductive composite encapsulation film and a photovoltaic module. The heat-conductive composite encapsulation film is a composite encapsulation film after pre-crosslinking treatment, comprising a phase-change heat storage adhesive layer in contact with a solar cell sheet, a nano silver wire layer, and a heat-conductive adhesive layer in contact with a photovoltaic back plate or a front plate; the phase-change heat storage adhesive layer comprises a first resin and a phase-change heat storage material, the phase-change heat storage material is a paraffin microcapsule, and the addition amount thereof is 20-30% of the mass of the first resin; the heat-conductive adhesive layer comprises a second resin and a heat-conductive material, and the addition amount of the heat-conductive material is 10%-30% of the mass of the second resin; the first resin and the second resin are both EVA resins. The heat-conductive composite encapsulation film can effectively avoid the problems of reduced insulation and wet leakage performance and delamination caused by existing adhesive films in photovoltaic modules, and the heat storage and rapid heat conduction performance are effectively improved, and efficient cooling can be achieved, thereby improving the power generation and reliability of photovoltaic modules.

The invention relates to a flexible high-thermal-conductivity graphite cold chain which comprises a graphene film laminated body and two metal terminals arranged at the two ends of the graphene film laminated body, and the part, fixed by the metal terminals, of the graphene film laminated body is a rigid section of the graphene film laminated body. The part, which is positioned between the two metal terminals and is not fixed, of the graphene film laminated body is a flexible section of the graphene film laminated body; and the flexible section of the graphene film laminated body is wrapped with a polyimide film. A glue filling groove is formed in the metal terminal; and heat-conducting glue is filled between the metal terminal and the rigid section of the graphene film laminated body. According to the invention, the high-thermal-conductivity graphene film and the metal terminal are compounded by filling the assembly gap with the heat-conducting glue, so that the contact thermal resistance of the edge of the laminated graphite film and the metal terminal is greatly reduced, and the heat transfer path in the thickness direction of the graphite cold chain is improved, thereby achieving the effect of improving the heat-conducting property of the graphite cold chain.

The invention discloses a thermal insulation photovoltaic-thermoelectric coupling system for severe cold areas, which comprises a photovoltaic cell, a phase change container, a phase change material and a thermoelectric power generation sheet, and is characterized in that the phase change container filled with the phase change material and the thermoelectric power generation sheet are sequentially arranged below the photovoltaic cell; the bottom of the photovoltaic cell is connected with the upper side of the phase change container through heat-conducting glue, the lower side of the phase change container is connected with the thermoelectric power generation sheet through heat-conducting glue, phase change materials in the phase change container utilize and transfer heat generated by the photovoltaic cell in the whole process, the effect of keeping and slightly increasing the temperature of the photovoltaic panel is achieved, and meanwhile large heat flow input is provided for the hot end of the thermoelectric sheet. Effective utilization of solar energy is ensured through the two effects, and the conversion efficiency of the coupling system is improved. In addition, the cold ends of the thermoelectric pieces make contact with the external environment, waste heat is dissipated into the cold environment through convection and radiation heat dissipation, and thermoelectric conversion is maintained.

The invention relates to the technical field of thermal conductive materials, in particular to a graphene aluminum vapor chamber and a preparation method thereof. The graphene aluminum vapor chamber comprises a graphene layer and an aluminum layer, and the graphene layer and the aluminum layer are connected through heat-conducting glue. The preparation method of the heat-conducting adhesive comprises the following steps: adding a matrix material and a curing agent into an organic solvent, and uniformly stirring and mixing to obtain an adhesive matrix; modifying the heat-conducting filler system to obtain a modified heat-conducting filler system; and adding the modified heat-conducting filler system into the adhesive matrix, and uniformly stirring and mixing to obtain the heat-conducting adhesive. The problems of complex preparation process and high production cost of the graphene aluminum composite material can be solved.

The present invention relates to the field of circuit boards, and more specifically, to a method for preparing a flexible aluminum PCB substrate material that can be arbitrarily bent and shaped. The flexible aluminum PCB substrate prepared by the present invention has an ingenious and rational structural design. The aluminum plate and copper foil are combined using a thermally conductive adhesive, resulting in excellent flexibility, resistance to breakage, and the ability to bend arbitrarily, meeting the diverse shapes and all-round lighting requirements of LED lamps. Furthermore, heat generated by the LED lamp is rapidly transferred to the aluminum substrate via the thermally conductive adhesive and then dissipated from the aluminum substrate, thereby achieving rapid heat dissipation and achieving excellent heat dissipation effects.

The utility model belongs to the technical field of automobile motor controllers, and particularly relates to a silicon carbide module packaging structure, a motor controller and an automobile. According to the silicon carbide module packaging structure, the first active metal welding ceramic substrate is arranged on the upper side of the silicon carbide module, and the second active metal welding ceramic substrate is arranged on the lower side of the silicon carbide module; wherein the first active metal welding ceramic substrate and the second active metal welding ceramic substrate can be directly sintered through an active brazing process and then are directly arranged in the silicon carbide module through a simple filling process and the like, namely, the similar thermal process modes such as heat-conducting glue or solder welding when a copper substrate is arranged are not needed; therefore, the process installation requirement is reduced; meanwhile, the water cooling unit is further arranged, heat dissipation can be conducted on the heat conduction part on the lower side, and therefore the heat dissipation amount of the silicon carbide module is increased.

The present application discloses a module pressing device and a pressing method therefor. The module pressing device is provided with a pressing workstation for maintaining pressure on a battery module, the bottom of which is bonded to a heat dissipation plate. The module pressing device comprises a conveying line, a pressing apparatus, and a control apparatus. The conveying line passes through the pressing workstation and is used for conveying the battery module. The pressing apparatus is arranged corresponding to the pressing workstation, and comprises a jacking mechanism and a pressing mechanism opposite to each other in a first direction. The jacking mechanism is provided with a plurality of jacking portions movable in the first direction. The plurality of jacking portions are arranged in a second direction and are used to jack up the heat dissipation plate. The pressing mechanism is used to tightly press the battery module. The control apparatus is electrically connected to the jacking mechanism and the pressing mechanism, so as to control the jacking mechanism and the pressing mechanism to act. The heat dissipation plate is supported by means of the jacking mechanism, which cooperates with the pressing mechanism applying pressure to the battery module, so that thermally conductive adhesive coated between the heat dissipation plate and the battery module is evenly spread by means of pressing, thereby mitigating uneven coating of the thermally conductive adhesive and improving the heat dissipation capability of the battery module.

The utility model relates to the technical field of adhesive tape production, which comprises a power assembly and is characterized in that the power assembly is fixedly connected to a machine shell, the power assembly is fixedly connected with a cutting assembly and a cutting board assembly, the cutting assembly is arranged above the cutting board assembly, the cutting assembly and the cutting board assembly are arranged in a matched mode, and the cutting board assembly is arranged on the machine shell. A conveying assembly fixedly connected to the machine shell is arranged outside the cutting board assembly. The cutting-off assembly and the cutting board assembly are fixedly connected through the power assembly, the cutting-off assembly is arranged above the cutting board assembly, the cutting-off assembly and the cutting board assembly are arranged in a matched mode, the cutting-off assembly and the cutting board assembly are driven by the power assembly, and after a transmission sleeve and a rotating roller rotate by a circle, a cutter is embedded into a notch. And the time that the cutter and the notch rotate by one circle is equal to the time that the adhesive tape passes through, so that the packaging efficiency of the adhesive tape is effectively improved, and manual operation is not needed.

The invention discloses a polyimide adhesive based on cooperation of double dynamic bonds and a preparation method thereof, hydrogen bonds, dynamic disulfide bonds and flexible molecular chain segments are introduced into polyimide through copolymerization of fluorinated dianhydride and two different diamines, and the obtained high-molecular-weight dynamic polyimide adhesive is adjustable in rigidity and flexibility, and has the advantages of high-molecular-weight dynamic polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide, high-molecular-weight polyimide and the like. Meanwhile, the glass transition temperature is high (the maximum Tg is 265.4 DEG C), and the self-repairing capacity and the low-boiling-point organic solvent rapid dissolving and recycling capacity are achieved. In addition, the adhesive has excellent tensile shear strength (as high as 12.54 MPa). Preferably, graphene (GNP) is added into the double-dynamic polyimide matrix for ultrasonic mixing, and the polyimide-based heat-conducting adhesive is prepared through thermal imidization. When the content of GNP is 7.5 wt%, the in-plane heat conductivity coefficient of the material is 3.32 W / (mK), and the tensile shear strength of the heat-conducting adhesive can reach 8.49 MPa, so that the heat-conducting adhesive can be comparable with a high-performance commercial heat-conducting adhesive, and can be used as a reusable adhesive between heat management material interfaces.

The invention discloses post-curing-free platinum catalyst original glue which comprises the following components in parts by mass: 5-60 parts of an organosilicon polymer, 0.1-5 parts of a platinum catalyst, 40-65 parts of mesoporous alumina, 0.2-3 parts of an antioxidant, 0.5-8 parts of an anti-settling agent, 0.03-6 parts of a dispersing agent and 3-10 parts of a solvent. The post-curing-free platinum catalyst raw rubber disclosed by the invention is excellent in oxidation resistance and good in dispersity and compatibility in an organosilicon heat-conducting adhesive formula, the modulus and rebound resilience of the material in a high-temperature long-term aging process are kept stable, and a post-curing phenomenon hardly occurs when the post-curing-free platinum catalyst raw rubber is applied to a heat-conducting adhesive formula containing a large amount of heat-conducting filler; the application requirements of high stability and high reliability of the heat-conducting glue are met.