High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film

Abstract

The invention relates to a high head conduction metal foil layer / graphene metal mixing layer composite heat radiation film. The high heat conduction metal foil layer / graphene metal mixed layer composite heat radiation film comprises a graphene metal mixed layer, a metal foil layer, a heat-conducting glue layer and a base layer; the metal foil layer is arranged between the graphene metal mixed layer and the heat-conducting glue layer; and the heat-conducting glue layer is arranged between the metal foil layer and the base layer. The high heat conduction metal foil layer / graphene metal mixing layer composite heat radiation film adopts graphene-and-metal-particle mixed slurry as a high heat-conducting layer, uses more effective heat conduction between the graphene and the metal particles, and provides a thermal interface having good heat radiation. The heat-conducting layer is adhered to the metal foil layer, the heat-conducting glue layer and the base layer to form a vertical heat-conducting effect, solves a problem that a traditional heat radiation product is low in efficiency, and can be widely applied to products having high heat productivity like an electronic device, a liquid crystal display screen, etc.

Description

technical field [0001] The invention relates to the application field of heat dissipation materials, in particular to a composite heat dissipation film with a high thermal conductivity metal foil layer / graphene metal mixed layer. Background technique [0002] With the rapid development of modern science and technology, the miniaturization of electronic devices is developing rapidly. In particular, the components on electronic circuit boards are becoming more and more dense. With the development of thinning trend, the surface temperature of electronic products is also rising, and research shows that the failure mode of most electronic equipment is caused by excessive temperature, so the heat dissipation problem of electronic devices plays a pivotal role in the development of electronic devices . [0003] At present, some products in the market use metals as heat conduction and heat dissipation materials, especially copper and aluminum are widely used. The thermal conductivit...

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Problems solved by technology

[0003] At present, some products in the market use metals as heat conduction and heat dissipation materials, especially copper and aluminum are widely used. The thermal conductivity of copper is 398W / mk, and the thermal conductivity of aluminum is 237W / mk. However, choosing metal materials for heat conduction has a large weight , easy to oxidize and other issues

Graphene is currently the thinnest and hardest nanomaterial with a thermal conductivity as high as 5300W / mk. Its excellent performance has attracted widespread attention. However, the current production process of graphene is only controlled by a few companies as technical secrets, and the price is high. On the other hand, when producing graphene heat dissipation film, its thickness and number of layers need to be strictly controlled, and the produced graphene heat dissipation film needs to be uniform in thickness. At present, the production process is still difficult to achieve perfect results.

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