281 results about "Copper metal" patented technology

The metasurface array antenna housing comprises a plurality of array units of the same structure, each array unit sequentially comprises a first lightning protection layer from top to bottom, and each first lightning protection layer comprises four copper metal cylinders and a lightning protection top layer drainage metal patch; the second metasurface wave absorbing and transmitting layer comprises a first dielectric substrate, and four quasi-rectangular patches, four lumped resistors, four quasi-triangular patches and four quasi-square rings which are arranged on the upper surface of the first dielectric substrate; the third metasurface wave-transparent layer comprises a square metal patch, and a first circular ring and a second circular ring are etched on the square metal patch. Lightning is guided to the third metasurface wave-transparent layer through the first lightning protection layer, the lightning is conducted to other areas through the metal patch, damage of the lightning to the antenna housing is effectively avoided, and the antenna housing can directly replace a lightning protection strip for use; the structural size is greatly reduced, the angle stability is improved, and integration is facilitated; the copper-clad surface of the third metasurface wave-transparent layer can be used as a metal back plate of the second metasurface wave-absorbing layer, and structural multiplexing is achieved.

The invention relates to the technical field of etching liquid, in particular to a copper metal etching liquid composition. Comprising the following components in percentage by weight: 5-10% of hydrogen peroxide, 0.1-0.3% of a first fluorine source, 1-5% of first inorganic acid, 1-5% of alkali, 0.01-0.8% of a first metal corrosion inhibitor and the balance of deionized water; and the auxiliary agent comprises 2-8% of a second fluorine source, 10-55% of second inorganic acid, 0.1-2% of a second metal corrosion inhibitor and the balance of deionized water. The etching liquid is excellent in etching effect, CD-loss reaches 0.6-0.8 [mu] m, the slope angle reaches 40-50 degrees, the highest copper load reaches 20000 ppm, and meanwhile the problem that when copper is high, due to the fact that the nitric acid concentration is too high, metal etching is abnormal is solved.

An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.

Microbial activity can be mitigated or prevented by applying an antimicrobial article to an object to inhibit the transfer of microbial life from the object to anyone thereafter touching the object. The antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface, which catalytic ink pattern comprises multiple unconnected features; and a pattern of electrolessly plated copper metal of unconnected copper metal features that is disposed in registration with the catalytic ink pattern. This antimicrobial article exhibits a sheet resistivity of more than 1,000 ohms / □ as determined using a four-point probe and a source meter.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a prefabricated branch fireproof cable with a copper metal shell and a preparation method of the prefabricated branch fireproof cable. The prefabricated branch fireproof cable comprises a copper metal main shell, the bottom of the copper metal main shell is communicated with a copper metal sub-shell, a main cable is installed in the copper metal main shell, and a branch cable is installed in the copper metal sub-shell; the main cable and the branch cable both adopt copper core conductors, and copper has high conductivity, so that resistance in a current transmission process can be reduced, electric energy loss can be reduced, electric energy transmission efficiency can be improved, and stable and efficient transmission of electric power to each electric device can be ensured; the nanoscale magnesium oxide insulation powder filled in the copper metal main shell and the copper metal branch shell has excellent insulation performance, can effectively isolate electrical connection between the main cable and the branch cable and the external environment and between the main cable and the branch cable and other conductors, prevents electric leakage and short circuit accidents, and improves the electrical safety of a cable system.

The invention relates to the technical field of wastewater treatment, and discloses an electrochemical device and a treatment method of high-concentration organic wastewater. The electrochemical device includes a reaction vessel, and an anode, a cathode, and a particle electrode disposed within the reaction vessel, at least one of the anode and the cathode including a first electrode layer, a second electrode layer, and a metal layer disposed between the first electrode layer and the second electrode layer. Wherein the metal layer contains a metal and b metal, the a metal is copper, and the b metal is selected from at least one of iron, nickel and zinc. When the electrochemical device is used for treating high-concentration organic wastewater, the ammonia nitrogen content and the COD content of effluent can be effectively reduced.

The invention discloses a photosensitive type copper metal organic framework material Cu-MOF, a composite xerogel material thereof, a preparation method and application. According to the invention, a Cu-MOF composite xerogel (Cu-MOF (at) XG) material is utilized to assemble a friction nano generator (TENG), the influence of Cu-MOF (at) XG with different doping proportions on the output performance of the TENG is explored, and meanwhile, the influence of the Cu-MOF (at) XG material with the doping proportion of 10% on the output performance of the TENG under different wave band light (red light (630-640 nm), blue light (460-465 nm), purple light (380-390 nm) and white light (390-780 nm) is explored. An ultra-sensitive wearable self-powered ultraviolet sensor system is constructed by selecting a Cu-MOF (at) XG-TENG device, self power supply is realized by pressing the sensor, accurate identification of ultraviolet intensity in a special environment is realized by comparing output signals, and communication with the outside is realized by displaying an output Morse code communication signal.

Solid powder and an organic carrier are matched according to the mass ratio of (82-86): (14-18), silver powder and titanium dihydride powder which form the solid powder are matched according to the mass ratio of 96: 4, and a solvent, a thickening agent and a dispersing agent which form the organic carrier are matched according to the mass ratio of (91-95): (2-6): (1-5). According to the Ag-Ti soldering paste, silver powder and titanium dihydride powder serve as solid phases and are matched with a specific organic carrier, by optimizing the rheological property and the vacuum brazing technology, TiH2 is decomposed to generate active Ti atoms, the active Ti atoms react with AlN ceramic to generate a continuous TiN reaction layer, and high-strength and low-defect connection of an AlN ceramic base material and an oxygen-free copper metal copper layer is achieved; a traditional Cu element is abandoned in a soldering paste system, generation of a brittle phase is avoided, and the reliability of a connector under the extreme working condition is improved; when applied to preparation of the ceramic copper-clad plate, the film has the advantages of strong silk-screen printing adaptability, uniform film thickness and low voidage.

An intermediate article has a non-electrically conductive substrate having first and second opposing surfaces; and a catalytic ink disposed as a pattern of half-tone dots on at least the first opposing surface. Copper metal can be plated on the pattern of catalytic ink to provide a copper metal pattern that have antimicrobial properties. The resulting antimicrobial article can then be applied to various surfaces to mitigate the spread of infectious agents from one person to another.

The invention discloses copper metal foam and a preparation method of the copper metal foam, the copper metal foam comprises a copper-based supporting body and foamy copper supported by the supporting body, and the copper-based supporting body comprises at least one of a copper net and a copper foil. In the application, the copper-based support body is arranged to provide support for the foamy copper, so that the strength of the copper metal foam can be improved while the lightweight of the material is met, a new-generation multifunctional material solution is provided for the fields of new energy, 5G communication and the like, and the copper metal foam is suitable for the fields of new energy battery current collectors, electromagnetic shielding devices, environment-friendly catalytic carriers and the like.

The invention discloses a copper metal complex and a preparation method thereof. The copper metal complex is prepared by mixing copper powder and refractory metal powder, adding a dispersing agent and graphite and carrying out compression and vacuum sintering. The outer layer of the complex structure is copper foil, the inner layer is uniform alloy powder, the complex structure can be used as intermediate alloy for subsequent smelting, the smelting temperature is remarkably reduced, element oxidation is inhibited, and the component uniformity is improved; the method is suitable for preparing the copper-based complexes of various high-melting-point and easily-oxidized elements.

A non-electrically antimicrobial conductive article can be prepared by: A) providing a non-electrically conductive substrate with first and second opposing surfaces; B) disposing a pattern of a catalytic ink, having unconnected features, on the first opposing surface of the non-electrically conductive substrate, and drying, curing, or drying and curing the pattern of catalytic ink to form an intermediate article; C) electrolessly plating copper metal in registration with the pattern of catalytic ink, to provide a pattern of unconnected copper metal features in registration with the pattern of catalytic ink, to form the non-electrically conductive antimicrobial article, and D) optionally passivating the pattern having unconnected copper metal features. The prepared antimicrobial article can provide antimicrobial properties when applied to various surfaces that are frequently touched, to inhibit or reduce the transmission of various microorganisms from one person to another.

The invention provides a preparation method of porous metal copper, which comprises the following steps: S1, adding copper oxide powder and a pore-forming agent into an organic solvent, and stirring and mixing to obtain slurry; in the slurry, the mass percentages of the copper oxide, the pore-forming agent and the organic solvent are 60%-70%, 0-10% and 20%-30% respectively; s2, printing the slurry through a steel mesh to obtain a biscuit; s3, the biscuit is sintered in a reducing atmosphere, the sintering temperature ranges from 600 DEG C to 900 DEG C, the sintering time ranges from 2 h to 8 h, and a sintered body is obtained after cooling; and S4, the sintered body is cleaned and freeze-dried, and the porous metal copper is obtained. According to the technical scheme, by controlling the technological parameters such as the size of the copper oxide, the content of the pore forming agent and the size and shape of the steel mesh, the prepared porous metal copper is controllable in pore size, size and proportion, the process is simple, the cost is low, and batch preparation of the porous copper can be achieved.

A system for dynamic oxidation of a heap of copper ore includes a “process island” for formulating and dispensing oxidizing reactive mixtures having predetermined compositions, and irrigating the heap with the mixtures to progressively transform the ore and maintain conditions for enhanced recovery of metal by heap leaching, solvent-extraction and electrowinning. In embodiments, the system is adapted to obtain copper metal from the refractory copper mineral chalcopyrite.

The present application relates to waste copper recycling processing technology field, especially to a kind of copper-containing waste recovery metal copper processing equipment.The technical problem to be solved is that artificial secondary processing is carried out on residual copper wire, which leads to continuous taking by workers, not only increases labor cost, but also greatly affects production efficiency.Due to the excessive friction between the operating knife and the motor shaft during cutting, the operating knife is jammed, which affects the cutting efficiency, and the copper wire after cutting is easily wound on the dismantling device, which seriously affects the efficiency of copper recovery.The technical scheme is that a kind of copper-containing waste recovery metal copper processing equipment includes a shell and a rotating wheel, etc.The shell upper side middle part is rotatably connected with rotating wheel.The present application changes the angle of the second saw blade during cutting through the universal joint, prevents the excessive friction between the saw blade and the copper shaft during cutting, leads to the jamming of the first saw blade and the second saw blade, affects the cutting efficiency, and separates the copper shaft after cutting.

The invention discloses a post-etching processing method for improving copper loss in a through hole array region in a semiconductor device, which is particularly suitable for a back-end metal interconnection dual damascene process. In order to solve the problem of copper loss at the bottom of a through hole caused by insufficient conventional post-etching treatment after integrated etching and before wet stripping, an enhanced post-etching treatment step is executed after a through hole structure for exposing lower-layer copper metal is formed by integrated etching and before wet stripping. The key point of the enhancement step is to treat the exposed copper surface with a reducing plasma comprising hydrogen (H2), optionally further comprising nitrogen N2. The treatment can passivate a copper surface and / or reduce a copper compound formed in etching, so that copper loss and related through hole abnormal defects are remarkably reduced, and a process window of subsequent wet stripping is expanded, so that the reliability and the manufacturing yield of the device are improved, and the effect is particularly remarkable for a high-density through hole array.

The utility model relates to nickel hydrogen battery technical field, concretely is a kind of square high capacity nickel hydrogen battery, including shell, the inside of shell is provided with laminated pole group, the laminated pole group is by diaphragm, positive plate and negative plate and is stacked to be formed, the top of laminated pole group is provided with hole connecting piece, the top of shell is equipped with top cover, the inside of shell is symmetrically equipped with two groups of copper metal block, the inside of two groups copper metal block is inserted with second nut, second nut connects hole connecting piece with copper metal block, and is fixed in another side by nut, the top of copper metal block is installed on top cover by first nut, hole is opened in the top cover, exhaust valve is installed in hole, the utility model discloses the setting of laminated pole group makes positive and negative plate laminated mode easy operation, and by laminated form, make full use of battery shell content space, the square battery made has the effect of high capacity, low internal resistance.

The present disclosure relates to the technical field of lithium ion batteries, in particular to a composite copper foil, a manufacturing method and a lithium ion battery. The manufacturing method of the composite copper foil comprises: taking a composite copper foil with partial copper film peeling as a quasi-base film, and attaching a polymer material to the surface of the quasi-base film to obtain a base film; and depositing a copper metal layer on the two side surfaces of the base film. The above technical solution improves the defective product into a base film by attaching a polymer material to the surface of the composite copper foil with partial copper film peeling, and further deposits a copper metal layer on the two side surfaces of the base film to obtain a composite copper foil meeting the requirements, thereby realizing the reuse of defective products and reducing the cost.

The invention relates to the technical field of nanometer energy and sensing, in particular to a ferrite film direct current friction nanometer generator and a preparation method and application thereof.The ferrite film direct current friction nanometer generator comprises a positive electrode friction layer and a negative electrode friction layer, the negative electrode friction layer comprises a substrate, a conductive electrode and a functional layer, and the functional layer comprises an MZF film. The positive friction layer comprises copper metal; the functional layer of the negative electrode friction layer and the negative electrode friction layer are arranged in an opposite contact manner through a bearing type structure unit; the chemical formula of the MZF thin film is MnxZn (1-x) FeyOz, the value range of x is 0.5-0.7, the value range of y is 2-3, and the value range of z is 3-4. The MZF thin film in the nano-generator provided by the invention has a polycrystalline structure and a grain boundary interface polarization characteristic, the grain boundary interface polarization is enhanced when the temperature rises, carrier diffusion-drift balance is broken, and diffusion-dominated direct current output is realized.

The invention relates to the related technical field of wire straightening, and discloses a motor coil production straightening device for a textile depilator, which comprises a base, a mounting frame, a pressing driving mechanism, a longitudinal straightening mechanism and a horizontal straightening mechanism, the device further comprises a horizontal adjusting mechanism, a longitudinal adjusting mechanism and a limiting mechanism. Wherein the limiting mechanism comprises a limiting driving module, a horizontal resistance increasing limiting module and a longitudinal resistance increasing limiting module, and the limiting mechanism is arranged between the limiting driving module and the longitudinal adjusting mechanism and used for locking or releasing the pressing force and the longitudinal correcting force of the longitudinal adjusting mechanism; therefore, the straightening force can be automatically adjusted and the straightening force can be locked when the copper metal flat wires with different sizes are faced, the working efficiency of the straightening process is improved while manpower is not consumed, the uniformity and the adaptability of the automatic adjustment of the straightening force are effectively guaranteed, and the straightening effect can be continuously guaranteed.

The application provides a sulfide compound for inhibiting copper corrosion, and a structural formula of the sulfide compound is as follows: The application adds mercaptan compounds, alkyne and a photoinitiator into ethanol to obtain a mixed solution, then immerses a copper metal sheet into the mixed solution, and under the action of ultraviolet light, a click reaction occurs to synthesize the sulfide compound containing a C-S-C bond, so as to inhibit the corrosion of the copper metal and protect the copper metal, and the sulfide compound has a good effect of inhibiting the corrosion of the copper.

The present invention discloses a method for batch preparation of an ultra-flat graphene electron microscope support film, which belongs to the field of materials. The method of the present invention comprises: utilizing an electrochemical stripping method to separate graphene from a pre-oxidized copper metal growth substrate, and transferring the result to a polymer composite medium; then utilizing a solvent thermal bonding method to conformally bond the graphene supported by the polymer film to an electron microscope grid, and removing the polymer medium to obtain the graphene grid. The method of the present invention has a simple process, high repeatability, strong compatibility, and can be prepared and produced on a large scale. The graphene support film prepared by the method of the present invention has an integrity of up to 90%, and the graphene in the suspended holes of the grid has the characteristics of ultra-flatness and good cleanliness.

The invention provides a treatment method for copper nickel oxide ore, and relates to the technical field of metallurgical ore dressing. The method comprises the following steps: S1, ore pretreatment; s2, reducing and vulcanizing the mixture; s3, low-nickel matte blowing; s4, smelted slag is slowly cooled; s5, smelting slag beneficiation; according to the method, part of the copper-nickel oxide ore can be smelted into nickel matte, the other part of the copper-nickel oxide ore is modified into the copper-nickel sulfide ore, nickel-copper metal is recycled in a nickel-copper sulfide phase mode through the flotation technology, and resource utilization of valuable metal is achieved.

A method for recovering metals from waste materials includes steps of contacting a waste material feed stream with a first lixiviant adapted to leach copper and other base metals from the waste material feed stream and provide a treated waste material feed stream, recovering copper metal from the first lixiviant, contacting the treated waste material stream with a second lixiviant adapted to leach noble metals from the treated waste material feed stream and recovering gold from the second lixiviant.

The invention provides a semiconductor metal interconnection structure, a semiconductor structure and a preparation method of the semiconductor metal interconnection structure, and cobalt metal, ruthenium metal and molybdenum metal are applied to the metal interconnection structure of a back-end process of the semiconductor structure. A main body conductive layer of a metal interconnection line with the line width not larger than (namely smaller than or equal to) 17nm in a metal interconnection layer is set as a cobalt metal interconnection layer or a ruthenium metal interconnection layer or a molybdenum metal interconnection layer, and a main body conductive layer of a metal interconnection line with the line width larger than 17nm is set as a copper metal interconnection layer, so that a composite metal interconnection layer design is realized; by combining the advantages of copper metal under large-size line width and the advantages of cobalt metal, ruthenium metal and molybdenum metal under small-size line width, the RC delay of the rear-section metal interconnection line is obviously improved, and the electromigration resistance of the rear-section metal interconnection line is improved, so that the reliability of the line is improved, and the service life of the line is prolonged.

The invention discloses an aluminum-based conducting bar surface functional layer and a preparation system and process thereof. The preparation process comprises the following steps: substrate pretreatment: removing surface pollutants through ethanol ultrasonic cleaning; preparing a transition layer: performing cold solid deposition on the copper-based composite powder to form the transition layer; functional layer cold spraying: constructing a functional conductive layer on the surface of the transition layer; preparing an anti-corrosion layer: constructing a composite protection system on the surface of the functional conductive layer; densification treatment is conducted, specifically, hole sealing densification treatment is conducted on the surface of the anti-corrosion layer; and detecting the quality of the coating. The functional layer comprises an aluminum-based layer, a copper metal transition layer, a nickel-based or tin-based conductive layer and an anticorrosive layer. By adopting the process, the equipment investment can be saved, the processing time can be saved, the metal lattice distortion can be effectively realized, the accurate control of the dislocation density of the material surface can be realized, the specific strength of the conducting bar material can be improved, and the light weight of the conducting bar can be realized.

The invention belongs to the technical field of metal rust prevention, and discloses a preparation method and application of a humidity response release type hydrogel microsphere loaded with a vapor phase corrosion inhibitor. The preparation method comprises the following steps: dissolving chitosan / PVA in water and acetic acid according to a certain proportion, and adding a vapor phase corrosion inhibitor; dissolving span 80 in n-heptane to form an oil phase; stirring the two phases to form an emulsion; and carrying out cross-linking on glutaraldehyde, stirring, and carrying out centrifugal drying treatment, so as to prepare the microspheres loaded with the gas phase corrosion inhibitor. The preparation method is simple and high in operability and repeatability. According to the hydrogel microspheres prepared by the method, the loading capacity of the vapor phase corrosion inhibitor is high, and breathable release along with the change of environmental humidity can be realized; the BTA coated CS-PVA has high stability, and has good corrosion inhibition efficiency in an extreme environment.

The application discloses a kind of sulphur oxygen mixed type copper ore grading magnetic-flotation combined beneficiation method, including grinding screening, magnetic separation, grading, copper sulphide flotation, copper oxide roughing, copper oxide strengthening scavenging.The application is by using strong magnetic separation recovery part coarse grain copper oxide in mill grading system, reduce the overgrinding of copper oxide mineral in the process of grinding, realize the ability to collect early collection, improve copper oxide comprehensive recovery rate, while reducing the release of copper ions in the process of grinding, reduce the adverse effect on subsequent copper sulphide flotation.By using sodium sulphide and sodium pyrosulphite to form efficient copper oxide sulphidizing agent, the stability of the film in the sulphidation process is strengthened, and the inhibition of pyrite is also strengthened, improving the separation efficiency of copper oxide flotation.In addition, by using efficient reagents and precise control, the copper oxide concentrate is directly obtained by opening the circuit of copper oxide roughing and strengthening scavenging concentrate, reducing the copper metal loss caused by closed loop circulation.