474 results about "Copper metal" patented technology

The invention relates to the technical field of chemical mechanical polishing, particularly discloses a method for controlling the surface concave-convex rate difference by adopting an abrasive-free copper CMP (Chemical Mechanical Polishing) solution, aims to realize abrasive-free chemical mechanical polishing so as to solve the problem of surface scratch caused by the abrasive action in the polishing process, and is suitable for a substrate polishing solution containing a copper metal layer. The polishing solution comprises a macromolecular chelating agent with the molecular weight of 300-500 g / mol, wherein the optimal molecular weight is 400 g / mol. The alkalescent copper polishing solution prepared by utilizing the macromolecular chelating agent has the advantages that the removal rate of concave parts is low and the polishing rate of convex parts is high through strong chemical reaction under the conditions of no abrasive and no corrosion inhibitor, so that the high-speed difference of the concave parts and the convex parts is generated, and the planarization is realized. Under the condition of alkalescence, no grinding material and no corrosion inhibitor, the polishing solution has high correction capacity on the height difference of the copper surface, and the problems of high polishing pressure, many surface scratches and difficulty in cleaning caused by a traditional method are solved.

The metasurface array antenna housing comprises a plurality of array units of the same structure, each array unit sequentially comprises a first lightning protection layer from top to bottom, and each first lightning protection layer comprises four copper metal cylinders and a lightning protection top layer drainage metal patch; the second metasurface wave absorbing and transmitting layer comprises a first dielectric substrate, and four quasi-rectangular patches, four lumped resistors, four quasi-triangular patches and four quasi-square rings which are arranged on the upper surface of the first dielectric substrate; the third metasurface wave-transparent layer comprises a square metal patch, and a first circular ring and a second circular ring are etched on the square metal patch. Lightning is guided to the third metasurface wave-transparent layer through the first lightning protection layer, the lightning is conducted to other areas through the metal patch, damage of the lightning to the antenna housing is effectively avoided, and the antenna housing can directly replace a lightning protection strip for use; the structural size is greatly reduced, the angle stability is improved, and integration is facilitated; the copper-clad surface of the third metasurface wave-transparent layer can be used as a metal back plate of the second metasurface wave-absorbing layer, and structural multiplexing is achieved.

The invention discloses a composite current collector containing a PTC material and a preparation method thereof, and relates to the technical field of current collectors, and the composite current collector comprises a polymer base film and copper metal layers located on the upper and lower surfaces of the polymer base film. The polymer base film is prepared from the following raw materials in parts by weight: 100 to 110 parts of modified polypropylene, 20 to 25 parts of modified PTC (Positive Temperature Coefficient) material, 1.2 to 1.4 parts of lubricant, 0.3 to 0.5 part of initiator and 14 to 18 parts of filler. According to the synthesized modified polypropylene, benzotriazole and an epoxy group are grafted into a polypropylene molecular chain, so that the binding power of a polymer base film and a copper metal layer and the corrosion resistance of the composite current collector are improved. The synthesized modified PTC material is obtained by loading a thiophene ring and DOPO on nano barium titanate, so that the composite current collector has relatively high ultraviolet resistance, flame retardance and thermal runaway resistance. The composite current collector containing the PTC material is high in use safety in a battery and worthy of popularization and application.

The invention discloses a selective etching solution for a titanium and / or copper metal layer of a circuit board and a preparation method of the selective etching solution, and the selective etching solution comprises the following components: 10-20% of persulfate, 4-8% of o-nitrobenzenesulfonate, 0.5-1% of phosphoric acid, 0.2-0.8% of 3-(aminomethyl) pyrazole, 0.3-1.5% of ammonium fluoride, 2-5% of cyclohexanediamine tetraacetic acid, 0.1-0.5% of cyclodextrine and the balance of water. The etching solution can selectively etch a titanium and / or copper metal layer, through selection and cooperation of etching solution components, etching is uniform and stable, taper angle and lateral etching control is good, metal wires are smooth, no metal residues exist, and a good etching solution is provided for the circuit board etching process.

The embodiment of the present application provides an aluminum-copper dissimilar metal composite laser welding method and an aluminum-copper welding joint, which relates to the field of laser welding technology. The aluminum-copper dissimilar metal composite laser welding method of the embodiment of the present application includes the following steps: S1, stacking and relatively fixing aluminum metal plates and copper metal plates to obtain parts to be welded; S2, combining blue laser, point infrared laser and ring infrared laser, and focusing them to the welding position on the surface of the parts to be welded to form a composite laser beam; S3, welding the parts to be welded in an oscillating manner by keeping the composite laser beam. The aluminum-copper dissimilar metal composite laser welding method and the aluminum-copper welding joint of the embodiment of the present application can reduce the porosity in the weld and improve the mechanical properties and ductility of the weld.

The invention relates to the technical field of etching liquid, in particular to a copper metal etching liquid composition. Comprising the following components in percentage by weight: 5-10% of hydrogen peroxide, 0.1-0.3% of a first fluorine source, 1-5% of first inorganic acid, 1-5% of alkali, 0.01-0.8% of a first metal corrosion inhibitor and the balance of deionized water; and the auxiliary agent comprises 2-8% of a second fluorine source, 10-55% of second inorganic acid, 0.1-2% of a second metal corrosion inhibitor and the balance of deionized water. The etching liquid is excellent in etching effect, CD-loss reaches 0.6-0.8 [mu] m, the slope angle reaches 40-50 degrees, the highest copper load reaches 20000 ppm, and meanwhile the problem that when copper is high, due to the fact that the nitric acid concentration is too high, metal etching is abnormal is solved.

An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.

The invention relates to the technical field of cables, and provides a long-life cable for nuclear power, which sequentially comprises a conductor, an insulating layer, a shielding layer and a sheath layer from inside to outside, the sheath layer comprises the following components in parts by weight: 60-70 parts of high-density polyethylene, 12-22 parts of carboxy nitrile rubber, 4-8 parts of a styrene-acrylonitrile copolymer, 0.5-8 parts of a copper metal organic complex, 8-15 parts of palygorskite powder, 2-5 parts of zinc oxide, 0.5-1.3 parts of an antioxidant, 1-3 parts of a plasticizer and 0.2-0.5 part of a vulcanizing agent; the copper metal organic complex comprises copper trifluoromethanesulfonate and copper acetylacetonate in a weight ratio of (1-3): 1. According to the technical scheme, the problem of poor aging resistance of the sheath layer of the nuclear power cable in the prior art is solved.

The composite copper foil comprises a supporting layer, a metal layer is arranged on the surface of the supporting layer, the supporting layer is provided with crystals, the crystal form of the crystals of the supporting layer is spherocrystal, the average particle size of the crystals of the supporting layer is larger than that of the metal layer, and the average particle size of the crystals of the supporting layer is larger than that of the metal layer. And copper metal or copper alloy is arranged in the metal layer. The metal layer can be in bonding contact with the spherocrystal of the supporting layer through a plurality of nanoscale particles, the acting force between particle molecules of the metal layer and molecules of the supporting layer is increased, the bonding strength can be improved, and therefore the bonding force between the metal layer and the supporting layer can be improved; meanwhile, the contact among metal layer particle molecules is increased, the overall sheet resistance of the metal layer is reduced, the flow conductivity of the metal layer is improved, the tensile strength of the metal layer is improved due to the fact that the contact among the metal layer molecules is large, and the composite copper foil is not prone to being stretched and damaged in the follow-up processing link.

The invention relates to the technical field of high polymer materials, and particularly discloses a nuclear-grade cable for spent fuel aftertreatment and a preparation method of the nuclear-grade cable. Comprising the following steps: S1, taking hydroxyl-containing cyclotriphosphazene, tetra (4-hydroxybenzene) ethylene, oleic acid acyl chloride, guar gum hydroxypropyl trimethyl ammonium chloride, triethylamine and a mixed solvent, cooling, dropwise adding triethylamine in a nitrogen atmosphere, dropwise adding a phenoxyphosphoryl dichloride solution, stirring for reaction, filtering, and performing rotary evaporation to obtain a composite flame retardant; s2, polyethylene, aluminum hydroxide, a composite flame retardant and an anti-radiation agent are added into an internal mixer for mixing, a cross-linking agent is added, uniform mixing, extrusion and granulation are performed, and a cable material is obtained; the cable material is used for preparing an outer sheath layer of a nuclear-grade cable. S3, twisting a plurality of copper metal monofilaments to form a conductor, wrapping the conductor with an insulating layer, and wrapping the conductor with a polyimide film to form a wire core; a plurality of wire cores are twisted to form a cable core; a non-woven fabric wrapping tape layer and an outer sheath layer are wrapped outside the cable core; and obtaining the nuclear-grade cable.

Microbial activity can be mitigated or prevented by applying an antimicrobial article to an object to inhibit the transfer of microbial life from the object to anyone thereafter touching the object. The antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface, which catalytic ink pattern comprises multiple unconnected features; and a pattern of electrolessly plated copper metal of unconnected copper metal features that is disposed in registration with the catalytic ink pattern. This antimicrobial article exhibits a sheet resistivity of more than 1,000 ohms / □ as determined using a four-point probe and a source meter.

The invention discloses a preparation method of a Prussian blue analogue (CoFe-PBA) and copper metal organic framework (HKUST-1) composite core-shell material and application of the composite core-shell material in oxygen evolution reaction (OER). The material is prepared through a step-by-step synthesis and composite process: firstly, synthesizing copper-based MOF (HKUST-1) and a ferrocobalt Prussian blue analogue (CoFe-PBA), then compounding the copper-based MOF (HKUST-1) and the ferrocobalt Prussian blue analogue (CoFe-PBA) through a solvothermal method to form a core-shell structure (HKUST-1-atCoFe-PBA), and further performing high-temperature oxidation and vulcanization treatment to obtain HKUST-1-atCoFe-O and HKUST-1-atCoFe-S materials. According to the composite material, the electron transmission efficiency and the catalytic activity are remarkably improved by utilizing the synergistic effect of multi-metal active sites of Cu, Co and Fe. No precious metal or strong corrosive reagent is used in the preparation process, the cost is low, and the green synthesis requirement is met. An electrochemical test shows that the OER overpotential of the optimized catalyst at the current density of 10mAcm is only 268mV, and the catalyst shows excellent catalytic performance. The material can be widely applied to the fields of water electrolysis hydrogen production and the like, and has important industrial application prospects.

The invention discloses a circuit board hole copper metal heat treatment method and metal heat treatment equipment, the circuit board hole copper metal heat treatment method specifically adopts a laser beam to heat a conductive copper column so as to carry out metal heat treatment, and when the laser beam heats the conductive copper column, the metal heat treatment is carried out on the conductive copper column. The thermal field temperature of the side wall of the conductive copper column is lower than the melting point temperature of the conductive copper column, so that the conductive copper column on the circuit board can be independently heated by using the laser beam so as to carry out metal heat treatment on the conductive copper column, and the metal characteristic of the conductive copper column can be improved on the premise that the structure of the circuit board is not damaged; the conductive copper cylinder can meet the performance requirements of a high-calorific-value, high-frequency and high-speed circuit board, and particularly can improve the mechanical reliability performance such as flexibility and compactness of the conductive copper cylinder and the high-frequency and high-speed electric signal transmission performance, thereby improving the thermal stability and the electric signal transmission performance of the circuit board.

The utility model provides a film thermal printing head, and relates to the technical field of printing equipment. Comprising a ceramic substrate, a heat storage layer, a resistance layer, a conductive layer, a protective layer and a connecting layer, the connecting layer is arranged between the resistance layer and the conducting layer so as to improve the binding force of the resistance layer and the conducting layer; the conductive layer comprises a copper metal layer and a nickel metal layer, and the conductive layer and the connecting layer jointly form a conductor layer used for connecting an I C assembly; and the IC assembly is welded on the conductor layer, and the IC assembly is provided with a silver finger on the heat storage layer, wherein the silver finger is used for being directly welded with an external FFC / FPC (Flexible Printed Circuit / Flexible Printed Circuit) in use, so that a film thermal printing head structure without the FFC / FPC is formed. According to the scheme, a circuit board on the ceramic substrate is omitted, the external circuit board is directly welded through the silver finger, the structure of the thin film thermal printing head can be optimized, and the size of the thin film thermal printing head is further reduced.

The invention provides an electrochemical carbon dioxide trapping system and method coupled with metal refining. According to the system, carbon dioxide is absorbed in an absorption unit through an absorbent; a crude copper metal plate in coordination combination with ammonia is adopted as an electrode of an anode chamber, absorption liquid is desorbed under the action of a crude copper anode, elements, more active than metal copper, in the crude copper anode in the anode chamber are dissolved in the absorption liquid, and copper ions can be released into the carbon dioxide loaded absorption liquid in an electrochemical dissolution mode; carbon dioxide is desorbed in a mode of coordination combination with ammonia, and a gas mixture containing the copper / ammonia coordination compound and carbon dioxide is obtained; separating the gas-liquid mixture through a gas-liquid separation unit to obtain carbon dioxide gas and a separation liquid; the separation liquid is subjected to electrodeposition under the action of a refined copper cathode in a cathode chamber, refined copper and an absorbent are obtained, and regeneration of the absorbent is achieved; finally, the absorbent enters the absorption unit again to provide the absorbent, and cyclic utilization of the absorbent is achieved.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The invention relates to a preparation method of a low-profile HTE copper foil for a mini LED. The preparation method comprises the following steps: (1) electrolyzing a raw foil under the action of a composite additive to prepare a compact copper layer; (2) feeding the compact copper layer into a surface treatment section, and performing acid pickling, coarsening, curing and water washing to form a low-profile roughened structure, wherein a coarsening additive is added into a coarsening solution; (3) electroplating non-copper metal anti-oxidation layers on the two surfaces of the copper foil subjected to surface treatment; and (4) the copper foil electroplated with the anti-oxidation layer is coated with a silane coupling agent in a roller coating mode, and the low-profile HTE copper foil for the mini LED is obtained. The method has the capacity of continuous batch production, and the problem of layering and bubbling in outer layer pressing of the PCB for the mini LED is greatly solved while spontaneous heating of the copper foil is reduced.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention belongs to the field of electronic packaging, and relates to a nano-copper metal material for low-temperature sintering conductive paste and preparation and application of the paste of the nano-copper metal material. The nano-copper metal material comprises copper nanoparticles and copper nanowires, and the copper nanoparticles and the copper nanowires are both prepared through a one-step hydrothermal method: (1) the copper nanoparticles are prepared, specifically, the high-purity copper nanoparticles are obtained through a hydrothermal reaction by adjusting the pH value; (2) preparing a copper nanowire: carrying out hydrothermal reaction on a copper source, a reducing agent and an end-capping reagent, so that copper ions are reduced into quintuple twin crystal seeds in one step and further directionally deposited into the copper nanowire; and (3) preparing conductive paste: mixing the nano-copper material and an organic reagent according to a certain proportion, and homogenizing to obtain the low-temperature sintering type conductive copper paste. The low-temperature copper paste is used for preparing the low-temperature copper paste for bonding a chip and a substrate. The prepared nano-copper metal material for the low-temperature sintering conductive paste is stable in size and simple in preparation process, and the prepared paste is good and excellent in sintering performance (the shear strength is 25 MPa, and the thermal conductivity is 4 W / m.K).

The invention discloses a prefabricated branch fireproof cable with a copper metal shell and a preparation method of the prefabricated branch fireproof cable. The prefabricated branch fireproof cable comprises a copper metal main shell, the bottom of the copper metal main shell is communicated with a copper metal sub-shell, a main cable is installed in the copper metal main shell, and a branch cable is installed in the copper metal sub-shell; the main cable and the branch cable both adopt copper core conductors, and copper has high conductivity, so that resistance in a current transmission process can be reduced, electric energy loss can be reduced, electric energy transmission efficiency can be improved, and stable and efficient transmission of electric power to each electric device can be ensured; the nanoscale magnesium oxide insulation powder filled in the copper metal main shell and the copper metal branch shell has excellent insulation performance, can effectively isolate electrical connection between the main cable and the branch cable and the external environment and between the main cable and the branch cable and other conductors, prevents electric leakage and short circuit accidents, and improves the electrical safety of a cable system.

The invention discloses a grading magnetic-flotation combined beneficiation method for sulfur-oxygen mixed copper ore. The grading magnetic-flotation combined beneficiation method comprises the steps of ore grinding and screening, magnetic separation, grading, copper sulfide flotation, copper oxide roughing and copper oxide enhanced scavenging. According to the method, strong magnetic separation is adopted in the mill grading system to recover part of coarse-grain copper oxide, excessive grinding of copper oxide minerals in the ore grinding process is reduced, early recovery can be achieved, the comprehensive recovery rate of copper oxide is increased, meanwhile, release of copper ions in the ore grinding process is reduced, and the adverse effect on follow-up copper sulfide flotation is relieved. The efficient copper oxide vulcanizing agent is composed of sodium sulfide and sodium pyrosulfite, the stability of a film in the vulcanizing process is enhanced, meanwhile, the inhibition effect on pyrite is enhanced, and the flotation separation efficiency of copper oxide is improved. In addition, by adopting an efficient reagent and precise regulation and control, copper oxide concentrate is directly obtained through open circuit of copper oxide roughing and enhanced scavenging concentrate, and the copper metal falling loss caused by closed cycle is reduced.

The invention discloses a high-strength antioxidant tungsten-copper-chromium composite material and a preparation method thereof, and belongs to the technical field of tungsten-copper composite materials. The mass of the required tungsten metal powder, the mass of the required copper metal powder and the mass of the required chromium metal powder are calculated according to the mass fractions of the designed components, and then weighing and proportioning are conducted for standby application; tungsten metal powder and chromium metal powder are subjected to mechanical alloying through a planetary ball mill to obtain tungsten-chromium alloy powder, then copper metal powder is added, ball milling continues to be conducted, and tungsten-copper-chromium composite powder is obtained; and the obtained tungsten-copper-chromium composite powder is subjected to cold pressing, and then the high-strength anti-oxidation tungsten-copper-chromium composite material is prepared through liquid-phase sintering. According to the preparation method of the high-strength anti-oxidation tungsten-copper-chromium composite material, compared with a tungsten-copper composite material under the same preparation condition, the tensile strength and the oxidation resistance of the prepared tungsten-copper-chromium composite material are synergistically improved.

The invention relates to the technical field of wastewater treatment, and discloses an electrochemical device and a treatment method of high-concentration organic wastewater. The electrochemical device includes a reaction vessel, and an anode, a cathode, and a particle electrode disposed within the reaction vessel, at least one of the anode and the cathode including a first electrode layer, a second electrode layer, and a metal layer disposed between the first electrode layer and the second electrode layer. Wherein the metal layer contains a metal and b metal, the a metal is copper, and the b metal is selected from at least one of iron, nickel and zinc. When the electrochemical device is used for treating high-concentration organic wastewater, the ammonia nitrogen content and the COD content of effluent can be effectively reduced.

The invention discloses a photosensitive type copper metal organic framework material Cu-MOF, a composite xerogel material thereof, a preparation method and application. According to the invention, a Cu-MOF composite xerogel (Cu-MOF (at) XG) material is utilized to assemble a friction nano generator (TENG), the influence of Cu-MOF (at) XG with different doping proportions on the output performance of the TENG is explored, and meanwhile, the influence of the Cu-MOF (at) XG material with the doping proportion of 10% on the output performance of the TENG under different wave band light (red light (630-640 nm), blue light (460-465 nm), purple light (380-390 nm) and white light (390-780 nm) is explored. An ultra-sensitive wearable self-powered ultraviolet sensor system is constructed by selecting a Cu-MOF (at) XG-TENG device, self power supply is realized by pressing the sensor, accurate identification of ultraviolet intensity in a special environment is realized by comparing output signals, and communication with the outside is realized by displaying an output Morse code communication signal.

The invention discloses a negative electrode current collector and a preparation method thereof, the negative electrode current collector comprises a film substrate layer and aluminum oxide layers arranged on the upper and lower sides of the film substrate layer, and the outer side of each aluminum oxide layer is provided with a copper metal layer; the film base material layer comprises a PET (Polyethylene Terephthalate) base film layer and PP (Polypropylene) film layers positioned on two sides of the PET base film layer. By adopting the negative current collector structure provided by the invention, the production cost of the negative current collector can be reduced, and the binding force between the layer structures on the negative current collector can be improved.

The present invention provides a copper-based metal powder that is suitable for use in a conductive material, and a conductive paste containing the copper-based metal powder has excellent applicability because the copper-based metal powder particles are less likely to aggregate or become blurred when applied, and can produce a fired coating film that exhibits excellent conductivity when fired at a low temperature. [Solution] A copper-based metal powder having an average particle size of 10 μm or less and a rattler value of 90% or more.

The embodiment of the invention provides an aluminum-copper dissimilar metal composite laser welding method and an aluminum-copper welding head, and relates to the technical field of laser welding. The aluminum-copper dissimilar metal composite laser welding method comprises the following steps that S1, an aluminum metal plate and a copper metal plate are arranged in a stacked mode and relatively fixed, and a to-be-welded part is obtained; s2, blue laser, point infrared laser and ring infrared laser are combined and focused to a welding site on the surface of the to-be-welded part, and a composite laser beam is formed; and S3, the composite laser beam is kept in an oscillating swing mode to weld the to-be-welded part. According to the aluminum-copper dissimilar metal composite laser welding method and the aluminum-copper welding head, the porosity in a welding seam can be reduced, and the mechanical property and ductility of the welding seam are improved.

Solid powder and an organic carrier are matched according to the mass ratio of (82-86): (14-18), silver powder and titanium dihydride powder which form the solid powder are matched according to the mass ratio of 96: 4, and a solvent, a thickening agent and a dispersing agent which form the organic carrier are matched according to the mass ratio of (91-95): (2-6): (1-5). According to the Ag-Ti soldering paste, silver powder and titanium dihydride powder serve as solid phases and are matched with a specific organic carrier, by optimizing the rheological property and the vacuum brazing technology, TiH2 is decomposed to generate active Ti atoms, the active Ti atoms react with AlN ceramic to generate a continuous TiN reaction layer, and high-strength and low-defect connection of an AlN ceramic base material and an oxygen-free copper metal copper layer is achieved; a traditional Cu element is abandoned in a soldering paste system, generation of a brittle phase is avoided, and the reliability of a connector under the extreme working condition is improved; when applied to preparation of the ceramic copper-clad plate, the film has the advantages of strong silk-screen printing adaptability, uniform film thickness and low voidage.

The invention relates to a preparation method of a double-sided roughened copper foil applied to a battery negative electrode current collector. The preparation method comprises the following steps: (1) electrolyzing a raw foil under the action of a composite additive to prepare a compact copper layer; (2) feeding the compact copper layer into a surface treatment section, and performing acid pickling, coarsening, curing and water washing to form a double-sided roughened structure; and (3) electroplating non-copper metal anti-oxidation layers on the two sides of the copper foil subjected to surface treatment to obtain the double-sided roughened copper foil. According to the method, the process of preparing the copper foil with the double-sided roughened structure through a traditional etching method is abandoned, the roughened structure is formed on the compact copper layer through one-time double-sided surface treatment electroplating, and continuous preparation of the double-sided roughened copper foil is achieved; and meanwhile, the problem that the tensile strength of the copper foil is reduced when the double-sided roughened copper foil is prepared by an etching method is fundamentally solved.

An intermediate article has a non-electrically conductive substrate having first and second opposing surfaces; and a catalytic ink disposed as a pattern of half-tone dots on at least the first opposing surface. Copper metal can be plated on the pattern of catalytic ink to provide a copper metal pattern that have antimicrobial properties. The resulting antimicrobial article can then be applied to various surfaces to mitigate the spread of infectious agents from one person to another.