The invention discloses an electronic packaging material. The electronic packaging material is characterized by comprising a matrix and a reinforcement, wherein the matrix is made of aluminum, copper, aluminum alloy or copper alloy, the reinforcement is of graphene accounting for 0.5-30% of total mass percentage, and the graphene has 1-20 layers of tiny plates the area of each which is 1-5000 mu m<2> or plates the area of each which is more than 1mm<2>; and the aluminum or copper metal comprises Cr, Fe, Ti, W, B or Mo element, the content of the Cr, Fe, Ti, W, B or Mo element is 0.05-1%. The electronic packaging material has the advantages of being high-heat conductivity, high-strength, low-density, environment-friendly and good in machineable property; and as the electronic packaging material, the composite has excellent property and good application prospects.