374 results about "Copper metal" patented technology

The metasurface array antenna housing comprises a plurality of array units of the same structure, each array unit sequentially comprises a first lightning protection layer from top to bottom, and each first lightning protection layer comprises four copper metal cylinders and a lightning protection top layer drainage metal patch; the second metasurface wave absorbing and transmitting layer comprises a first dielectric substrate, and four quasi-rectangular patches, four lumped resistors, four quasi-triangular patches and four quasi-square rings which are arranged on the upper surface of the first dielectric substrate; the third metasurface wave-transparent layer comprises a square metal patch, and a first circular ring and a second circular ring are etched on the square metal patch. Lightning is guided to the third metasurface wave-transparent layer through the first lightning protection layer, the lightning is conducted to other areas through the metal patch, damage of the lightning to the antenna housing is effectively avoided, and the antenna housing can directly replace a lightning protection strip for use; the structural size is greatly reduced, the angle stability is improved, and integration is facilitated; the copper-clad surface of the third metasurface wave-transparent layer can be used as a metal back plate of the second metasurface wave-absorbing layer, and structural multiplexing is achieved.

The invention discloses a selective etching solution for a titanium and / or copper metal layer of a circuit board and a preparation method of the selective etching solution, and the selective etching solution comprises the following components: 10-20% of persulfate, 4-8% of o-nitrobenzenesulfonate, 0.5-1% of phosphoric acid, 0.2-0.8% of 3-(aminomethyl) pyrazole, 0.3-1.5% of ammonium fluoride, 2-5% of cyclohexanediamine tetraacetic acid, 0.1-0.5% of cyclodextrine and the balance of water. The etching solution can selectively etch a titanium and / or copper metal layer, through selection and cooperation of etching solution components, etching is uniform and stable, taper angle and lateral etching control is good, metal wires are smooth, no metal residues exist, and a good etching solution is provided for the circuit board etching process.

The embodiment of the present application provides an aluminum-copper dissimilar metal composite laser welding method and an aluminum-copper welding joint, which relates to the field of laser welding technology. The aluminum-copper dissimilar metal composite laser welding method of the embodiment of the present application includes the following steps: S1, stacking and relatively fixing aluminum metal plates and copper metal plates to obtain parts to be welded; S2, combining blue laser, point infrared laser and ring infrared laser, and focusing them to the welding position on the surface of the parts to be welded to form a composite laser beam; S3, welding the parts to be welded in an oscillating manner by keeping the composite laser beam. The aluminum-copper dissimilar metal composite laser welding method and the aluminum-copper welding joint of the embodiment of the present application can reduce the porosity in the weld and improve the mechanical properties and ductility of the weld.

The invention relates to the technical field of etching liquid, in particular to a copper metal etching liquid composition. Comprising the following components in percentage by weight: 5-10% of hydrogen peroxide, 0.1-0.3% of a first fluorine source, 1-5% of first inorganic acid, 1-5% of alkali, 0.01-0.8% of a first metal corrosion inhibitor and the balance of deionized water; and the auxiliary agent comprises 2-8% of a second fluorine source, 10-55% of second inorganic acid, 0.1-2% of a second metal corrosion inhibitor and the balance of deionized water. The etching liquid is excellent in etching effect, CD-loss reaches 0.6-0.8 [mu] m, the slope angle reaches 40-50 degrees, the highest copper load reaches 20000 ppm, and meanwhile the problem that when copper is high, due to the fact that the nitric acid concentration is too high, metal etching is abnormal is solved.

An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.

The invention relates to the technical field of cables, and provides a long-life cable for nuclear power, which sequentially comprises a conductor, an insulating layer, a shielding layer and a sheath layer from inside to outside, the sheath layer comprises the following components in parts by weight: 60-70 parts of high-density polyethylene, 12-22 parts of carboxy nitrile rubber, 4-8 parts of a styrene-acrylonitrile copolymer, 0.5-8 parts of a copper metal organic complex, 8-15 parts of palygorskite powder, 2-5 parts of zinc oxide, 0.5-1.3 parts of an antioxidant, 1-3 parts of a plasticizer and 0.2-0.5 part of a vulcanizing agent; the copper metal organic complex comprises copper trifluoromethanesulfonate and copper acetylacetonate in a weight ratio of (1-3): 1. According to the technical scheme, the problem of poor aging resistance of the sheath layer of the nuclear power cable in the prior art is solved.

Microbial activity can be mitigated or prevented by applying an antimicrobial article to an object to inhibit the transfer of microbial life from the object to anyone thereafter touching the object. The antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface, which catalytic ink pattern comprises multiple unconnected features; and a pattern of electrolessly plated copper metal of unconnected copper metal features that is disposed in registration with the catalytic ink pattern. This antimicrobial article exhibits a sheet resistivity of more than 1,000 ohms / □ as determined using a four-point probe and a source meter.

The invention discloses a preparation method of a Prussian blue analogue (CoFe-PBA) and copper metal organic framework (HKUST-1) composite core-shell material and application of the composite core-shell material in oxygen evolution reaction (OER). The material is prepared through a step-by-step synthesis and composite process: firstly, synthesizing copper-based MOF (HKUST-1) and a ferrocobalt Prussian blue analogue (CoFe-PBA), then compounding the copper-based MOF (HKUST-1) and the ferrocobalt Prussian blue analogue (CoFe-PBA) through a solvothermal method to form a core-shell structure (HKUST-1-atCoFe-PBA), and further performing high-temperature oxidation and vulcanization treatment to obtain HKUST-1-atCoFe-O and HKUST-1-atCoFe-S materials. According to the composite material, the electron transmission efficiency and the catalytic activity are remarkably improved by utilizing the synergistic effect of multi-metal active sites of Cu, Co and Fe. No precious metal or strong corrosive reagent is used in the preparation process, the cost is low, and the green synthesis requirement is met. An electrochemical test shows that the OER overpotential of the optimized catalyst at the current density of 10mAcm is only 268mV, and the catalyst shows excellent catalytic performance. The material can be widely applied to the fields of water electrolysis hydrogen production and the like, and has important industrial application prospects.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The invention relates to a preparation method of a low-profile HTE copper foil for a mini LED. The preparation method comprises the following steps: (1) electrolyzing a raw foil under the action of a composite additive to prepare a compact copper layer; (2) feeding the compact copper layer into a surface treatment section, and performing acid pickling, coarsening, curing and water washing to form a low-profile roughened structure, wherein a coarsening additive is added into a coarsening solution; (3) electroplating non-copper metal anti-oxidation layers on the two surfaces of the copper foil subjected to surface treatment; and (4) the copper foil electroplated with the anti-oxidation layer is coated with a silane coupling agent in a roller coating mode, and the low-profile HTE copper foil for the mini LED is obtained. The method has the capacity of continuous batch production, and the problem of layering and bubbling in outer layer pressing of the PCB for the mini LED is greatly solved while spontaneous heating of the copper foil is reduced.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a prefabricated branch fireproof cable with a copper metal shell and a preparation method of the prefabricated branch fireproof cable. The prefabricated branch fireproof cable comprises a copper metal main shell, the bottom of the copper metal main shell is communicated with a copper metal sub-shell, a main cable is installed in the copper metal main shell, and a branch cable is installed in the copper metal sub-shell; the main cable and the branch cable both adopt copper core conductors, and copper has high conductivity, so that resistance in a current transmission process can be reduced, electric energy loss can be reduced, electric energy transmission efficiency can be improved, and stable and efficient transmission of electric power to each electric device can be ensured; the nanoscale magnesium oxide insulation powder filled in the copper metal main shell and the copper metal branch shell has excellent insulation performance, can effectively isolate electrical connection between the main cable and the branch cable and the external environment and between the main cable and the branch cable and other conductors, prevents electric leakage and short circuit accidents, and improves the electrical safety of a cable system.

The invention discloses a high-strength antioxidant tungsten-copper-chromium composite material and a preparation method thereof, and belongs to the technical field of tungsten-copper composite materials. The mass of the required tungsten metal powder, the mass of the required copper metal powder and the mass of the required chromium metal powder are calculated according to the mass fractions of the designed components, and then weighing and proportioning are conducted for standby application; tungsten metal powder and chromium metal powder are subjected to mechanical alloying through a planetary ball mill to obtain tungsten-chromium alloy powder, then copper metal powder is added, ball milling continues to be conducted, and tungsten-copper-chromium composite powder is obtained; and the obtained tungsten-copper-chromium composite powder is subjected to cold pressing, and then the high-strength anti-oxidation tungsten-copper-chromium composite material is prepared through liquid-phase sintering. According to the preparation method of the high-strength anti-oxidation tungsten-copper-chromium composite material, compared with a tungsten-copper composite material under the same preparation condition, the tensile strength and the oxidation resistance of the prepared tungsten-copper-chromium composite material are synergistically improved.

The invention relates to the technical field of wastewater treatment, and discloses an electrochemical device and a treatment method of high-concentration organic wastewater. The electrochemical device includes a reaction vessel, and an anode, a cathode, and a particle electrode disposed within the reaction vessel, at least one of the anode and the cathode including a first electrode layer, a second electrode layer, and a metal layer disposed between the first electrode layer and the second electrode layer. Wherein the metal layer contains a metal and b metal, the a metal is copper, and the b metal is selected from at least one of iron, nickel and zinc. When the electrochemical device is used for treating high-concentration organic wastewater, the ammonia nitrogen content and the COD content of effluent can be effectively reduced.

The invention discloses a photosensitive type copper metal organic framework material Cu-MOF, a composite xerogel material thereof, a preparation method and application. According to the invention, a Cu-MOF composite xerogel (Cu-MOF (at) XG) material is utilized to assemble a friction nano generator (TENG), the influence of Cu-MOF (at) XG with different doping proportions on the output performance of the TENG is explored, and meanwhile, the influence of the Cu-MOF (at) XG material with the doping proportion of 10% on the output performance of the TENG under different wave band light (red light (630-640 nm), blue light (460-465 nm), purple light (380-390 nm) and white light (390-780 nm) is explored. An ultra-sensitive wearable self-powered ultraviolet sensor system is constructed by selecting a Cu-MOF (at) XG-TENG device, self power supply is realized by pressing the sensor, accurate identification of ultraviolet intensity in a special environment is realized by comparing output signals, and communication with the outside is realized by displaying an output Morse code communication signal.

The invention discloses a negative electrode current collector and a preparation method thereof, the negative electrode current collector comprises a film substrate layer and aluminum oxide layers arranged on the upper and lower sides of the film substrate layer, and the outer side of each aluminum oxide layer is provided with a copper metal layer; the film base material layer comprises a PET (Polyethylene Terephthalate) base film layer and PP (Polypropylene) film layers positioned on two sides of the PET base film layer. By adopting the negative current collector structure provided by the invention, the production cost of the negative current collector can be reduced, and the binding force between the layer structures on the negative current collector can be improved.

Solid powder and an organic carrier are matched according to the mass ratio of (82-86): (14-18), silver powder and titanium dihydride powder which form the solid powder are matched according to the mass ratio of 96: 4, and a solvent, a thickening agent and a dispersing agent which form the organic carrier are matched according to the mass ratio of (91-95): (2-6): (1-5). According to the Ag-Ti soldering paste, silver powder and titanium dihydride powder serve as solid phases and are matched with a specific organic carrier, by optimizing the rheological property and the vacuum brazing technology, TiH2 is decomposed to generate active Ti atoms, the active Ti atoms react with AlN ceramic to generate a continuous TiN reaction layer, and high-strength and low-defect connection of an AlN ceramic base material and an oxygen-free copper metal copper layer is achieved; a traditional Cu element is abandoned in a soldering paste system, generation of a brittle phase is avoided, and the reliability of a connector under the extreme working condition is improved; when applied to preparation of the ceramic copper-clad plate, the film has the advantages of strong silk-screen printing adaptability, uniform film thickness and low voidage.

The invention relates to a preparation method of a double-sided roughened copper foil applied to a battery negative electrode current collector. The preparation method comprises the following steps: (1) electrolyzing a raw foil under the action of a composite additive to prepare a compact copper layer; (2) feeding the compact copper layer into a surface treatment section, and performing acid pickling, coarsening, curing and water washing to form a double-sided roughened structure; and (3) electroplating non-copper metal anti-oxidation layers on the two sides of the copper foil subjected to surface treatment to obtain the double-sided roughened copper foil. According to the method, the process of preparing the copper foil with the double-sided roughened structure through a traditional etching method is abandoned, the roughened structure is formed on the compact copper layer through one-time double-sided surface treatment electroplating, and continuous preparation of the double-sided roughened copper foil is achieved; and meanwhile, the problem that the tensile strength of the copper foil is reduced when the double-sided roughened copper foil is prepared by an etching method is fundamentally solved.

An intermediate article has a non-electrically conductive substrate having first and second opposing surfaces; and a catalytic ink disposed as a pattern of half-tone dots on at least the first opposing surface. Copper metal can be plated on the pattern of catalytic ink to provide a copper metal pattern that have antimicrobial properties. The resulting antimicrobial article can then be applied to various surfaces to mitigate the spread of infectious agents from one person to another.

The invention discloses copper metal foam and a preparation method of the copper metal foam, the copper metal foam comprises a copper-based supporting body and foamy copper supported by the supporting body, and the copper-based supporting body comprises at least one of a copper net and a copper foil. In the application, the copper-based support body is arranged to provide support for the foamy copper, so that the strength of the copper metal foam can be improved while the lightweight of the material is met, a new-generation multifunctional material solution is provided for the fields of new energy, 5G communication and the like, and the copper metal foam is suitable for the fields of new energy battery current collectors, electromagnetic shielding devices, environment-friendly catalytic carriers and the like.

The invention discloses a copper metal complex and a preparation method thereof. The copper metal complex is prepared by mixing copper powder and refractory metal powder, adding a dispersing agent and graphite and carrying out compression and vacuum sintering. The outer layer of the complex structure is copper foil, the inner layer is uniform alloy powder, the complex structure can be used as intermediate alloy for subsequent smelting, the smelting temperature is remarkably reduced, element oxidation is inhibited, and the component uniformity is improved; the method is suitable for preparing the copper-based complexes of various high-melting-point and easily-oxidized elements.

A non-electrically antimicrobial conductive article can be prepared by: A) providing a non-electrically conductive substrate with first and second opposing surfaces; B) disposing a pattern of a catalytic ink, having unconnected features, on the first opposing surface of the non-electrically conductive substrate, and drying, curing, or drying and curing the pattern of catalytic ink to form an intermediate article; C) electrolessly plating copper metal in registration with the pattern of catalytic ink, to provide a pattern of unconnected copper metal features in registration with the pattern of catalytic ink, to form the non-electrically conductive antimicrobial article, and D) optionally passivating the pattern having unconnected copper metal features. The prepared antimicrobial article can provide antimicrobial properties when applied to various surfaces that are frequently touched, to inhibit or reduce the transmission of various microorganisms from one person to another.

The invention provides a preparation method of porous metal copper, which comprises the following steps: S1, adding copper oxide powder and a pore-forming agent into an organic solvent, and stirring and mixing to obtain slurry; in the slurry, the mass percentages of the copper oxide, the pore-forming agent and the organic solvent are 60%-70%, 0-10% and 20%-30% respectively; s2, printing the slurry through a steel mesh to obtain a biscuit; s3, the biscuit is sintered in a reducing atmosphere, the sintering temperature ranges from 600 DEG C to 900 DEG C, the sintering time ranges from 2 h to 8 h, and a sintered body is obtained after cooling; and S4, the sintered body is cleaned and freeze-dried, and the porous metal copper is obtained. According to the technical scheme, by controlling the technological parameters such as the size of the copper oxide, the content of the pore forming agent and the size and shape of the steel mesh, the prepared porous metal copper is controllable in pore size, size and proportion, the process is simple, the cost is low, and batch preparation of the porous copper can be achieved.

A system for dynamic oxidation of a heap of copper ore includes a “process island” for formulating and dispensing oxidizing reactive mixtures having predetermined compositions, and irrigating the heap with the mixtures to progressively transform the ore and maintain conditions for enhanced recovery of metal by heap leaching, solvent-extraction and electrowinning. In embodiments, the system is adapted to obtain copper metal from the refractory copper mineral chalcopyrite.

The utility model discloses a low melting point solder ball relates to solder ball field, including inner ball core and antioxidation protection mechanism, the top of inner ball core is provided with the straight-through hole equidistantly of annular array, and the side edge of inner ball core is provided with the anti-slip arc groove equidistantly of annular. According to the low-melting-point solder ball, through the arrangement of the straight-through hole and the anti-skid arc-shaped groove, the contact area between the solder ball and heat is larger after the anti-oxidation protection mechanism is molten, so that the melting speed of the solder ball can be further increased, and the situation that the solder ball is not completely molten is effectively prevented; meanwhile, the inner ball core is formed by fusing the tin-silver-copper metal layer and the tin-bismuth metal layer, so that the melting point of the solder ball is lower, the oxidation resistance of the solder ball is more excellent through the arrangement of the anti-oxidation resin layer and the anti-oxidation coating film, and the service life of the solder ball is prolonged. Therefore, the situation that subsequent melting of the solder balls and interference on the welding quality are caused by the oxidation phenomenon after the solder balls make contact with air for a long time is avoided.

The present application relates to waste copper recycling processing technology field, especially to a kind of copper-containing waste recovery metal copper processing equipment.The technical problem to be solved is that artificial secondary processing is carried out on residual copper wire, which leads to continuous taking by workers, not only increases labor cost, but also greatly affects production efficiency.Due to the excessive friction between the operating knife and the motor shaft during cutting, the operating knife is jammed, which affects the cutting efficiency, and the copper wire after cutting is easily wound on the dismantling device, which seriously affects the efficiency of copper recovery.The technical scheme is that a kind of copper-containing waste recovery metal copper processing equipment includes a shell and a rotating wheel, etc.The shell upper side middle part is rotatably connected with rotating wheel.The present application changes the angle of the second saw blade during cutting through the universal joint, prevents the excessive friction between the saw blade and the copper shaft during cutting, leads to the jamming of the first saw blade and the second saw blade, affects the cutting efficiency, and separates the copper shaft after cutting.

The invention discloses a post-etching processing method for improving copper loss in a through hole array region in a semiconductor device, which is particularly suitable for a back-end metal interconnection dual damascene process. In order to solve the problem of copper loss at the bottom of a through hole caused by insufficient conventional post-etching treatment after integrated etching and before wet stripping, an enhanced post-etching treatment step is executed after a through hole structure for exposing lower-layer copper metal is formed by integrated etching and before wet stripping. The key point of the enhancement step is to treat the exposed copper surface with a reducing plasma comprising hydrogen (H2), optionally further comprising nitrogen N2. The treatment can passivate a copper surface and / or reduce a copper compound formed in etching, so that copper loss and related through hole abnormal defects are remarkably reduced, and a process window of subsequent wet stripping is expanded, so that the reliability and the manufacturing yield of the device are improved, and the effect is particularly remarkable for a high-density through hole array.

The utility model discloses an equipotential connecting plate lap joint structure convenient to operate, which comprises a connecting wire, the connecting wire is made of copper metal, a pair of connecting structures is arranged on the connecting wire, a pair of clamping structures is arranged on the pair of connecting structures, and a pair of movable structures is arranged on the pair of clamping structures. The equipotential connecting plate lap joint structure belongs to the technical field of solar photovoltaic connection and is convenient to operate, the equipotential connecting plate lap joint structure is provided with a pair of clamping structures, connecting wires in the pair of clamping structures are connected with a hinged support, and connecting rods in the pair of connecting structures are inserted into placing grooves in connecting assemblies in the pair of clamping structures, so that the equipotential connecting plate lap joint structure is formed. The movable shaft in the combined assembly in the pair of movable structures is connected with the hinge pin of the hinged support, and then the pointed end on the movable rod can be driven to rapidly scratch the protective film on the aluminum frame of the photovoltaic module.

The utility model relates to nickel hydrogen battery technical field, concretely is a kind of square high capacity nickel hydrogen battery, including shell, the inside of shell is provided with laminated pole group, the laminated pole group is by diaphragm, positive plate and negative plate and is stacked to be formed, the top of laminated pole group is provided with hole connecting piece, the top of shell is equipped with top cover, the inside of shell is symmetrically equipped with two groups of copper metal block, the inside of two groups copper metal block is inserted with second nut, second nut connects hole connecting piece with copper metal block, and is fixed in another side by nut, the top of copper metal block is installed on top cover by first nut, hole is opened in the top cover, exhaust valve is installed in hole, the utility model discloses the setting of laminated pole group makes positive and negative plate laminated mode easy operation, and by laminated form, make full use of battery shell content space, the square battery made has the effect of high capacity, low internal resistance.

The present disclosure relates to the technical field of lithium ion batteries, in particular to a composite copper foil, a manufacturing method and a lithium ion battery. The manufacturing method of the composite copper foil comprises: taking a composite copper foil with partial copper film peeling as a quasi-base film, and attaching a polymer material to the surface of the quasi-base film to obtain a base film; and depositing a copper metal layer on the two side surfaces of the base film. The above technical solution improves the defective product into a base film by attaching a polymer material to the surface of the composite copper foil with partial copper film peeling, and further deposits a copper metal layer on the two side surfaces of the base film to obtain a composite copper foil meeting the requirements, thereby realizing the reuse of defective products and reducing the cost.