176 results about "Copper metal" patented technology

The metasurface array antenna housing comprises a plurality of array units of the same structure, each array unit sequentially comprises a first lightning protection layer from top to bottom, and each first lightning protection layer comprises four copper metal cylinders and a lightning protection top layer drainage metal patch; the second metasurface wave absorbing and transmitting layer comprises a first dielectric substrate, and four quasi-rectangular patches, four lumped resistors, four quasi-triangular patches and four quasi-square rings which are arranged on the upper surface of the first dielectric substrate; the third metasurface wave-transparent layer comprises a square metal patch, and a first circular ring and a second circular ring are etched on the square metal patch. Lightning is guided to the third metasurface wave-transparent layer through the first lightning protection layer, the lightning is conducted to other areas through the metal patch, damage of the lightning to the antenna housing is effectively avoided, and the antenna housing can directly replace a lightning protection strip for use; the structural size is greatly reduced, the angle stability is improved, and integration is facilitated; the copper-clad surface of the third metasurface wave-transparent layer can be used as a metal back plate of the second metasurface wave-absorbing layer, and structural multiplexing is achieved.

The invention relates to the technical field of etching liquid, in particular to a copper metal etching liquid composition. Comprising the following components in percentage by weight: 5-10% of hydrogen peroxide, 0.1-0.3% of a first fluorine source, 1-5% of first inorganic acid, 1-5% of alkali, 0.01-0.8% of a first metal corrosion inhibitor and the balance of deionized water; and the auxiliary agent comprises 2-8% of a second fluorine source, 10-55% of second inorganic acid, 0.1-2% of a second metal corrosion inhibitor and the balance of deionized water. The etching liquid is excellent in etching effect, CD-loss reaches 0.6-0.8 [mu] m, the slope angle reaches 40-50 degrees, the highest copper load reaches 20000 ppm, and meanwhile the problem that when copper is high, due to the fact that the nitric acid concentration is too high, metal etching is abnormal is solved.

The invention provides improved techniques for bonding devices using copper-to-copper or other types of bonds. A substrate is cleaned to remove surface oxides and contaminants and then rinsed. The rinsed substrate is provided to coating unit where a protective coating is applied to the substrate. The protective coating may be applied by immersing the substrate in a bath or via chemical vapor deposition. In an aspect, the protective coating may be copper selective so that the protective coating is only applied to copper features of the substrate. The protective coating minimizes formation of oxides and other bond weakening forces that may form during bonding processes, such as bonding a copper wire to a copper bond pad of the substrate. In an aspect, an annealing process is used to cure the protective coating and remove small imperfections and other abnormalities in the protective coating prior to the bonding process.

The invention discloses a prefabricated branch fireproof cable with a copper metal shell and a preparation method of the prefabricated branch fireproof cable. The prefabricated branch fireproof cable comprises a copper metal main shell, the bottom of the copper metal main shell is communicated with a copper metal sub-shell, a main cable is installed in the copper metal main shell, and a branch cable is installed in the copper metal sub-shell; the main cable and the branch cable both adopt copper core conductors, and copper has high conductivity, so that resistance in a current transmission process can be reduced, electric energy loss can be reduced, electric energy transmission efficiency can be improved, and stable and efficient transmission of electric power to each electric device can be ensured; the nanoscale magnesium oxide insulation powder filled in the copper metal main shell and the copper metal branch shell has excellent insulation performance, can effectively isolate electrical connection between the main cable and the branch cable and the external environment and between the main cable and the branch cable and other conductors, prevents electric leakage and short circuit accidents, and improves the electrical safety of a cable system.

The invention discloses a photosensitive type copper metal organic framework material Cu-MOF, a composite xerogel material thereof, a preparation method and application. According to the invention, a Cu-MOF composite xerogel (Cu-MOF (at) XG) material is utilized to assemble a friction nano generator (TENG), the influence of Cu-MOF (at) XG with different doping proportions on the output performance of the TENG is explored, and meanwhile, the influence of the Cu-MOF (at) XG material with the doping proportion of 10% on the output performance of the TENG under different wave band light (red light (630-640 nm), blue light (460-465 nm), purple light (380-390 nm) and white light (390-780 nm) is explored. An ultra-sensitive wearable self-powered ultraviolet sensor system is constructed by selecting a Cu-MOF (at) XG-TENG device, self power supply is realized by pressing the sensor, accurate identification of ultraviolet intensity in a special environment is realized by comparing output signals, and communication with the outside is realized by displaying an output Morse code communication signal.

The invention discloses a copper metal complex and a preparation method thereof. The copper metal complex is prepared by mixing copper powder and refractory metal powder, adding a dispersing agent and graphite and carrying out compression and vacuum sintering. The outer layer of the complex structure is copper foil, the inner layer is uniform alloy powder, the complex structure can be used as intermediate alloy for subsequent smelting, the smelting temperature is remarkably reduced, element oxidation is inhibited, and the component uniformity is improved; the method is suitable for preparing the copper-based complexes of various high-melting-point and easily-oxidized elements.

A system for dynamic oxidation of a heap of copper ore includes a “process island” for formulating and dispensing oxidizing reactive mixtures having predetermined compositions, and irrigating the heap with the mixtures to progressively transform the ore and maintain conditions for enhanced recovery of metal by heap leaching, solvent-extraction and electrowinning. In embodiments, the system is adapted to obtain copper metal from the refractory copper mineral chalcopyrite.

The present application relates to waste copper recycling processing technology field, especially to a kind of copper-containing waste recovery metal copper processing equipment.The technical problem to be solved is that artificial secondary processing is carried out on residual copper wire, which leads to continuous taking by workers, not only increases labor cost, but also greatly affects production efficiency.Due to the excessive friction between the operating knife and the motor shaft during cutting, the operating knife is jammed, which affects the cutting efficiency, and the copper wire after cutting is easily wound on the dismantling device, which seriously affects the efficiency of copper recovery.The technical scheme is that a kind of copper-containing waste recovery metal copper processing equipment includes a shell and a rotating wheel, etc.The shell upper side middle part is rotatably connected with rotating wheel.The present application changes the angle of the second saw blade during cutting through the universal joint, prevents the excessive friction between the saw blade and the copper shaft during cutting, leads to the jamming of the first saw blade and the second saw blade, affects the cutting efficiency, and separates the copper shaft after cutting.

The utility model relates to nickel hydrogen battery technical field, concretely is a kind of square high capacity nickel hydrogen battery, including shell, the inside of shell is provided with laminated pole group, the laminated pole group is by diaphragm, positive plate and negative plate and is stacked to be formed, the top of laminated pole group is provided with hole connecting piece, the top of shell is equipped with top cover, the inside of shell is symmetrically equipped with two groups of copper metal block, the inside of two groups copper metal block is inserted with second nut, second nut connects hole connecting piece with copper metal block, and is fixed in another side by nut, the top of copper metal block is installed on top cover by first nut, hole is opened in the top cover, exhaust valve is installed in hole, the utility model discloses the setting of laminated pole group makes positive and negative plate laminated mode easy operation, and by laminated form, make full use of battery shell content space, the square battery made has the effect of high capacity, low internal resistance.

The invention relates to the technical field of nanometer energy and sensing, in particular to a ferrite film direct current friction nanometer generator and a preparation method and application thereof.The ferrite film direct current friction nanometer generator comprises a positive electrode friction layer and a negative electrode friction layer, the negative electrode friction layer comprises a substrate, a conductive electrode and a functional layer, and the functional layer comprises an MZF film. The positive friction layer comprises copper metal; the functional layer of the negative electrode friction layer and the negative electrode friction layer are arranged in an opposite contact manner through a bearing type structure unit; the chemical formula of the MZF thin film is MnxZn (1-x) FeyOz, the value range of x is 0.5-0.7, the value range of y is 2-3, and the value range of z is 3-4. The MZF thin film in the nano-generator provided by the invention has a polycrystalline structure and a grain boundary interface polarization characteristic, the grain boundary interface polarization is enhanced when the temperature rises, carrier diffusion-drift balance is broken, and diffusion-dominated direct current output is realized.

A method for recovering metals from waste materials includes steps of contacting a waste material feed stream with a first lixiviant adapted to leach copper and other base metals from the waste material feed stream and provide a treated waste material feed stream, recovering copper metal from the first lixiviant, contacting the treated waste material stream with a second lixiviant adapted to leach noble metals from the treated waste material feed stream and recovering gold from the second lixiviant.

The invention provides a semiconductor metal interconnection structure, a semiconductor structure and a preparation method of the semiconductor metal interconnection structure, and cobalt metal, ruthenium metal and molybdenum metal are applied to the metal interconnection structure of a back-end process of the semiconductor structure. A main body conductive layer of a metal interconnection line with the line width not larger than (namely smaller than or equal to) 17nm in a metal interconnection layer is set as a cobalt metal interconnection layer or a ruthenium metal interconnection layer or a molybdenum metal interconnection layer, and a main body conductive layer of a metal interconnection line with the line width larger than 17nm is set as a copper metal interconnection layer, so that a composite metal interconnection layer design is realized; by combining the advantages of copper metal under large-size line width and the advantages of cobalt metal, ruthenium metal and molybdenum metal under small-size line width, the RC delay of the rear-section metal interconnection line is obviously improved, and the electromigration resistance of the rear-section metal interconnection line is improved, so that the reliability of the line is improved, and the service life of the line is prolonged.

The application discloses a kind of sulphur oxygen mixed type copper ore grading magnetic-flotation combined beneficiation method, including grinding screening, magnetic separation, grading, copper sulphide flotation, copper oxide roughing, copper oxide strengthening scavenging.The application is by using strong magnetic separation recovery part coarse grain copper oxide in mill grading system, reduce the overgrinding of copper oxide mineral in the process of grinding, realize the ability to collect early collection, improve copper oxide comprehensive recovery rate, while reducing the release of copper ions in the process of grinding, reduce the adverse effect on subsequent copper sulphide flotation.By using sodium sulphide and sodium pyrosulphite to form efficient copper oxide sulphidizing agent, the stability of the film in the sulphidation process is strengthened, and the inhibition of pyrite is also strengthened, improving the separation efficiency of copper oxide flotation.In addition, by using efficient reagents and precise control, the copper oxide concentrate is directly obtained by opening the circuit of copper oxide roughing and strengthening scavenging concentrate, reducing the copper metal loss caused by closed loop circulation.

The invention provides copper paste for a ceramic antenna, the ceramic antenna and a preparation method of the ceramic antenna, and belongs to the field of electronic paste. The copper paste is composed of spherical low-impurity copper powder, bismuth-boron-silicon lead-free glass powder containing a heavy element combination A and a rare earth element B and a composite organic solvent, the glass powder is prepared through step-by-step pre-firing, the copper paste is prepared through infiltration and mixing, and then the ceramic antenna is prepared through screen printing and nitrogen atmosphere metallization. Through copper powder characteristic optimization, glass powder functional design, organic solvent compounding and precise process regulation and control, the problems that existing silver paste is high in cost and silver migration, and existing copper paste is high in resistivity, poor in binding force and poor in printing performance are solved. The prepared metal copper layer is low in square resistance, the binding force of the ceramic body and the copper metal layer is improved, the cost is greatly reduced compared with that of traditional silver paste, and the silver paste is suitable for ceramic antenna production in the fields of consumption, communication, automobiles and the like and has remarkable industrial application value.

Disclosed herein are glass-ceramics that may include a phase assemblage including: 35 wt % to 60 wt % of a petalite crystalline phase; 20 wt % to 60 wt % of a lithium disilicate crystalline phase; and 5 wt % to 20 wt % of a residual amorphous glass phase. The glass-ceramics may further include copper metal nanoparticles dispersed in the residual amorphous glass phase. The glass-ceramics may appear red in color and comprises transmittance color coordinates in CIE LAB color space of: L* greater than or equal to 0 and less than or equal to 100; a* greater than or equal to −23 and less than or equal to 62; and b* greater than or equal to −10 and less than or equal to 60.5 at an article thickness of 0.55 mm for a CIE illuminant D65 under SCI UVC conditions and a 10 degree observer angle.

The invention relates to a copper metal etching liquid composition. Comprising the following components in percentage by weight: 8-12% of hydrogen peroxide, 0.02-0.2% of a first fluorine source, 3-8% of first organic acid, 0.1-1% of first inorganic acid, 0.5-4% of a hydrogen peroxide stabilizer, 0.01-0.5% of a first metal corrosion inhibitor and the balance of deionized water; and the auxiliary agent comprises the following components: 50-80% of second organic acid, 3-10% of second inorganic acid, 0.1-1% of a second fluorine source, 0.1-1% of a second metal corrosion inhibitor and the balance of deionized water. The etching liquid composition is used for etching copper-molybdenum titanium alloy double-layer metal (the thickness of a copper film is 3000-8000, and the thickness of a molybdenum titanium alloy film is 100-300), the highest copper load can reach 20000 ppm, CD-loss can be controlled to be 0.9-1.1 micrometers, and the slope angle reaches 40-50 degrees.

The invention discloses a composite current collector, a preparation method of the composite current collector, a pole piece and a battery. The composite current collector comprises a macromolecular base membrane layer and a central layer located on the composite current collector, the copper metal layers are positioned on two side surfaces of the macromolecular base film layer of the composite current collector; the metal diffusion barrier layers are positioned on two side surfaces of the copper metal layer of the composite current collector; the oxygen-containing sputtering layers are positioned on two side surfaces of the metal diffusion barrier layer of the composite current collector; elements on the outer side of the copper metal layer, the metal diffusion barrier layer and the inner side of the oxygen-containing sputtering layer are mutually doped to form a mixed transition structure. The copper layer, the metal diffusion barrier layer and the oxygen-containing sputtering layer form a mixed transition structure through element doping, so that a compact anti-oxidation barrier is formed, and low resistivity is kept; on the basis of oxidation resistance, the conductivity of the copper substrate is kept, and the interface energy is reduced through the mixed transition structure, so that the current collector is more stable, and the conductivity is further improved.

The invention relates to the technical field of high-temperature heat dissipation, and discloses a metal surface treatment method, surface modified metal and a heat flow component. The method comprises the steps that an active metal is adopted to conduct alloying treatment on a metal material to obtain an alloyed material, the metal material comprises at least one of aluminum metal, copper metal and titanium metal, and the adding amount of the active metal is smaller than or equal to 10 wt.% with the mass of the alloyed material as the standard; and the alloying material is subjected to dynamic surface treatment, and the temperature of the alloying material ranges from 50 DEG C to 200 DEG C or ranges from 300 DEG C to 600 DEG C. And dynamic preparation of the surface micro-nano structure can be realized.

The invention provides a catalyst as well as a preparation method and application thereof, and relates to the technical field of organic catalytic synthesis, the catalyst comprises a mesoporous zirconium-silicon composite oxide, and active metal cobalt and auxiliary metal which are loaded on the mesoporous zirconium-silicon composite oxide; the auxiliary metal comprises one or two of copper metal and nickel metal. Based on the catalyst provided by the invention, the problems of high cost, low active metal utilization efficiency, poor carrier stability and many byproducts of the catalyst in the prior art are solved.

The invention discloses a compound etching additive as well as a preparation method and application thereof, and the compound etching additive is prepared from 5-aminotetrazole, 3, 5-diamino-1, 2, 4-triazole, glucomannan, triethanolamine, ethylenediamine tetraacetic acid tetrasodium salt, diethylene glycol monoethyl ether, sodium p-hydroxybenzenesulfonate and ultrapure water. The compound etching additive disclosed by the invention has the advantages that the hydrogen peroxide is not cracked under the conditions of high temperature and low temperature for organic acid, inorganic acid and hydrogen peroxide and organic alkali and inorganic alkali and hydrogen peroxide system titanium etching liquid, so that attack and corrosion of liquid medicine to silicon nitride, silicon oxide, aluminum nitride, aluminum oxide, stainless steel and copper metal are inhibited; the corrosion rate can be greatly reduced, even part of materials are not corroded, the etching effect of the liquid medicine on the titanium layer is not affected, and the beneficial effects of improving the titanium etching rate and prolonging the service life of the bath solution are achieved.

The grid structure comprises a frame body, a pole lug is fixedly connected to the top end of one side of the frame body, main ribs are evenly and fixedly connected to the interior of the frame body at equal intervals, a honeycomb plate is fixedly connected to one side of the interior of each main rib, cooling fins are evenly and fixedly connected to one side of each honeycomb plate at equal intervals, and the cooling fins are fixedly connected to the other side of each honeycomb plate at equal intervals. And a material layer is arranged in the frame body. The plurality of groups of main ribs and reinforcing ribs are distributed in the frame body in a staggered manner, so that the overall framework strength of the frame body can be ensured, meanwhile, the honeycomb plates are arranged in the main ribs and the reinforcing ribs, the honeycomb structure in the honeycomb plates effectively disperses stress while improving the stability, and the graphite is filled in the honeycomb plates, so that the service life of the honeycomb plates is prolonged. And meanwhile, the copper metal nanoparticles are coated outside, so that the electrical conductivity and heat conduction effects of the grid plate are remarkably improved while the space of the grid structure is fully utilized.

The application discloses a preparation method of an ultrahigh-temperature ceramic combined metal modified composite material and belongs to the field of ultrahigh-temperature ceramic-metal modified composite materials, and the specific method is as follows: a 2.5D preform is obtained by needling and weaving with PAN-based carbon fibers as a matrix; a 2.5D carbon / carbon composite material is obtained by depositing pyrolytic carbon on the surface of the preform through a chemical vapor infiltration method; a 2.5D carbon / carbon-silicon carbide composite material is obtained by continuously introducing a ceramic phase through a precursor impregnation and pyrolysis method; and finally, a 2.5D carbon / carbon-silicon carbide-zirconium carbide-copper composite material is prepared by high-temperature vacuum infiltration in zirconium copper metal powder through a reaction infiltration method. The three technologies are coupled and used, which not only ensures the uniform distribution of the silicon carbide and zirconium carbide components in the composite material, but also significantly shortens the preparation period, and greatly improves the ablation resistance and mechanical properties of the material.

The utility model belongs to the field of pressure head mechanisms, and particularly relates to a pressure head mechanism of a high-frequency longitudinal welded pipe unit, which comprises a base, one side of the base is fixedly connected with a material guide mechanism, one side of the base is fixedly connected with a pressing mechanism, and one side of the base is provided with a forming mechanism. The forming mechanism is fixedly communicated with the heat supply equipment through the connecting pipe, heat generated by the heat supply equipment is conveyed into the heat storage cavity through the heat supply pipe when steel is conveyed to the position above the lower die base, a heat conduction plate can be made of copper metal materials and the like, the leading-in efficiency is improved, the heat heats the steel through a second through hole, and the forming efficiency is improved. The internal temperature of the steel plate can be uniformly distributed, the problems of stress, deformation and the like caused by temperature change in the machining or welding process are reduced, the right triangle reinforcing plate can improve the strength of the lower die base on one hand, heat can be intensively guided out through the inclined plane on the other hand, and the flowing efficiency is improved.

The application discloses a kind of advanced packaging structures of GaN integrated circuits, belong to semiconductor device packaging technical field.The structure includes copper substrate, resin insulating layer, GaN chip, second epoxy resin layer, copper circuit board structure and external filling layer;GaN chip is set on resin insulating layer by first epoxy resin layer, it has copper column pin;Copper circuit board structure is integrally formed by columnar copper metal structure being set in etching groove and being connected with copper column pin, and trapezoidal copper metal structure being set on the surface of resin layer, forms top electrical and thermal passage;External filling layer is filled between adjacent circuit structure.Preparation method includes: substrate processing, chip mounting, plastic package, surface roughening, laser etching forms groove, chemical copper deposition and copper plating, polishing, selective etching patterning and filling steps.The application significantly improves the thermal performance, electrical performance and reliability of packaging by double-sided heat dissipation and integrated copper interconnection structure.

The invention provides a circuit board structure. The circuit board structure comprises a substrate layer, a redistribution layer, a copper metal layer and a first molybdenum metal layer. The redistribution layer penetrates through the substrate layer and is provided with a first end and a second end. The copper metal layer is disposed on the first end of the redistribution layer. The first molybdenum metal layer is disposed on the copper metal layer or the second end of the redistribution layer.

The invention provides a repair process for a selective atomic layer. The repair process comprises the following steps: placing a semiconductor structure in an ALD reaction cavity, firstly introducing a first precursor to perform selective adsorption on the surface of a metal interconnection line, then introducing a second precursor to react with the first precursor adsorbed on the surface of the metal interconnection line, and repeating the steps of selective adsorption and reaction to obtain a metal atomic layer; wherein the first precursor is selected from bis (hexafluoroacetylacetone) copper (II) or (trimethylsilane methyl) copper (I); the second precursor is a reducing gas. According to the method, the specific chemical reaction between the specific precursor substance and the copper metal surface is adopted, high selectivity in the repairing process is achieved, then through the reduction reaction, the deposition reaction only occurs on the exposed surface of the copper interconnection line and in pores and gaps in the copper interconnection line and does not deposit on the dielectric layer, and then precise repairing is achieved.

This invention relates to the field of non-ferrous metal processing technology, specifically to a method for preparing antioxidant alloy copper wire. The invention involves stepwise melting of pure copper metal, pure nickel metal, zinc ingots, tin granules, copper-yttrium master alloy, and copper-boron master alloy to obtain an alloy melt; after casting, it undergoes temperature-change rotary forging, high-pressure spray cooling, and drawing to obtain a copper wire semi-finished product; the copper wire semi-finished product is then subjected to ultrasonic cleaning, drying, and gradient annealing to obtain the alloy copper wire. This invention utilizes the synergistic effect of trace elements, combined with rotary forging to densify the microstructure, cleaning to remove carbon, and dew point controlled annealing processes, to generate a dense composite oxide film in situ on the surface of the copper wire. This method endows the alloy copper wire with excellent antioxidant and corrosion resistance properties, making it suitable for large-scale industrial production.

The invention provides an ultrasonic-assisted stripping and flotation combined waste graphite negative electrode efficient separation process and equipment, and the process comprises the following steps: mixing negative electrode piece fragments with an aqueous medium to form slurry, and conveying the slurry into an ultrasonic reactor for stripping; carrying out preliminary screening on the stripped slurry, and separating graphite particles from larger copper foil fragments; the undersize liquid containing the copper cuttings and the graphite particles is fed into a flotation machine, a flotation reagent is added, flotation is carried out under the air inflation condition, and hydrophobic graphite is captured in foam and discharged as concentrate; the hydrophilic copper cuttings are left in the water phase and are discharged as tailings; collecting the concentrate, filtering, washing and drying to obtain regenerated graphite; and tailings are collected, and copper metal is recycled. The equipment comprises a crushing and screening unit, an ultrasonic stripping unit, a preliminary screening unit, a flotation separation unit and a dewatering and drying unit. According to the invention, copper and graphite can be efficiently and thoroughly separated, the separation efficiency is improved, and the purity of the separated product is improved.

The application belongs to the field of air electrode materials of zinc-air batteries, and discloses a kind of transition metal nitrogen-doped carbon nanotube array self-supporting electrode and preparation and application. First, the application dissolves poly-metallic sulfate in water according to the proportion, adjusts the acidic pH, and then reduces the metal to the working electrode under the voltage of-0.75V vs SCE. Then, the voltage of 0.3V vs SCE is applied to etch the copper metal, and a porous alloy thin film electrode is obtained. The product obtained above is subjected to chemical vapor deposition, and the target product, nitrogen-doped carbon nanotube-coated metal alloy array structure material, is obtained. The three-dimensional porous interconnected network structure promotes ion transmission and electrolyte diffusion, and combined with the metal alloy particles grown on the tip, there are more active site quantities. The active sites can better contact with the electrolyte, so that the electrode material has excellent oxygen evolution reaction (OER) and oxygen reduction reaction (ORR) performance.

The invention provides a manufacturing method of a vehicle gauge level power module, which belongs to the technical field of power modules, and comprises the following steps of: calculating a parasitic inductance predicted value of a busbar laminated structure body through a boundary element fast multi-pole hybrid algorithm, and adjusting an interlayer distance value or an insulating film thickness value according to a deviation ratio; a cross-scale collaborative simulation platform is adopted to analyze interface thermal stress distribution of a silicon nitride ceramic substrate and a copper metal layer, a particle contact interface Monte Carlo model is utilized to simulate porosity evolution in the sintering process, and a physical information neural network replaces the model to predict temperature field and pressure field evolution. And a sintering quality objective function and a mechanical performance objective function are constructed to perform multi-objective optimization, and sintering parameters are dynamically adjusted according to function values. The technical problem that parasitic inductance and sintering layer quality cannot be accurately controlled at the same time in the design and manufacturing process of the vehicle gauge level power module is solved.