Precursor compositions for the deposition of electrically conductive features

Abstract

A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and / or copper metal for the formation of highly conductive features.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Application No. 60 / 327,621 filed Oct. 5, 2001 and U.S. Provisional Patent Application No. 60 / 338,797 filed Nov. 22, 2001. The disclosure of each of these applications is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to precursor compositions that are useful for the deposition of conductive electronic features. The precursor compositions can advantageously have a low conversion temperature to enable low-temperature treatment of the precursors to form conductive features on a variety of substrates. The precursor compositions have a relatively high viscosity and can be deposited onto a substrate using methods such as thick-film deposition or syringe dispensing. [0004] 2. Description of Related Art [0005] The electronics, display and energy industries rely on the formation of coatings a...

AI Technical Summary

Benefits of technology

The present invention is about a method for depositing conductive features onto a surface using precursor compositions that can be thick-film deposited. These compositions have a low decomposition temperature, making them suitable for use on a variety of substrates, including organic substrates. The compositions can include various combinations of molecular metal precursors, solvents, micron-sized particles, nanoparticles, vehicles, reducing agents, and other additives. The precursor compositions can be deposited onto a substrate and reacted to form highly conductive features with good electrical and mechanical properties. The conductive features formed according to the present invention have good electrical properties, such as a resistivity not greater than 20 times the resistivity of the bulk conductor. The method also uses low processing temperatures and short heating times.

Problems solved by technology

Existing thick film conductor compositions cannot provide this combination of features.

These pastes provide processing temperatures close to 100° C., but offer poor reliability and performance.

Thin film techniques offer high reliability and high performance, but have a high cost and provide limited materials and geometries.

Paste compositions including conductor particles that must be sintered require firing temperatures of 600° C. or higher, limiting their application to glass or ceramic substrates.