The invention discloses
ohmic contact modified thick-film
copper paste adaptive to
spinel ceramics and a preparation method of the
ohmic contact modified thick-film
copper paste. The
ohmic contact modified thick-film
copper paste comprises 80-85 wt% of high-purity copper
powder, 0.5-1 wt% of an interface modifier, 4-7 wt% of a bonding aid, 0.3-0.8 wt% of a grain refiner, 0.2-0.5 wt% of an
antioxidant aid and 12-15 wt% of a carrier. The preparation method comprises the following steps:
drying in a high-temperature vacuum environment; weighing all the materials except the carrier, adding 4wt% of terpilenol, and stirring and mixing to obtain mixed
powder; adding the terpilenol and the
ethyl cellulose in the remaining proportion into the mixed
powder, stirring and dispersing, and
grinding for three times; after
grinding is completed, terpilenol is added, and the
viscosity of the copper paste is adjusted; the copper
slurry is filtered, and large-particle impurities and aggregates are removed; and defoaming the copper paste to obtain the modified thick-film copper paste. The method has the advantages that the interface modifier provides excellent ohmic contact performance; the sintered copper paste is high in density, low in
porosity, stable in
sheet resistance and large in through-flow density, and is obviously superior to the traditional copper paste; the grain refiner avoids
structural failure, and the long-term working reliability is improved; sn powder and copper form an
alloy, so that the service life is prolonged.