203 results about "Butyl carbitol" patented technology

The invention provides a solar cell back silver slurry which can reduce the cost, and guarantee better conductivity of a silver layer and great adhesive force with a silicon substrate, and a preparing device thereof. The solar cell back silver slurry is composed of: 65%-75% of powdery mixed materials, 8%-10% of ethyecellulose, 8%-10% of butyl carbitol, 5%-8% of terpilenol, 2%-4% of thixotropic agents and remaining weight ratio of auxiliary agents, wherein the powdery mixed materials are the mixed materials of silver-coated copper powder and glass powder, and the weight ratio between the silver-coated copper powder and the glass powder is (7-12):1. The content of pure silver in the back silver slurry is only about 35%, which is much lower than the heavy silver content of present back silver slurry, so that the usage amount of silver powder is substantially reduced, the cost of the back silver slurry is greatly reduced, and the cost pressure caused by silver cost increase can be alleviated; in addition, greater adhesive force exists between a finally prepared silver layer and the silicon substrate, and the binding property, solderability and soldering resistance are greater. The solar cell back silver slurry and the preparing device thereof are suitable for popularization in the electronic material technical field.

The present invention intends to provide a manufacturing method for a PDP that can continuously apply phosphor ink for a long time and can accurately and evenly produce phosphor layers even when the cell construction is very fine. To do so, phosphor ink is continuously expelled from a nozzle while the nozzle moves relative to channels between partition walls formed on a plate so as to scan and apply phosphor ink to the channels. While doing so the path taken by the nozzle within each channel between a pair of partition walls is adjusted based on position information for the channel. When phosphor particles is successively applied to a plurality of channels, phosphor ink is continuously expelled from the nozzle even when the nozzle is positioned away from the channels. The phosphor ink is composed of: phosphor particles that have an average particle diameter of 0.5 to 5 mum; a mixed solvent in which materials selected from a group consisting of terpineol, butyl carbitol acetate, butyl carbitol, pentandiol, and limonene are mixed; and a binder that is an ethylene group polymer or ethyl cellulose containing at least 49% of ethoxy group (-OC2H5) cellulose molecules. After dispersion a charge-removing material is added to the phosphor ink.

A semiconductor wafer cleaning formulation for use in post plasma ashing semiconductor fabrication comprising at least one organic chelating agent and at least one polar solvent, wherein the chelating agent and polar solvent are in sufficient amounts to effectively remove inorganic compound residue from a semiconductor wafer. Preferably, the chelating agent is selected from the group consisting of 2,4-Pentanedione, Malonic acid, Oxalic acid, p-Toluenesulfonic acid, and Trifluoroacetic acid; and the polar solvent is selected from the group consisting of Water, Ethylene glycol, N-Methylpyrrolidone (NMP), Gamma butyrolactone (BLO), Cyclohexylpyrrolidone (CHP), Sulfolane, 1,4-Butanediol, and Butyl carbitol.

The invention relates to a micro-emulsified cutting fluid production additive package and a preparation method and the application thereof. The additive package is composed of, by weight, 5-25 parts of higher fatty acid, 10-35 parts of alkylol amine, 3-15 parts of sodium alkane sulfonate, 5-20 parts of sorbitan monooleate, 2-15 parts of fatty alcohol-polyoxyethylene ether, 3-15 parts of coconutt diethanol amide, 3-15 parts of butyl carbitol, 1-5 parts of polyether, 0.1-0.6 part of benzotriazole, 1-5 parts of antiseptic bactericide and 3-10 parts of water. The additive package is high in emulsifying ability, high in emulsifying efficiency, and fine in hard water resistance and bubble inhibition performance in preparation of cutting fluid, and micro-emulsified cutting fluid is high in water solubility and free of coagulation, caking and precipitation.

A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose, including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder with respect to the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).

The invention discloses lead-free silver and aluminum slurry for a solar photocell. The slurry is prepared from raw materials in percent by mass as follows: 75-80% of silver powder, aluminum powder and copper powder, 15-20% of organic bond, 1-5% of inorganic glass powder, and 1-5% of additive; the purities of the silver powder, the aluminum powder and the copper powder are more than or equal to 99.9%; the organic bond is prepared from the following materials in percent by mass of: 0.5-2% of butyl carbitol, 1-2.5% of resin, 1-4% of rosin, 11-13% of ethylene glycol monomethyl ether, 5-9% of diethylene glycol monobutyl ether, 65-75% of cyclohexanone and 10-20% of n-butyl alcohol; the inorganic glass powder is prepared from the following materials in percent by mass of: 1-3% of titanium dioxide, 55-75% of boric acid, 3-5% of aluminium sesquioxide, 15-25% of antimony oxide and 2-5% of zirconium oxide; and the additive is prepared from the following materials in percent by mass of: 35-45% of span and 55-65% of pump oil. The lead-free silver and aluminum slurry prepared by the raw material has the advantages of good weldability and strong adhesion and meets the lead-free environmental friendless requirement.

The invention provides a ceramic surface material. The ceramic surface material comprises 20.0wt%-70.0wt% of organosilicone, 20.0wt%-70.0wt% of an organic solvent, 10wt%-50wt% of filler and 0.1wt%-3.0wt% of an auxiliary, wherein the organic solvent is selected from one or more of butyl acetate, dimethylbenzene, n-butyl ether, butyl carbitol acetate, hexahydrotoluene, normal octane and butyl titanate; and the filler consists of graphene, graphite, transition group metallic oxide, composite silicate, rare earth oxide, nonmetal and metal. The components in the ceramic surface material cooperatively interact, and the ceramic surface material has good overall performance when used as a coating.

Disclosed is a liquid detergent composition which contains: a component (A) that is composed of a nonionic surfactant represented by formula {R1O(CH2CH2O)nH}; a component (B) that is composed of at least one anionic surfactant selected from the group consisting of compounds represented by formula {R2CH(SO3M1)COOR3} and compounds represented by formula {R4CH(SO3M2)CONHR5}; and a component (C) that is composed of at least two water-miscible solvents selected from the group consisting of methanol, ethanol, propanol, butanol, ethylene glycol, propylene glycol, butylene glycol, butyl carbitol, phenoxyethanol and polyethylene glycols having an average molecular weight of 570-3800. The total of the component (A) and the component (B) contained in the liquid detergent composition is 40-75% by mass, and the mass ratio of the component (B) to the total of the component (A) and the component (B) contained in the liquid detergent composition, namely component (B)/ {component (A) + component (B)} is within the range from 1/10 to 6/10.

The invention relates to an unleaded back silver paste used for a crystalline silicon solar cell and a preparation method of the unleaded back silver paste used for the crystalline silicon solar cell. Raw materials comprise 60 parts of aluminum powder, 29-42 parts of organic binding agents and 1-10 parts of inorganic binding agents, the organic binding agents comprise 40-70 parts of terpilenol, 5-10 parts of butyl carbitol, 5-10 parts of butyl carbitol acetic ester, 3-10 parts of ethyl cellulose, 5-15 parts of diethyl phthalate and 2 parts of sorbitol anhydride stearate, and the inorganic binding agents comprise 30-60 parts of Bi2O3, 5-15 parts of B2O3, 1-2 parts of NaF, 10-20 parts of SiO2, 5-10 parts of ZnO, 1-5 parts of TiO2, 10-20 parts of Al2O3 and 2 parts of P2O5. After being mixed evenly, the components are rolled until the fineness degree is smaller than or equal to 10 microns, and viscosity is 30-100 Pa.s. The unleaded back silver paste used for the crystalline silicon solar cell is high in adhesive force and good in weldability and welding resistance.

The invention provides low-expansion-coefficient insulating medium slurry. The low-expansion-coefficient insulating medium slurry is prepared from the following materials in percentage by weight: 8%-45% of an organic carrier, 55%-90% of glass powder, 0-5% of an auxiliary agent and 0-5% of a colorant; the organic carrier is prepared from the following materials in percentage by weight: 45%-60% of terpineol, 15%-25% of texanol, 5%-15% of butyl carbitol acetate,1%-10% of butyl carbitol and 4%-15% of ethyecellulose; and the glass powder is prepared from the following materials in percentage by weight: 50%-75% of silicon dioxide (SiO2), 10%-25% of aluminum oxide (Al2O3), 5%-15% of boron oxide (B2O3), 0-15% of calcium oxide (CaO), 0.1%-5% of strontium oxide (SrO), 0.1%-10% of zinc oxide (ZnO) and 0-5% of a fluxing agent. Glass glaze formed by the medium slurry has good acid and alkali corrosion resistance, good insulation, good water resistance and good gas resistance, a circuit on the surface of electronic ceramic can be effectively protected against corrosion damage, and short-circuiting or electric leakage of the circuit is prevented.

The invention discloses a preparation method of silver-doped modified ruthenium dioxide thick-film resistance slurry. The method specifically comprises the following steps of: 1, using RuO2 powder, CuO powder and Ag powder to prepare a conductive phase; 2, using SiO2, Al2O3, CaO, BaO, B2O3, PbO and Bi2O3 to prepare a modified aluminosilicate glass phase; 3, using terpilenol, cellulose, butyl carbitol and castor oil to prepare an organic phase; and 4, uniformly mixing the conductive phase obtained in the step 1, the modified aluminosilicate glass phase obtained in the step 2 and the organic phase in the the step 3 to obtain the silver-doped modified ruthenium dioxide thick-film resistance slurry. According to the invention, the problem that a contradiction exists between low resistance and high TCR of the present thick-film resistance slurry is solved, the preparation method has no specific demands on the production process and device, and the popularization and the industrial production are facilitated.

The invention relates to a process for extracting, separating and purifying Ag, Au, Pd and Pt. The process comprises the following steps of: precipitating and separating Ag in the form of AgC1, then adding ammonia water for dissolving, reducing hydrazine hydrate to obtain Ag; extracting by using dibutyl carbitol, and back-extracting Au with 5 percent of oxalic acid with a direct acceptance rate of more than or equal to 99.9 percent; extracting Pd with n-octyl sulfur ether, wherein the extraction rate of palladium is more than or equal to 99.99 percent, and then back-extracting the palladium with 3mol/L ammonia water; and finally, extracting Pt with tri-n-octylamine, back-extracting platinum with alkaline water and reducing to obtain platinum.

A low-silver-bearing printed circuit board silver paste comprises, by weight, 1 part to 2 parts of glucose, 20 parts to 30 parts of nanoscale sheet cooper powder, 30 parts to 40 parts of 1-micrometer to 20-micrometer sheet silver powder, 13 parts to 16 parts of glass powder, 5 parts to 7 parts of hyperbranched polyester resin, 5 parts to 8 parts of terpilenol, 2 parts to 5 parts of sulfo-diglycol, 2 parts to 4 parts of bisphenol A epoxy resin, 6 parts to 8 parts of butyl carbitol, 7 parts to 9 parts of acetic ether, 1 part to 2 parts of nanometer titania, 1 part to 2 parts of nanometer crystalline cellulose, 3 parts to 5 parts of nanometer tantalum carbide powder and 3 parts to 5 parts of nanometer niobium carbide powder. According to the low-silver-bearing printed circuit board silver paste, the nanoscale sheet copper powder, the nanometer tantalum carbide powder and the nanometer niobium carbide powder are added, so that the good conductive performance is kept, and the use amount of the silver powder is saved; the glass powder does not contain lead and is environmentally friendly and good in caking property, and a circuit is firm; the organic vehicle solvents are sequentially volatilized, the high temperature resistance is good, the printing performance is good, and the circuit yield is high.

The invention relates to crystalline silicon solar cell back surface field aluminum paste and a preparation method thereof. The crystalline silicon solar cell back surface field aluminum paste comprises, by weight, 74 parts of aluminum powder, 20-25 parts of organic bonds, 1-4 parts of lead-free glass powder and 0.1-2 parts of additives, wherein the organic bond comprises, by weight, 40-70 parts of terpineol, 5-10 parts of butyl carbitol, 5-10 parts of butyl carbitol acetic ester, 3-10 parts of ethyl cellulose, 5-15 parts of dibutyl phthalate and one part of sorbitol anhydride stearate; the lead-free powder comprises, by weight, 30-60 parts of Bi2O3, 5-15 parts of B2O3, 3 parts of BiF3, 10-20 parts of SiO2, 5-10 parts of ZnO, 1-5 parts of TiO2, 10-20 parts of Al2O3 and 1-3 parts of P2O5; and the additive is spherical copper powder with the purity larger than 99% and the fineness being 20000 meshes. The aluminum powder, the organic bonds, the lead-free glass powder and the additives are evenly mixed and then rolled by a three-roll grinder until the fineness is smaller than or equal to 10 mum and the viscosity is 30-60Pa*s. The crystalline silicon solar cell back surface field aluminum paste is high in photoelectric conversion efficiency and adhesive force, the adhesive force conversion efficiency after high temperature aging declines, and the water-boiling resistance is good.

The invention discloses a lead-free aluminum electrode paste for a PTC thermistor and the preparation method, the electrode paste is composed of the raw materials with the following parts by weight: 55 to 70 parts of aluminum powder, 10 to 20 parts of inorganic binder, 15 to 25 parts of organic binder and 2 to 4 parts of auxiliary; wherein, the organic binder is composed of 2 to 5 parts by weight of ethyl cellulose, 3 to 6 parts by weight of butyl carbitol, 15 to 23 parts by weight of butyl carbitol acetate, 2 to 4 parts by weight of benzyl alcohol, 60 to 70 parts by weight of terpineol, 0.5 to 2 parts by weight of phenolic resin and 1 to 4 parts by weight of castor oil; and the auxiliary is composed of 30 to 50 parts by weight of Bi2O3 and 50 to 70 parts by weight of phosphorus red. The electrode paste can prepare the aluminum conductive paste by rolling, an aluminum electrode can be formed by screen printing and sintering on a doped barium titanate semiconductor substrate within the range of 630 plus or minus 20 DEG C, the electrode and the substrate form good ohmic contact, the adhesion is good, the aluminum membrane dose not shed, and the long-term placement of the electrode has no oxidation.

The invention discloses silicon carbide-silver palladium composite resistor paste. The composite resistor paste comprises a resistance functional phase and an organic carrier, wherein the resistance functional phase comprises superfine silver powder, nano-palladium powder, superfine silicon carbide powder and lead-free glass powder, the organic carrier comprises resin, a solvent and an additive, the resin is ethyl cellulose, the solvent is formed by mixing one or more of butyl carbitol, terpilenol and a DBE solvent, and the additive comprises a liquid defoaming agent, a liquid flatting agent and a dispersing agent. The invention also discloses a preparation method of the composite resistor paste. With the composite resistor paste prepared according to the method, the technical problem of difficulty in thin and light of the prior art can be effectively solved, direct silk printing or spraying can be performed, the technical development requirements of an electric heater tending to miniaturization, thinness and lightness are satisfied, and the composite resistor paste is wide in application range.

The invention belongs to a photocell electrode material, and discloses silver slurry for a crystalline silicon solar cell. The silver slurry is prepared from, by weight, 40-60 parts of silver powder, 5-10 parts of tin powder, 10-20 parts of silver coated aluminum alloy powder, 1-5 parts of a lithium iron phosphate and carbon nanotube composite material, 1-8 parts of glass powder, 0.5-2 parts of silane coupling agent KH560, 8-10 parts of butyl carbitol, 1-5 parts of ethylene glycol butyl ether, 1-3 parts of lecithin, 0.1-0.5 part of ethyl cellulose and 0.25-1 part of fumed silica. The invention further discloses a preparation method of the silver slurry. The obtained silver slurry is free of lead and completely meets the environment protection requirement; when the silver slurry is applied to production of the solar cell, the adhesion of the silver slurry on the surface of the solar cell is high, and the photoelectric conversion efficiency of the solar cell is high; meanwhile, the technology is simple, the cost is low, and therefore the silver slurry has a wide application prospect.

The invention discloses a water-based circuit board cleaning agent and a preparation method thereof. The water-based circuit board cleaning agent comprises the following components in parts by weight: 25-35 parts of 3-methoxy-3-methyl-1-butanol, 15-20 parts of butyl carbitol, 3-8 parts of fatty alcohol-polyoxyethylene ether, 1-1.5 parts of chelating agent, 5-10 parts of cosolvent, 2-5 parts of isopropanol and 30-45 parts of deionized water. The preparation method of the water-based circuit board cleaning agent comprises the following steps: firstly, mixing the chelating agent with the deionized water, heating to 40-45 DEG C and stirring for 6-12 minutes; secondly, controlling the temperature within the range from 28 DEG C to 31 DEG C, adding the fatty alcohol-polyoxyethylene ether, the cosolvent, the 3-methoxy-3-methyl-1-butanol, the butyl carbitol and the isopropanol, continuously stirring for 1 hour and then standing for 10-15 minutes to obtain the water-based circuit board cleaning agent. The preparation method of the water-based circuit board cleaning agent disclosed by the invention has the beneficial effects of simple steps and stable process, and prepared product is environment-friendly and harmless, high in cost performance and high in cleaning ability.

The invention discloses a preparation method of an organic carrier. The preparation method comprises the following steps: (1) determination of a thickening agent: adopting ethyl cellulose as the thickening agent; (2) selection of organic solvents: adopting tributyl citrate, butyl carbitol, terpilenol and the like as the solvents; (3) selection of other auxiliary agents; and (4) preparation of a formula: dissolving the carrier by adopting the following components in percentage by weight: 8% of ethyl cellulose, 12% of tributyl citrate, 21% of butyl carbitol, 57% of terpilenol and 2% of the auxiliary agents. By adopting the organic carrier in a process disclosed by the invention, slurry has proper viscosity, volatility, thixotropy and levelling properties so as to obtain good printing performance, and a membrane layer subjected to silk-screen printing is uniform, compact, clearer and smoother.

The invention discloses a heat-insulating and mildew-resistant water-based paint for a glass door. The water-based paint is characterized by being prepared from the following raw materials in parts by weight: 23-26 parts of an epoxy resin emulsion, 40-45 parts of water-based amino-alkyd resin, 0.3-0.5 part of a flatting agent BYK-307, 1-2 parts of zinc powder, 0.5-1.0 part of a silane coupling agent NQ-71, 0.2-0.3 part of nanometer ground calcium carbonate, 0.2-0.4 part of a polyacrylate thickener, 0.4-0.7 part of hollow glass powder, 0.2-0.3 part of polyoxyethylene monoleate, 0.3-0.5 part of ceramic powder microsphere, 0.1-0.3 part of polymeric microspheres, 0.2-0.4 part of sodium diacetate, 2-3 parts of butyl carbitol, 0.2-0.4 part of liquid paraffin, 2-3 parts of ethylene glycol monobutyl ether, 0.1-0.3 part of fatty acid polyethylene glycol ester, 3-5 parts of a modified nanometer titanium dioxide photocatalyst, 1-2 parts of a pigment and 12-15 parts of deionized water. The added modified titanium dioxide photocatalyst has the functions of effectively purifying air, removing stink and odor, killing a plurality of bacteria and preventing mildew; a good thermal insulation effect is achieved by combined action of added hollow glass powder, ceramic powder microspheres and polymeric microspheres; the production cost of the paint is reduced; and the paint disclosed by the invention is excellent in various performances, does not contain a special odor, is safe and non-toxic, and can be widely applied to glass for home decoration.