This invention belongs to the field of printed circuit technology and provides a
copper electronic paste for glass-based printed circuits and its preparation method. The
copper electronic paste for glass-based printed circuits includes composite modified
copper powder, modified glass
powder, and an organic carrier. The composite modified copper
powder is composed of modified spherical copper powder and modified flake copper powder. The modified spherical copper powder is obtained by modifying spherical copper powder with an organic
titanate, and the modified flake copper powder is obtained by modifying flake copper powder with a
silicate. The modified glass powder is obtained by modifying glass powder with polyethyleneimine and a
phosphate coupling agent. The glass powder is obtained by mixing B2O3, Bi2O3, ZnO, SiO2, Al2O3, P2O5, TiO2, ZrO2, La2O3, and MoO3 and then melting, water
quenching,
drying, and
grinding. The organic carrier includes
terpineol,
butyl carbitol acetate,
ethyl cellulose, and a thixotropic agent.