Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof

A technology of dielectric paste and thick film circuit, which is applied in the direction of circuits, electrical components, electric solid devices, etc. It can solve the problems of reduced thermal conductivity, the working environment temperature of electronic components should not be too high, and the circuit is easy to foam, etc., to achieve insulation resistance High, excellent thixotropy and anti-settling effect, the effect of high breakdown strength
CN101740160AInactive Publication Date: 2010-06-16湖南利德电子浆料股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
湖南利德电子浆料股份有限公司
Publication Date
2010-06-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses dielectric paste for a metal aluminum substrate thick film circuit and a preparation method thereof. The invention aims to prepare the dielectric paste matched with a metal aluminum substrate. The dielectric paste is characterized in that SiO2, Na2O, B2O3, K2O, BaO, CaO, Co2O3, TiO2, P2O5, V2O5, Sb2O3 and Cr2O3 are combined to prepare microcrystalline glass powder; and the microcrystalline glass powder and an organic binder which consists of terpinol, butyl carbitol, butyl carbitol acetate, tirbutyl citrate, 1,4-butyrolactone, nitroncellulose, ethyecellulose, hydrogenated castor oil and lecithin are put in a vessel for stirring and rolling by a three-roll roller mill in a weight ratio of the microcrystalline glass powder to the organic binder of 70-90 parts: 30-10 parts so as to prepare the finished product dielectric paste. The dielectric paste is mainly used as the dielectric paste of the thick film circuit formed by being printed on the metal aluminum substrate.
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Description

technical field

[0001] The invention relates to a dielectric slurry and a preparation method thereof, more specifically, to a dielectric slurry for a metal aluminum substrate thick-film circuit and a preparation method thereof. Background technique

[0002] With the development of multilayer and miniaturization of thick film circuit components, corresponding mechanical and thermal performance requirements are put forward for the substrate, especially the thermal conductivity requirements of the substrate. The metal aluminum plate has the properties of low density, good ductility and good thermal conductivity, which make it possible to be used as a substrate material, but it also brings problems such as the mismatch between the expansion coefficient and the commonly used electronic paste.

[0003] Metal aluminum as a substrate material puts forward technical requirements different from general dielectric pastes for the preparation of thick-film integrated circuit dielectric p...

Claims

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