Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof

A technology of dielectric paste and thick film circuit, which is applied in the direction of circuits, electrical components, electric solid devices, etc. It can solve the problems of reduced thermal conductivity, the working environment temperature of electronic components should not be too high, and the circuit is easy to foam, etc., to achieve insulation resistance High, excellent thixotropy and anti-settling effect, the effect of high breakdown strength

Inactive Publication Date: 2010-06-16
湖南利德电子浆料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the thick film circuit, it is mainly used as a heat dissipation material, or it is mechanically bound with the circuit module, or the circuit module is combined with the aluminum plate by SMT technology, but the epoxy glue between the circuit and the aluminum plate in the mechanical binding and SMT method Both will cause a decrease in thermal conductivity. At the same time, the circuit is easy to bubble and cause waste in the SMD technology process, and the working environment temperature of electronic components cannot be too high, so the application is also limited.

Method used

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  • Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof
  • Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof

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preparation example Construction

[0020] The preparation method of the dielectric slurry for thick-film circuit of metal aluminum substrate of the present invention is characterized in that the following steps:

[0021] (1) To prepare glass-ceramic powder, mix the components of glass-ceramic powder in the mixer according to the above-mentioned ratio range, and then put them into a high-temperature electric furnace for smelting, quench the melt obtained in water to obtain glass micro-slag, and mix the glass-ceramic powder with water. The fine slag is ground in a ball mill to obtain glass-ceramic powder with an average particle size not greater than 5 microns;

[0022] (2) Prepare an organic binder, mix and dissolve each composition of the organic binder in a water-bath furnace according to the above ratio range to form an organic binder and control its viscosity to be 100-300mPa·s;

[0023] (3) Put the prepared glass-ceramic powder and organic binder in the container according to the above-mentioned ratio range...

example 1

[0026] Preparation of glass-ceramic powder, composition and weight ratio of glass-ceramic powder: SiO 2 20 parts, Na 2 O 20 parts, K 2 O 15 parts, BaO 1 part, CaO 3 parts, TiO 2 20 copies, P 2 o 5 5 copies, V 2 o 5 10 parts, Sb 2 o 3 5 parts; the above composition is placed in a high-temperature electric furnace, the melting temperature is 1350 ° C, heat preservation for 1 hour, water quenching, to obtain glass slag, and the glass slag is ground in a ball mill to obtain glass ceramics with an average particle size of no more than 5 microns pink;

[0027] Preparation and dissolution process of organic binder, composition and weight ratio of organic binder: 75 parts of terpineol, 10 parts of butyl carbitol acetate, 10 parts of tributyl citrate, 1,4-butyl 1 part of lactone, 3 parts of nitrocellulose, 0.6 part of hydrogenated castor oil, and 0.4 part of lecithin. The dissolution process is to mix, stir and dissolve the above-mentioned composition in a water bath furnace a...

example 2

[0034]Weight ratio of glass-ceramics: SiO 2 40 parts, Na 2 O 10 parts, B 2 o 3 10 copies, K 2 20 parts of O, 5 parts of BaO, Co 2 o 3 5 parts, TiO 2 3 copies, V 2 o 5 1 part, Sb 2 o 3 3 copies;

[0035] Organic binder weight ratio and dissolution process: 40 parts of terpineol, 30 parts of butyl carbitol, 10 parts of butyl carbitol acetate, 10 parts of tributyl citrate, 1,4-butyrolactone 2 parts, 5 parts of ethyl cellulose, 2 parts of hydrogenated castor oil, and 1 part of lecithin. The dissolution process is to mix, stir and dissolve the components of the above-mentioned organic binder in a water bath furnace at a temperature of 90 ° C, and keep it warm. 4 hours.

[0036] The weight ratio of glass-ceramic powder and organic binder in the slurry mixing process is 70 parts: 30 parts, and the solid content of the medium slurry of output is 70%, all the other are the same as example 1

[0037] The performance list of media slurry is as follows:

[0038] col...

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Abstract

The invention discloses dielectric paste for a metal aluminum substrate thick film circuit and a preparation method thereof. The invention aims to prepare the dielectric paste matched with a metal aluminum substrate. The dielectric paste is characterized in that SiO2, Na2O, B2O3, K2O, BaO, CaO, Co2O3, TiO2, P2O5, V2O5, Sb2O3 and Cr2O3 are combined to prepare microcrystalline glass powder; and the microcrystalline glass powder and an organic binder which consists of terpinol, butyl carbitol, butyl carbitol acetate, tirbutyl citrate, 1,4-butyrolactone, nitroncellulose, ethyecellulose, hydrogenated castor oil and lecithin are put in a vessel for stirring and rolling by a three-roll roller mill in a weight ratio of the microcrystalline glass powder to the organic binder of 70-90 parts: 30-10 parts so as to prepare the finished product dielectric paste. The dielectric paste is mainly used as the dielectric paste of the thick film circuit formed by being printed on the metal aluminum substrate.

Description

technical field [0001] The invention relates to a dielectric slurry and a preparation method thereof, more specifically, to a dielectric slurry for a metal aluminum substrate thick-film circuit and a preparation method thereof. Background technique [0002] With the development of multilayer and miniaturization of thick film circuit components, corresponding mechanical and thermal performance requirements are put forward for the substrate, especially the thermal conductivity requirements of the substrate. The metal aluminum plate has the properties of low density, good ductility and good thermal conductivity, which make it possible to be used as a substrate material, but it also brings problems such as the mismatch between the expansion coefficient and the commonly used electronic paste. [0003] Metal aluminum as a substrate material puts forward technical requirements different from general dielectric pastes for the preparation of thick-film integrated circuit dielectric p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/08C09J11/06C09J9/00H01L27/00C03C12/00
Inventor 杨华荣刘飘
Owner 湖南利德电子浆料股份有限公司
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