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Method for preparing paste soldering flux

A flux and paste-like technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of viscosity rise and other problems, achieve good thixotropy, stable viscosity, and avoid post-thickening phenomenon

Active Publication Date: 2012-06-27
厦门市及时雨焊料有限公司
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, after the flux is stored and stirred into solder paste, it continues to function, forming a new gel thixotropic structure, which increases the viscosity

Method used

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  • Method for preparing paste soldering flux

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Embodiment 1

[0035] Embodiment 1 preparation technology:

[0036] Add rosin and solvent into the reaction kettle, turn on the anchor paddle and serrated paddle, stir and heat to 150°C, cool to 80°C after the rosin is completely dissolved, add amine activator and stir until completely dissolved, cool to 50°C , add powdered thixotropic agent, open the high-speed shear emulsification mechanism and carry out constant temperature emulsification and dispersion at 50°C for 2 hours, the thixotropic agent is activated, close the high-speed shear emulsification mechanism, add organic acid activator, corrosion inhibitor, and Turn on the anchor stirring paddle and the sawtooth paddle and stir for 1 hour to fully chemically react the organic acid activator and the amine activator. Turn off the sawtooth stirring paddle, keep the anchor stirring on, vacuumize while cooling down, cool to 25°C, grind with a three-roller grinder, test with a scraper fineness agent, and the paste fineness is less than 10 μm ...

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Abstract

The invention provides a method for preparing a paste soldering flux. The soldering flux comprises the following raw materials: resin, a solvent, an amine activating agent, a thixotropic agent, an organic acid activating agent and a corrosion inhibitor. The preparation method comprises the following steps of: a) stirring the resin and the solvent, heating until the resin is dissolved completely, cooling, adding the amine activating agent, and stirring until the amine activating agent is dissolved completely; b) adding the thixotropic agent, and emulsifying and dispersing by using emulsification equipment at constant temperature, so that the thixotropic agent forms a thixotropic gel network structure; c) adding the organic acid activating agent, reacting with the amine activating agent to form a salt compound, and adding the corrosion inhibitor and stirring to dissolve the salt compound; and d) stirring and cooling slowly to room temperature to obtain the paste soldering flux. The prepared paste soldering flux is mainly applied to soldering paste formed by stirring and mixing the paste soldering flux and superfine solder powder under vacuum, and has high heat collapse resistance, and high viscosity stability in the processes of storage and printing to avoid the 'post-thickening' phenomenon.

Description

technical field [0001] The invention belongs to the field of solder paste for soldering in the electronic industry, and in particular relates to a preparation method of paste flux. The flux is mainly used in the preparation of solder paste, especially for surface mount technology in the electronics industry. Background technique [0002] The electronics industry needs to install a large number of electronic components on the printed circuit board by soldering. Good and reliable solder joint formation requires wetting, diffusion and metallurgical bonding of molten solder on very clean metal surfaces. The possibility of oxidation of printed circuit boards, electronic components, or metal surfaces of soldered materials during manufacturing, storage, and transportation is almost 100%. Therefore, the treatment of the oxide layer on the surface of the welding material is very critical in the production of the electronics industry. It is often necessary to use a large amount of f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 孙洪日罗礼伟郑序漳
Owner 厦门市及时雨焊料有限公司
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