The invention discloses a
dielectric slurry for aluminum
alloy substrate thick-film circuits and a preparation process thereof. The
slurry is composed of the following components: 60-75% of glass-
ceramic powder and 25-40% of binder; wherein, Glass-
ceramic powder is composed of SiO2, Bi2O3, B2O3, BaO, CaO, ZnO, Al2O3, V2O5, TiO2, Co2O3. The glass-
ceramic powder prepared by using the above raw materials has a low
melting temperature, so that the
sintering temperature is lower than the
melting temperature of the aluminum
alloy substrate when the
dielectric layer is prepared, and the substrate will not be damaged when the
dielectric layer is prepared. In addition, the raw materials do not contain lead, which meets
environmental protection requirements. . The
thermal expansion coefficient of the obtained
dielectric layer matches the aluminum
alloy substrate, has good bonding performance, and can form a
solid network structure, making the composite glass-ceramic insulating medium have excellent
hardness and flexibility, which can meet the requirements of high-power aluminum
alloy substrate thick film Special requirements when the circuit is in a harsh
working environment. At the same time, the preparation process of the
slurry is simple and easy to produce, and the obtained medium slurry has excellent performance.