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High-thermal-conductivity dry mica tape and preparation method therefor

A low-glue mica tape, high thermal conductivity technology, used in mica, insulators, electrical components, etc., can solve the problems of difficult to increase the volume filling of fillers, poor composite performance, etc., to improve design power, excellent electrical performance, and increase service life. Effect

Active Publication Date: 2016-06-01
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Judging from the existing domestic patent literature on high thermal conductivity mica tape, it is mainly a method of directly filling thermal conductive fillers with adhesives. Generally, the increase in filler content is limited by the content of adhesives; It is difficult to increase the volume filling amount, even if the filling amount is increased, it will cause poor composite performance

Method used

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  • High-thermal-conductivity dry mica tape and preparation method therefor
  • High-thermal-conductivity dry mica tape and preparation method therefor
  • High-thermal-conductivity dry mica tape and preparation method therefor

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preparation example Construction

[0033] The preparation method of above-mentioned high thermal conductivity little glue mica tape, comprises the following steps:

[0034](1) Surface treatment of the selected thermally conductive filler with a surface treatment agent; the selected surface treatment agent is an ethanol solution of silane coupling agent KH-560, and the amount of silane coupling agent is 3% to 5% of the mass of the thermally conductive filler , the amount of ethanol is 1 to 3 times the volume of the thermally conductive filler; the specific operation for surface treatment is: add the thermally conductive filler to the surface treatment agent for ball milling for 2h to 5h, and then put it into the oven after vacuum filtration (the oven temperature is 90°C or so), and finally take it out and seal it for later use;

[0035] (2) Evenly disperse the thermally conductive filler after the above-mentioned surface treatment in the binder to obtain a filler-containing glue for subsequent use; the selected ...

Embodiment

[0042] a kind of like figure 1 The high thermal conductivity mica tape with less glue of the present invention is shown. The mica tape is composed of mica paper 11, adhesive layer 12 and fiber cloth layer 13, and the mica paper 11, adhesive layer 12 and fiber cloth layer 13 are stacked sequentially from bottom to top, and the fibers The surface of the cloth layer 13 is uniformly coated with thermally conductive fillers, and the adhesive layer 12 is superimposed on the fiber cloth layer 13 coated with thermally conductive fillers. The mica paper 11 in this embodiment is non-calcined mica paper, and the thickness of the mica paper 11 is 0.10mm. The adhesive layer 12 is mainly composed of a mixture of polyester resin and epoxy resin. The matrix of the fiber cloth layer 13 is electrical non-alkali glass fiber cloth, and the thickness of the matrix of the fiber cloth layer 13 is 0.04mm.

[0043] The preparation method of the above-mentioned high thermal conductivity less glue mic...

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Abstract

The invention discloses a high-thermal-conductivity dry mica tape, and the dry mica tape consists of mica paper, an adhesive layer, and a fiber cloth layer. Moreover, the mica paper, the adhesive layer and the fiber cloth layer are sequentially overlapped from the bottom to the top. The surface of the fiber cloth layer is uniformly coated with a heat conduction filling material, and the adhesive layer and the fiber cloth layer coated with the heat conduction filling material are overlapped. The preparation method for the mica tape comprises the steps: firstly carrying out the surface treatment of a selected heat conduction filling material through employing a surface treating agent; secondly dispersing the processed heat conduction filling material in an adhesive uniformly, and enabling the obtained adhesive liquid containing the filling material to coat the surface of prepared fiber cloth; thirdly carrying out the baking of the fiber cloth coated with the adhesive liquid, coating one face of the surface with the adhesive, carrying out the surface treatment of the composite mica paper through the adhesive, and obtaining an initial finished product of the mica tape; finally carrying out baking, winding and cutting, and obtaining the finished product of the high-thermal-conductivity dry mica tape. The high-thermal-conductivity dry mica tape is excellent in electrical performances and composite performances, is not layered, does not cause powder to fall, and is stable in quality.

Description

technical field [0001] The invention relates to a mica tape and a preparation process thereof, in particular to a heat-conducting and less adhesive mica tape and a preparation method thereof. Background technique [0002] As the key material of the motor, the mica tape is a polymer-based composite material with poor thermal conductivity. During the long-term high-intensity operation of the motor, the motor will generate a high temperature rise (the temperature of a certain part of the motor and the surrounding cooling medium temperature difference), the long-term high-temperature environment will cause the main insulation material of the motor to age, which will affect the service life of the motor. [0003] Mica tape is generally a composite material composed of mica paper, reinforcing materials, and adhesives. In the composite material of mica tape, the thermal conductivity of the adhesive and the reinforcing material are relatively small. The key to the research and dev...

Claims

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Application Information

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IPC IPC(8): H01B17/60H01B3/04H01B3/08H01B19/00
Inventor 李忠良黄友根曾亮李鸿岩
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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