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2362results about "Insulating bodies" patented technology

Resin inner member-provided grommet

A locking claw (23a) to be locked to a through-hole (H) projects outwardly from a peripheral wall (21) of a resinous inner member (20). At least one pair of locking holes (24) is formed on a locking flange part (22) projecting from the peripheral wall (21). An annular concavity (12a) (13a), on which the locking flange part (22) fits, is formed on an inner peripheral surface of a large-diameter cylindrical part (12, 13). Locking projections (12a-1, 13a-1) project from a leading end of a side wall of the annular concavity (12a, 13a). The locking projections (12a-1, 13a-1) are inserted into and locked with the locking holes (24). Locking claws (123a-126a) project from the resinous inner member (120) and are locked to a through-hole (H1) of the body panel (P1). A pair of flexible locking pieces (123-126), to be locked to the body panel (P1), project from each of a shorter side and a longer side of an elliptic peripheral wall (121) of the resinous inner member (120) projecting from an open end of the large-diameter cylindrical part (112, 113). A leading end of the locking pieces (123-126) project outwardly from an intermediate position of an outer surface of the locking pieces (123-126). The locking pieces on the longer side are curved longitudinally to form a circular arc shape.
Owner:SUMITOMO WIRING SYST LTD

Insulating adhesive film for laminated bus bar and laminated bus bar

The invention relates to an insulating adhesive film for a laminated bus bar. The insulating adhesive film comprises an insulating film layer, and a hardened or semi-hardened adhesion agent layer which coats on the insulating film layer, wherein the thickness of the insulating film layer is 0.025-0.50mm; the thickness of the adhesion agent layer is 0.010-0.1mm; the formula of the adhesion agent layer comprises the following raw materials by weight percent: 20-50% of saturated polyester resin A, 5-30% of saturated polyester resin B, 2-20% of epoxy resin, 1-10% of isocyanate, 20-70% of a fire retardant and 0.05-5% of a dispersing agent; the limiting viscosity of the saturated polyester resin A is 0.2-1.2dl/g; the glass transition temperature Tg is -40 DEG C to 50 DEG C; the limiting viscosity of the saturated polyester resin B is 0.2-1.2dl/g; the glass transition temperature Tg is 51 DEG C to 100 DEG C; and the number-average molecular weight of epoxy resin is 500-70,000. The adhesion agent layer of the insulating adhesive film has the characteristics of after-tack resistance, insulativity, good fire resistance and the like, and has the characteristics of high adhesion with a metal plate, excellent bending processability, cold and hot shock resistance and the like after the laminated bus bar is prepared.
Owner:CYBRID TECHNOLOGIES INC

High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape

The invention discloses a high thermal conductivity epoxy few adhesive mica tape and a preparation method of the high thermal conductivity epoxy few adhesive mica tape. The high thermal conductivity epoxy few adhesive mica tape is composed of mica paper, an epoxy adhesive layer filled with high thermal conductivity filler, and alkali-free glass cloth. The volume of the high thermal conductivity filler is 20%-40% of the volume of an epoxy adhesive. The high thermal conductivity filler is prepared through the steps of preprocessing with a solution of a silane coupling agent and an absolute ethyl alcohol solution, dispersion, scatter of adhesive powder, press roller hot press composition, cooling, secondary adhesive sizing, baking, rolling-up, cutting and the like. Due to the fact that the inorganic high thermal conductivity filler is used for filling an adhesive of the high thermal conductivity epoxy few adhesive mica tape, a heat conduction network chain is formed inside the adhesive between the mica paper and glass fiber cloth in a high thermal conductivity epoxy few adhesive mica tape system, not only can the temperature of a winding bar be effectively reduced, but also influence on electrical performance and mechanical performance of the high thermal conductivity epoxy few adhesive mica tape is small. The preparation method of the high thermal conductivity epoxy few adhesive mica tape greatly reduces consumption of solvent, and has the advantages of reducing production cost, being energy-saving, reducing emission, and reducing environmental pollution.
Owner:ZHUZHOU TIMES ELECTRIC INSULATION
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