199results about How to "Reduce DC resistance" patented technology

A shredded parallel stacked inductor is provided. The shredded parallel stacked inductor includes a substrate, an oxide film formed on the substrate, metallic layers spirally formed within the oxide film, and vias formed in regions of the metallic layers to join the metallic layers in parallel, thus forming a spiral cavity in a center part of the metallic layers.

A laminated inductor includes ceramic sheets provided with spiral coil conductor patterns of one turn, ceramic sheets provided with spiral coil conductor patterns of two turns, and ceramic sheets provided with lead-out conductor patterns, which are laminated together. The coil conductor patterns are successively electrically connected in series in regular order through via holes. The via holes are disposed at fixed locations in the ceramic sheets.

A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.

A magnetic device includes a sheet-type coil including a planar conductive coil and an insulating substance; and a sheet-type first magnetic member disposed on at least one of upper and lower surfaces of the sheet-type coil, where a magnetic permeability of the insulating substance is smaller than a magnetic permeability of the first magnetic member. The magnetic device preferably includes a second magnetic member provided at a predetermined area of the sheet-type coil, the second magnetic member being made of a resin containing a magnetic powder and having a permeability larger than the insulating substance and smaller than the first magnetic member. The predetermined area is at least one position selected from a center portion and a peripheral portion of the sheet-type coil where a conductor constituting the planar conductive coil is not present. Further, a power supply module of the present invention includes the magnetic device according to the present invention.

An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.

Provided is a coil substrate and a surface mounting type coil element which have higher inductance and low resistance coil conductor and are manufactured with less number of processes. Magnetic cores 2 and 5 are provided face to face. A spiral coil conductor 20 is formed to the front and rear surfaces of a core structure body 1 having an external core closed at both ends and a central leg, and of an insulating plate 11 including a through hole 12 at the center thereof. Moreover, a coil substrate 10 mutually connecting the spiral coil conductors 20 at the front and rear surfaces via the front and rear contacts and an external electrode connected to the coil conductor 20 are also provided. Under the condition that the central leg is inserted into the through-hole 12, the coil substrate 10 is allocated at the internal side of the core structure body 1 and the magnetic cores 2, 5 include a gap at the central leg.

A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component.

According to the present invention, a dielectric ceramic composition can be provided which is available to be sintered at low temperature (for example, 950° C. or lower) while comparatively decreasing contents of a glass component, which shows good properties (specific permittivity, loss Q value and insulation resistance), and which is available to perform cofiring different materials.

The invention relates to the field of electrochemistry, in particular to a positive electrode material as well as a preparation method and application thereof. The invention provides a positive electrode material, which comprises a base material, the base material comprises secondary particles composed of primary particles, and the surface of the base material is provided with an oxide coating layer. According to the positive electrode material disclosed by the invention, doping and surface coating are carried out in a high-nickel base material; the powder resistivity of the positive electrodematerial is controlled within a proper range; and meanwhile, the specific surface area of the positive electrode active material is reduced, the surface miscellaneous lithium amount is reduced, the polarization problem of the positive electrode material is improved, the direct current impedance of the lithium ion battery is reduced, the side reaction between the positive electrode material and anelectrolyte is effectively reduced, the gas production problem of the battery is inhibited, the volume energy density of the battery is improved, and the cycle performance and the rate capability areoptimized.

Disclosed are a winding power inductor and a production method thereof. An I-shaped core is made of ferrous alloy soft magnet powder. A coil winding is a butt-wound flat enameled wire winding made by butt-welding flat wires. A glue layer is a magnetic glue layer made of ferrous alloy soft magnet and epoxy resin system. The production method includes: making the I-shaped core of the ferrous alloy soft magnet powder, making an L-shaped sputtered metallized layer on the vane swing side of the I-shaped core by means of sputtering, winding the flat enameled wires on a middle post of the I-shaped core by means of butt welding to make the butt-wound flat enameled wire winding, connecting wire ends of the butt-wound flat enameled wire winding to the L-shaped-section metallized layer by spot welding to form electrodes, and using a glue dispenser to coat the surface of the butt-wound flat enameled wire winding after the wire ends are fused so as to make the magnetic glue layer. The winding power inductor has the advantages of evident high current and low-current impedance, is simple in process, and is convenient for automatic batch production.

The invention provides an electrode assembly and a lithium ion battery. The electrode assembly comprises a positive pole piece, an isolating membrane and a negative pole piece, wherein the negative pole piece comprises a negative current collector and a negative active material layer, and further comprises a metal lithium layer, the metal lithium layer is formed by a plurality of regular or irregular strip-shaped lithium-rich areas, and the plurality of lithium-rich areas are distributed at intervals in the length direction of the negative pole piece in a non-continuous form. The electrode assembly also satisfies the following conditions: the ratio of the negative electrode capacity per unit area to the positive electrode capacity per unit area is 1.2-2.1, and the ratio of the negative electrode capacity per unit area to the sum of the positive electrode capacity per unit area and 80% of the capacity of the metal lithium layer on the surface of the negative electrode active material layer per unit area is greater than or equal to 1.10. The lithium ion battery disclosed by the invention has relatively high lithium supplementing efficiency and relatively low direct-current impedance,and meanwhile, the lithium ion battery also has long cycle life and storage life.

The invention discloses an all-solid-state lithium-ion battery and a manufacturing method thereof. The manufacturing method comprises the following steps of (1) dissolving a polymer electrolyte into a solvent to prepare a glue solution; (2) fully mixing a positive electrode host material, a conductive agent and the glue solution obtained in the step (1), coating a positive current collector, heating the positive current collector and then carrying out co-curing to obtain a positive electrode plate, fully mixing a negative electrode host material, the conductive agent and the glue solution obtained in the step (1), coating a negative current collector, heating the negative current collector and then carrying out co-curing to obtain a negative electrode roll; (3) carrying out mechanical ball milling on a sulfide electrolyte, dissolving the product into the solvent to prepare slurry, coating the surface of the negative electrode roll, heating the negative electrode roll and then curing the negative electrode roll to obtain a negative electrode plate; and (4) assembling the positive electrode plate and the negative electrode plate by adopting a lamination technology to obtain the all-solid-state lithium-ion battery. Compared with the prior art, the all-solid-state lithium-ion battery disclosed by the invention has relatively low DC resistance, relatively high ionic conductivity and good cycle performance.

Provided is a highly reliable multilayer coil component wherein migration of Ag constituting an inner conductor is controlled, problem of internal stress is relaxed without forming an air gap between a magnetic ceramic layer and an inner conductor layer, DC resistance is lowered, and disconnection of an inner conductor due to a surge is prevented from occurring easily. A metal film (20) is distributed over the surface of an inner conductor (2), so that an air gap does not exist on the interface (A) of the inner conductor (2) including the metal film (20) and a magnetic ceramic (11) on the periphery of the inner conductor, and the interface (A) of the inner conductor (2) and the magnetic ceramic (11) is in a dissociative state. An acid solution containing a metal is infiltrated from the side surface of a magnetic ceramic element via a side gap portion, i.e. a region between the side portion of the inner conductor and the side surface of the magnetic ceramic element, so as to reach the interface of the inner conductor and the magnetic ceramic on the periphery thereof, and thus the metal is deposited on the surface of the inner conductor.

The invention discloses a flat coil inductor, a flat coil and a manufacture method of the flat coil. The flat coil inductor comprises a magnetic core, a magnetic cover covering the magnetic core and the flat coil coiled on the magnetic core, wherein the magnetic core is provided with, at least, a first groove and a second groove. The flat coil comprises, at least, the top end base portion and two side edge flattening portions, wherein the base portion is larger than the side edge flattening portions in thickness, the side edge flattening portions are larger than the base portion in width, the base portion is embedded into the first groove, and the side edge flattening portions are embedded into the second groove. The side edge flattening portions are formed by locally flattening the flat coil of the inductor, so that different thicknesses are obtained, the side edge flattening portions are larger than the base portion in width but are smaller than the base portion in thickness, and a magnetic core accommodating space defined by the flat coil is increased. The magnetic core can be matched and assembled with a large corresponding magnetic core, so that the direct-current resistance of the inductor in a limited size range is decreased, the saturation current is increased, and the inductor can obtain the best electrical characteristics.

The invention relates to a novel silicon substrate low resistance inductance structure and a wafer level encapsulating method of the novel silicon substrate low resistance inductance structure, and belongs to the technical field of semiconductor encapsulation. A coil groove (102) is formed in the upper surface of a silicon wafer (100) in an etching mode, an insulation layer (300) is coated inside the coil groove (102), an electroplating seed layer (300) is arranged in a deposit mode through a physical method, a thick copper metal wiring layer (400), namely an inductance coil, is formed in the coil groove (102) in a photoetching imaging mode through an electroplating technology, and finally, a secondary passivating layer (500) and metal leading wires (600) are arranged on the thick copper metal wiring layer (400), and the thick copper metal wiring layer (400) is communicated with the thick copper metal wiring layer (400) through an secondary passivating layer opening (501). According to the novel silicon substrate low resistance inductance structure and a wafer level encapsulating method of the novel silicon substrate low resistance inductance structure, the copper metal wiring layer serving as the inductance coil is embedded into the interior of a silicon substrate body, technological difficulty and technological cost of preparation of the inductance coil are reduced, an encapsulating density is improved, meanwhile direct current resistance of an inductor is reduced by increasing the thickness of coils, and a quality factor of the inductor is improved.

The invention firstly aims to provide a cascading inductor based on metal magnetic slurry. The cascading inductor comprises a first base body, an interlayer and a second base body, wherein the first base body, the interlayer and the second base body are arranged from bottom to top. The interlayer comprises at least two single-layers arranged from bottom to top. Each single-layer comprises a dielectric layer, a packing layer and a coil electrode, wherein the dielectric layer is provided with a through hole in the vertical direction; the packing layer is arranged at the through hole, and the upper surface of the packing layer is not lower than the upper surface of the dielectric layer; the coil electrode is arranged on the upper surface of the dielectric layer and located around the packing layer; the packing layer comprises inorganic powder bodies composed of metal magnetic powder, lead-free glass powder, organic carriers and auxiliaries. The cascading inductor based on the metal magnetic slurry is simple in overall structure; since the packing layers are made of metal alloy materials with high saturation flux density, the saturation magnetization intensity of the whole cascading inductor is improved, and then the rated current is increased. The invention secondly aims to provide a preparation method of the cascading inductor based on the metal magnetic slurry. By means of the preparation method, the process steps are simple, the cost is low, and the cascading inductor is quite suitable for large-scale batch production.

The invention relates to a production method of a thick-electrode device, and the production method comprises the following steps of utilizing screen meshes with the same patterns to be printed with electrode paste on a first ceramic substrate and a film with a releasing function; utilizing the obtained film which is printed with the electrode paste to be laminated onto a second ceramic substrate, and removing the film to obtain the second ceramic substrate with the electrode paste; inverting the first ceramic substrate which is printed with the electrode paste onto the second ceramic substrate with the electrode paste to be aligned and laminated for the electrode patterns to form a third ceramic substrate; discharging the glue; and sintering. Due to the adoption of the production method of the thick-electrode device, the width of the electrode is reduced, while the production of a thick electrode is realized, the direct-current resistance of the device is effectively reduced, and the consumption of the electrode paste can be reduced on the premise of guaranteeing the performance of the device.

The invention relates to magnetic devices, in particular to a PCB flatbed magnetic device suitable for normal shock synchronous rectification. The PCB flatbed magnetic device suitable for the normal shock synchronous rectification comprises a transformer part, and the winding of the transformer part is formed by multiple overlapped double-faced PCBs with metal layers. The PCB flatbed magnetic device suitable for the normal shock synchronous rectification is characterized in that a primary winding and a secondary winding are arranged on different PCBs, and the PCB bearing the primary winding and the PCB bearing the secondary winding are arranged in an interlaced mode. The PCB flatbed magnetic device suitable for the normal shock synchronous rectification further comprises an inductor part, the winding wires of the inductor are also formed by the metal layers of the double-faced PCBs. In the transformer part and the inductor part, the winding wires of an identical PCB are connected through via holes formed in the PCB, and the winding wires of different PCBs are connected through solder casting holes. The inductor part comprises at least two inductors connected in parallel. The secondary output end of the transformer part and the input end of the inductor part share a set of via holes, and the whole magnetic device is provided with only five pins. The PCB flatbed magnetic device suitable for the normal shock synchronous rectification reduces assembling difficulty, and improves the utilization rate of space at the same time.