14results about "Encapsulation/impregnation" patented technology

A method for manufacturing a reactor includes a bonding process of joining molded cores with a molded coil with an adhesive, and a welding process of connecting, by welding, the lead wire of a coil to a busbar fixed to the molded core. The coils are attached to respective leg portions. The bonding process includes an applying process of applying the adhesive to the joining surfaces of the respective leg portions of each of the core members, and the inner circumferential surfaces of the respective yoke portions of the core members, a depressing process of spreading the applied adhesive by depression, and a curing process of curing the adhesive.

The application belongs to the technical field of soft magnetic material preparation, and particularly relates to a ferrosilicon magnetic material and a preparation method and application thereof. The preparation method comprises the following steps: (1) mixing ferrosilicon magnetic powder and a passivation agent, and then performing primary heat treatment and cooling to room temperature at a speed of not higher than 30 DEG C / h; (2) mixing the magnetic powder obtained in the step (1) with the passivation agent to obtain passivated magnetic powder; (3) adding a first coating agent to the passivated magnetic powder to perform primary coating, and then performing secondary heat treatment; and (4) adding a second coating agent to the magnetic powder obtained in the step (3) to perform secondary coating, pressing, and then performing tertiary heat treatment. The average particle size of the first coating agent is 300 nm-1 mu m; and the second coating agent comprises colloidal particles, and the average particle size of the colloidal particles is not higher than 100 nm. The preparation method can improve the density and effective magnetic permeability of the ferrosilicon magnetic material, so that the ferrosilicon magnetic material has excellent magnetic performance, the loss is greatly reduced, heat generation is reduced, and the device is beneficial to energy saving and high efficiency.

The present invention provides a method for manufacturing a reactor and a reactor that firmly joins the molded core and molded coil, and prevents damage to the welded joints of the busbar and lead wires. [Solution] The method for manufacturing the reactor includes an adhesive bonding step of joining molded cores 1a, 1b and molded coil 5 with an adhesive, and a welding step of connecting the lead wires of the coil 6 and the busbar fixed to the molded core 1a by welding. The coil 6 is mounted on the leg portion 23. The adhesive bonding step includes applying adhesive 8 to the joint surface 231 of the leg portion 23 of the core member and the inner circumferential surface 241 of the yoke portion 24, pressing the applied adhesive 8 to spread it out, and a curing step for the adhesive. In the pressing step, the adhesive 8 applied to the joint surface 231 is pressed out, causing it to overflow onto at least one of the upper and lower surfaces of the leg portion 23, and at least one of the inner side surface 236 and outer side surface 237 of the leg portion 23, and to adhere to the molded coil 5.

A semiconductor device package may include a package substrate, mold material formed over the package substrate, and a mold-embedded inductor that is embedded in the mold material. The mold-embedded inductor may be coupled to a die, such as a power management integrated circuit die, which may also be embedded in the mold material. The mold-embedded inductor may be formed by forming conductive traces and an inductor core in the mold material. For example, an active mold packaging (AMP) process and corresponding laser direct structuring (LDS) processes may be performed to form openings in the mold material and to activate surfaces of the mold material to facilitate subsequent plating of conductive material. Activated surfaces of the mold material may have micro-rough texture and may include bulk conductive material formed via the application of laser energy to additives in the mold material during the LDS process(es).

This invention belongs to the field of inductor technology and discloses a coreless inductor and its preparation method. The preparation method includes the following steps: assembly of coil and conductive sheet: a coil is installed into the corresponding coil positioning slot of a welding positioning module, and pairs of conductive sheets are respectively installed into the conductive sheet positioning slots of the welding positioning module; the two conductive sheets are located on the left and right sides of the coil, respectively; connection of coil and conductive sheet: the first end of the coil in the welding positioning module is electrically connected to the first pin of the first conductive sheet on one side, and the second end of the coil is electrically connected to the second pin of the second conductive sheet on the other side; forming of package: a package is formed to cover the pins of the coil and conductive sheet, and the exposed part of the conductive sheet is located outside the package. The preparation method simplifies the process, saves materials, effectively shortens the production cycle of the inductor, and improves the production efficiency of the inductor.

In one example, an integrated circuit (200) includes a substrate (206), a semiconductor die (104), metal interconnects (130, 132, 134, 136), an inductor (202) attached to the substrate, and a magnetic material (208) that encapsulates the semiconductor die, the inductor, and the metal interconnects. The semiconductor die is attached to the substrate via the metal interconnects. The magnetic material includes coated metal particles (510, 512, 514, 520, 522, 524, 526, 528, 530, and 532) that are coated with a first insulating material and a second insulating material (533) in which the coated metal particles are suspended.

In one example, an integrated circuit (200) includes a substrate (206), a semiconductor die (104), metal interconnects (130, 132, 134) coupled between the semiconductor die and the substrate, insulating layers (240_1, 240_2, 240_3, 240_4) coupled between the semiconductor die and the substrate and surrounding the metal interconnects, an inductor (202) coupled to the substrate, and a magnetic material (208) encapsulating the semiconductor die, the inductor, the metal interconnects, and the insulating layers and having a material different from that of the insulating layers.

Method for producing an adhesion- and crack-resistant insulating layer structure and topcoat structure for current transformer housings (1), wherein The cleaning of the current transformer housing (1) is carried out in several steps: to remove organic substances, a brief flame treatment is applied; then, to remove inorganic contaminants, especially electrostatic charge carriers, ionized air is blown out; subsequently, moisture is removed by ice drying or heat application; and then an adhesion promoter (2) in the form of a primer (2) is applied as an intermediate layer (2) with a defined layer thickness to the metal current transformer housing (1), with the simultaneous introduction of dipoles and an enlarged adhesion surface, which is generated by means of a high-pulsed blasting process; and on this intermediate layer (2) a conductive coupling layer (3) in the form of an electrically conductive lacquer (3) is applied as a basis for the subsequent assembly of the current transformer housing (1) with a current transformer (4) using potting technology.wherein, as a basis for the subsequent installation of the current transformer using potting technology in the current transformer housing (1), a primer (2) as an intermediate layer (2), as an adhesion promoter (2) and as an insulating layer (2) based on a 2K filling primer and an electrically conductive lacquer (3) as a top layer lacquer (3) and as a coupling layer (3) are applied one above the other, wherein the electrically conductive lacquer (3) consists of pigmented polyester and wherein the base filler (2) and the topcoat lacquer (3) are both applied in the same layer thickness of approximately 10 µm.

The present disclosure relates to a reactor and a manufacturing method thereof. The reactor is provided with a coil, a gap being ensured between adjacent windings; a core, inserted through the coil; and a heat sink, in contact with a side surface of the coil. The heat sink is inserted between the adjacent windings of the coil. Further, the thickness of the heat sink on the outer side of the coil in the axial direction of the coil is thinner than the thickness of the heat sink between the windings. By thinning the heat sink on the outer side of the coil, which contributes little to cooling of the coil, it is possible to suppress the amount of the heat sink without reducing the cooling performance for the coil.

The invention provides a method for manufacturing a reactor and a reactor, wherein a molded core and a molded coil are firmly jointed, and a welding part of a bus bar and a lead wire is prevented from being damaged. A method for manufacturing a reactor includes: a bonding step of bonding a molded core and a molded coil with an adhesive; and a welding step in which the lead wire of the coil is connected to the bus bar fixed to the mold core by welding. The coil is attached to the leg portion. The bonding step includes: a coating step in which an adhesive is applied to the bonding surface of the leg portion of the core member and the inner peripheral surface of the yoke portion of the core member; a pressing step for pressing and spreading the applied adhesive; and a hardening step for hardening the adhesive. In the pressing step, the adhesive applied to the bonding surface is pressed and spread out to be extruded to at least one of the upper surface and the lower surface of the leg part, and extruded to at least one of the inner side surface of the leg part and the outer side surface opposite to the inner side surface of the leg part, which are the surfaces of the leg part facing each other, and the adhesive is attached to the molded coil.

This invention relates to the field of inductor packaging equipment technology, specifically to an inductor dispensing and packaging device, comprising a platform and a cam divider. A rotating platform is fixed to the output end of the cam divider, and multiple sets of carrying fixtures are fixed on the rotating platform. Each carrying fixture includes a base, on which two sets of sliders are mounted via slide rails. Each set of sliders has a stand mounted on it. A carrying seat is fixed in the middle of the base, and the two sets of stands are symmetrically distributed on both sides of the carrying seat. Slide blocks are slidably connected to the top ends of the carrying seat, and mounting seats are fixed to the top of each slide block and each stand. A clamping mold is slidably connected to one end of each mounting seat. A push-mold assembly achieves synchronous movement of the four clamping molds through a contact assembly. This invention, through the four sets of clamping molds arranged in a cross shape, combined with a linkage assembly and a drive assembly, can achieve synchronous opening and closing adjustment of the clamping molds, adapting to the clamping requirements of inductors of different sizes and specifications, eliminating the need for frequent fixture changes, and significantly improving the versatility of the equipment.