113results about "Encapsulation/impregnation" patented technology

A casting type power inductor includes a base, a hollow coil, and a casting. The base includes a flange and a central column. The central column is fixedly arranged at the center of the flange. The hollow coil is tightly wound on the central column. The casting is used for wrapping the base and the hollow coil. The preparation method for the casting type power inductor includes blank preparation, coil winding, combined body arrangement, slurry casting, curing treatment, and post-treatment that are sequentially performed. According to the casting type power inductor, pressureless forming can be implemented by casting a magnetic slurry, so that a short circuit, an open circuit, or deviation to the edge of the inductor, of the coil caused by excessive pressure is avoided.

The application relates to the technical field of inductor production equipment, and discloses a common-mode inductor glue dispensing and assembling machine, which comprises a machine base, an inductor material bin device, an inductor material taking and feeding device, an inductor glue dispensing device and a common-mode magnetic sleeve loading and pressing device. The inductor material bin device comprises a material bin box and a material disc, and the inductor material taking and feeding device transfers the material disc to the inductor glue dispensing device. The inductor glue dispensing device comprises a second movable seat and a third movable seat, the second movable seat is provided with a second conveying mechanism, the third movable seat is provided with a glue dispensing mechanism, a first industrial camera mechanism and a grabbing mechanism. The common-mode magnetic sleeve loading and pressing device comprises a common-mode magnetic sleeve loading vibrating disc mechanism, a fourth movable seat and a fifth movable seat, the fourth movable seat is provided with a third conveying mechanism, and the fifth movable seat is provided with a pressing mechanism. The common-mode inductor glue dispensing and assembling machine has the advantages of high integration, high automation and strong continuous working capacity, and can effectively improve the production efficiency and product quality.

A method for manufacturing a reactor includes a bonding process of joining molded cores with a molded coil with an adhesive, and a welding process of connecting, by welding, the lead wire of a coil to a busbar fixed to the molded core. The coils are attached to respective leg portions. The bonding process includes an applying process of applying the adhesive to the joining surfaces of the respective leg portions of each of the core members, and the inner circumferential surfaces of the respective yoke portions of the core members, a depressing process of spreading the applied adhesive by depression, and a curing process of curing the adhesive.

The application discloses a manufacturing method of an involute transformer core, which comprises the following steps: S1, cutting a stainless steel silicon steel sheet to obtain a silicon steel sheet blank; S2, using a rolling tool to manufacture the silicon steel sheet blank into an involute silicon steel sheet; S3, stacking a plurality of the involute silicon steel sheets on the periphery of a base cylinder, and tightly holding the involute silicon steel sheets and the base cylinder by using a plurality of stainless steel hoops to form a holding piece, and annealing the holding piece as a whole; S4, bundling; S5, preheating the bundled piece; S6, immersing the preheated bundled piece into insulating paint; S7, solidifying the bundled piece; S8, surface treatment; and S9, gluing, coating epoxy glue on the outer surface of the component which has been surface treated in the step S8, and firmly bonding the component with an epoxy cylinder. The manufacturing method of the involute transformer core provided by the application has single specification of the involute silicon steel sheet, avoids a plurality of specifications of the width of the radial silicon steel sheet, is convenient to manage, and reduces storage devices.

The application discloses an inductor, which comprises a packaging shell, an input pole, an output pole and a metal shielding layer. The inductor is characterized in that the inductor is internally packaged with an inductive component; the input pole is exposed on the surface of the packaging shell and used for receiving an alternating voltage; the output pole is exposed on the surface of the packaging shell and used for outputting a direct current voltage; the metal shielding layer is asymmetrically covered on the surface of the packaging shell and electrically connected with the output pole; and the metal shielding layer still keeps the input pole and the output pole electrically isolated. The application further provides an inductor manufacturing method and a power supply circuit comprising the inductor, solves the problems of small electromagnetic shielding range, poor effect and unstable inductor potential in the prior art, and realizes better electromagnetic shielding effect and stable inductor potential.

The application discloses a paraffin solid sealing furnace for a vehicle-mounted superconducting magnet coil, wherein the melting paraffin cabin and the solid sealing cabin are combined into one, and the structure is compact; the paraffin groove is arranged in the solid sealing furnace, the original paraffin pipeline exposed to the environment can be cancelled, the temperature reduction, solidification, blockage and injection of paraffin in the pipeline due to flow can be avoided, the pouring process is smooth and controllable, and a good solid sealing effect is achieved. In terms of temperature control, mainly using air convection to conduct heat transfer, scientifically arranging the electric heating pipe and the turbulence fan, effectively eliminating the temperature gradient inside the coil and the paraffin, and improving the uniformity of the temperature distribution. In terms of pouring control, the vibration exciter arranged below the superconducting coil tray can effectively accelerate the discharge of bubbles inside the coil. In terms of vacuum control, only slight negative pressure in the furnace needs to be maintained, which greatly reduces the performance of the vacuum pump, the sealing requirement of the furnace body, the manufacturing difficulty and the cost.

The invention discloses a magnetic track brake electromagnet coil, a magnetic track brake electromagnet and a preparation method. The magnetic track brake electromagnet coil comprises a winding, a coil frame, an insulating layer, a cover plate and a heat insulation layer. The winding is arranged in a coil groove of the coil rack, and the winding is formed by winding an enameled flat copper wire of which the temperature resistance level is H level or higher; the insulating layer wraps the winding; the cover plate is welded and fixed at the opening of the coil slot and is used for sealing the coil slot; the heat insulation layer is arranged at the position, corresponding to the welding position of the cover plate, in the coil groove and used for blocking heat generated when the cover plate is welded. Damage of welding heat to the coil is effectively avoided, the overall sealing performance and environmental adaptability of the coil are improved, and therefore long-term stable operation of the coil is guaranteed.

Manufacturing system (1) for the manufacture of a stator (2) and / or a rotor (3) of an electric machine (4), comprising: wherein a holding tool (5) for receiving a plurality of stacked annular disc-shaped electrical steel sheets (6), wherein the holding tool (6) has a clamping mandrel (7) for fixing the electrical steel sheets (6) to the inner diameter (8) of the clamping mandrel (7), and a base plate (10) at a first axial end (9) of the clamping mandrel (7) and a cover plate (12) at a second axial end (11), wherein an axial stress can be introduced into the electrical steel sheets (6) arranged on the clamping mandrel (7) via the base plate (10) and / or the cover plate (11); a baking lacquer tool (20) into which the holding tool (5) equipped with the electrical steel sheets (6) can be inserted and adjusted to a baking lacquer temperature; a transfer molding tool (30) into which the holding tool (5) equipped with the electrical steel sheets (6) can be inserted and adjusted to a molding temperature, characterized in that the holding tool (5) comprises a injection geometry which, in a state inserted into the transfer molding tool (30), influences the shaping and / or the flow of the plastic during the transfer molding process.

A method of fabricating a high-temperature bobbin for a solenoid or other electrical assembly includes the step of providing a bobbin configured for use in the assembly. The bobbin is coated with an anti-oxidation composition and an anti-corrosion composition to produce an oxidation / corrosion resistant bobbin. The oxidation / corrosion resistant bobbin is coated with an electrical insulating composition that is resistant to corona discharge at or below a predetermined voltage threshold to produce an insulated and oxidation / corrosion resistant bobbin. The anti-oxidation composition, the anti-corrosion composition, and the electrical insulating composition can withstand temperatures of subzero up to temperature greater than 1000° F.

Impregnation device (2) for impregnating bodies (4), in particular wound materials, with at least one holding device (6) having at least one holding means (8) on which a body (4), in particular a wound material, can be fixed, with at least one first working area (10) in which at least the body (4) can be fixed on the holding means (8) and in which the body (4) can be released from the holding means (8) again, with at least one second working area (12) in which at least one impregnation container (14) is arranged which is filled with a fluid impregnating the body (4), with at least one transfer device (16) by which the holding means (8) can be transferred from the first working area (10) to the second working area (12) and back, and with at least one electric heating unit (18) comprising at least one contact means (20) fixed in or on the holding means (8),the body (4) can be manually or automatically connected or connected in the arrangement of the body (4) fixed on the holding means (8) with at least one phase connection (22) of the body (4), which can be continuously and without interruption connected or connected to a power supply of the electric heating unit (18) when the holding means (8) is transferred from the first working area (10) to the second working area (12), and by which the body (4) can be electrically heated continuously and without interruption in the first working area (10) and in the second working area (12), wherein the transfer device (16) comprises at least one bearing unit (30) comprising a rotary axis (28), wherein the transfer of the at least one holding means (8) from the first working area (10) to the second working area (12) comprises a rotary or oscillating movement about the rotary axis (28) of the bearing unit (30), characterized by at least one lifting / lowering device (34),comprising at least one first lifting / lowering means (36) in the first working area (10) by which the body (4) is movable, in particular liftable, along a first direction of movement (38) onto the holding means (8), and comprising at least one second lifting / lowering means (40) in the second working area (12) by which the impregnation container (14) is movable, in particular liftable, along a second direction of movement (42) onto the body (4), and the body (4) is arrangable in the fluid, wherein the first direction of movement (38) and the second direction of movement (42) are parallel to the axis of rotation (28) of the bearing unit (30).

The invention relates to a high-frequency thin film magnetic bead and a preparation method and application thereof. The preparation method comprises the steps that a Fe source, a Si source, a B source, a Cu source, a Nb source and a Ga source are smelted into a first alloy ingot according to a formula, then the first alloy ingot and a C source are smelted to prepare a second alloy ingot, the second alloy ingot is prepared into an amorphous alloy strip, and an iron-based nanocrystalline alloy is obtained through magnetic field heat treatment; the method comprises the following steps: mixing an iron-based nanocrystalline alloy and aluminum oxide to form a magnetic mixture, placing the magnetic mixture in a mold provided with a surrounding wire, carrying out pressure forming to obtain a thin-film-shaped magnetic blank, and sintering the thin-film-shaped magnetic blank in an inert gas environment to obtain a magnetic bead blank; and mixing an insulating material with graphite, forming a coating layer on the surface of the magnetic bead blank to obtain a magnetic bead body, and arranging an electrode electrically connected with the surrounding wire on the magnetic bead body to obtain the high-frequency thin-film magnetic bead. According to the invention, the material and the structure of the magnetic bead are optimally designed, so that the high-frequency thin-film magnetic bead with better magnetic performance and smaller volume can be obtained.

The application belongs to the technical field of soft magnetic material preparation, and particularly relates to a ferrosilicon magnetic material and a preparation method and application thereof. The preparation method comprises the following steps: (1) mixing ferrosilicon magnetic powder and a passivation agent, and then performing primary heat treatment and cooling to room temperature at a speed of not higher than 30 DEG C / h; (2) mixing the magnetic powder obtained in the step (1) with the passivation agent to obtain passivated magnetic powder; (3) adding a first coating agent to the passivated magnetic powder to perform primary coating, and then performing secondary heat treatment; and (4) adding a second coating agent to the magnetic powder obtained in the step (3) to perform secondary coating, pressing, and then performing tertiary heat treatment. The average particle size of the first coating agent is 300 nm-1 mu m; and the second coating agent comprises colloidal particles, and the average particle size of the colloidal particles is not higher than 100 nm. The preparation method can improve the density and effective magnetic permeability of the ferrosilicon magnetic material, so that the ferrosilicon magnetic material has excellent magnetic performance, the loss is greatly reduced, heat generation is reduced, and the device is beneficial to energy saving and high efficiency.

The invention relates to the technical field of magnetic functional materials, in particular to a high-pressure molded copper-iron co-fired inductor and a preparation method thereof. The preparation method comprises the following steps: S1, pretreating a copper sheet; s2, coating an insulating layer; s3, preparing soft magnetic metal powder; s4, preparing a magnetic powder core; and S5, preparing the copper-iron co-fired inductor: performing two-way compression molding on the magnetic powder core through a mold, performing gradient annealing on the magnetic powder core by using a reducing atmosphere, finally soaking the magnetic powder core in an epoxy resin acetone solution under the vacuum degree of 0.05 MPa, washing the magnetic powder core with acetone for three times, and baking the magnetic powder core to obtain the high-pressure molded copper-iron co-fired inductor. Through deep combination of material innovation (passivation / coating / lubrication system) and process optimization (stepped curing-bidirectional pressing-gradient annealing), breakthrough improvement of the high-pressure molded copper-iron co-fired inductor in the aspects of loss, voltage resistance, reliability and the like is realized, meanwhile, the production cost is remarkably reduced, and a core device is provided for upgrading of high-frequency power electronic equipment.

The invention discloses a powder filling hot-pressing device for inductor processing, and belongs to the field of hot-pressing devices.The powder filling hot-pressing device comprises a workbench, a bottom die is arranged on the workbench, a plurality of forming cavities are formed in the top face of the bottom die, a mounting frame is arranged on the workbench, a top die is arranged above the bottom die, and a first air cylinder is arranged on the top face of the mounting frame; the bottom end of a piston rod of the first air cylinder is fixed to the bottom face of the top die, a plurality of hot-pressing heads are arranged on the bottom face of the top die and correspond to the multiple forming cavities, a movable base is arranged on one side of the top face of the workbench, two rows of powder conveying pipes are arranged on the bottom face of the movable base, a plurality of powder spraying nozzles are arranged on the powder conveying pipes and correspond to the multiple forming cavities, and the powder spraying nozzles correspond to the multiple forming cavities. The workbench is provided with a driving mechanism used for driving the movable base to move in the length direction of the workbench. The device has the effects that powder can be conveniently added into the forming cavity, and the phenomenon that arms of workers are scalded by a hot-pressing head is reduced.

The invention provides a power module. The power module comprises a substrate, a first electronic component, at least one metal component, a first metal connecting part and a second metal connecting part. The first electronic component and the at least one metal component are arranged on the first side of the substrate. The first metal connecting part and the second metal connecting part are arranged on the second side of the substrate. And the first metal connecting part is electrically connected with the first electronic component to form an input and / or output pin of the power module. And the second metal connecting part is at least electrically connected with the substrate to form a signal pin of the power module. The first side is opposite to the second side.

The invention relates to the technical field of transformer manufacturing, in particular to a laminated transformer preparation method and a laminated transformer. The preparation method of the laminated transformer comprises the following steps: respectively preparing ferrite powder and microcrystalline glass ceramic powder into a first green tape and a second green tape by adopting a tape casting process; forming through holes in the first green tape and the second green tape, and filling the through holes with conductive paste; a primary coil layer and a secondary coil layer are printed on the first hole filling green ceramic tape; laminating a plurality of coil hole-filling green ceramic tapes and a plurality of second hole-filling green ceramic tapes according to a preset sequence to form an intermediate electrode layer; laminating a plurality of first green tapes to form a cover layer; stacking the two cap layers and the intermediate electrode layer together to form a block; and sintering the laminated monomers to obtain the laminated transformer. The problems of interface stress concentration and structure cracking caused by difference of thermal expansion coefficients of different materials are effectively solved, and the product yield and reliability are remarkably improved.

A method for manufacturing a coil (1) comprising the steps of: a. providing a tube (2) with a tube wall (6) made of an electrically conductive material, b. creating a gap (4) in an inductive section (7) of the tube (2), wherein the gap (4) in the inductive section (7) forms the tube wall (6) into a helix, and forming at least two sections of the tube into contact sections (8), wherein in step b. a coil strand is first produced by creating several inductive sections (7) along the tube (2), in each of which a gap (4) is created which forms the tube wall (6) into a helix in the respective inductive section, and wherein a contact section (8) is formed between each of two inductive sections (7), which, after separation of the coil strand, forms an electrical connection to the two adjacent inductive sections (7).

The application discloses a winding inductance heat transfer pouring structure and method, which comprises a substrate, a heat conduction column is vertically arranged on the upper end surface of the substrate, a winding inductance is sleeved on the heat conduction column and located at the bottom of the substrate, a pouring cavity is arranged between the winding inductance and the heat conduction column, a pressing plate is detachably connected to the top of the winding inductance, a plurality of pouring openings are formed in the pressing plate and communicated with the pouring cavity, the winding inductance comprises an inductance magnetic ring, a first insulating film wrapped on the inductance magnetic ring, a second insulating film wrapped on the first insulating film and an inductance winding wound on the inductance magnetic ring, the inductance winding is located between the first insulating film and the second insulating film, and a plurality of pouring holes are formed in the first insulating film and the second insulating film and communicated with the pouring cavity. The application improves the heat dissipation efficiency and heat transfer capacity of the winding inductance and effectively solves the problem of heat accumulation of the winding inductance.

The invention relates to the technical field of power electronic test equipment, and discloses a flat conductor single-layer vertically-wound inductor and a manufacturing method thereof, and the flat conductor single-layer vertically-wound inductor comprises an upper magnetic plate, a lower magnetic plate and at least one parallel magnetic core arranged between the upper magnetic plate and the lower magnetic plate, two ends of the parallel magnetic core are respectively and magnetically connected with the upper magnetic plate and the lower magnetic plate to form a closed magnetic circuit, the winding unit is wound on the periphery of the parallel magnetic core, and the winding unit is of a spiral winding structure formed by a continuous flat conductor through multiple times of inward bending. And the flat conductor is wound on the parallel magnetic core in a vertical winding manner. The flat conductor is subjected to continuous inward bending, so that the effects of simplifying the process and improving the performance can be achieved, the winding process is simplified by the single-layer vertical winding structure, accurate inward bending only needs to be performed at a specific position, the method is suitable for automatic production, the production efficiency and consistency are remarkably improved, the cost is reduced, and the performance is effectively improved.

The present application relates to the technical field of high-temperature-resistant electronic components, and particularly relates to a high-temperature-resistant electronic component, which adopts the following technical scheme: a frame body is provided with a glue-filling sealed electromagnetic coil at the center of the frame body, and the frame body is made of high-temperature-resistant plastic material; a manufacturing process of the high-temperature-resistant electronic component comprises the following steps: S1, selecting a suitable coil body and an outer frame with a pin; S2, sealing the middle part of the coil body in the outer frame to provide mechanical support, heat dissipation and electrical connection; and S3, connecting the coil motor and the inner lead of the outer frame by using a fine metal wire (gold wire, aluminum wire or copper wire) to realize electrical conduction. The molten material in the discharge bucket can be dispersed into different cavities respectively, and the bubbles in the dispersed molten material are more easily extracted, so that the residual bubbles in the molten material are reduced.

The application discloses an AI inductance feeding and discharging machine, which comprises a jig conveying line, a feeding port and a discharging port arranged on the same side of the jig conveying line, a receiving table assembly comprising a fixed receiving table, a movable receiving table and a first pushing assembly, the fixed receiving table and the movable receiving table being respectively connected with the feeding port and the discharging port, the movable receiving table being driven to lift by a material supporting lifting cylinder, a second pushing assembly, a middle mold plate separating track connected with the movable receiving table, middle mold plate supporting rails arranged on the two sides of the middle mold plate separating track, the thickness of the middle mold plate supporting rails being greater than the distance between the combined middle mold plate and the supporting plate, and a first floating table arranged below the feeding end of the middle mold plate separating track and driven to lift by a servo linear module. The application can adjust the height of the middle mold plate and the supporting plate, connect the jig conveying line with a pressing machine, and improve the processing efficiency of the inductance powder pressing.

The invention discloses an electronic expansion valve coil structure, an electronic expansion valve and a manufacturing method of the electronic expansion valve coil structure, the electronic expansion valve coil structure comprises a coil body, a wire harness assembly, a wire buckle structure and a plastic package outer layer, the coil body is provided with a winding coil, the wire harness assembly is provided with a plurality of wires, and the wires are electrically connected with the winding coil; the wire buckle structure is provided with a plurality of wire pressing grooves, and the wire buckle structure seals and compresses wires in a one-to-one correspondence manner through the wire pressing grooves. The plastic package outer layer is correspondingly and integrally formed outside the coil body in an injection molding mode and connected with the wire buckle structure in an injection molding mode. Therefore, traditional parts such as a housing body and the like and an epoxy resin glue filling process are omitted, the assembly structure is simplified, the efficiency and the waterproof grade are improved, the cost is reduced, the structure is stable, injection molding connection is carried out through the plastic package outer layer and the wire buckle structure, the problem that wires are damaged by high temperature is avoided, and production safety is guaranteed.

The invention provides a preparation method of an integrated inductor device integrated with a heat transfer piece, which comprises the step of pressing the heat transfer piece, soft magnetic powder and a winding according to a target position relationship to obtain the integrated inductor device integrated with the heat transfer piece. According to the preparation method, the heat transfer part and the soft magnetic powder are integrated in a pressing mode, so that the surface of the heat transfer part is plastically deformed, the soft magnetic powder on the surface layer of the magnetic body can be embedded into the heat transfer part, the contact area of the heat transfer part and the magnetic body is increased, and the heat transfer distribution path of electric devices around the magnetic body can be changed; and a magnetic body of the integrated inductor device is fully utilized for heat dissipation.

A magnetic element structure with a heat conductive filler and a method of manufacturing the same, wherein the magnetic element structure with a heat conductive filler comprises a first magnetic core, a second magnetic core combined with the first magnetic core to form an outer shell with a front opening and a back opening, a coil assembled in the outer shell, wherein two end points of the coil extend from the front opening, and a heat conductive filler filled in the outer shell and between the outer shell and the coil.

The utility model relates to the technical field of inductors, and provides a liquid cooling heat dissipation inductance device which is characterized in that based on the heat dissipation requirement of a current large-current inductor, a liquid cooling bottom plate is integrated in an integrally-formed base, liquid cooling flow channels distributed in the radial direction are arranged, every two adjacent liquid cooling flow channels are connected end to end, and cooling liquid is poured into the liquid cooling flow channels; therefore, a large amount of heat generated when the inductor body works in a large current is taken away, high temperature caused by heat accumulation or continuous high-temperature work is avoided, liquid-cooled heat dissipation is achieved, and the heat dissipation efficiency is greatly improved. As the liquid cooling flow channel and the base are integrally formed, the volume of the product is reduced by 34% on year-on-year basis, and the product is miniaturized and is matched with the mounting plate for built-in mounting, so that the waterproof, dustproof and anticorrosive functions are realized; and moisture and dust caused by aging of the sealing ring when the photovoltaic inductor is externally arranged outside the photovoltaic equipment case are prevented from entering the photovoltaic equipment case to influence an electric appliance circuit, so that the service life of a product is further prolonged.

The present invention provides a method for manufacturing a reactor and a reactor that firmly joins the molded core and molded coil, and prevents damage to the welded joints of the busbar and lead wires. [Solution] The method for manufacturing the reactor includes an adhesive bonding step of joining molded cores 1a, 1b and molded coil 5 with an adhesive, and a welding step of connecting the lead wires of the coil 6 and the busbar fixed to the molded core 1a by welding. The coil 6 is mounted on the leg portion 23. The adhesive bonding step includes applying adhesive 8 to the joint surface 231 of the leg portion 23 of the core member and the inner circumferential surface 241 of the yoke portion 24, pressing the applied adhesive 8 to spread it out, and a curing step for the adhesive. In the pressing step, the adhesive 8 applied to the joint surface 231 is pressed out, causing it to overflow onto at least one of the upper and lower surfaces of the leg portion 23, and at least one of the inner side surface 236 and outer side surface 237 of the leg portion 23, and to adhere to the molded coil 5.

The present disclosure relates to the technical field of electronic power, and particularly discloses a power supply module, a power supply system and a multi-phase anti-coupling inductor. The power supply module comprises an anti-coupling inductor and a plurality of half-bridge modules arranged on the anti-coupling inductor. The anti-coupling inductor comprises a plurality of windings and a magnetic core. The plurality of windings are linear windings between a first plane and a second plane. A first magnetic core and a second magnetic core are respectively located at two ends of the windings. A magnetic core column connects the first magnetic core and the second magnetic core. The magnetic core column is a plurality of magnetic core columns, and forms a plurality of magnetic core units with the first magnetic core and the second magnetic core. The magnetic core units are arranged in correspondence with the windings. The plurality of magnetic core units all extend from the first plane to the second plane in the same direction around the corresponding windings. A closed region is arranged in one-to-one correspondence with the windings. Each half-bridge module is connected in one-to-one correspondence with the windings, and a midpoint of a bridge arm of each half-bridge module is electrically coupled with a first end of the corresponding winding.

The invention discloses packaging equipment and method for a thin-wall dry-type electronic transformer, and belongs to the technical field of thin-wall dry-type electronic transformer production. The device comprises a base, the base is fixedly connected with a vacuum paint dipping tank, the vacuum paint dipping tank is provided with a mixing assembly, the vacuum paint dipping tank is provided with a plurality of clamping assemblies, each clamping assembly comprises two clamping cylinders, the vacuum paint dipping tank is provided with a control assembly, the clamping cylinders are sleeved with clamping rings, and the clamping cylinders are provided with grooves. In the packaging process, especially in the dipping process, under the action of the clamping ring and the rotating circular truncated cone, the transformer core can be better clamped and fixed, in the dipping process, a port, a gasket and the like on the outer side of the transformer core are located in the clamping ring, and in the paint dipping process, the clamping ring is located in the clamping ring. And the resin solution does not abut against a port, a gasket and the like on the outer side of the transformer core, so that the workload of subsequent cleaning is reduced.

The invention relates to the technical field of electronic component manufacturing and semiconductor packaging, and discloses an integrally-formed inductor packaging process for preventing coil deformation. According to the process, a composition containing magnetic powder, crystalline epoxy resin, an epoxy-terminated hyperbranched polymer and a urea-based thixotropic agent is adopted, and transfer molding is carried out under the low pressure of 5-15 MPa by utilizing a semiconductor injection molding machine. According to the invention, through synergistic viscosity reduction of resin phase change and hyperbranched molecular lubrication and cooperation of the thixotropic agent to prevent magnetic powder sedimentation, the bottleneck that a high filling material is difficult to flow under low pressure is solved. According to the process, traditional dry powder high-pressure pressing is replaced, the risks of coil disordering and deformation are thoroughly eliminated, single-mode multi-cavity high-flux precision manufacturing is achieved, and it is ensured that product resistors are stably arranged and the magnetic performance is highly consistent.

A semiconductor device package may include a package substrate, mold material formed over the package substrate, and a mold-embedded inductor that is embedded in the mold material. The mold-embedded inductor may be coupled to a die, such as a power management integrated circuit die, which may also be embedded in the mold material. The mold-embedded inductor may be formed by forming conductive traces and an inductor core in the mold material. For example, an active mold packaging (AMP) process and corresponding laser direct structuring (LDS) processes may be performed to form openings in the mold material and to activate surfaces of the mold material to facilitate subsequent plating of conductive material. Activated surfaces of the mold material may have micro-rough texture and may include bulk conductive material formed via the application of laser energy to additives in the mold material during the LDS process(es).