Manufacturing method and manufacturing device for coil component

Abstract

Provided is a coil component having a core including a winding portion, and first and second flanges disposed one on either end of the winding portion, A winding is wound about the winding portion, and first and second terminal electrodes are disposed on the first flange. The first flange has an octagonal shape including a bottom surface, a first peripheral surface, first and third omitted peripheral surfaces disposed one on either side of the first peripheral surface, a second peripheral surface opposing the first peripheral surface, and second and fourth omitted peripheral surfaces disposed one on either side of the second peripheral surface. The first terminal electrode is disposed across the first omitted peripheral surface, a part of the bottom surface in a region connecting the entire first omitted side to the entire third omitted side, and the third omitted peripheral surface. The second terminal electrode is disposed across the second omitted peripheral surface, a part of the bottom surface in a region connecting the entire second omitted side to the entire fourth omitted side, and the fourth omitted peripheral surface. The winding has a first end electrically connected to the first terminal electrode on the first omitted peripheral surface and a second end electrically connected to the second terminal electrode on the second omitted peripheral surface.

Description

technical field [0001] The present invention relates to a coil component, a manufacturing method and a manufacturing device thereof, and more particularly to a power supply coil component capable of low height and high density mounting, a manufacturing method and a manufacturing device for manufacturing the power supply coil component. Background technique [0002] As a coil component, the structure which has the roll core which has a pair of flange part and the winding core part which connects this pair of flange part is known. In recent electronic devices, such as mobile phones, high-density mounting of internal devices is required as the performance increases. Therefore, in order to reduce the volume of coil components, JP 2005-210055 A lowers the height or shortens the distance between adjacent coil components. [0003] Here, when wiring the winding on the mounting surface, only the upper back of the wiring portion becomes larger. Furthermore, in the above-mentioned pu...

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Problems solved by technology

[0006] However, in the above conventional method of manufacturing a coil component, there is a problem that when the roller core is inserted into the recess, the resin in the recess overflows, and the resin adheres to parts where the resin should not adhere, such as the terminals provided on

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