The invention discloses an insulated gate
semiconductor device, the leading part of a gate lead wire leading the gate
electrode of an
MOSFET out of the surrounding of a substrate is not configured as an
MOSFET having the same effect in an element region; namely if the gate lead wire is arranged along the periphery of a
chip, the non-work region is increased, so that the situation of expanding the area of the element region and reducing the
chip area are restrained. In the insulated gate
semiconductor device, a gate lead wiring and an
electrical conductor connecting the gate lead wiring to a protective
diode are arranged in a straight line without bending along one and the same side of the
chip. One bent portion or no bent portion is overlapped and extended on the upper parts of the gate lead wiring and the
electrical conductor and connects them to the protective
diode. Further, the protective
diode is arranged adjacent to the
electrical conductor or the gate lead wiring, and a portion of the protective diode is arranged in close proximity to a gate pad portion.