Ceramic electronic parts and its making method

A technology of electronic components and manufacturing methods, applied in the direction of fixed capacitor parts, electrical components, resistance terminals/electrodes, etc., can solve the problems of damaging the reliability of electronic components, complex manufacturing processes, low productivity, etc., and achieve wear resistance Strong, prevents the intrusion of the plating solution, and has the effect of small characteristic deviation

Inactive Publication Date: 2002-11-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the method of impregnating the ceramic green body with resin has the problems of complicated manufacturing process and high productivity and low cost.
[0007] In addition, if synthetic resin remains on the finished ceramic electronic part, then when the part is mounted on the printed circuit board, or when it is used in a high-temperature and high-humidity environment after mounting, the resin remaining in the void is gradually dissolved or Qualitative change, which may damage the reliability of electronic components

Method used

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  • Ceramic electronic parts and its making method
  • Ceramic electronic parts and its making method
  • Ceramic electronic parts and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] As the external electrode, a ceramic green body for a multilayer ceramic capacitor in which a Cu bottom electrode is formed is prepared. After sintering the bottom electrode, prepare a water repellent for water repellent treatment. As a water repellent treatment agent, for methyl ethyl ketone as an organic solvent, 30g / L of Ra-(CH 2 )-Si-(O-Rb) 3 . Here, Ra is a perfluoro group, and Rb is an amino group. The ceramic green body forming the bottom electrode was immersed in the water-repellent treatment agent for 2 minutes, the liquid was removed, and after air-drying, Ni plating and Sn plating were sequentially performed to fabricate a multilayer ceramic capacitor.

[0045] For the obtained multilayer ceramic capacitor, 4WV was applied to a thermostatic bath at a temperature of 85°C and a humidity of 85% for the formation state of the internal plating film of the external electrode of the cross-sectional structure, the solderability, and the humidity of 85%, and the number of...

Embodiment 2

[0050] As in Example 1, the multilayer ceramic capacitor formed by immersing the bottom electrode in the water repellent treatment agent was treated with a ceramic green body for 2 minutes, the liquid was removed, and it was air-dried. Then, the ceramic green body is put into the furnace and heat-treated at 100-120°C for 30 minutes. As a comparative example, as in Example 1, no heat treatment was performed, and a ceramic green body to which the water repellent treatment agent was adsorbed was prepared. Then, assuming that the hand-operated water repellent treatment agent in the mass production process is peeled off, the ceramic green bodies are treated with a roller at 60 rpmj and 30 minutes at 2L perimeter. In addition, Ni plating and Sn plating are sequentially performed on the bottom electrode to manufacture a multilayer ceramic capacitor. Regarding these multilayer ceramic capacitors, as in Example 1, the results of plating penetration into the electrodes, solderability, and w...

Embodiment 3

[0054] Prepare a ceramic green body for chip inductors made of porous ferrite material as the ceramic green body. Using this ceramic green body, as in Example 1, the external electrodes were subjected to water-repellent treatment, Ni and Sn were plated in sequence, and terminal electrodes were formed on both ends of the ceramic green body. As a comparative example, a water-repellent agent using a carboxyl group as an adsorption group without water-repellent treatment was produced, and a sample of resin immersion was performed. Then, in the same manner as in Example 1, Table 3 shows the results of the plating penetration into the electrode, solderability, and moisture resistance load tests.

[0055] this invention

[0056] It is understood from Table 3 that the water-repellent treatment of the present invention does not penetrate into the electroplating in the electrode, the solderability is also good, and even in the humidity resistance load test, no deterioration of ...

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Abstract

The present invention provides a ceramic electronic component that does not intrude into a ceramic body with a plating solution, and a ceramic electronic component manufacturing method for simply manufacturing such a ceramic electronic component. A ceramic electronic component includes a ceramic body on which terminal electrodes are formed on both end faces. The terminal electrode includes a sintered external electrode and a plating film formed thereon. In order to form the ceramic electronic component, a ceramic body having external electrodes is dipped in a water-repellent treatment agent, dried, and subjected to electroplating treatment. The water repellent treatment agent includes functional groups that are easily adsorbed on the external electrodes and functional groups that have hydrophobicity.

Description

Technical field [0001] The present invention relates to a ceramic electronic component and a manufacturing method thereof, and more particularly to a ceramic electronic component in which terminal electrodes are formed on the end surface of a ceramic blank body and a manufacturing method thereof. Background technique [0002] The ceramic electronic component has a structure in which a conductor and a conductive terminal motor are formed on a ceramic body composed of a conductor and a ceramic insulator. The terminal electrode is formed by an external electrode sintered on the end face of the ceramic green body, and a plating film formed on the external electrode. As the plating film, for example, in order to obtain solder resistance during soldering, a Ni plating film is formed. Furthermore, in order to have good solderability, a coating film such as Sn or Sn / Pb plating is formed. Such a plating film is electroplated on the ceramic body with a plating solution and formed by the so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/28C23C18/18H01G4/248
CPCC23C18/1865C23C18/1882H01G4/248Y10T29/435Y10T29/49155Y10T428/31663H01C17/28
Inventor 真田幸雄齐藤芳则
Owner MURATA MFG CO LTD
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