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Water-Dispersed Electrodeposition Liquid For Forming Insulating Coating Film

An insulating coating and electrodeposition technology, applied in the direction of electrophoretic plating, electrophoretic coating, electrolytic coating, etc., can solve the problems of reducing the quality of electrodeposition resin, insufficient stability of dispersion, and deterioration of insulator productivity, etc., to achieve excellent dispersion performance, suppression of productivity decline, and improvement of dispersibility

Active Publication Date: 2018-02-16
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in an electrodeposition solution using polymer particles containing polyamic acid (hereinafter referred to as polyamic acid particles), even if the same method as above is carried out, the dispersibility is not sufficiently stable, and as a result, the Gelation of the synthesized resin or failure to stably obtain an electrodeposition solution in which polymer particles with the same average particle size are dispersed
In addition, by adding a large amount of basic compounds, some degree of improvement in dispersibility can be observed, but many basic compounds will remain in the electrodeposition solution, which will reduce the charge per unit when forming an insulating film by electrodeposition. electrodeposition resin quality (coulombic efficiency), thus deteriorating productivity of insulators

Method used

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  • Water-Dispersed Electrodeposition Liquid For Forming Insulating Coating Film
  • Water-Dispersed Electrodeposition Liquid For Forming Insulating Coating Film
  • Water-Dispersed Electrodeposition Liquid For Forming Insulating Coating Film

Examples

Experimental program
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Effect test

Embodiment

[0111] Next, examples of the present invention will be described in detail together with comparative examples.

[0112]

[0113] First, put 3.00g (15mmol) of 4,4'-diaminodiphenyl ether and N,N-dimethyl into a separable flask equipped with a stirrer, a three-way joint for introducing argon, and a thermocouple. 45 g of acetamide (DMAc) was stirred and dissolved. Next, 3.16 g (15 mmol) of chlorinated trimellitic anhydride and 15 g of DMAc were added to the flask, and the contents of the flask were stirred and reacted at room temperature (25°C) for 6 hours under an argon atmosphere. Thus, the first reaction mixture was prepared.

[0114] Then, 0.32 g (1.5 mmol) of chlorinated trimellitic anhydride was added to the first reaction mixture in the flask, and the mixture was stirred and reacted for another hour to prepare a second reaction mixture.

[0115] Next, water and alcohol were put into a beaker at a mass ratio of 3:1, and a mixed solution was prepared by vigorous stirring. In 800 ...

Embodiment 2

[0120] Except that the addition amount of 2-aminoethanol was 0.015 g, the electrodeposition liquid was obtained in the same manner as in Example 1. In addition, using this electrodeposition solution, an insulator was produced under the same method and conditions as in Example 1.

Embodiment 3

[0122] Except that the addition amount of 2-aminoethanol was 0.005 g, in the same manner as in Example 1, an electrodeposition solution was obtained. In addition, using this electrodeposition solution, an insulator was produced under the same method and conditions as in Example 1.

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PUM

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Abstract

A water-dispersed electrodeposition liquid for forming an insulating coating film, which contains polymer particles, an organic solvent, a basic compound and water, and wherein: the polymer particlesare formed from a polyamic acid having a predetermined structural unit; and the polymer particles have a volume-based median diameter (D50) of 0.08-0.7 mum.

Description

Technical field [0001] The present invention relates to an electrodeposition liquid for forming a water-dispersed insulating film used when forming an insulating material such as an insulated wire by an electrodeposition method. [0002] This application claims the priority based on the patent application No. 2015-133394 filed in Japan on July 2, 2015 and the patent application No. 2016-115966 filed in Japan on June 10, 2016, and uses the content here. Background technique [0003] In the past, insulators such as insulated wires whose surfaces are covered with an insulating coating have been used in motors, reactors, transformers, and the like. As a method of forming an insulating film on the surface of an electric wire, a dipping method, an electrodeposition method (electrodeposition coating), etc. are known. The dipping method is, for example, a method in which a flat wire or the like is used as a body to be coated, and the process of immersing the wire in a paint and then dryin...

Claims

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Application Information

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IPC IPC(8): C25D13/06C08L79/08C09D5/44C09D179/08
CPCC08G73/105C08G73/1071C08G73/14C09D5/4461C09D179/08C25D13/04C08L79/08C25D9/02C25D13/06
Inventor 矶村洵子樱井英章
Owner MITSUBISHI MATERIALS CORP
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