The invention discloses a high and low temperature resistant
epoxy resin adhesive for bonding complex components in the
aerospace field and a preparation method of the high and low temperature resistant
epoxy resin adhesive, relates to the field of
aerospace new materials, and aims to solve the problem that an existing
epoxy resin adhesive is difficult to maintain high
bonding strength in a wide temperature range. Wherein the component A is prepared from liquid epoxy resin, aromatic heterocyclic epoxy resin, super-tough resin and
inorganic filler; the component B is prepared from
aromatic amine, modified alicyclic amine,
polymer particles and a thixotropic agent. The method comprises the following steps: adding the liquid epoxy resin and the aromatic heterocyclic epoxy resin into mixing equipment for mixing, and then adding the super-tough resin and the
inorganic filler for mixing to obtain a component A;
aromatic amine and modified alicyclic amine are mixed, then
polymer particles and a thixotropic agent are added and mixed, and a component B is obtained. According to the
adhesive disclosed by the invention, the
bonding strength of different materials can be kept at a high level in a temperature range of-160 DEG C to 230 DEG C. The
adhesive is used for bonding complex components in the
aerospace field.