362 results about "Inorganic layer" patented technology

An electroluminescent display device according to an example embodiment of the present disclosure may include a substrate having an active area and a non-active area, an oxide thin film transistor disposed on the substrate, an inorganic layer disposed on the oxide thin film transistor, an organic layer disposed on the inorganic layer, at least one hole disposed in the organic layer of the non-active area, a hydrogen blocking layer disposed on the organic layer and an inner surface of the hole and a light emitting element disposed on the organic layer and including an anode, a light emitting unit, and a cathode. As a result, characteristics and reliability of the thin film transistor can be improved by preventing hydrogen from flowing into the oxide thin film transistor.

The invention discloses a method for efficiently depolymerizing polyethylene glycol terephthalate, which comprises the following steps: mixing a PET material, ethylene glycol and a core-shell type magnetic nano composite catalyst, and carrying out alcoholysis reaction at 160-200 DEG C for 30-180 minutes; after the reaction is finished, separating the catalyst from a reaction system through an external magnetic field to obtain a solution containing bis (2-hydroxyethyl) terephthalate; the core-shell type magnetic nano composite catalyst comprises a magnetic FeO core, a SiO shell layer and active metal sites, the FeO core is coated with the SiO shell layer, the SiO shell layer is an insulating inorganic layer and is of a porous structure, the active metal sites are fixed to the surface of the SiO shell layer through coordinate bonds, and active metal is selected from one or more of Co, Ni, Cu, Ce, La and Al. The problems that an existing PET alcoholysis catalyst is easy to dissolve out, difficult to separate, harsh in reaction condition and poor in cycling stability are solved.

Provided is an organic light emitting display module including an active area, a pad area, and a boundary area between the active area and the pad area. Unlike the active area and the pad area, since the boundary area does not include an inorganic layer, less stress is applied to the boundary area when the boundary area is bent. Display panel pads and touch sensing member pads are disposed at the same height without having a height difference therebetween. Thus, a dummy pad may be added to remove the height difference between the display panel pads and the touch sensing member pads.

A display panel and an electronic device. The display panel includes: a substrate; an inorganic layer located on a side of the substrate and provided with a plurality of first openings penetrating through the inorganic layer along a thickness direction of the substrate; and an isolation structure located on a side of the inorganic layer away from the substrate, with a plurality of isolation openings being surrounded by the isolation structure, wherein orthographic projections of the plurality of first openings on the substrate are located at least partially within an orthographic projection of the isolation structure on the substrate.

The present invention provides: a vapor-deposited multilayer film which has high oxygen barrier properties and high water vapor barrier properties, and has sufficient oxygen barrier properties even after a bending treatment; and the like. Provided is a vapor-deposited multilayer film comprising: a multilayer film in which a layer (A), as the outermost layer, a layer (B), and a layer (C) are stacked in this order; and a vapor-deposited inorganic layer (I) stacked on the exposed surface side of the layer (A). The vapor-deposited inorganic layer (I) is a vapor-deposited metal layer that is mainly composed of aluminum, or a vapor-deposited inorganic oxide layer that is mainly composed of alumina or silica. The layer (A) contains, as a main component, an ethylene-vinyl alcohol copolymer (a) that has an ethylene unit content of 36-60 mol%; the layer (B) contains, as a main component, an ethylene-vinyl alcohol copolymer (b) that has an ethylene unit content of 20-35 mol%; and the layer (C) contains a polyethylene or a polypropylene as a main component. The average thickness of the multilayer film is 300 µm or less.

The invention provides a bifunctional interface lithium-rich manganese-based positive electrode material as well as a preparation method and application thereof, and belongs to the technical field of lithium ion battery positive electrode materials. The bifunctional interface lithium-rich manganese-based positive electrode material comprises a lithium-rich manganese-based layered oxide core particle, an inner negative thermal expansion inorganic layer coating the surface of the lithium-rich manganese-based layered oxide core particle, and an outer fast lithium ion conducting layer coating the outer side of the inner negative thermal expansion inorganic layer. Through the synergistic effect of inner and outer coating layers, mechanical regulation and control and chemical / ion regulation and control are simultaneously realized on the particle size. Compared with a scheme which only adopts an inert coating, a single lithium ion conductive coating or a single negative thermal expansion coating, the method has the advantages that the thermal-chemical-mechanical coupling failure problem of a positive electrode / solid electrolyte interface in the all-solid-state battery can be more comprehensively solved, relatively low interface impedance, smaller voltage attenuation and higher cycling stability are realized, the preparation process is simple, and the preparation cost is low. The method is suitable for large-scale production.

Embodiments provide a deposition mask. a method for manufacturing the deposition mask and an electronic device fabricated using the deposition mask. The deposition mask includes a mask frame, an inorganic layer disposed on the mask frame, a plurality of nitride layers sequentially stacked on the inorganic layer, and an alignment member disposed between the plurality of nitride layers.

The invention belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel, and the preparation method of the display panel comprises the steps: providing a substrate, and forming an organic light-emitting unit on the substrate; forming a packaging layer on the organic light-emitting unit, wherein the packaging layer comprises a first inorganic layer, an organic layer, a heat insulation layer and a second inorganic layer which are stacked in sequence; forming a heating electrode on the second inorganic layer; forming a color filter layer on the heating electrode, wherein the color filter layer comprises a black matrix and a plurality of sub-pixel color resistors; and carrying out curing treatment on the color filter layer, namely electrifying the heating electrode to heat the heating electrode so as to provide heat required by curing. According to the invention, high-temperature curing of the color filter layer can be completed while the light-emitting unit is protected.

The present invention relates to a vehicle pane (1) comprising, in the following order: a first pane (2) having a first surface (I) and a second surface (II); an inorganic layer (3) which is arranged on at least one part of the second surface (II) of the first pane (2), wherein the inorganic layer (3) comprises scale-like particles (3a); a thermoplastic intermediate layer (4); and a second pane (5) having a first surface (III) and a second surface (IV), wherein the thermoplastic intermediate layer (4) is a coloured thermoplastic intermediate layer and / or the second pane (5) is a coloured pane. The present invention also relates to a method for producing the vehicle pane (1) and to the use thereof.

There is provided a display device. The display device includes a substrate including an emission area and a non-emission area; a passivation layer on the substrate; a first anode electrode on the passivation layer; a pixel defining layer on the first anode electrode to overlap the non-emission area and defining a first opening; a bank structure on the pixel defining layer and defining a second opening; a first cathode electrode on the first anode electrode and in contact with the bank structure; and a first element inorganic layer on the first cathode electrode, wherein the bank structure includes a first bank layer and a second bank layer having a tip protruding toward the first opening beyond a side surface of the first bank layer, and the tip of the second bank layer is tilted toward the substrate as it extends toward the first opening.

The present application relates to a photovoltaic cell, a photovoltaic cell module, and a photovoltaic cell assembly. The photovoltaic cell includes: a substrate; at least a cell body disposed on a surface of one side of the substrate; and an encapsulation structure disposed on a side of the cell body facing away from the substrate, an orthographic projection of the encapsulation structure covering an orthographic projection of the cell body in the thickness direction, and the encapsulation structure including a first inorganic layer, a first organic layer and a second inorganic layer which are stacked sequentially in a direction away from the cell body. The photovoltaic cell according to the embodiments of the present application can have an improved encapsulation effect and improved reliability.

To provide a laminated film improved in adhesion while having good optical characteristics, and a method for manufacturing the laminated film.SOLUTION: The laminated film 1 of the present invention includes a base film 2, a cured resin layer 3 disposed on one surface in the thickness direction of the base film 2, and an inorganic material layer 4 disposed on one surface in the thickness direction of the cured resin layer 3. The ratio of the ion intensity of the C3H3O2 fragment to the ion intensity of the HSi2O5 fragment measured by time-of-flight secondary ion mass spectrometry is 1.0 * 10 - 1 or more. In addition, the total reflectance of the laminated film 1 from one side in the thickness direction of the inorganic material layer 4 with respect to irradiated light of wavelengths 380nm to 780nm of a standard illuminant D65 is 0.40% or less.SELECTED DRAWING: Figure 1

The application belongs to the technical field of lithium ion batteries, and discloses a poly-m-phenylene isophthalamide-based electrostatic spinning flame-retardant separator and application thereof. The m-phenylene isophthalamide-based electrostatic spinning separator, namely PMIA-based electrostatic spinning separator, is prepared by mixing modified PZS microspheres, PMIA and an organic solvent, and then adopting an electrostatic spinning method. The modified PZS microspheres are prepared by in-situ growth of an inorganic layer SiO2 on the surface of polyphosphazene PZS microspheres with flame-retardant properties. The polyphosphazene PZS microspheres are prepared by a polymerization reaction between tannic acid and hexachlorocyclotriphosphazene. The spinning separator prepared by the application has very excellent porosity, liquid absorption rate and ionic conductivity, and good thermal stability and flame retardancy.

The invention provides a display panel and electronic equipment. The display panel includes: a substrate including a first region, a second region, and a third region between the first region and the second region; a stacked structure in the second region and including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode; a groove in the third region and separating the at least one organic material layer contained in the intermediate layer; and at least one metal layer in the third region and including a first opening overlapping the groove, where the groove is defined in a multilayer film including an organic layer and an inorganic layer on the organic layer, and the at least one metal layer is between the substrate and the multilayer film.

The invention relates to the technical field of electric heating materials, and discloses a graded adjustable resistance type composite electrothermal film material and a preparation method and application thereof. The electrothermal film adopts a multi-layer composite structure and comprises an electrode layer, a polymer-conductive carbon composite functional layer (forming an adjustable resistor R1), an inorganic glass powder-conductive carbon composite functional layer (forming a stable resistor R2) and an electrode layer from top to bottom. The core is that the total resistance R is equal to R1 + R2, constant power output and linear temperature control under fixed voltage are realized by presetting the R value in the preparation stage, and an external regulation and control circuit is not needed. The material fundamentally eliminates the risk of electrode short circuit, has the advantages of high temperature resistance, good flexibility, low driving voltage, fast response, high safety and the like, and is especially suitable for high-power-density flexible heating devices in the working environment of 40-120 DEG C. The preparation method comprises the steps of inorganic layer / polymer layer ink preparation, layer-by-layer forming sintering and composite packaging, and is easy and convenient to operate and suitable for industrial large-scale production.

The invention provides a thin film, a photoelectric device and a display device. The thin film comprises M layers of barrier units which are arranged in a stacked mode, each barrier unit comprises an organic layer, a mesoporous layer and an inorganic layer which are arranged in a stacked mode, and M is an integer larger than or equal to 2. According to the invention, water vapor and oxygen in the external environment can be blocked through the blocking unit, so that the packaging effect of the photoelectric device is improved.

A display device includes: a base layer including a light emitting area, a sensing area, and a non-light-emitting area disposed between the light emitting area and the sensing area; a light emitting element disposed in the light emitting area; an optical sensing element disposed in the sensing area; a capping layer disposed on the light emitting element and the optical sensing element and overlapping the light emitting area, the sensing area, and the non-light-emitting area; an inorganic layer disposed on the capping layer and including a first opening overlapping the sensing area; and a thin film encapsulation layer disposed on the inorganic layer and including a first encapsulation inorganic layer, an encapsulation organic layer disposed on the first encapsulation inorganic layer, and a second encapsulation inorganic layer disposed on the encapsulation organic layer.

A lens includes a lens portion, an anti-reflection (AR) coating layer disposed on a surface of the lens portion, and a water-repellent layer disposed on a surface of the AR coating layer. The water-repellent layer includes an inorganic layer having a plurality of pores and an organic layer at least partially disposed in the plurality of pores. The inorganic layer includes silicon oxynitride (SiOxNy).

Disclosed is a display device that prevents or suppresses damage to an inorganic layer or a data line layer during a bending process of a display panel. The display device includes a display panel including a display area, a non-display area, and a bendable area; first and second back plates supporting the display panel; and a curved cover member having a cavity having a predetermined depth defined therein, wherein the first and second back plates are seated in the cavity, wherein the curved cover member has a flange disposed outwardly of the cavity, wherein a general shape of the curved cover member is a sprue shape, wherein the display panel has a bent portion in the bendable area, and wherein the second back plate includes a flat portion corresponding to the display area, and a bending stress relief hole is formed in the flat portion.

An electronic device and a method for manufacturing the electronic device are disclosed. The electronic device may include an electronic module and a display module including a hole region to overlap the electronic module, wherein the display module includes a base layer having a module hole that is defined therein and corresponds to the hole region, a circuit layer on the base layer, a display element layer provided on the circuit layer and including a light-emitting element, and an encapsulation layer partially provided on the display element layer and including at least a first inorganic layer, wherein the circuit layer includes a plurality of insulating layers provided on the base layer and including a first intermediate insulating layer, a first dam portion spaced from the first intermediate insulating layer, and a protrusion pattern provided on at least a portion of the first intermediate insulating layer and the first dam portion.

Disclosed is a method for manufacturing a mask using a laminate. The laminate may include: a silicon substrate; a first lower inorganic layer covering a lower surface of the silicon substrate; a second lower inorganic layer covering a lower surface of the first lower inorganic layer; a first upper inorganic layer covering the upper surface of the silicon substrate; and a second upper inorganic layer covering an upper surface of the first upper inorganic layer. The method may include the steps of: forming or providing a first opening; forming or disposing a first pattern portion and a second pattern portion; forming or providing a second opening overlapping the first opening by etching the silicon substrate through the first pattern portion and the second pattern portion; and removing the first lower inorganic layer, the second lower inorganic layer, and the first upper inorganic layer overlapping the second opening.

A display device, an electronic device, and a method for manufacturing the display device are provided. The display device includes: a substrate including an emission area and a non-emission area; a passivation layer on the substrate; a first anode electrode on the passivation layer; a pixel defining layer on the first anode electrode to overlap the non-emission region, and defining a first opening; a bank structure on the pixel defining layer and defining a second opening; a first cathode electrode on the first anode electrode and in contact with the bank structure; and a first element inorganic layer on the first cathode electrode, in which the bank structure includes a first bank layer and a second bank layer, the second bank layer having an end protruding beyond a side surface of the first bank layer toward the first opening, and the end of the second bank layer being inclined toward the substrate as it extends toward the first opening.

A display device and an electronic device including the same are provided. The display device includes a display panel including a light emitting element, an input sensor disposed on the display panel, and an anti-reflection layer disposed on the input sensor. The input sensor includes a sensor conductive layer including a plurality of first conductive patterns, a sensor organic layer covering the plurality of first conductive patterns, and a sensor inorganic layer disposed on the sensor organic layer and in contact with an upper surface of the sensor organic layer. An opening is defined in the sensor inorganic layer.

The present application relates to the technical field of semiconductor packaging, and particularly relates to a Micro-LED packaging structure and a manufacturing method thereof. The packaging structure comprises, from bottom to top, a substrate, a color filtering layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light emitting diode layer, a first filling layer, a reflective layer and a second filling layer. The substrate is ground, thinned, cut and split to form independent discrete devices. By setting the reflective layer covering the packaging structure and the discontinuous chip bonding layer, the light emitted by the quantum dots and the micro light emitting diodes is reflected by the reflective layer, avoiding light crosstalk between the packaging structures. The first filling layer with a slope surface is arranged between the reflective layer and the micro light emitting diodes, so that the side light path avoids the micro light emitting diode body, improving the light efficiency. The micro light emitting diodes are arranged in a bias layout, preventing top damage during transfer packaging. The packaging structure has the advantages of preventing light crosstalk and facilitating laser cutting while improving light efficiency and preventing damage.

The invention belongs to the technical field of macromolecular absorbing materials. The material is prepared from the following raw materials in percentage by mass: 5-30% of natural polysaccharide derivative; 30-60% of an ionic acrylic monomer; 0.1-3% of a reversible dynamic crosslinking monomer; 1-10% of an organic porous reinforcing phase; 0.05-1% of an initiation system; a proper amount of water. The material internally has an organic / inorganic double-network structure, wherein a natural polysaccharide chain interacts with inorganic layered silicate through a hydrogen bond to form a physical cross-linked network. According to the universal high-absorption resin material, natural polysaccharide derivatives, ionic acrylic monomers and the like are used as raw materials, an organic-inorganic double-network structure is constructed, a reversible dynamic crosslinking mechanism is introduced, and the universal high-absorption resin material is prepared by adopting a water-phase low-temperature one-step polymerization process. The material has both high absorption performance and mechanical strength, excellent salt tolerance and cycle stability, stable performance in different pH environments, and good biodegradability.

Semiconductor substrate (Sub) designed to enable laser separation of an active material layer (ActMat), comprising: a support substrate (Sprt); an inorganic layer (Inorg) on ​​the support substrate, the inorganic layer being formed from a material selected from Al2O3, TiO2, WO3, La2O3, LaAlO3, and TiN; an electrically insulating layer (Ins) on the inorganic layer; and the active material layer (ActMat) on the electrically insulating layer, the active material layer being single-crystal. Figure to be published with the abstract: Fig. 3

The invention relates to the technical field of display, particularly provides a mother board, a display panel, a mother board manufacturing method and a display panel manufacturing method, and aims to solve the technical problem that an existing display panel cannot dissipate static electricity. To this end, the mother board of the present application comprises: a substrate layer; the inorganic layer is arranged in the display panel area and the cutting channel area on the substrate layer; the active layer is arranged in the display panel area and the cutting channel area on the inorganic layer; the first gate insulating layer and the second gate insulating layer are arranged in the display panel area and the cutting channel area on the active layer and respectively cover the active layer in the display panel area and the active layer in the cutting channel area; the grid electrode is arranged in the display panel area of the first grid electrode insulating layer; the dielectric layer is arranged in the display panel area on the grid electrode, and the dielectric layer covers the grid electrode. And the active layer of the cutting channel region has charge conduction capability, so that an effective electrostatic dredging channel can be formed, and static electricity can be quickly dissipated.

An integrated circuit (IC) package, comprising a die having a first set of interconnects of a first pitch, and an interposer comprising an organic substrate having a second set of interconnects of a second pitch. The interposer also includes an inorganic layer over the organic substrate. The inorganic layer comprises conductive traces electrically coupling the second set of interconnects with the first set of interconnects. The die is attached to the interposer by the first set of interconnects. In some embodiments, the interposer further comprises an embedded die. The IC package further comprises a package support having a third set of interconnects of a third pitch, and a second inorganic layer over a surface of the interposer opposite to the die. The second inorganic layer comprises conductive traces electrically coupling the third set of interconnects with the second set of interconnects.

A printed circuit board including: a first conductor pattern; a first insulating film covering at least a portion of the first conductor pattern conforming to a shape of a surface of the first conductor pattern; and an insulating layer disposed on the first insulating film, the first insulating film including a first inorganic layer and a first organic layer.

The display device comprises a light emitting element layer on a substrate and configured to emit light, a wavelength control layer on the light emitting element layer and configured to convert a wavelength of the light, a color filter layer on the wavelength control layer, and an anti-reflection layer on the color filter layer, wherein the anti-reflection layer includes a first inorganic layer on the color filter layer, a second inorganic layer on the first inorganic layer, and a coating layer on the second inorganic layer and including a dye.