181results about "Flexible printed circuits" patented technology

The invention discloses a hot-pressing control method and system for a flexible circuit board, and particularly relates to the technical field of flexible electronic manufacturing process control, and the method comprises the following steps: calculating a heat conduction equilibrium coefficient through collecting the temperature and heat flux density data of each region in the flexible circuit board, and achieving the real-time evaluation of a heat diffusion characteristic; in combination with an infrared scanning mode, acquiring reflectivity data, analyzing dynamic change of the reflectivity data along with time, and identifying an abnormal region in which coating residues possibly exist; further comparing the position relationship between the thermal diffusion anomaly and the infrared reflection anomaly, screening a space overlapping region as a high-risk point, and executing a preset regulation and control strategy; according to the method, the heat conduction equilibrium coefficient is calculated by collecting heat flow and temperature data, the coating residue abnormal area is recognized by combining infrared reflectivity time sequence characteristics, the high-risk area is screened based on the space overlap ratio for dynamic regulation and control, accurate recognition, differential control and closed-loop optimization of hot pressing defects are achieved, and the hot pressing quality and consistency are improved.

An electronic device includes a display which is foldable at a folding region of the display, a housing which is foldable together with the display, the housing including a first housing and a second housing, and a sensor which is on the first housing and detects a magnetic field, and a hinge structure which corresponds to the folding region of the display, is foldable together with the display and hingedly connects the first housing and the second housing to each other, the hinge structure including a magnet which is slidable along the first housing. Folding of the hinge structure includes folding of the housing together with folding of the display and sliding of the magnet relative to the sensor.

A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.

The invention discloses new energy circuit board processing equipment and a processing method, and belongs to the technical field of flexible circuit board preparation, the new energy circuit board processing equipment comprises a rack, a copper foil processing mechanism, an upper PI film laminating mechanism, a lower PI film laminating mechanism and a forming mechanism; the copper foil processing mechanism comprises a copper foil unwinding roller, a laser cutting machine, a copper foil waste discharge assembly and a lower protection assembly I; the copper foil unwinding roller is rotationally mounted at a first station on the rack; the rack is provided with a copper foil waste discharge assembly and a lower protection assembly I; the upper PI film laminating mechanism comprises an upper protection assembly, an upper PI film windowing assembly, a first hot pressing assembly and a position adjusting assembly, the upper protection assembly is installed on the rack, the upper PI film windowing assembly is installed on the rack, and the first hot pressing assembly is installed on the rack; a position adjusting assembly is mounted on the rack; a lower PI film laminating mechanism is mounted on the rack; and a forming mechanism is mounted on the rack. Through the mode, after the copper foil material belt is cut by laser, the upper film and the lower film are sequentially bonded on the copper foil material belt.

A cold plate assembly includes a cold plate body and a flexible printed circuit. The cold plate body is provided with a cooling liquid flow channel for flowing of cooling liquid. The cold plate body is connected to an electronic component in a thermally conductive manner, and the cooling liquid is used to conduct heat of the electronic component through the cold plate body, to dissipate the heat for the electronic component. The flexible printed circuit is integrated on the cold plate body, and the flexible printed circuit is provided with a high-speed signal cable and a power interconnection cable, where the high-speed signal cable and the power interconnection cable are separately used to electrically connect to the electronic component.

According to the special-shaped FPC and the manufacturing method thereof, the pre-formed special-shaped flexible base material layer is arranged, the shape of the pre-formed special-shaped flexible base material layer is directly matched with the special-shaped surface of a target installation space, and a circuit layer, an insulation covering layer and a special-shaped supporting layer are all attached to the special-shaped surface of the special-shaped flexible base material layer, so that the FPC does not need to be forcibly bent, twisted or stretched subsequently, and the production efficiency is improved. The problems of circuit breakage and delamination caused by stress concentration are fundamentally avoided, the structural stability of the FPC is improved, and the service life of the FPC is prolonged. The flexible circuit board is used for solving the technical problem that in order to achieve special-shaped layout, the plane of an existing flexible circuit board generally needs to be forcibly bent, twisted or stretched.

A flexible film conductor (122) as a balancing resistor for charge or discharge balancing of the cells (102), the flexible film conductor (122) being arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112), comprising an electrically conductive material, characterized in that the flexible film conductor (122) has a predetermined conductor guide (204) and / or the flexible film conductor (122) has a predetermined conductor width, and the flexible film conductor (122) has a predetermined conductor guide (204) and / or a predetermined conductor width, and the flexible film conductor (122) is arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112). The flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122), and / or the flexible film conductor (122) has a conductor length, which is adapted to the spatial arrangement between the cells (102, 104, 105, 106) and the integrated switching circuit (102, 104, 105, 106), and / or the flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122) and / or the flexible film conductor (122) has a conductor length.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof, and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

The invention discloses a circuit board with steps. The circuit board comprises a base material layer, a conductive layer, an enhancement layer, an insulating layer and a heat dissipation layer, the conductive layers are arranged on the upper and lower surfaces of the base material layer; the enhancement layer covers the bending area of the conductive layer; the insulating layer covers the surface of the enhancement layer; the heat dissipation layer covers the surface of the insulating layer; step type transition structures are arranged between the base material layer and the conductive layer and between the conductive layer and the enhancement layer, the step height is 5-15 microns, and the single-stage step width is 0.1-0.3 mm. The composite material has the advantages of high bending resistance, strong interlayer bonding force and excellent heat dissipation performance.

An electronic device may include, for example: a first housing, a second housing, a hinge cover, a hinge structure, a display, and a flexible printed circuit board (FPCB) including a rigid portion configured to be disposed on a first cover portion in the folded state, a first flexible portion connected to the rigid portion and configured to be at least partially bent along a second cover portion, and a second flexible portion connected to the rigid portion oppositely to the first flexible portion and configured to be at least partially bent along a third cover portion. The rigid portion is more rigid than the first flexible portion and the second flexible portion.

Earbud core of a bone conduction loudspeaker, characterized in that the earbud core of a bone conduction loudspeaker comprises: a magnetic circuit arrangement, a vibration arrangement, an external conductor and a support, wherein the vibration arrangement comprises a coil and an internal guide conductor, wherein the external conductor can transmit audio current to the coil for the vibration arrangement, wherein an end of the external conductor is connected to the internal guide conductor of the earphone core, wherein the support has a cable trough, wherein the external conductor and / or the internal conductor are at least partially arranged in the cable trough, wherein the internal guide conductor and the external guide conductor are welded together, and wherein the weld point is located in the cable trough.

The application discloses a manufacturing method of a high-shielding flexible plate and the high-shielding flexible plate, and provides the flexible plate, which comprises a first film layer, a circuit copper layer and a second film layer, and the first film layer and the second film layer are respectively arranged on the upper and lower surfaces of the circuit copper layer; the flexible plate is subjected to roughening treatment; a silver paste pattern layer is screen-printed on the first film layer, and baking and curing are carried out; a third film layer is attached to the silver paste pattern layer after curing, and rapid pressing is carried out to form the high-shielding flexible plate. The silver paste pattern layer with high shielding characteristics is manufactured on the film layer, and another film layer is manufactured on the silver paste pattern layer to form a good double-layer pattern and double-layer film layer structure, and a reliable process manufacturing method is formed, the high shielding characteristics can be effectively realized, the flexibility of the flexible circuit board itself is not affected, and the flexible plate with high shielding performance can be provided for connectors and high-precision instruments.

A display device includes a substrate, a first wiring layer, a second wiring layer, a data fan-out, and a data flexible printed circuit board. The substrate has a display area and a peripheral area. The first wiring layer transfers a gate signal in the display area. The second wiring layer transfers a data voltage in the display area. The data fan-out has a first data fan-out wire connected to the second wiring layer. The data flexible printed circuit board is electrically connected to the first data fan-out wire in the peripheral area. The first data fan-out wire includes a first zigzag portion having a zigzag shape and a first straight portion that extends from the first zigzag portion. A width of the first straight portion is larger than a width of the first zigzag portion.

The invention relates to the technical field of circuit board processing equipment, and particularly discloses LCD flexible circuit board hot-pressing binding equipment convenient for excessive glue cleaning, the LCD flexible circuit board hot-pressing binding equipment comprises a bottom ring, the upper surface of the edge of the bottom ring is fixedly connected with a supporting rod, and the top of the supporting rod is fixedly connected with a top ring. The side surface of the circuit board is continuously rubbed with the polishing strip on the moving block through the rotating circuit board, and solidified overflowing glue on the side surface of the circuit board is rubbed and scraped, so that the overflowing glue on the side surface of the circuit board is automatically cleaned after hot pressing is completed, the automation degree of the equipment is greatly improved, and the production efficiency is improved. Meanwhile, the follow-up procedure of manually cleaning excessive glue is removed, the production efficiency is greatly improved, meanwhile, when the driving ring moves to the bottom, the upper heating disc and the lower heating disc can be driven to start synchronous forward and reverse rotation by continuously and intermittently moving the driving disc up and down through hydraulic equipment, and the grinding effect on the circuit board is greatly improved in combination with a grinding strip; and thus, the capability of cleaning the excessive glue is greatly improved.

The invention discloses a spacecraft force bearing and multi-layer flexible circuit integrated structure based on 3D printing. The spacecraft force bearing and multi-layer flexible circuit integrated structure is integrally formed by a metal force bearing layer, an electric insulation coating layer and a multi-layer flexible circuit functional layer through an in-situ continuous printing process, wherein the metal force bearing layer is made of metal additive materials. The metal bearing layer is a lightweight metal gradient dot matrix shell with complex internal functional channels; the electric insulation coating layer is sprayed or printed on the surface of the metal bearing layer in a surface modification binding force enhancing mode. And the multi-layer flexible circuit function layer is directly printed on the insulating layer across the curved surface and the edge. Physical and functional deep integration of a spacecraft main force bearing structure, a thermal management path, an electromagnetic compatibility substrate, electrical insulation and a high-low frequency circuit is realized, and the systematic problems of large size, heavy weight, multiple interfaces and low reliability of a traditional discrete design are solved. And the method is particularly suitable for platforms with strict requirements on space, weight and reliability, such as micro-nano satellites and the like.

The flexible LED circuit board comprises a flexible base material layer and a conductive layer, the conductive layer is embedded in the middle of the flexible base material layer, a plurality of open slots are formed in the upper end face of the flexible base material layer at equal intervals, and bonding pads on the conductive layer are exposed through the open slots; the multiple LED lamp beads are welded to the bonding pad, the two sides of each LED lamp bead are positioned and clamped through the structure of the flexible base material layer, and when the folding angle is too large, the LED lamp beads and the flexible base material layer are automatically separated to release stress; the flexible base material layer forms an elastic stretching section at the position of the opening groove, the conductive layer forms an arc-shaped conceding section at the corresponding position, and the structure can absorb extrusion deformation and prevent breakage when bent. According to the invention, the foldability and durability of the circuit board are improved, the self-adaptive protection and maintainability of the lamp beads are realized, and the circuit board is suitable for the fields of foldable display and flexible illumination.

A semiconductor device includes a rigid flex circuit that has a first rigid region and a second rigid region that are electrically connected by a flexible portion. A first die is mounted to a first side of the first rigid region. A second die is mounted to a second side of the second rigid region. The first and second sides are on opposite sides of the rigid flex circuit. The flexible portion is bent to hold the first and second rigid regions in generally vertical alignment with each other.

A method for preparing and applying a conductive silver paste suitable for flexible circuits belongs to the field of flexible electronics and low-temperature conductive pastes. The conductive silver paste suitable for flexible circuits prepared by the present invention relies on the formation of a cross-linked network internally after mixing a first type of functional mixture with a second type of functional mixture. The interlacing and mutual entanglement of the resin molecular chains enhance the deformation ability of the conductive paste, improve the ductility and impact resistance of the material, and ultimately enhance toughness. Compared with traditional conductive pastes, this conductive paste has better conductivity, flexibility, and mechanical strength, and meets the harsh environmental conditions that flexible circuits may face during application. In addition, by optimizing the organic carrier, the amount of conductive phase can be reduced, greatly reducing the production cost.

An optical module driving device comprises a seat stand, a rotation driving part which is arranged on one side of the seat stand and drives the seat stand to rotate around a first shaft, and an inclined driving part which is supported on the other side of the seat stand in a free swinging mode and drives an optical module to swing around the direction perpendicular to the first shaft. The optical module comprises a seat stand and a flexible circuit board for supplying power to the optical module, and is characterized in that the flexible circuit board is provided with a plane part and a peripheral part which is formed by bending and is perpendicular to the plane part, the peripheral part is wound outside the seat stand, and a gap is formed between the peripheral part and the peripheral surface of the seat stand; a relay part is arranged between the plane part and the peripheral part of the flexible circuit board, and the relay part is fixed on the seat stand, so that no relative motion exists between the plane part and the seat stand when the rotation driving part drives the seat stand to rotate; and when the inclined driving part drives the optical module to incline, no relative motion exists between the peripheral part and the seat stand.

In an embodiment, an electronic device includes: a housing including a printed circuit board (PCB) in an internal space thereof; and a camera module assembly. The camera module assembly is disposed in the internal space, and includes: a module housing; a first camera module having a first camera housing, disposed in at least a portion of the module housing, and including a first flexible PCB (FPCB) led out from the module housing and connected to the PCB; and a second camera module having a second camera housing separated from the first camera housing, disposed in the module housing in a manner adjacent to the first camera module, and including a second FPCB led out from the module housing and electrically connected to the PCB, in which the first FPCB and the second FPCB at least partially overlap each other when the module housing is viewed from above, and are guided to the same direction.

An ultrasonic endoscope includes an ultrasound transducer, a distal end body block component in which an observation optical system and an illumination optical system are mounted, a channel block component, and a flexible printed circuit part that is disposed inside the distal end body block component and is connected to the ultrasound transducer, the flexible printed circuit part includes a transducer connection portion, an offset wiring portion that is positioned on an opposite side to the transducer connection portion and is disposed in an offset manner at a position away from a longitudinal axis toward an outside in a radial direction of the longitudinal axis with respect to the transducer connection portion, and an intermediate connection portion that connects the transducer connection portion and the offset wiring portion, the offset wiring portion has a cable bonding portion to which loose cables are bonded, and the cable bonding portion is covered with an insulating member that is positioned inside the distal end body block component.

The invention relates to the field of flexible circuit board manufacturing, and provides a preparation method for improving interlayer layering and warping of a bending area of a flexible circuit board. The method comprises the following steps: determining the width of a non-adhesive region of a bending region of the flexible circuit board based on analysis of bending stress distribution; the method comprises the following steps: replacing an adhesive-free electrolytic copper foil used by a base material in a bending area with an adhesive-free rolled copper foil, and utilizing a grain structure which is formed by the rolled copper foil due to a rolling process and is internally compact and axially arranged; manufacturing a flexible circuit board, and manufacturing a non-glue area in a bending area of the flexible circuit board according to the determined width of the non-glue area; carrying out press-fit encapsulation, and carrying out overall press-fit on the flexible circuit board with the manufactured non-glue area; cutting the laminated and encapsulated flexible circuit board into single pieces by adopting high-precision laser cutting equipment; and carrying out a bending test, carrying out bending operation on the flexible circuit board which is cut into the single pieces, and verifying the bending effect and the improvement condition of the warping problem.

An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

The present invention relates to a circuit board, an antenna package, and a display device. The circuit board according to one embodiment includes a core layer including a first region and a second region, and an antenna feed line disposed on the core layer across the first region and the second region, wherein the antenna feed line includes a first portion extending in a first direction over the first region, a second portion extending in a second direction over the first region, and a third portion extending in the first direction over the second region, and a distance between adjacent second portions of the antenna feed line may be three times or less the distance between adjacent third portions of the antenna feed line.

The invention discloses a flexible circuit board manufacturing method, a flexible circuit board and a rigid-flex board, and relates to the technical field of circuit boards. The manufacturing method of the flexible circuit board comprises the following steps: providing a flexible core board; first covering films are pressed on the two opposite sides of the flexible core plate respectively; electromagnetic shielding films are pressed on the sides, away from the flexible core plate, of the two first covering films; and a second covering film is pressed on one side, deviating from the first covering film, of each electromagnetic shielding film. The flexible circuit board processed by the flexible circuit board manufacturing method provided by the invention can provide wear-resistant protection for the electromagnetic shielding film.

A display device includes: a display panel; a data driver transmitting a data voltage to the display panel; a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver; a first printed circuit board (PCB) electrically connected to the input-side wiring to transmit a high-speed driving signal to the data driver; a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board; and an adhesive layer disposed between the metal tape and the insulating layer of the first flexible printed circuit board.

To provide an electric conduction structure of a circuit board in a flexible substrate.SOLUTION: An electric conduction structure of a circuit board in a flexible substrate according to the present invention includes a flexible substrate, a circuit layer, and at least a welding structure and an electric connection structure. The flexible substrate includes a first surface, a second surface, one side surface, and a plurality of grooves. The first surface and the second surface are disposed opposite to each other and the side surface connects the first surface and the second surface. On the side surface, the grooves are formed and connect the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure near the side surface of the flexible substrate. The welding structure is disposed on the second surface of the flexible substrate. The electric connection structure connects the conductive structure and the welding structure, and the electric connection structure extends from the first surface to the second surface of the flexible substrate.SELECTED DRAWING: Figure 3

The invention discloses a flexible circuit double-sided board and a preparation process thereof, and relates to the technical field of flexible circuit boards, the flexible circuit double-sided board comprises a flexible circuit board base material and a covering film covering the surface of the flexible circuit board base material, and the covering film is provided with a window for exposing a copper surface to be subjected to gold immersion. According to the method, the white stains on the gold surface are thoroughly eliminated, the reaction path between the oxidation area of the windowing edge and the golden finger is blocked through the 200-micron copper bars, gold plating abnormity of the oxidation area is concentrated on the copper bars, gold plating on the surface of the golden finger is uniform, and the elimination rate of the white stains reaches 100%; a board grinding process does not need to be newly added, the technical index of'copper surface board grinding forbidding 'of a client is completely met, and potential damage of board grinding to the performance of the circuit board is avoided.

A display device includes a driver comprising a flexible circuit board connected to a display panel. The driver further includes: a first source circuit board; a second source circuit board; a main circuit board including a controller for generating a power supply voltage, the main circuit board applying the power supply voltage to each of the first and second source circuit boards; and a connector connecting the first and second source circuit boards. The connector is electrically connected to a first voltage line of a plurality of voltage lines of the first source circuit board that is most adjacent to the second source circuit board, and a second voltage line of a plurality of voltage lines of the second source circuit board that is most adjacent to the first source circuit board.