387results about "Flexible printed circuits" patented technology

The invention relates to the technical field of flexible circuit board production, in particular to a process optimization method and system for a flexible circuit board production line. The method comprises the following steps: acquiring characteristic data of a flexible circuit board material; executing a circuit board thermocuring action according to the material characteristic data of the flexible circuit board, performing thermal stress intensity evaluation, and generating stress hot spot distribution data; performing real-time curing temperature control feedback adjustment according to the stress hotspot distribution data to obtain circuit board curing effect evaluation data; detecting a real-time surface wettability index of the to-be-processed flexible circuit board in front of the laminating station; and fitting process parameter compensation is carried out based on the circuit board curing effect evaluation data and the real-time surface wettability index so as to realize curing-fitting process optimization of the flexible circuit board production line. According to the invention, intelligent optimization of the curing-laminating process of the flexible circuit board production line is realized, and the quality problems of uneven stress and overlarge deformation in the thermocuring-laminating process are effectively solved.

The invention discloses a hot-pressing control method and system for a flexible circuit board, and particularly relates to the technical field of flexible electronic manufacturing process control, and the method comprises the following steps: calculating a heat conduction equilibrium coefficient through collecting the temperature and heat flux density data of each region in the flexible circuit board, and achieving the real-time evaluation of a heat diffusion characteristic; in combination with an infrared scanning mode, acquiring reflectivity data, analyzing dynamic change of the reflectivity data along with time, and identifying an abnormal region in which coating residues possibly exist; further comparing the position relationship between the thermal diffusion anomaly and the infrared reflection anomaly, screening a space overlapping region as a high-risk point, and executing a preset regulation and control strategy; according to the method, the heat conduction equilibrium coefficient is calculated by collecting heat flow and temperature data, the coating residue abnormal area is recognized by combining infrared reflectivity time sequence characteristics, the high-risk area is screened based on the space overlap ratio for dynamic regulation and control, accurate recognition, differential control and closed-loop optimization of hot pressing defects are achieved, and the hot pressing quality and consistency are improved.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

The present disclosure relates to a display panel including: a first panel area having a first front face and a first rear face; a second panel area having a second front face and a second rear face, the second panel area being configured to overlap the first panel area with the second rear face facing the first rear face with the display panel in a folded state; a third panel area having a third front face and a third rear face, the third panel area being configured to overlap the second panel area with the third front face facing the second front face with the display panel in the folded state; a first hinge coupling for coupling the first panel area and the second panel area to each other; and a second hinge coupling for coupling the second panel area and the third panel area to each other.

The invention relates to a soft electronic device based on a particle phagocytosis effect and a preparation method thereof, and the preparation method comprises the following steps: S1, attaching a hollow mask plate to a polymer substrate, and controlling the position where the polymer substrate can be printed; s2, uniformly dispersing micro-nano particles on the mask plate, wherein the micro-nano particles are in contact with the polymer substrate at the hollowed-out part of the hollowed-out mask plate; s3, after the micro-nano particles make contact with the polymer substrate, the micro-nano particles gradually enter the polymer substrate through the particle phagocytosis effect, and a functional composite material is formed; and S4, removing the hollow mask plate to form the soft electronic device. According to the method, the micro / nano material is directly printed in the soft polymer matrix without introducing a solvent, so that chemical incompatibility and complex fluid dynamic behaviors are avoided. The surface energy-driven particle phagocytosis phenomenon is utilized to realize deep embedding of the material, spontaneous generation is realized, and additional introduction of energy is not needed. Different materials can be seamlessly integrated into the high-performance elastic electronic equipment. Multi-material wireless electronic equipment is created through a multi-layer phagocytic printing technology, and layered printing can be achieved.

The present invention provides a bending machine, which relates to the field of product processing technology, including a frame, a power drive unit, a rotating shaft and a bending assembly; the power drive unit is installed on the frame, the rotating shaft is rotatably connected to the power drive unit, and the power drive unit is configured to drive the rotating shaft to rotate; the bending assembly includes a first clamping plate, a second clamping plate, an adhesive tape and a counterweight; the first clamping plate is fixedly connected to the rotating shaft, the second clamping plate is fixed to the first clamping plate in a detachable manner, and one end of the adhesive tape is fixed between the second clamping plate and the first clamping plate, and the counterweight is fixed to the other end of the adhesive tape. The present invention alleviates the technical problem that the FPC board is bent by the upper and lower knife mold bending method in the prior art, the outer surface of the FPC board is easily scratched, and there is a high risk of the internal core wire of the FPC board being broken.

The invention belongs to the field of FPCs (Flexible Printed Circuit), and particularly discloses a reinforcing method of an FPC. According to the method, the boundary dimension of an FR4 reinforcing plate is designed to be 1.2 mm larger than the boundary dimension of a to-be-reinforced area on an FPC, then the FR4 reinforcing plate and the to-be-reinforced area on the FPC are sequentially attached and solidified to obtain a stacked plate, finally the stacked plate is sequentially subjected to rough punching and fine punching with the single-side allowance being 0.05-0.2 mm, and the FR4 reinforcing plate and the to-be-reinforced area on the FPC are sequentially subjected to rough punching and fine punching with the single-side allowance being 0.05-0.2 mm. And an FPC reinforcing product with the FR4 reinforcing plate having the same boundary dimension as the to-be-reinforced area on the FPC is obtained. According to the method, the defects of scraps and burrs generated in a conventional punching method can be overcome, the size precision and the qualified rate of products are improved, and the yield of the products and the machining quality stability of the products are improved.

The invention relates to the technical field of FPC bending devices, in particular to an automatic FPC board bending device, a board splicing platform comprises an objective table and a moving block, a sliding block of the board splicing platform is in sliding connection with a sliding rail on an FPC production line, an FPC board is placed on the objective table and limited through a positioning mechanism, the objective table is provided with a bending mechanism, and the moving block is arranged on the moving block. A first adsorption mechanism is mounted on one side, close to the bending mechanism, of the objective table; the bending mechanism comprises a bearing plate and a mounting frame, the bearing plate is used for placing the FPC board, a second adsorption mechanism is arranged on the side, close to the board splicing platform, of the bearing plate, a servo motor is mounted on the mounting frame, bending adjusting mechanisms are mounted on the two faces of the bearing plate correspondingly, and the bending adjusting mechanisms act on the FPC board located between the board splicing platform and the bearing plate. Comprising supporting rods and mounting bases. The bending requirements of different positions on different FPC boards can be met, the different positions on the FPC boards can be synchronously bent at the same time, the equipment compatibility is high, meanwhile, the manual operation cost is reduced through the automatic design, and the production efficiency is improved.

The invention discloses a bending machine for a flexible circuit board. The bending machine comprises a rack; the movable connecting seat is connected with a second sliding rail, the second sliding rail is connected with a first sliding rail, the first sliding rail is fixedly connected with the rack, and the movable connecting seat can move in the first direction of the first sliding rail and the second direction of the second sliding rail; the rotating part comprises a rotating piece and an overturning plate, the rotating piece is connected with the movable connecting base and can rotate around the axis x of the rotating piece, and the overturning plate is connected with the rotating piece; the guide part is connected with the rotating part, and the guide part responds to transmission of the rotating part to rotate around the axis x of the rotating part; the guide groove is formed in the rack, and the guide piece is inserted into the guide groove; and the fixed plate is arranged opposite to the turnover plate. According to the bending machine, the movable connecting base and the guide groove are used for controlling the guide piece to drive the overturning plate to bend a material piece along a preset track, and the production efficiency is greatly improved while the process yield is guaranteed.

An electronic device includes a display which is foldable at a folding region of the display, a housing which is foldable together with the display, the housing including a first housing and a second housing, and a sensor which is on the first housing and detects a magnetic field, and a hinge structure which corresponds to the folding region of the display, is foldable together with the display and hingedly connects the first housing and the second housing to each other, the hinge structure including a magnet which is slidable along the first housing. Folding of the hinge structure includes folding of the housing together with folding of the display and sliding of the magnet relative to the sensor.

A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.

The invention relates to a display module and a display device, in the display module, a protective layer on a first part of a flexible circuit board is in lap joint with a binding part of a display panel, so that back glue does not need to be arranged at the joint of the first part and the binding part, and therefore, when a mother board of the display panel is cut, a linear cutting process does not need to be adopted, and the production efficiency is improved. The utilization rate of the mother board is improved; meanwhile, the first adhesive layer between the first back plate and the binding part is expanded outwards; the end part of the first adhesive layer exceeds the end part of the binding part and is connected with the protective layer of the flexible circuit board, so that the joint of the binding part and the first part is sealed; therefore, the waterproof, salt mist-proof and sweat-proof capabilities of the display module can be improved, so that the reliability of the display module is improved.

The invention discloses new energy circuit board processing equipment and a processing method, and belongs to the technical field of flexible circuit board preparation, the new energy circuit board processing equipment comprises a rack, a copper foil processing mechanism, an upper PI film laminating mechanism, a lower PI film laminating mechanism and a forming mechanism; the copper foil processing mechanism comprises a copper foil unwinding roller, a laser cutting machine, a copper foil waste discharge assembly and a lower protection assembly I; the copper foil unwinding roller is rotationally mounted at a first station on the rack; the rack is provided with a copper foil waste discharge assembly and a lower protection assembly I; the upper PI film laminating mechanism comprises an upper protection assembly, an upper PI film windowing assembly, a first hot pressing assembly and a position adjusting assembly, the upper protection assembly is installed on the rack, the upper PI film windowing assembly is installed on the rack, and the first hot pressing assembly is installed on the rack; a position adjusting assembly is mounted on the rack; a lower PI film laminating mechanism is mounted on the rack; and a forming mechanism is mounted on the rack. Through the mode, after the copper foil material belt is cut by laser, the upper film and the lower film are sequentially bonded on the copper foil material belt.

A cold plate assembly includes a cold plate body and a flexible printed circuit. The cold plate body is provided with a cooling liquid flow channel for flowing of cooling liquid. The cold plate body is connected to an electronic component in a thermally conductive manner, and the cooling liquid is used to conduct heat of the electronic component through the cold plate body, to dissipate the heat for the electronic component. The flexible printed circuit is integrated on the cold plate body, and the flexible printed circuit is provided with a high-speed signal cable and a power interconnection cable, where the high-speed signal cable and the power interconnection cable are separately used to electrically connect to the electronic component.

According to the special-shaped FPC and the manufacturing method thereof, the pre-formed special-shaped flexible base material layer is arranged, the shape of the pre-formed special-shaped flexible base material layer is directly matched with the special-shaped surface of a target installation space, and a circuit layer, an insulation covering layer and a special-shaped supporting layer are all attached to the special-shaped surface of the special-shaped flexible base material layer, so that the FPC does not need to be forcibly bent, twisted or stretched subsequently, and the production efficiency is improved. The problems of circuit breakage and delamination caused by stress concentration are fundamentally avoided, the structural stability of the FPC is improved, and the service life of the FPC is prolonged. The flexible circuit board is used for solving the technical problem that in order to achieve special-shaped layout, the plane of an existing flexible circuit board generally needs to be forcibly bent, twisted or stretched.

A flexible film conductor (122) as a balancing resistor for charge or discharge balancing of the cells (102), the flexible film conductor (122) being arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112), comprising an electrically conductive material, characterized in that the flexible film conductor (122) has a predetermined conductor guide (204) and / or the flexible film conductor (122) has a predetermined conductor width, and the flexible film conductor (122) has a predetermined conductor guide (204) and / or a predetermined conductor width, and the flexible film conductor (122) is arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112). The flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122), and / or the flexible film conductor (122) has a conductor length, which is adapted to the spatial arrangement between the cells (102, 104, 105, 106) and the integrated switching circuit (102, 104, 105, 106), and / or the flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122) and / or the flexible film conductor (122) has a conductor length.

The invention discloses a method for manufacturing a large current-carrying flexible circuit board, which comprises the following steps of: splicing a plurality of independent large current-carrying flexible circuit boards on a spliced board, designing that one independent large current-carrying flexible circuit board forms an acute angle relative to the board edge and an independent board adjacent to the independent large current-carrying flexible circuit board forms a negative equal angle with the board edge, and taking a thick copper layer, manufacturing a circuit pattern for part of the thickness, forming a first half-circuit pattern, pressing and covering one surface of the half-circuit pattern with a first windowing covering film, manufacturing a circuit pattern for the rest of the thickness of the thick copper layer, forming a second half-circuit pattern, forming a thick copper single-surface pattern plate, pressing and covering one surface of the second half-circuit pattern with a second windowing covering film, and pressing; forming a large current-carrying flexible circuit board; the non-parallel jointed board design is adopted, the gummosis filling capacity of the covering film is improved, the thick copper layer is manufactured twice to form a complete circuit pattern, and lateral erosion is reduced; the whole manufacturing method forms a design and processing process which is matched with each other, and an effective and feasible whole technical effect is formed.

A fuse according to an embodiment disclosed herein includes a printed circuit board (PCB); a conductive pattern disposed on the PCB; a film disposed at lateral sides of the conductive pattern or on a partial region of the conductive pattern to leave an open region; and a coating disposed on the conductive pattern and the film.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

The invention discloses a preparation method and application of conductive silver paste suitable for a flexible circuit, and belongs to the field of flexible electronics and low-temperature conductive paste. According to the prepared conductive silver paste suitable for the flexible circuit, a cross-linked network is formed inside after the first type of functional mixture and the second type of functional mixture are mixed, the deformability of the conductive paste is enhanced through staggering and mutual winding of resin molecular chains, the ductility and impact resistance of the material are improved, and finally the toughness is enhanced. Compared with the traditional conductive paste, the conductive paste has better conductivity, flexibility and mechanical strength, and meets the harsh environment condition possibly faced by a flexible circuit in the application process. And by optimizing the organic carrier, the use amount of the conductive phase can be reduced, and the cost required by production is greatly reduced.

In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof, and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

The invention discloses a circuit board with steps. The circuit board comprises a base material layer, a conductive layer, an enhancement layer, an insulating layer and a heat dissipation layer, the conductive layers are arranged on the upper and lower surfaces of the base material layer; the enhancement layer covers the bending area of the conductive layer; the insulating layer covers the surface of the enhancement layer; the heat dissipation layer covers the surface of the insulating layer; step type transition structures are arranged between the base material layer and the conductive layer and between the conductive layer and the enhancement layer, the step height is 5-15 microns, and the single-stage step width is 0.1-0.3 mm. The composite material has the advantages of high bending resistance, strong interlayer bonding force and excellent heat dissipation performance.

An electronic device may include, for example: a first housing, a second housing, a hinge cover, a hinge structure, a display, and a flexible printed circuit board (FPCB) including a rigid portion configured to be disposed on a first cover portion in the folded state, a first flexible portion connected to the rigid portion and configured to be at least partially bent along a second cover portion, and a second flexible portion connected to the rigid portion oppositely to the first flexible portion and configured to be at least partially bent along a third cover portion. The rigid portion is more rigid than the first flexible portion and the second flexible portion.

The invention relates to a field device assembly (1) for process and automation technology, comprising a housing (14) and at least one first chamber (2) and one second chamber (3) arranged in the housing (14), at least one first module (4a) being arranged in the first chamber (2) and at least one second module (4b) being arranged in the second chamber (3), the two chambers (2, 3) being connected via at least one passage (13), and an electrical connecting element (6) being guided in at least one passage (12), the electrical connecting element (6) being provided for establishing an electrical connection between the first module (2) and the second module (3), the electrical connecting element (6) being at least partially composed of rigid (6a, b, c) and flexible sections (6f, g, h, k, j) and being provided with contact surfaces (6x, y, z) or contact elements for contacting the modules (2, 3).

Earbud core of a bone conduction loudspeaker, characterized in that the earbud core of a bone conduction loudspeaker comprises: a magnetic circuit arrangement, a vibration arrangement, an external conductor and a support, wherein the vibration arrangement comprises a coil and an internal guide conductor, wherein the external conductor can transmit audio current to the coil for the vibration arrangement, wherein an end of the external conductor is connected to the internal guide conductor of the earphone core, wherein the support has a cable trough, wherein the external conductor and / or the internal conductor are at least partially arranged in the cable trough, wherein the internal guide conductor and the external guide conductor are welded together, and wherein the weld point is located in the cable trough.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

The invention provides a flexible circuit board and a manufacturing method thereof, the flexible circuit board comprises an insulating substrate, and two opposite end faces of the insulating substrate are respectively provided with a groove. The signal line is arranged in the insulating substrate, and the insulating substrate surrounds the signal line. The two layers of flexible circuit substrates are respectively arranged on two opposite surfaces of the insulating substrate, and each flexible circuit substrate comprises a conductive layer and a power supply layer. The conductive layer extends from one surface of the insulating substrate to the end face and extends into the groove along the end face. The power supply layer is located between the conductive layer and the insulating substrate and is electrically connected with the conductive layer. Wherein one conducting layer is connected with the other conducting layer in the groove, and the two conducting layers are electrically connected with each other. Therefore, the electromagnetic shielding effect of the flexible circuit board can be improved.

The application discloses a manufacturing method of a high-shielding flexible plate and the high-shielding flexible plate, and provides the flexible plate, which comprises a first film layer, a circuit copper layer and a second film layer, and the first film layer and the second film layer are respectively arranged on the upper and lower surfaces of the circuit copper layer; the flexible plate is subjected to roughening treatment; a silver paste pattern layer is screen-printed on the first film layer, and baking and curing are carried out; a third film layer is attached to the silver paste pattern layer after curing, and rapid pressing is carried out to form the high-shielding flexible plate. The silver paste pattern layer with high shielding characteristics is manufactured on the film layer, and another film layer is manufactured on the silver paste pattern layer to form a good double-layer pattern and double-layer film layer structure, and a reliable process manufacturing method is formed, the high shielding characteristics can be effectively realized, the flexibility of the flexible circuit board itself is not affected, and the flexible plate with high shielding performance can be provided for connectors and high-precision instruments.

A display device is provided. The display device includes a display panel, a flexible printed circuit board, and a shielding member, the display panel having a front surface and a rear surface opposite to the front surface and including a plurality of display pads arranged on the front surface and arranged in one direction, the flexible printed circuit board being connected to the display pads and being bent toward the rear surface of the display panel along an imaginary bending axis extending in one direction, and the shielding member being arranged on the flexible printed circuit board, wherein the flexible printed circuit board includes a first bending area and a second bending area based on an intersection with an imaginary line extending from the bending axis in a crossing direction intersecting with the one direction, the first bending area being adjacent to the display pads, the second bending area being adjacent to the rear surface of the display panel, and the shielding member covering the second bending area.

A display device includes a substrate, a first wiring layer, a second wiring layer, a data fan-out, and a data flexible printed circuit board. The substrate has a display area and a peripheral area. The first wiring layer transfers a gate signal in the display area. The second wiring layer transfers a data voltage in the display area. The data fan-out has a first data fan-out wire connected to the second wiring layer. The data flexible printed circuit board is electrically connected to the first data fan-out wire in the peripheral area. The first data fan-out wire includes a first zigzag portion having a zigzag shape and a first straight portion that extends from the first zigzag portion. A width of the first straight portion is larger than a width of the first zigzag portion.