8results about "Flexible printed circuits" patented technology

To provide a device, equipped with three or more circuit members overlapping one another, whose height can be reduced.SOLUTION: A device 10 comprises a first circuit member 40, a second circuit member 50, and a third circuit member 60. The first circuit member 40 has: a first main part 41 in which a main electrode 422 is formed; and a first flexible substrate 46 in which a first collective electrode part 47 is formed. The second circuit member 50 has: a second main part 51 in which a second conductive pattern is formed; and a second flexible substrate 56 in which a second collective electrode part 57 is formed. The third circuit member 60 has: a third main part 61 in which a third conductive pattern is formed; and a third flexible substrate 66 in which a third collective electrode part 67 is formed. The first collective electrode part 47, the second collective electrode part 57, and the third collective electrode part 67 overlap one another in the vertical direction. The first main part 41, the second main part 51, and the third main part 61 are separated from one another when viewed along the vertical direction.SELECTED DRAWING: Figure 4

This disclosure provides a fabrication process for circuits and fuses for a flexible printed circuit board. The fabrication process for circuits and fuses includes: pressing and bonding a release liner to the underside of a polyethylene terephthalate silicone film using an upper rubber roller and a lower steel roller; removing the release liner, based on a circuit and fuse retention position on the metal foil, at an alignment position for the circuit and fuse on the bottom of the PET silicone film using a lower circular knife die and holding the release liner outside the alignment position for the circuit and fuse; aligning the PET silicone film, based on the circuit and fuse retention position on the metal foil, thereby removing the release liner.Pressing and bonding, using an upper rubber roller and a lower steel roller, the metal foil to the PET silicone film with a release liner side; cutting the circuit and fuse with the lower circular blade shape; bonding a PET silicone film to the underside of the metal foil after cutting the circuit and fuse; removing the PET silicone film from the bottom of the metal foil and any metal foil waste; and holding the cut circuit and fuse on the PET silicone film with the release liner side.

The present application relates to the technical field of circuit board processing, in particular to a kind of automatic control method and system for punching flexible circuit board.The method determines initial positioning point by preliminary analysis of image data through edge saliency analysis, establishes the association of physical FPC and ideal design coordinates, determines the position of more accurate initial hole position, for the second hole position, combined with initial positioning point and initial hole position quantitative deformation deviation, through the influence proportion of global error and local error, weight balance correction is carried out, and error correction value is obtained to dynamically compensate and correct hole position.The present application corrects error by balancing deviation weight from direction and distance through quantifying overall and local deformation, carries out continuous punching tracking dynamic correction, reduces batch error accumulation, and improves the accuracy of punching position in real time.

The display device may include a display panel and a frame disposed on a rear surface of the display panel. The display device also includes a plurality of binders fixed to the rear surface of the display panel and disposed between the display panel and the frame, and a plurality of coupling members penetrating through the frame and coupled to the plurality of binders. Therefore, the flatness of the display panel attached to the plurality of binders may be improved by adjusting the locations of the frame and the plurality of binders. Also, the display panel and the frame may be easily attached and detached using the plurality of binders and the plurality of coupling members.

This electronic device may comprise: a housing including a front surface, a rear surface facing the opposite direction of the front surface, and a side wall at least partially surrounding the space between the front surface and the rear surface; a camera assembly disposed adjacent to the side wall at one edge of the space; a cover plate disposed at at least a portion of the circumference of the camera assembly; a keypad assembly disposed between a first portion of the sidewall, which is at least partially adjacent to the camera assembly, and the camera assembly; and an antenna module of which a portion is disposed between a second portion of the sidewall adjacent to the first portion and the camera assembly, the antenna module including a first flexible printed circuit board disposed at least partially between the first portion and the camera assembly.

A flexible substrate includes a base layer and a pattern portion on the base layer, wherein the pattern portion includes a plurality of line portions extending in a first direction and spaced apart from each other in a second direction perpendicular to the first direction and a plurality of arc portions connecting the line portions to each other, and wherein the widths of the line portions in the second direction increase as they get closer to an edge region of the base layer.

To provide an ultrasonic endoscope that facilitates insertion processing within the tip while ensuring insulation performance. [Solution] The ultrasonic endoscope comprises an ultrasonic transducer, a rigid tip section on which observation optics and illumination optics are arranged, a treatment instrument outlet located in the rigid tip section for discharging treatment instruments, and a flexible wiring board section located inside the rigid tip section and connected to the ultrasonic transducer. The flexible wiring board section includes a transducer connection section, an offset wiring section located on the opposite side of the transducer connection section and offset from the transducer connection section in a direction perpendicular to the longitudinal axis of the tip section, and an intermediate connection section connecting the transducer connection section and the offset wiring section. The offset wiring section has a cable connection section to which a loose wire cable is joined, and the cable connection section is covered with an insulating material.

The present application provides a multilayer circuit board and an electronic device. The multilayer circuit board has a circuit unit layer having at least two parallel and spaced circuit layers and an insulation layer disposed between adjacent circuit layers. A conductive through hole penetrating through the thickness direction is formed in the circuit unit layer, the conductive through hole is formed by being surrounded by an inner wall. The multilayer circuit board of the present application realizes parallel connection between the circuit layers, effectively controls the resistance value of the circuit board, and meets performance requirements while reducing the overall thickness of the multilayer circuit board and lowering the space requirement for mounting the multilayer circuit board.