1127 results about "Bi layer" patented technology

Embodiments of the invention are described that use a thin metallic hard mask, which can be a bi-layer film, to increase the incident IBE angle for MTJ sidewall cleaning without losing the process margin for the subsequent interconnection process. The patterned metallic hard mask pads also serve as the top electrode for the MTJ cells. Using a thin metallic hard mask is possible when the hard mask material acts as a CMP stopper without substantial loss of thickness. In the first embodiment, the single layer hard mask is preferably ruthenium. In the second embodiment, the lower layer of the bi-layer hard mask is preferably ruthenium. The wafer is preferably rotated during the IBE process for uniform etching. A capping layer under the hard mask is preferably used as the etch stopper during hard mask etch process in order not to damage or etch through the upper magnetic layer.

An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

Methods and apparatuses for electronic devices such as non-volatile memory devices are described. The memory devices include a multi-layer control dielectric, such as a double or triple layer. The multi-layer control dielectric includes a combination of high-k dielectric materials such as aluminum oxide, hafnium oxide, and/or hybrid films of hafnium aluminum oxide. The multi-layer control dielectric provides enhanced characteristics, including increased charge retention, enhanced memory program/erase window, improved reliability and stability, with feasibility for single or multi state (e.g., two, three or four bit) operation.

A reimageable medium including a transparent substrate having a first side and any opposing side, a protective layer and an imaging layer. The protective layer can be located on the first side of the transparent substrate and the imaging layer can be located on the opposing side of the transparent substrate.

Multi-layer coated materials and methods of making them are disclosed. In a specific embodiment, a porous polymeric substrate is pre-activated and immersed in a polyelectrolyte solution to form a first layer having an electric charge and at least one functional group. The coated material is next immersed in a second solution of a material having an electric charge opposite of that of the first layer to provide a bi-layer coating. This process can be repeated to form multi-layer coatings on porous substrates.

The present invention relates to a multilayer cellulose ester film having a reversed optical dispersion. The film can have an A-B bi-layer or an A-B-A tri-layer configuration. The cellulose ester material for layer A has a hydroxyl degree of substitution (DS_OH) from 0 to 0.5, while the cellulose ester material for layer B has a DS_OH from 0.5 to 1.3. By manipulating the thickness of layers A and B, and the film stretching conditions, desirable optical retardation and optical dispersion properties can be obtained. The film can be used as an optical waveplate in liquid crystal displays to improve viewing angle, contrast ratio, and color shift.

A bi-layer bond coating for use on metal alloy components exposed to hostile thermal and chemical environment, such as a gas turbine engine used to generate electricity and the method for applying such coatings. The preferred coatings include a bi-layer bond coat applied to the metal substrate, with both layers being applied using high velocity oxy-fuel (HVOF) thermal spraying. In one embodiment, bond coatings in accordance with the invention can be used in combination with a thermal barrier coating (“TBC”). However, the invention can also take other forms, such as a stand alone overlay coating. Bi-layer bond coatings in accordance with the invention consist of a dense first inner layer (such as iron, nickel or cobalt-based alloys) that provides oxidation protection to the metal substrate, and a second outer layer having controlled porosity that tends to promote roughness, mechanical compliance, and promotes adherence of the TBC. Preferably, the outer, less dense layer of the bi-layer bond coat is formed from a mixture of metallic powder and polyester to adjust and control the porosity, but without sacrificing mechanical compliance. Together, the layers enhance adherence to the substrate and improve the overall life of the coating system.

A bi-layer, woven geotextile fabric has interwoven first and second layers. The first layer is over and under woven through the second layer in a pre-determined pattern so that the first layer has portions which face a first side of the second layer and portions which face a second side of the second layer. Monofilaments in the warp direction of the first layer have a pre-determined differential heat shrinkage characteristic that is greater than the monofilaments in the warp direction of the second layer. Closed cells defined by the pattern of the over and under weave are disposed on the first and second sides of the second layer. Shrinkage of the monofilaments in the warp direction of the first layer provide for a separation of a portion of the second layer from the first layer at the cells.

A dosage form that facilitates the controlled release of an active agent at a desired release rate or release rate profile includes a bi-layer membrane system and an osmotic core. The bi-layer membrane system includes a semipermeable membrane and an osmosensitive membrane and forms an internal compartment occupied by the osmotic core. The osmotic core includes an active agent composition and a light push layer. A passageway is formed through the bi-layer membrane system and permits expulsion of the active agent composition from the dosage form during operation. The bi-layer membrane system and the osmotic core are formulated and formed to provide controlled release of the active agent included in the active agent composition, while simultaneously facilitating increased loading of active agent within a dosage form of given dimension and increasing the delivery efficiency of such active agent relative to prior osmotic dosage forms including a push layer.

A method of etching multiple films with a dual layer hard mask wherein one layer is totally removed and the other layer partially removed during deep trench etching of the silicon substrate. In particular, a method of deep trench etching silicon substrates comprising the steps of providing a semiconductor substrate capable of being etched, with HBr/NF3/He/O2, having a layer of pad dielectric disposed depositing a layer of material capable of selective removability with respect to the pad dielectric, preferably BSG; depositing a layer of material having a slower etch rate than the semiconductor substrate and the layer of material capable of selective removability with respect to the pad dielectric, preferably, silicon oxide deposited by PECVD; patterning at least one of the layers, and etching the semiconductor substrate to form a trench and removing the layer of material having a slower etch rate than the semiconductor substrate, wherein trenches are of close proximity to each other.

The invention provides a method for passivation of various surfaces (metal, polymer, semiconductors) from external contaminants, and the functionalization of inert surfaces. The method of the invention can functionalize 2D semiconductor and other insert surfaces such as non-reactive metals, oxides, insulators, glasses, and polymers. The method includes formation of a monolayer, an ordered bilayer or an ordered multilayer of metal phthalocyanines (MPc). The invention also provides layer structure in a semiconductor device, the layer structure comprising one of an ordered monolayer, ordered bilayer or ordered multi-layer of metal phthalocyanine upon a surface, and one of an ALD deposited layer or 2D semiconductor on the one of a monolayer, ordered bilayer or ordered multi-layer of metal phthalocyanine.

The invention discloses a method for rolling a high-strength metal composite plate. The method is characterized in that a metal substrate and a cladding plate are selected, it is required that the deformation resistance of the metal substrate is larger than that of the cladding plate, the composite faces of the substrate and the cladding plate are cleaned, the substrate with the large deformation resistance is machined to obtain the substrate with a corrugated face on the composite face, the section of each corrugation is in an arc shape or a sinusoidal wave shape or an oval shape, and the height s of the corrugations, the width t of the corrugations and the thickness h0 of a metal layer with the large deformation resistance satisfy the conditions that s/h0 ranges from 0.1 to 0.8, 2s/t is equal to tan alpha, and alpha ranges from 10 degrees to 40 degrees; the substrate and the cladding plate are stacked and pressed in sequence, and a double-layer composite plate blank is obtained; and a composite plate strip is obtained after rolling is conducted according to the warm-rolling process or the hot-rolling process. By the adoption of the method, the problem of difference of metal plastic deformation caused by different degrees of deformation resistance of dissimilar metals is solved, and the curved surface of the substrate makes compensation for the difference, so that the rolled cladding layer and the rolled substrate layer are matched in length without buckling, and meanwhile the binding force between the substrate and the cladding plate is increased through traction on the cladding plate of the corrugations of the substrate.

The invention relates to a two-dimensional double-layer fiber array and a method for manufacturing the same. The two-dimensional double-layer fiber array is manufactured on the same silicon chip; the fiber array is divided into an upper layer and a lower layer; a plurality of fibers can be placed in each layer; and each layer is fixed and protected by a cover plate. The double-layer fiber array applies double-side photoetching and anisotropic etching technology of a silicon process to manufacture a layer of the fiber array on the upper bottom surface and the lower bottom surface of the silicon chip respectively; each layer of the fiber array consists of at least one V-shaped groove; and the fibers are placed and fixed inside the V-shaped groove. The proposal, effectively improves the density of the fiber array and saves the space.

The invention discloses a lower temperature co-fired ceramic (LTCC) double-layer microstrip antenna used for system-in-package. The LTCC double-layer microstrip antenna used for the system-in-package comprises an antenna coating (1), an upper layer radiating element (2), a middle interlayer (3), a lower layer radiating element (4), an antenna substrate layer (5), an interior earth plate (6), a package (7) and an exterior earth plate (8). Compared with the prior art, the LTCC double-layer microstrip antenna used for the system-in-package has the advantages that three dimension multi-chip module (3D-MCM) technology is adopted, a cavity is formed in the interior of the package, integrated circuit (IC) bare chips can be inlaid in the cavity, and therefore the size of a system is enabled to be smaller, and functions are diversified; all earth design is adopted for the exterior earth plate, and therefore the antenna is free of spatial use limitations, and the antenna is unnecessary to be placed on a corner of a printed circuit board (PCB); and a double-layer microstrip line is adopted as the radiating elements, and therefore the antenna is enabled to have a small lateral dimension, and meanwhile a large bandwidth of 2.35GHz-2.55GHz is obtained.

The invention discloses a 1550 nm long wavelength vertical-cavity surface-emitting laser with an InGaAsN/AlGaInAs QWs as an active layer. The laser is characterized in that the InP-based InGaAsN/AlGaInAs QWs and AlGaAsSb/AlAsSb are used as DBR materials of the active layer. The length of a resonant cavity of the laser is 1 lambda so that the better light emitting effect can be achieved. In addition, the performance of the surface-emitting laser is further improved by the adoption of a double-layer oxidation limiting layer structure, single-mode output power is improved, and 1550 nm long wavelength transmission is achieved. The laser comprises a P-type DBR layer, the active layer, an N-type DBR layer, a substrate, a SiO2 insulating layer, a transparent conducting medium ZnO, a P-type electrode and an N-type back electrode. The whole structure achieves lattice matching in material, so that the epitaxy technology can be widely applied. The vertical-cavity surface-emitting laser is simple in manufacturing technology, good in repeatability and easy to popularize.

The invention which provides a preparation method of a superhydrophilic TiO2/SiO2 porous bilaminar membrane which has a high transmittance and can perform the superhydrophilicity under visible light belongs to the technical field of nanomaterials. The method comprises the following steps: 1, carrying out spin coating on a glass substrate with an SiO2 sol, drying, carrying out spin coating with a mixed solution of polyethylene glycol 2000 and TiO2, and drying the glass substrate in a drying box for 20-40min at 80-120DEG C; 2, heating the dried glass substrate in a muffle furnace to 450-550DEG C according to a heating rate of 2-3DEG C/min, and annealing for 2-3h; and 3, naturally cooling to room temperature after completing the anneal to obtain the superhydrophilic TiO2/SiO2 porous bilaminar membrane. The prepared superhydrophilic TiO2/SiO2 porous bilaminar membrane of the invention, which has a highly ordered porous structure and a high transmittance, can perform the superhydrophilicity under visible light and has a good antifog effect, can be applied to various antifog occasions of building glass, automobile rearview windows, windscreens, bathroom glass and the like.

The invention relates to a process for preparing a Ti662 titanium alloy tube material. The process is characterized by comprising the following steps: (1) preparing an ingot, namely firstly preparing a Ti662 titanium alloy ingot or TC10 titanium alloy ingot with phi of 600mm, and then detecting the phase transformation point T beta by a heating metallographic method; (2) forging a bar billet; (3) carrying out ultrasonic flaw detection, namely carrying out ultrasonic flaw detection on the forged bar billet according to the standard GB/T5193-2007 to require the flow detection level to achieve the class B at least; (4) preparing an extrusion billet, namely mechanically processing the forged bar billet; (5) coating, washing the prepared billet with HNO3 solution or alcohol, coating with two layers, wherein the inner coating is a 1mm A3 steel plate, and the outer coating is a 1mm copper strip. The finished product Ti662/TC10 tube material prepared by the process has the advantages of uniform microscopic structure and fine crystalline grain, and has good room-temperature and high-temperature mechanical performance.

A composite pipe has a metal conduit sandwiched between inner and outer conduits of PVC/CPVC, each of which are adhesively secured to the interlaying metal conduit with a dried, solvent-free thin layer of a thermosetting bilayer adhesive which provides a bond with the metal, which bond fails in cohesive failure. Narrowly defined limits on the thickness of each conduit are found to provide a bendable composite pipe with an aluminum interlayer; and to provide a rigid non-bendable composite pipe with a steel interlayer. Making the composite pipe which meets required ASTM and NSF test considerations requires unexpectedly critical process steps. A process for making the pipe is disclosed, as are PVC/CPVC fittings which allow lengths of pipe to be solvent-cemented in them so as to seal the terminal ends of the pipe against infusion of fluid under pressure in the pipe, thus preventing delaminaton.