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1079results about How to "Reduce processing steps" patented technology

Full-automatic feeding, cutting and receiving equipment and processing method thereof

The invention relates to the field of production machining mechanical equipment and discloses full-automatic feeding, cutting and receiving equipment. A material slot of a feeding device of the full-automatic feeding, cutting and receiving equipment is provided with a shifting mechanism consisting of a shifting fork and a shifting rod. The end of the shifting mechanism, which corresponds to a rear baffle plate of the feeding device, is provided with a leveling mechanism. A feeding bracket at the side of an unloading mechanism, which is correspondingly connected with a tube cutting device, is provided with a clamping mechanism. A lower roller and a side roller which are connected are arranged in the unloading mechanism. A split clamp of the tube cutting device is arranged on a tube cutting bracket through a trapezoid block. A recovery device consists of a recovery mechanism and a return mechanism, wherein the recovery mechanism is arranged at one side of the split clamp in a leveling mode; and the return mechanism is arranged on a recovery bracket at the rear end of the recovery mechanism. A brush wheel is arranged in the return mechanism. A machining method of the equipment comprises the steps of adding, aligning, feeding, cutting and receiving. The full-automatic feeding, cutting and receiving equipment is smooth to feed materials and is clear to separate the materials, so that resource waste is avoided, the machining procedures of the engineering are reduced, the cutting quality is improved, both manpower and material resources are saved and the production efficiency is improved.
Owner:东莞市机信机械有限公司

Method for printing patterns on finished product shoe in three-dimension way

InactiveCN102511975AThe purpose of expanding salesSimple processShoemaking devicesTypewritersEconomic benefitsEngineering
The invention relates to a method for printing patterns on a finished product shoe in a three-dimension way and belongs to the field of finished product shoe processing. The method comprises the following steps of: (1) carrying out computer treatment on electronic digital pictures to be printed; (2) spraying early-stage treatment liquid on vamp materials; (3) sheathing the finished product shoe onto a three-dimension manufacture tool, supporting the vamp printing part into a plane, fixing the plane and placing the sheathed finished product shoe in a position with a distance being 2 to 3cm under a printing spray head; (4) setting the parameters of a printing machine and calling out the pictures by machine operation software for printing; (5) directly printing the electronic digital pictures to be printed onto the finished product shoe through the printing machine; and (6) carrying out finished product baking, placing the finished product shoe printed with the electronic digital pictures into a baking oven to be baked, taking out the finished product shoe after the finished product shoe is baked, and obtaining the finished product shoe with the electronic digital pictures printed on the vamp. The method is used for printing the patterns on the finished product shoe in the three-dimension way, the patterns printed on the vamp are very stable and firm, the patterns are clear, the precision is high, the quality is good, the processing work procedures are few, and the economic benefits are good.
Owner:邓健

Highly-abrasion-resistant anti-scratching modified PC (polycarbonate) material and preparation method thereof

InactiveCN102391634AIncrease wear resistance and scratch resistanceAvoid oxidative degradationPolymer scienceAntioxidant
The invention relates to the field of high polymer materials and particularly relates to a highly-abrasion-resistant anti-scratching modified PC (polycarbonate) material and a preparation method thereof. The high-abrasion-resistant anti-scratching modified PC material comprises the following raw materials in parts by weight: 65-90 parts of PC, 10-35 parts of abrasion-resistant anti-scratching auxiliary agent, 0.5-1.5 parts of coupling agent, 1-10 parts of toughening agent, 0.1-1 part of antioxidant and 0.1-1 part of lubricating agent. According to the invention, PC is used as a substrate material, and composite systems such as the abrasion-resistant anti-scratching auxiliary agent, the lubricating agent, other auxiliary agents and the like are added, so that the abrasion-resistant anti-scratching property of the material is improved; the abrasion-resistant anti-scratching modified PC material is prepared by adopting high-temperature smelting, mixing and extruding modes in a twin-screw extruder, thus the hardness and abrasion-resistant anti-scratching effect of PC are improved; and modified PC has the advantages of high rigidity, high toughness, high flowability, high heat resistance, bright surface and the like.
Owner:GUANGDONG JANUS SMART GRP CO LTD

Single-surface texturing method for diamond wire cut polycrystalline silicon wafer, and diamond wire cut polycrystalline silicon wafer with single surface textured

The invention provides a single-surface texturing method for a diamond wire cut polycrystalline silicon wafer. The method comprises the following steps of taking diamond wire cut polycrystalline silicon wafers, inserting every two silicon wafers side by side in the same groove of a silicon wafer basket, putting the silicon wafer basket with the silicon wafers in a mixed solution containing hydrofluoric acid, hydrogen peroxide, silver nitrate and water and corroding the silicon wafer basket with the silicon wafers for 2-8 minutes, so as to prepare silicon wafers of a porous structure; sequentially putting the silicon wafers in an alkaline solution for alkali treatment, putting the silicon wafers in a nitric acid solution for acid treatment, and preparing a surface structural layer with slight defects on one surface of the silicon wafer; and texturing normally on the treated silicon wafers, water scrubbing and drying so as to obtain the polycrystalline silicon wafer with single surface textured. Through adoption of the method, the textured surface uniformly corroded can be formed on one surface of the diamond wire cut polycrystalline silicon wafer. The invention also provides the diamond wire cut polycrystalline silicon wafer with the single surface textured.
Owner:LDK SOLAR XINYU HI TECH XINYU CO LTD
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