1079results about How to "Reduce processing steps" patented technology

In embodiments of the present invention improved capabilities are described for threat detection using a behavioral-based host-intrusion prevention method and system for monitoring a user interaction with a computer, software application, operating system, graphic user interface, or some other component or client of a computer network, and performing an action to protect the computer network based at least in part on the user interaction and a computer code process executing during or in association with a computer usage session.

A method for processing semiconductor devices includes providing a semiconductor substrate. The method includes forming a pad oxide layer overlying the substrate and forming a silicon nitride layer overlying the pad oxide layer. The method includes forming a trench region extending through an entirety of a portion of the silicon nitride layer and extends into a depth of the semiconductor substrate. The method also includes filling the trench region with an oxide material. The oxide material extends from a bottom portion of the trench region to an upper surface of the silicon nitride layer. The method includes planarizing the oxide material and selectively removing the silicon nitride layer to form an isolation structure. A polysilicon material is deposited overlying the isolation structure. The polysilicon material is planarized to expose a top portion of the isolation structure and form a first electrode and a second electrode structures separated by a portion of the isolation structure.

A method of depositing thin films comprising Ti and TiN within vias and trenches having high aspect ratio openings. The Ti and TiN layers are formed on an integrated circuit substrate using a Ti target in a non-nitrided mode in a hollow cathode magnetron apparatus in combination with controlling the deposition temperatures by integrating cooling steps into the Ti/TiN deposition processes to modulate the via and contact resistance. The Ti and TiN layers are deposited within a single deposition chamber, without the use of a collimator or a shutter.

The present invention provides a semiconductor device package comprising a substrate with at lease a pre-formed die receiving cavity formed and terminal contact metal pads formed within an upper surface of the substrate. At lease a first die is disposed within the die receiving cavity. A first dielectric layer is formed on the first die and the substrate and refilled into a gap between the first die and the substrate to absorb thermal mechanical stress there between. A first re-distribution layer (RDL) is formed on the first dielectric layer and coupled to the first die. A second dielectric layer is formed on the first RDL, and then a second die is disposed on the second dielectric layer and surrounded by core pastes having through holes thereon. A second re-distribution layer (RDL) is formed on the core pastes to fill the through holes, and then a third dielectric layer formed on the second RDL.

This invention discloses a semiconductor power device disposed in a semiconductor substrate and the semiconductor substrate has a plurality of deep trenches. The deep trenches are filled with an epitaxial layer thus forming a top epitaxial layer covering areas above a top surface of the deep trenches covering over the semiconductor substrate. The semiconductor power device further includes a plurality of transistor cells disposed in the top epitaxial layer whereby a device performance of the semiconductor power device is dependent on a depth of the deep trenches and not dependent on a thickness of the top epitaxial layer. Each of the plurality of transistor cells includes a trench DMOS transistor cell having a trench gate opened through the top epitaxial layer and filled with a gate dielectric material.

The disclosure relates to a cassette, frame and mold for holding a tissue sample during an embedding and mircotoming process, and related methods. The cassette is sectionable in a microtome and includes a body with a bottom wall and a plurality of side walls. First and second side walls are generally V-shaped to present an apex of the “V” to the microtome blade. A lid of the cassette is stiffer than the bottom wall of the cassette to assist with positioning the tissue sample. The side walls of the cassette are perforated so as to significantly reduce the amount of cassette material that must be cut by the microtome blade. In one embodiment, to additionally reduce blade wear the ribs on one side wall are offset lengthwise relative to the ribs on an opposite side wall. An upper flange of the cassette includes depressions configured to register with detents in the frame.

The invention relates to a process for preparing crosslinkable polymers containing silane groups having at least one hydrolyzable radical by free-radical-initiated grafting of the base polymers with an olefinically unsaturated silane having at least one hydrolyzable radical, wherein the grafting is carried out in the presence of(a) an alkylsilane of the formula I, whereR1 is a monovalent hydrocarbon radical having from 1 to 33 carbon atoms or a divalent hydrocarbon radical having from 4 to 24 carbon atoms,R2 is a hydrocarbon radical having from 1 to 10 carbon atoms,X are identical or different hydrolyzable radicals,n is 0, 1 or 2 andm is 1 or 2 and/or(b) a fluoroalkylsilane of the formula whereR3 is a fluoroalkyl radical,R4 is an alkyl radical andX is a hydrolyzable radical,x is an integer from 1 to 3,y is 0, 1 or 2 andz is an integer from 1 to 3, with the proviso that the sum x+y+z=4.

The invention relates to the field of production machining mechanical equipment and discloses full-automatic feeding, cutting and receiving equipment. A material slot of a feeding device of the full-automatic feeding, cutting and receiving equipment is provided with a shifting mechanism consisting of a shifting fork and a shifting rod. The end of the shifting mechanism, which corresponds to a rear baffle plate of the feeding device, is provided with a leveling mechanism. A feeding bracket at the side of an unloading mechanism, which is correspondingly connected with a tube cutting device, is provided with a clamping mechanism. A lower roller and a side roller which are connected are arranged in the unloading mechanism. A split clamp of the tube cutting device is arranged on a tube cutting bracket through a trapezoid block. A recovery device consists of a recovery mechanism and a return mechanism, wherein the recovery mechanism is arranged at one side of the split clamp in a leveling mode; and the return mechanism is arranged on a recovery bracket at the rear end of the recovery mechanism. A brush wheel is arranged in the return mechanism. A machining method of the equipment comprises the steps of adding, aligning, feeding, cutting and receiving. The full-automatic feeding, cutting and receiving equipment is smooth to feed materials and is clear to separate the materials, so that resource waste is avoided, the machining procedures of the engineering are reduced, the cutting quality is improved, both manpower and material resources are saved and the production efficiency is improved.

A benign all-wet process for stripping photoresist after an implantation process performed to fabricate a device is provided. A method of stripping implanted resist includes a first step of disrupting a crust formed on the surface of the resist during the implantation process and then removing the underlying resist. In accordance with embodiments of the invention, a catalyzed hydrogen peroxide (CHP) chemical system is used to disrupt the crust and allow for low temperature (<180° C.) removal of the underlying resist.

A thin film transistor (TFT) may include a substrate, a gate electrode on the substrate, a gate insulating layer on the gate electrode, and a semiconductor layer on the gate insulating layer. The semiconductor layer may include a top surface, a channel area aligned in a vertical direction with the gate electrode, a plurality of doped areas proximate to the channel area, and a plurality of non-doped areas. Source and drain electrodes may be on the top surface of the semiconductor layer aligned above respective ones of the plurality of non-doped areas of the semiconductor layer. A planarization layer may be on the gate insulating layer, the source and drain electrodes and the semiconductor layer channel area, and may include a plurality of openings respectively exposing the plurality of doped areas of the semiconductor layer and a portion of the source electrode and the drain electrode.

The invention relates to a halogen-free intumescent flame retardant wire/cable insulating material composition. The formula of the materials of the composition is as follows: 60 to 80 percent by mass of polyolefin; 15 to 35 percent by mass of halogen-free intumescent flame retardant; 2 to 10 percent by mass of synergist; 1 to 10 percent by mass of compatilizer; 0.1 to 1 percent by mass of lubricant; and 0.1 to 1 percent by mass of antioxidant. Compared with the prior art, the composition has the advantages that: dosage is low, the flame-retardant property is high, no harmful substances are released and the color cannot be changed in the process of processing and use, and precipitation resistance and water resistance are good. The composition has good flame-retardant property and toughness, and is particularly suitable for use in the fields of wires/cables, electronics/electricity, house decoration, automobile industry and the like which have strict requirement on flame retardance.

The invention discloses a water-based dye ink and an application thereof. The water-based dye ink comprises the following components in percent by weight: 0.2 to 12 percent of water-soluble dye, 55 to 80 percent of modified acrylic resin emulsion, 0.01 to 1 percent of ultraviolet absorbent and balance of water, and different additives can be added. The dye ink can be applicable to the fields such as jet ink, cipher paint ink, textile printing ink, water-type printing ink, fountain pen ink and water ball pen ink, and has the advantages of water resistance, oil resistance, scratch resistance, illumination resistance, high temperature resistance, low temperature resistance, good color reducibility, duration and the like.

An information processing apparatus includes: a data processing unit that acquires content codes including a data processing program recorded in an information recording medium and executes data processing according to the content codes; and a memory that stores an apparatus certificate including an apparatus identifier of the information processing apparatus. The data processing unit is configured to execute an apparatus checking process applying the apparatus certificate stored in the memory on the basis of a code for apparatus checking process included in the content codes, acquire the apparatus identifier recorded in the apparatus certificate after the apparatus checking process, and execute data processing applying content codes corresponding to the acquired apparatus identifier.

A possibly pre-infected system is inspected for the existence of tracked application-specific accounts. In a tracked application-specific account is found, the system is further audited to verify that only authorized processes are using the account and that the authorized account creation application is installed on the host computer system.

The invention relates to a method for printing patterns on a finished product shoe in a three-dimension way and belongs to the field of finished product shoe processing. The method comprises the following steps of: (1) carrying out computer treatment on electronic digital pictures to be printed; (2) spraying early-stage treatment liquid on vamp materials; (3) sheathing the finished product shoe onto a three-dimension manufacture tool, supporting the vamp printing part into a plane, fixing the plane and placing the sheathed finished product shoe in a position with a distance being 2 to 3cm under a printing spray head; (4) setting the parameters of a printing machine and calling out the pictures by machine operation software for printing; (5) directly printing the electronic digital pictures to be printed onto the finished product shoe through the printing machine; and (6) carrying out finished product baking, placing the finished product shoe printed with the electronic digital pictures into a baking oven to be baked, taking out the finished product shoe after the finished product shoe is baked, and obtaining the finished product shoe with the electronic digital pictures printed on the vamp. The method is used for printing the patterns on the finished product shoe in the three-dimension way, the patterns printed on the vamp are very stable and firm, the patterns are clear, the precision is high, the quality is good, the processing work procedures are few, and the economic benefits are good.

The invention relates to static spinning machine, which comprises: a high-voltage system, a material supplier, an ejection height adjuster, and a collector, wherein said power system is formed by high-voltage direct-current static generator, an anode and a cathode; the supplier is formed by a cup support, a micro ejection pump, and an ejector; the adjuster comprises a group of worm systems integrated with the liquid storage cup, while one end of it fixes the liquid storage cup and another end has the worm wheel meshed with worm, to slide along the trapeze groove at the side edge of worm groove; and the collector can be metallic plate shape, mesh shape and tube shape.

The invention relates to the field of high polymer materials and particularly relates to a highly-abrasion-resistant anti-scratching modified PC (polycarbonate) material and a preparation method thereof. The high-abrasion-resistant anti-scratching modified PC material comprises the following raw materials in parts by weight: 65-90 parts of PC, 10-35 parts of abrasion-resistant anti-scratching auxiliary agent, 0.5-1.5 parts of coupling agent, 1-10 parts of toughening agent, 0.1-1 part of antioxidant and 0.1-1 part of lubricating agent. According to the invention, PC is used as a substrate material, and composite systems such as the abrasion-resistant anti-scratching auxiliary agent, the lubricating agent, other auxiliary agents and the like are added, so that the abrasion-resistant anti-scratching property of the material is improved; the abrasion-resistant anti-scratching modified PC material is prepared by adopting high-temperature smelting, mixing and extruding modes in a twin-screw extruder, thus the hardness and abrasion-resistant anti-scratching effect of PC are improved; and modified PC has the advantages of high rigidity, high toughness, high flowability, high heat resistance, bright surface and the like.

This invention discloses a semiconductor power device disposed on a semiconductor substrate supporting an epitaxial layer as a drift region composed of an epitaxial layer. The semiconductor power device further includes a super-junction structure includes a plurality of doped sidewall columns disposed in a multiple of epitaxial layers. The epitaxial layer have a plurality of trenches opened and filled with the multiple epitaxial layer therein with the doped columns disposed along sidewalls of the trenches disposed in the multiple of epitaxial layers.

A method of refrigeration control through a refrigeration system of a refrigerated transport container includes performing a defrost cycle on the refrigeration system by activating a heat source; and restarting the refrigeration system after the defrost cycle has completed, wherein restarting the refrigeration system includes performing a liquid slugging avoidance process including: initiating a compressor of the refrigeration system at a speed; opening a pressure equalization valve in parallel with the compressor in response to the initiating; opening a liquid valve in series between a condenser and an evaporator after opening of the pressure equalization valve; and closing the pressure equalization valve after a period of time.

A game system includes a plurality of game apparatuses, and the respective game apparatuses are connected so as to make a communication with each other. A virtual space in a communication game comprises a plurality of scenes. Out of the game apparatuses participating in each scene, a parent device (scene host) and a child device (scene visitor) of the scene are determined. During the game, the scene host performs an updating process of scene shared data to be shared with all the game apparatuses participating in the communication game and scene specific data to be shared with only the game apparatuses which exist in the scene where a user's own apparatus participates in.

An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.

A connection cap includes: an insulative cap body for receiving conductors of a wire provided with a back wall and an opening at respective opposite ends thereof; an electrically-conductive conductor connection member which is provided within the cap body and is adapted to be connected to the conductors when the cap body is compressed radially in a state the conductors are received in the cap body; and an electrically-conductive resin material which is filled in a back wall-side portion of the cap body, and is extruded toward the opening to penetrate into interstices between the conductors when the cap body is compressed.

In semiconductor devices having a copper-based metallization system, bond pads for wire bonding may be formed directly on copper surfaces, which may be covered by an appropriately designed protection layer to avoid unpredictable copper corrosion during the wire bond process. A thickness of the protection layer may be selected such that bonding through the layer may be accomplished, while also ensuring a desired high degree of integrity of the copper surface.

The invention discloses a method for manufacturing an aluminum alloy wheel hub of a light-loaded automobile. The steps are as follows: A. Making the rim: according to requirements, select profiles of different cross-sections extruded from aluminum alloy materials, and then roll the profiles into a circle Cylinder, welding the butt joint, then rounding, and finally flanging the wheel lip; B. Spoke production: the circular aluminum plate is stretched or spun to make the aluminum plate reach the designed shape of the spoke, and then the spoke Stamping and processing various through holes; C. Manufacturing of the wheel hub: assembling the spokes in the inner circle of the rim; D. Completing the manufacturing: machining the lip parts of the wheel to complete the final manufacturing of the hub. The wheel rim in the present invention adopts the wheel rim profile that can be produced in large quantities to make the wheel rim. A large number of processing steps are reduced, manufacturing costs are saved, mass production is easier, and it can be directly entered into the ranks of low-end cars, making the promotion range of aluminum alloy wheels wider.

A method and apparatus for operating a monitoring unit operable to receive signals from a mobile transmitter in an electronic location monitoring system involves causing a first receiver to change a signal reception threshold thereof for receiving signals from the mobile transmitter, in response to proximity of the monitoring unit relative to a reference position whereby the receiver rejects signals received from the mobile transmitter that have a signal strength below the signal reception threshold and receives and processes signals received from the mobile transmitter that have a signal strength above the signal reception threshold. Alternatively, detection of a first monitoring unit in proximity to a second monitoring unit may cause the second monitoring unit to take over receiving signals from the mobile transmitter while the first monitoring unit is put into a low power mode.

The invention provides a single-surface texturing method for a diamond wire cut polycrystalline silicon wafer. The method comprises the following steps of taking diamond wire cut polycrystalline silicon wafers, inserting every two silicon wafers side by side in the same groove of a silicon wafer basket, putting the silicon wafer basket with the silicon wafers in a mixed solution containing hydrofluoric acid, hydrogen peroxide, silver nitrate and water and corroding the silicon wafer basket with the silicon wafers for 2-8 minutes, so as to prepare silicon wafers of a porous structure; sequentially putting the silicon wafers in an alkaline solution for alkali treatment, putting the silicon wafers in a nitric acid solution for acid treatment, and preparing a surface structural layer with slight defects on one surface of the silicon wafer; and texturing normally on the treated silicon wafers, water scrubbing and drying so as to obtain the polycrystalline silicon wafer with single surface textured. Through adoption of the method, the textured surface uniformly corroded can be formed on one surface of the diamond wire cut polycrystalline silicon wafer. The invention also provides the diamond wire cut polycrystalline silicon wafer with the single surface textured.

A process for manufacturing (R)-propynylaminoindans, and alternatively, a process for manufacturing (S)-propynylaminoindans. The chiral propynylaminoindans include alkoxy or alkylcarbamates derivatives. The process comprises transfer or pressure hydrogenation in the presence of an optically active catalyst to reduce 1-indanones. The chiral product, either (S)- or (R)-indanols undergo nucleophilic substitution to produce the named product. In an additional aspect, the invention relates to novel intermediates and compounds, namely, substituted indanones, substituted (S)-indanols and substituted (R)-indanols.

The invention discloses a method and a device for installing and regulating light equipment and a steel structure. The method comprises the following steps of: (1) firstly inspecting a foundation and prepared holes of stone bolts; (2) pairwise connecting the lower parts of four stone bolts to form a box structure by four angle steels; (3) placing the four fixed stone bolts into the prepared holes, regulating according to required precision, welding a reinforced concrete plate and an embedded part arranged on the foundation outside each angle steel for fixing after the regulation; (4) grouting the stone bolt holes after each stone bolt is completely regulated; (5) welding an intermediate steel plate between two oppositely angle steels; (6) cutting a hole by taking the intersecting position of a diagonal intersection point of the stone bolts and the intermediate steel plate as a center, welding a nut on the top of the hole, and installing a bolt on the nut so as to be used as a jackscrew for regulating a structural stand column of the equipment. The method and the device prevent and reduce the consumption and also greatly enhance the labor efficiency.

The invention relates to a high-copper alloy strip for a heat sink of an automobile. The high-copper alloy strip comprises the following components in percentage by weight: more than or equal to 99.6% of copper, 0.05-0.20% of silver, 0.01-0.02% of stibium, 0.01-0.02% of chromium, 0.005-0.01% of phosphorus, 0.01-0.05% of rare earth and less than 0.0005% of oxygen. A production process of the high-copper alloy strip comprises the following steps of: (1) upward continuous casting; (2) continuous extruding; (3) cold rolling; (4) intermediate annealing; (5) finish rolling; (6) washing and passivating; (7) slitting; and (8) packaging and warehousing. The high-copper alloy strip provided by the invention has the technical advantages that composition of a high-copper alloy strip for an ultrathin water tank strip of an automobile is reasonably optimized and the problems that comprehensive performances such as electrical conductivity, anti-softening temperature and tensile strength can not meet operating requirements as a strengthened red copper alloy is adopted for preparing the ultrathin water tank belt in the prior art are solved.

A signal generating apparatus, which is adapted for outputting a multicarrier signal where data are multiplexed with respect to a plurality of subcarriers, includes: a rotation sequence selection signal generator for generating a plurality of rotation sequence selection signal sequences which vary the phase relationship between subcarriers on the basis of a plurality of phase rotation sequences and include the number of samples, which are smaller than that of actual transmission signals; and a minimum peak power signal generator for selecting a signal of which peak power becomes minimum from the plurality of rotation sequence selection signals to generate an actual transmission signal by using a phase rotation sequence multiplied with respect to the selected signal.