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1851results about How to "Shorten cycle time" patented technology

Plasma atomic layer deposition system and method

An improved gas deposition chamber includes a hollow gas deposition volume formed with a volume expanding top portion and a substantially constant volume cylindrical middle portion. The hollow gas deposition volume may include a volume reducing lower portion. An aerodynamically shaped substrate support chuck is disposed inside gas deposition chamber with a substrate support surface positioned in the constant volume cylindrical middle portion. The volume expanding top portion reduces gas flow velocity between gas input ports and the substrate support surface. The aerodynamic shape of the substrate support chuck reduces drag and helps to promote laminar flow over the substrate support surface. The volume reducing lower portion helps to increase gas flow velocity after the gas has past the substrate support surface. The improved gas deposition chamber is configurable to 200 mm diameter semiconductor wafers using ALD and or PALD coating cycles. An improved coating method includes expanding process gases inside the deposition chamber prior to the process gas reaching surfaces of a substrate being coated. The method further includes compressing the process gases inside the deposition chamber after the process gas has flowed past surfaces of the substrate being coated.
Owner:ULTRATECH INT INC

Method and apparatus for shaping spring elements

Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.
Owner:FORMFACTOR INC

Method and system for automating issue resolution in manufacturing execution and material control systems

Automatic error recovery systems and methods for automated manufacturing plants and factories are disclosed. Such facilities normally have multiple automated control systems, including an automated material handling system (AMHS), all of which run automatically, typically under the control of a computerized manufacturing execution system (MES). The disclosed issue resolution (ISR) systems and methods involve providing components, which may be supervised and operated by an issue resolution management (ISRM) system, if desired, that interfaces with the MES, AMHS, and/or production control system(s) which operate the tools and other stations within the automated factory. The components, which may be considered customized logic cells, may each be written for handling a specific kind of incoming error condition, problem or other issue that might occur and which is amenable to automatic resolution or recovery. These errors often occur between or across the boundaries of the various interactive systems and automated equipment. Each cell may cycle through a sequence of possible error resolution or recovery steps until the specific issue is resolved or until the sequence of steps is exhausted. Other components of the ISR system may provide results-oriented messages and/or facilitate the collection of data as to whether and which corrective commands from the ISR system resolved the reported error conditions automatically. The disclosed ISR systems and methods for resolving errors and other issues automatically helps improve the overall productivity of automated factories by reducing downtime and the need for human intervention to correct problems, thereby increasing factory throughput.
Owner:IBM CORP
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