A
plasma cutting protection liquid, and a preparation method therefor, and a use thereof. The
plasma cutting protection liquid comprises, in parts by
mass: 8 to 40 parts of a water-soluble resin, 1 to 10 parts of a cosolvent, 0.1 to 8 parts of nanoscale
inorganic particles, 0.5 to 3 parts of a flow
promoter, 0.1 to 0.5 parts of an
ultraviolet light absorber, and 50 to 100 parts of a
solvent, wherein the water-soluble resin contains
amide groups, and the water-soluble resin is a partially cross-linked resin. By using the partially cross-linked resin containing the
amide groups, the partially cross-linked structure can form a three-dimensional
network structure to inhibit molecular movement so as to improve the high-
temperature resistance. The resin contains a large number of hydrophilic
amide groups, which extremely easily form
hydrogen bonds with water. After a
cutting process is completed, a film layer formed by the protection liquid can be easily removed, and the cleaning process is simple. The
inorganic particles can further improve the heat-resistant temperature of the cutting protection liquid and can also improve the compactness of the film layer, thereby facilitating the formation of a uniform film layer.