249results about How to "Avoid connection failure" patented technology

A terminal device and method of re-establishes a circuit switched call or a packet switched connection in a data network having at least a first access network and a second access network. A failure of the circuit switched call or the packet switched connection established via the first access network is detected at the terminal device and connection re-establishment is initiated via the second access network in response to the result of checking registration to the second access network, if a failure has been detected. Thereby, a new option is provided to avoid connection failures when coverage to another access network is available, especially where call re-establishment via the first access network is not allowed.

A cutter is coupled to a tip of a driven shaft rotatably attached in an operating arm as a main body of a bush cutter, and the other end thereof is provided to a driven side coupling portion selectively coupled with any one of a driving side coupling portion of an engine output shaft and a driving side coupling portion of a motor output shaft. To a driven side joint provided in the other end of the operating arm, any one of an engine output side joint of an engine and an engine output side joint of an electric motor is selectively detachably attached. An engine revolution regulator is connected to the engine through a cable, a motor revolution regulator is connected to the electric motor through an electric cord, and these regulators are detachably attached to a handle of the operating arm.

The invention discloses electronic equipment and an access point (APN) information updating method thereof. The APN information updating method thereof includes that acquiring the access point APN information of a current network, and comparing a local APN list corresponding to a current user identity identification card with the acquired APN information; if the compared result is inconsistent, updating the local APN list according to the acquired APN information.

A method of a first DNS which can update server information in real time without necessarily using a TTL (Time To Live) by recording a network address of the first DNS, which has previously obtained server address information from a second DNS, in a notification list, by the second DNS, and transmitting the changed information from the second DNS to the first DNS recorded in the notification list when the previously obtained/requested server address changes, and updating the server address by the first DNS as provided by the second DNS. A DNS updating server address method may further include providing a first DNS with server address information corresponding to a domain, recording a network address of the first DNS in a notification list, corresponding to the domain and/or the server address information, and transmitting a changed server address information to the first DNS based on the notification list.

An electronic component and an electronic-component production method in which the magnitude of a stray capacitance produced between adjacent outer electrodes is controllable. The electronic component includes a chip body and first to fourth outer electrodes. In the chip body, first and second coil block are sandwiched between magnetic substrates. Dielectric layers are interposed between the outer electrodes and the chip body such as to be away from exposed portions of coil patterns in the coil blocks. The dielectric layers have a width larger than a width of the outer electrodes, and a dielectric constant of the dielectric layers is set to be lower than the dielectric constant of the magnetic substrates.

The invention discloses an information processing method and electronic equipment. The method can be applied in the electronic equipment; the electronic equipment comprises a wireless network communication module. The method comprises the following steps: when the wireless communication module is used for searching a wireless network hotspot within a wireless communication range, acquiring a hotspot identifier of the wireless network hotspot and first information which corresponds to the wireless network hotspot, wherein the hotspot identifier and the first information are used for uniquely representing the wireless network hotspot; determining whether a pre-stored corresponding relation of the electronic equipment stores target hotspot information corresponding to the hotspot identifier and the first information; when the corresponding relation stores the target hotspot information corresponding to the hotspot identifier and the first information, controlling the electronic equipment to establish connection with the wireless network hotspot by using the target hotspot information. According to the information processing method and the electronic equipment, a connection failure caused when the same hotspot identifier exists is avoided; manual operation of a user is not required; the user experience is improved.

Provided is a semiconductor device having a semiconductor chip mounted over a substrate, in which an interconnect is formed, by using an adhesive layer to permit contact conduction between a stud bump of the semiconductor chip and an interconnect of a tape substrate, wherein an adhesive layer formed integral as a film is adhered to each block made of substrates corresponding to a plurality of semiconductor devices and contact bonding under heat is conducted. The adhesive layer corresponding to the plurality of semiconductor devices is thus formed continuously and with this adhesive layer, the interconnect formation surface at the end portion of the substrate is covered. Moreover, with a thermosetting resin used as the adhesive layer, the semiconductor chip and substrate are adhered by contact bonding under heat while placing the substrate on a rigid heat insulating plate. According to the present invention, heat diffusion and deformation of the substrate upon contact bonding under heat can be prevented by the rigid heat insulating plate. Upon dicing, the peeling of the interconnect from the substrate can be prevented by holding the interconnect with the adhesive layer at the end portion of the substrate.

For supporting an access to a destination network by a mobile device via a wireless access network, the mobile device generates a predetermined request, which is addressed to a connectivity test server in the destination network. The predetermined request is transmitted to the wireless access network. In case the predetermined request reaches the connectivity test server, it generates a predetermined response and transmits it to the mobile device via the wireless access network. The mobile device determines whether a response to the predetermined request is received from the wireless access network and whether a received response corresponds to the predetermined response.

The present invention provides a photovoltaic device having excellent environmental durability and good adhesion with a collector electrode made of metal paste. The photovoltaic device comprises an ITO film on a p-type amorphous silicon hydride film on a light incident side of the photovoltaic device and a collector electrode made of silver paste on the ITO film. A silicon oxide insulation film made of SiOx is provided on at least regions on the ITO film where the collector electrode is not formed. The thickness of the silicon oxide insulation film is about 1 to 10 times thicker than an arithmetic mean deviation (Ra) of the underlying ITO film. The silicon oxide insulation film is a film having a Si-2p peak with a full width at half maximum of 2.45 or less, which is evaluated by an X-ray photoelectron spectroscopy.

The invention discloses a continuous heat insulating oil pipe and a manufacturing method thereof. The continuous heat insulating oil pipe comprises an inner pipe (1), an outer pipe (2) and a heat insulating and heat preserving layer (3), wherein both the inner pipe (1) and the outer pipe (2) are entire continuous oil pipes; a heat reflecting and heat insulating coating (4) is sprayed on the outer wall of the inner pipe (1), and is coated with the heat insulating and heat preserving layer (3); the outer pipe (2) is sleeved on the inner pipe (1), and can be wound on a winding drum III (7); positioning rings (5) are uniformly distributed on the outer wall of the inner pipe (1); the two ports of the outer pipe (2) are welded and sealed with the outer walls of the two ports of the inner pipe (1) respectively; and an annular space (6) is formed between the inner pipe (1) and the outer pipe (2). During operation, threaded connection is not required, so that the service life of the heat insulating oil pipe is prolonged, the operating efficiency is increased, and higher economic benefit is created.

A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. An array of metal posts that provide vertical electrical connections are formed by using the same metal carrier that forms the recess, so that the predetermined distance and relative location between metal posts and pads/bumps of the electronic component can be maintained.

Cables W are spliced to one another by insulation displacement terminals 22 in sub connectors 21A and 21B, when a cable holder 11 that contains ends of a plurality of cables is fitted into containing sections of the sub connector housings 21A and 21B. A tab 22c of each insulation displacement terminal 22 is connected to each joint bus bar 24 disposed in a joint connector housing 31. The sub connectors 21A and 21B are interconnected when the sub connectors 21A and 21B are fitted into containing sections of the joint connector housing 31.

The invention relates to the field of semiconductor manufacture, in particular to a method for forming a non-load-effect large size groove. Large size and small size contact hole grooves are filled in a deposition medium layer after the metal hard mask etching process, the grinding process is utilized to form a dish recessed area on the large size grooves, load effect formed in etching of the grooves with large size difference is removed, and connection efficacy lose caused by residue caused by the load effect in the large size grooves is effectively avoided. The method improves product yield, further expands an etching process window and further improves etching process performance.