The invention discloses a method for preparing a thin-wall part with a snakelike hollow channel by adopting superplastic forming /
diffusion bonding. The method comprises the following specific steps: step 1, plate preparation and
surface cleaning treatment; and step 2, solder
resist coating: using a
mask plate to deposit on a specific area of the plate and
coating the solder
resist according to an S-shaped shape, and removing the protective
adhesive tape after spraying is completed. And 3, assembling and sealing, wherein the plates are stacked according to the design sequence, the edges are sealed and welded, and an air inlet / outlet is reserved to be connected with an air
pipe. And 4, heating is conducted, specifically, the
assembly is put into a mold, then the mold is uniformly put into a superplastic forming
machine tool, and heating is conducted till the plate superplastic forming temperature is reached. And fifthly,
diffusion bonding is conducted, specifically, uniform pressure is applied to the mold through a pressing head in the superplastic
machine tool, so that
diffusion bonding combination is conducted on the contact face, not coated with the solder
resist, of the plate at high temperature and
high pressure, and a connecting rib is formed. And 6, superplastic forming /
diffusion bonding is conducted, specifically, the temperature is kept, and high-pressure
inert gas is introduced into the
assembly through a reserved air inlet according to an air pressure loading curve. And the plate coated with the solder resist is subjected to superplastic deformation and is attached to a mold cavity, diffusion connection between the plates is completed in the area not coated with the solder resist, and finally the needed thin-wall part with the
serpentine channel cavity is formed. And 7, cooling and demolding are conducted, specifically, the thin-wall part with the snake-shaped hollow channel is taken out after cooling to the
room temperature, and the residual solder resist is cleaned.