Silicon-based miniature loop heat pipe cooler

Abstract

The invention provides a silicon-based miniature loop heat pipe cooler, which comprises a semiconductor silicon wafer and a heat-resisting borosilicate glass sheet which are bonded together; an evaporator, a condenser, a liquid compensator, a liquid-phase channel, a vapor-phase channel and a vacuumizing / liquid injection micro-channel are etched on the surface, in contact with the borosilicate glass sheet, of the silicon wafer; two ends of the evaporator and two ends of the condenser are connected respectively through the liquid-phase channel and the vapor-phase channel to form a closed loop; a liquid storage cavity is arranged on the liquid-phase channel; the evaporator comprises small conduits; the condenser comprises a condensation serpentine channel; the evaporator is communicated with the vacuumizing / liquid injection micro-channel; a vacuumizing / liquid injection hole which can be communicated with the vacuumizing / liquid injection micro-channel is processed in the borosilicate glass sheet. The silicon-based miniature loop heat pipe cooler provided by the invention can be directly integrated with a semiconductor microelectronic chip, and therefore the temperature and the temperature gradient of the chip are effectively reduced, the 'hotspot' problem caused by local high heat flow is reduced and weakened, and the safe and reliable operation of the chip is ensured.

Description

technical field [0001] The invention belongs to the field of temperature control of microelectronic chips, in particular to a silicon-based miniature loop heat pipe cooler. Background technique [0002] In recent years, with the development trend of high performance and miniaturization of various electronic devices and equipment (such as computer chips, etc.), their working heat load will increase rapidly and cause excessive heat generation, which will seriously affect the electronic devices. performance and safety reliability. At the same time, the uneven heating of the microelectronic chip itself will generate "hot spots" on the local surface, and its existence is considered to be the key reason for the "thermal failure" of the chip and the threat to system security. In view of the small cooling space and difficult heat dissipation of microelectronic chips, in order to control the chip temperature at a safe level, improve its temperature uniformity, and reduce local "hot ...

AI Technical Summary

Problems solved by technology

[0004] In view of the fact that the existing LPH heat dissipation technology is difficult to effectively solve the problem that the heat load of the microelectronic chip increases rapidly and causes local "hot spots" on the surface due to uneven heat generation, the present invention provides a silicon-based micro-loop heat pipe cooler, which can Effectively reduce the temperature of the "hot spot" part of the chip, improve the heat dissipation and cooling efficiency, combine the characteristics of LPH and the advantages of micro-scale heat transfer to enhance the heat transfer and temperature control ability, and make the working performance of the microelectronic chip safer and more reliable

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