30results about How to "Increase heat transfer limit" patented technology

The invention relates to a micro silicon-based capillary pump loop cooler. The micro silicon-based capillary pump loop cooler is characterized by comprising a pair of semiconductor silicon chips and heatproof boron silicate glass which are bonded, wherein a surface of the silicon chip (1) contacting with the boron silicate glass is etched with an evaporator (2), a condenser (3), a vapor phase channel (4), a liquid phase channel (5), a liquid storage chamber (6) and a silicon chip vacuum-pumping/liquid injection channel (9), a vacuum-pumping/liquid injection hole (12) is processed on the boron silicate glass (11), the evaporator (2) and the condenser (3) are respectively arranged at two ends of the silicon chip (1) and are mutually communicated through the vapor phase channel (4) and the liquid phase channel (5) to realize heat exchange, the liquid storage chamber (6) is communicated with a liquid inlet of the evaporator (2), and the silicon chip vacuum-pumping/liquid injection channel (9) is communicated with vacuum-pumping/liquid injection hole (12) processed on the boron silicate glass (11). The micro silicon-based capillary pump loop cooler has advantages of simple structure, convenient manufacturing and good heat radiation effect.

The invention relates to an ultra-thin flat heat pipe and a manufacturing method thereof. A wick comprises a porous medium bottom layer and a plurality of porous medium filaments arranged side by side; the porous medium filaments make contact with the top of a tube shell; the wick inside the heat pipe, a sharp angled area between the porous medium filaments and the upper surface of the tube shell, and a sharp angled area between the porous medium filaments and the porous medium bottom layer provide liquid return capillary driving force which is large enough in a limited space; spaces formed between the porous medium filaments provide steam flow channels, and the steam flow channels communicate with one another; and reasonable matching of vapor-liquid phase distribution is achieved, and steam and condensed liquid can flow easily. According to the ultra-thin flat heat pipe, efficient operation can be maintained at various angles, the performance of anti-gravity operation is excellent, the heat flux which can be borne by the heat pipe is high, and the heat transfer performance of the heat pipe is remarkably improved after further modification treatment.

The invention discloses a circulation radiator, and a manufacturing method and components thereof. The components of the circulation radiator comprise a pipeline, a heat dissipation mechanism and a vapor-liquid cavity; the heat dissipation mechanism is contacted with the pipeline, a capillary structure is arranged in the vapor-liquid cavity; the vapor-liquid cavity is divided into a liquid storage cavity and an evaporation cavity by the capillary structure; one end of the pipeline is connected with the evaporation cavity; the other end of the pipeline is connected with the liquid storage cavity or the capillary structure; the evaporation cavity comprises at least one steam channel; and the pipeline and the vapor-liquid cavity provide a low-pressure hermetic sealed channel. Compared with the prior art which employs one evaporation cavity, the invention has the advantages that: the whole capillary structure has stronger supporting force, so that the whole vapor-liquid cavity is difficult to deform and damage under the conditions of high temperature and high pressure; the evaporation cavity consisting of a plurality of the steam channels facilitates the evaporation of liquid in the evaporation cavity, so that vapor can reach a longer distance, heat dissipation of the long distance can be realized, a heat transfer limit based on the single-way circular flow of working fluid is greatly increased; and under the condition of the same heat dissipation and transfer capability, the vapor-liquid cavity provided by the scheme has lesser thickness, so that the volume of the radiator is reduced.

The invention provides a silicon-based miniature loop heat pipe cooler, which comprises a semiconductor silicon wafer and a heat-resisting borosilicate glass sheet which are bonded together; an evaporator, a condenser, a liquid compensator, a liquid-phase channel, a vapor-phase channel and a vacuumizing/liquid injection micro-channel are etched on the surface, in contact with the borosilicate glass sheet, of the silicon wafer; two ends of the evaporator and two ends of the condenser are connected respectively through the liquid-phase channel and the vapor-phase channel to form a closed loop; a liquid storage cavity is arranged on the liquid-phase channel; the evaporator comprises small conduits; the condenser comprises a condensation serpentine channel; the evaporator is communicated with the vacuumizing/liquid injection micro-channel; a vacuumizing/liquid injection hole which can be communicated with the vacuumizing/liquid injection micro-channel is processed in the borosilicate glass sheet. The silicon-based miniature loop heat pipe cooler provided by the invention can be directly integrated with a semiconductor microelectronic chip, and therefore the temperature and the temperature gradient of the chip are effectively reduced, the 'hotspot' problem caused by local high heat flow is reduced and weakened, and the safe and reliable operation of the chip is ensured.

The invention discloses a heat fin, which comprises two side panels, a frame for connecting the two side panels, a capillary structural layer and a phase changing working medium, wherein the two side panels and the frame form a hollow thin-plate shell; the capillary structural layer is closely attached onto the inner wall of the shell; the phase changing working medium is sealed in the shell; a local part of the edge of each side panel or a local part of the frame is used as an evaporation area, and the rest part of each side panel or the rest part of the shell is used as a condensation area. Due to the adoption of the heat fin, the area of a steam conveying passage, the reflux width of the liquid working medium and the direct heat radiation area of the condensation area are increased, the distance from the center of the evaporation area to the edge of the evaporation area is shortened, the heat conduction limit is greatly improved, and a higher heat flow density is obtained.

The invention belongs to the technical field of heat transfer, and particularly relates to a composite liquid-cooling heat pipe radiator. The composite liquid-cooling heat pipe radiator comprises a flat plate heat pipe, wherein heat generated by a heating component is transferred to a bottom plate of the flat plate heat pipe, a top plate of the flat plate heat pipe is provided with protrusions perpendicular to the bottom plate of the flat plate heat pipe, the protrusions form a tubular heat pipe, and an inner cavity of the flat plate heat pipe is communicated with an inner cavity of the tubular heat pipe. The composite liquid-cooling heat pipe radiator further comprises a shell. The flat plate heat pipe and the tubular heat pipe are both located in the shell, and the bottom plate of the flat heat pipe is attached to the bottom surface of the shell in a sealed mode; an area defined by the outer surface of the flat plate heat pipe, the outer surface of the tubular heat pipe and the innerwall of the shell forms a cooling liquid channel; and the shell is provided with a cooling liquid inlet and a cooling liquid outlet. According to the radiator, the tubular heat pipe is combined withthe flat plate heat pipe, so that the radiator can be attached to a flat surface of the heating component and has a good radiating effect; and meanwhile, heat released by a refrigerant of a condensation section is taken away through liquid cooling, and compared with air convection heat dissipation, the heat exchange capacity of the composite heat pipe with the outside is improved.

The invention belongs to the technical field of nuclear reactors, and particularly relates to a treatment method of an alkali metal heat pipe liquid absorption core. The treatment method includes thefollowing steps that 1, basic principles are confirmed; 2, materials are prepared; 3, nano-particles are deposited on a silk screen, and the alkali metal heat pipe liquid absorption core is formed; and 4, the alkali metal heat pipe liquid absorption core is applied to a heat pipe. The heat transfer limit of the heat pipe can be increased.

The invention relates to a high-power LED lamp heat dissipation device, and belongs to the technical field of LED heat dissipation. The high-power LED lamp heat dissipation device comprises an upper lampshade, a circuit board, a heat dissipation fan, a ribbed shell, a gas-liquid pulsating phase change heat pipe, a mounting base, an LED lamp bead integrated board, a lower lampshade and a glass cover plate. The high-power LED lamp heat dissipation device takes the gas-liquid pulsating phase change heat pipe as a core heat transfer component, and heat production of a bottom high-power LED lamp bead array is efficiently transmitted to a three-dimensional space and dissipated quickly; a self-wetting fluid working medium filled in the pipe can automatically moisten the evaporation section of theheat pipe, and the "drying" limit of the heat pipe can be effectively improved; and the capillary suction produced by micro grooves on the inner wall of the heat pipe can further enhance the wettability of the working medium to the inner wall of a whole pipe body, so that the temperature uniformity and heat transfer limit are further improved. Compared with an existing metal ribbed LED lighting and heat dissipation device and traditional heat pipe LED lighting and heat dissipation devices such as capillary heat pipes and gravity heat pipes, the high-power LED lamp heat dissipation device hasbetter heat transfer performance, higher heat transfer limit and better working adaptability.

The invention relates to the technical field of heat pipes, and discloses a liquid metal pulse heat pipe. The liquid metal pulse heat pipe comprises a pipe body, a rising pipeline and a returning pipeline; a heating chamber and a heat dissipation chamber which are independent mutually are sequentially constructed in the pipe body from bottom to top, and a low-boiling-point working medium and liquid metal are arranged in the heating chamber from top to bottom in a layered mode; the rising pipeline is arranged in the pipe body and penetrates through the heating chamber and the heat dissipation chamber; the returning pipeline is arranged in the pipe body and penetrates through the heating chamber and the heat dissipation chamber; and the returning pipeline and the rising pipeline are arrangedin a spaced mode. By heating the heating chamber, the low-boiling-point working medium is heated and evaporated into a gaseous work medium, and under the effect of the gas pressure, the liquid metaland the gaseous work medium are alternately conveyed from the heating chamber to the heat dissipation chamber along the rising pipeline in a segmented mode, and then conveyed from the heat dissipationchamber back to the heating chamber along the return pipeline; and the liquid metal pulse heat pipe has the advantages of high heat transfer efficiency and large heat transfer limit.

A heat-wing includes: a sealed hollow chamber including two plates and a frame connecting the two plates; a capillary structure layer closely attached to an inner surface of the chamber; and a phase transition working medium sealed in the chamber. A portion of the frame or a portion of a periphery of one of the two plates serves as an evaporation area of the heat-wing, and the rest portion of the chamber serves as a condensation area of the heat-wing. The heat-wing has an increased vapor passage area, liquid working medium flow-back passage width and condenser heat transfer area and a reduced evaporator center-to-edge distance, and is hence capable of achieving a great improvement in heat transfer limit and heat flux density.

The invention provides an ultrathin vapor chamber which comprises an upper shell plate (1) and a lower shell plate (4), and the periphery of the upper shell plate (1) and the periphery of the lower shell plate (4) are welded to form a closed cavity. The liquid injection pipe (2) is arranged on the closed chamber and is used for vacuumizing the closed chamber and injecting liquid into the closed chamber; the liquid absorption core structure (3) is arranged in the closed cavity, the liquid absorption core structure (3) comprises a central liquid absorption core (31) and a plurality of channel-shaped liquid absorption cores (32) which are distributed on the two sides of the liquid absorption core (31) and are arranged in parallel, the channel-shaped liquid absorption cores (32) form liquid backflow channels, and steam diffusion channels (33) are formed between the adjacent channel-shaped liquid absorption cores (32); the central liquid absorbing core (31) and the channel-shaped liquid absorbing core (32) are respectively composed of a first liquid absorbing core (34) and a second liquid absorbing core (35) which are stacked, the porosity of the liquid absorbing core structure (3) changes in a gradient mode in the direction from the first liquid absorbing core (34) to the second liquid absorbing core (35), and a super-hydrophilic nanometer structure is formed on the surface of the liquid absorbing core structure (3).

The invention discloses a radial heat transfer miniature channel heat pipe which comprises outer pipes, inner pipes, a cooling water inlet pipeline, a cooling water outlet pipeline, an end cover, a steam cavity and a capillary acting force channel. The outer pipe is a micro-channel with a rectangular section; the outer pipes are arranged outside the inner pipes in a sleeving mode, and the multiple outer pipes are adjacently arranged side by side to form the heat pipe of which the overall structure is in a flat plate shape. The space between the outer pipe and the inner pipe is a steam cavity, the steam cavity is filled with refrigerants, and the refrigerants can generate gas-liquid phase change. The inner wall face of the outer pipe is provided with a capillary acting force channel, and the liquid refrigerant can be distributed on all the wall faces of the outer pipe through capillary acting force. By changing the structure and the heat transfer mode of an existing micro heat pipe and replacing axial heat transfer with a radial heat transfer mode, the heat transfer limit is improved, the temperature uniformity and the space occupation of the micro heat pipe in the axial direction are improved, and the micro heat pipe can adapt to the working conditions of rotary motion and double-face heating.