Phase change heat dissipation device

Abstract

The invention discloses a phase change heat dissipation device which comprises a phase change component, wherein a phase change heat exchange medium is internally arranged in the phase change component, the phase change component comprises an evaporation part and a condensation part; an evaporation cavity is formed in the evaporation part, a condensation cavity is formed in the condensation part,and the evaporation cavity communicates with the condensation cavity; a heating source is directly contacted with the evaporation cavity, the phase change heat exchange medium in the evaporation cavity can absorb heat of the heating source and moves toward the condensation cavity; and the condensation cavity can outward dissipate heat to cool the heating source. In the phase change heat dissipation device, the phase change component is directly contacted with the heating source, without increasing a transitional thermal conductive plate, an appearance of the evaporation part is adapted to thatof the heating source, the phase change component can fully contact with the heating source, a heat transfer area is big, and a temperature difference between the heating source and the phase changeheat exchange medium is minimum.

Description

technical field [0001] The invention belongs to the technical field of phase change heat dissipation devices, in particular to a high heat flux density phase change heat dissipation device. Background technique [0002] With the development of software computing such as the Internet and the Internet of Things, the information processing speed of computers, notebooks and servers is required to be faster and faster, and the amount of information storage is increasing. The power consumption of the CPU and the memory is getting bigger and bigger, and the heat flux density of the cooling device is required to be higher and higher. In addition, as the power density of the CPU and memory increases, the heat flux density of the heat sink is also increasing. Traditional heat pipes are limited by the inner diameter of the heat pipe and the phase-change heat medium, and the heat transfer capacity cannot meet the needs of the CPU and memory. requirements of technological development. ...

AI Technical Summary

Problems solved by technology

Disadvantages of low-temperature tin-lead soldering include: before soldering, the overall surface treatment such as nickel plating or copper plating must be carried out on the heat sink, welding and surface treatment lead to high costs, and there is pollution to the environment; it is difficult to ensure that the heat pipe and aluminum alloy The plane of the substrate is well filled, and there are no local gaps. However, because the heat pipe is arranged under the power device, the heat flux density is high, and the gap will cause a local temperature rise of the CPU, resulting in device loss.

Images