Ultra-thin flat panel heat pipe and manufacturing method thereof

Abstract

The invention relates to an ultra-thin flat heat pipe and a manufacturing method thereof. A wick comprises a porous medium bottom layer and a plurality of porous medium filaments arranged side by side; the porous medium filaments make contact with the top of a tube shell; the wick inside the heat pipe, a sharp angled area between the porous medium filaments and the upper surface of the tube shell, and a sharp angled area between the porous medium filaments and the porous medium bottom layer provide liquid return capillary driving force which is large enough in a limited space; spaces formed between the porous medium filaments provide steam flow channels, and the steam flow channels communicate with one another; and reasonable matching of vapor-liquid phase distribution is achieved, and steam and condensed liquid can flow easily. According to the ultra-thin flat heat pipe, efficient operation can be maintained at various angles, the performance of anti-gravity operation is excellent, the heat flux which can be borne by the heat pipe is high, and the heat transfer performance of the heat pipe is remarkably improved after further modification treatment.

Description

Technical field [0001] The invention belongs to the technical field of heat pipes, and particularly relates to an ultra-thin flat heat pipe and a manufacturing method thereof. Background technique [0002] Electronic components are developing in the direction of miniaturization, integration, and high computing speed. For example, the heat flux density of miniature electronic components such as mobile phones, notebook computers, and high heat flux chips is getting higher and higher, and their performance will be restricted by heat dissipation capabilities. As a phase change heat transfer device, the heat pipe itself can be driven by itself without external energy. It has the advantages of small size, light weight, high heat transfer performance, etc., and is widely used in the cooling of electronic devices. [0003] The wick inside the heat pipe mainly includes grooves, wire mesh, porous media, and composite structures. The grooved wick channel provides a channel for liquid return,...

AI Technical Summary

Problems solved by technology

The channel of the grooved liquid-absorbing core provides a channel for liquid return, but the capillary driving force is small, and the requirements for the depth and width of the channel are relatively high; the wire-mesh liquid-absorbing core has good heat transfer performance, but the manufacturing The process is complex; the porous media type liquid-absorbing core can provide greater capillary force and greater heat transfer, but the liquid return resistance is also greater

In the traditional heat pipe with copper wire as the liquid-absorbing core, the sharp-angled area formed between the copper wire and the shell is used as a channel for the liquid to flow back. The processing is relatively simple, but the capillary force provided by the sharp-angled area is limited.

When the thickness of the heat pipe is thin, the traditional heat pipe is easy to reach the heat transfer limit, resulting in deterioration of heat transfer, low critical heat flux, poor anti-gravity operation effect, and poor heat transfer performance

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