Radial heat transfer miniature channel heat pipe

Abstract

The invention discloses a radial heat transfer miniature channel heat pipe which comprises outer pipes, inner pipes, a cooling water inlet pipeline, a cooling water outlet pipeline, an end cover, a steam cavity and a capillary acting force channel. The outer pipe is a micro-channel with a rectangular section; the outer pipes are arranged outside the inner pipes in a sleeving mode, and the multiple outer pipes are adjacently arranged side by side to form the heat pipe of which the overall structure is in a flat plate shape. The space between the outer pipe and the inner pipe is a steam cavity, the steam cavity is filled with refrigerants, and the refrigerants can generate gas-liquid phase change. The inner wall face of the outer pipe is provided with a capillary acting force channel, and the liquid refrigerant can be distributed on all the wall faces of the outer pipe through capillary acting force. By changing the structure and the heat transfer mode of an existing micro heat pipe and replacing axial heat transfer with a radial heat transfer mode, the heat transfer limit is improved, the temperature uniformity and the space occupation of the micro heat pipe in the axial direction are improved, and the micro heat pipe can adapt to the working conditions of rotary motion and double-face heating.

Description

technical field [0001] The invention relates to the fields of heat dissipation of electronic devices, spaceflight heat control and micro heat pipes, in particular to a micro channel heat pipe for radial heat transfer. Background technique [0002] The improvement of the performance of electronic devices often brings more heat generation. At the same time, people's requirements for the portability of mobile electronic devices make electronic devices develop in the direction of miniaturization and thinning. These factors limit the heat dissipation components of electronic devices. volume and structure. In the field of aerospace, there will be higher space restrictions, temperature control and temperature uniformity requirements for the electronic devices used. Therefore, the problem of heat dissipation has become an important limitation for the development of electronic devices. [0003] As an efficient heat transfer element, the heat pipe conducts heat rapidly through the p...

AI Technical Summary

Problems solved by technology

[0005] At present, electronic devices mainly use flat axial heat pipes as heat dissipation elements, and there are still problems such as insufficient heat transfer limit, poor temperature uniformity in the axial direction, and a large amount of space in the axial direction.

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