An edge of a surface to be measured of
wafer and each of search alignment marks on the
wafer are detected by an inline measurement instrument or the like that operates independently of an
exposure apparatus, and position coordinates of the search marks in an X′Y′ coordinate
system, which is a two-dimensional coordinate
system substantially parallel to the surface to be measured and is set by a position of a notch of the
wafer, are measured. Then, in pre-alignment performed when loading the wafer into the
exposure apparatus, the edge of the wafer is detected, and from the detection results, position information of the object in the X′Y′ coordinate
system is measured. Further, a relative position in the X′Y′ coordinate system of the wafer to be loaded into the
exposure apparatus based on measurement results of the pre-alignment with respect to a measurement field of an alignment system that measures positions of the search marks on the wafer is adjusted based on measurement results of the inline measurement instrument or the like.