914results about "Modifications using liquid cooling" patented technology

The invention belongs to the technical field of solid-liquid phase change heat dissipation, and discloses a memory alloy-based phase change expansion buffer structure, which comprises an elastic structure, a supporting structure, a thin wall, a cavity, a flaring, an electronic device, a heat sink, fins, a connecting structure and a phase change material, the thin wall is made of shape memory alloy and separates the internal cavity and the external phase-change material, the internal cavity is communicated with the external environment through the flaring, and in the flying process of the aerospace vehicle, external airflow flows into the flaring to take away heat stored by the phase-change material continuously. Based on the shape memory function of the memory alloy, additional space expansion buffering can be provided for the phase change material when the temperature changes, and stress damage caused by phase change expansion is avoided. The memory alloy thin wall and the elastic supporting structure are combined, the structure is simple, no moving part exists, circulating work in the high-temperature environment and the low-temperature environment can be achieved, local hot spots caused by internal gap movement of the phase change material in the circulating phase change process are reduced, and heat transfer deterioration is avoided.

The invention belongs to the technical field of energy storage cooling, and particularly relates to a cooling circulation system and an equipment cooling method, and the cooling circulation system comprises a liquid inlet system, a heat exchange system and a liquid outlet system. The heat exchange system comprises a plurality of heat exchange units which are connected in parallel; the liquid inlet system is connected with the input end of the heat exchange system, and a pressure detection device, a liquid temperature measurement device I, a pollution discharge degassing tank and a liquid circulation driving unit are connected into the liquid inlet system; the liquid outlet system is connected with the output end of the heat exchange system, and a conductivity detection device, an outlet pressure detection device and a liquid temperature measurement device II are connected into the liquid outlet system. Through dynamic modular adjustment, multi-parameter intelligent control, energy-saving composite heat dissipation and high-reliability design, the problems of low heat dissipation efficiency, high energy consumption, high maintenance cost, poor adaptability and the like in the prior art are effectively solved; and particularly, the method has remarkable advantages in the aspects of precise heat dissipation of high-power-density equipment, stable operation under complex working conditions and full-life-cycle cost control.

The present application provides a two-phase cold plate liquid cooling system and a control method. According to the present application, for parts which are cooled in series by the two-phase cold plate liquid cooling system, after a first evaporator cools a previous part, on the basis of the heat transfer requirements of a part cooled by a second evaporator, the quality of a refrigerant output from the first evaporator is adjusted to prevent the quality of the refrigerant from being too low or too high, and thus the refrigerant entering the second evaporator has proper quality, namely, the refrigerant entering the second evaporator has proper boiling point and heat exchange capacity, so that corresponding parts can be cooled to proper temperature, and large temperature difference between upstream and downstream parts is avoided. The solution solves the problem of the temperature of downstream parts in the series being lower than the temperature of upstream parts in the series, improves the temperature uniformity of multiple parts cooled in series, and then solves the problems of pressure oscillation, circulation stagnation and circulation reverse flow in the system, greatly improving the temperature uniformity of heat sources connected in series and the reliability of a series-parallel system.

The invention relates to the technical field of control cabinets, in particular to an intelligent heat dissipation control system of a control cabinet, which comprises a control cabinet body, a sensor array is arranged on the inner wall of the control cabinet body, the sensor array is composed of temperature sensors, an independent cold air area is arranged at the bottom end of the control cabinet body, and the temperature sensors are arranged in the independent cold air area. A cold air area is arranged in the control cabinet body, a vortex fan is arranged in the cold air area, an air channel of the vortex fan faces the interior of the control cabinet body, a variable guide plate is further arranged at the bottom end of the control cabinet body and arranged at the upper end of the cold air area, and directional control blocks driven by motors are arranged at the two ends of the variable guide plate. The directional control block drives the variable flow guide plate to rotate so as to adjust the orientation angle of the variable flow guide plate, a motor driver is arranged on the motor, and the motor driver and the temperature sensor are connected with a core control unit.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention relates to the technical field of heat dissipation, and discloses a wick, a vapor chamber and electronic equipment. The liquid absorption core can be compatible with the advantages of different capillary structures through lap joint coupling of the different capillary structures, for example, the first capillary structure and the third capillary structure have high capillary force, and therefore the requirement for the liquid return speed is met. The second capillary structure has high porosity so as to meet the requirement for the evaporation speed. Therefore, the liquid absorption core can achieve the design of the optimal capillary force, the minimum liquid flow resistance and the minimum steam flow resistance, so that the performance of the vapor chamber is optimal, and the heat dissipation requirement of electronic equipment is met.

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The embodiment of the application provides a kind of power conversion equipment, it is related to power electronics field.The power conversion equipment includes shell, circuit board, radiator and first heat exchanger, power cavity is formed in shell, heat dissipation cavity is formed outside shell, shell includes the partition between power cavity and heat dissipation cavity, opening is arranged on the partition, circuit board is arranged in power cavity and the side of opening has first power device;Radiator is arranged in heat dissipation cavity and includes first substrate and first heat dissipation part, first substrate is arranged at opening and is in contact with first power device, first substrate is provided with first gas-liquid passage, first heat dissipation part is provided with second gas-liquid passage communicated with first gas-liquid passage, and cooling working medium for gas-liquid conversion is arranged in first gas-liquid passage;First heat exchanger is located in power cavity or heat dissipation cavity.Through the above technical scheme, the device that can be targeted to heat seriously in power conversion equipment is cooled, so that power conversion equipment is stably operated.

The present inventions pertains to an air conditioner for a control cabinet, the air conditioner being mountable on the control cabinet to provide air-conditioning in an internal space of the control cabinet that is separated from an ambient space outside the control cabinet, the air conditioner comprising an evaporator with a heat exchanger that is configured to be in fluid communication with the internal space to cool the air in the internal space when the air conditioner is mounted on the control cabinet, the heat exchanger comprising a pipe system through which a refrigerant is guidable, the pipe system comprising at least two, in particular parallel, straight pipe portions, the straight pipe portions being connected to each other on at least one of their ends by at least one piping bend, wherein the straight pipe portions are arranged in the heat exchanger such that they are in fluid communication with the internal space when the air conditioner is mounted on the control cabinet, and wherein the at least one piping bend is enclosed in a safety space which is separated from the internal space of the control cabinet and from the external space when the air conditioner is mounted on the control cabinet.

The invention relates to the technical field of inverters, in particular to an inverter. The phase-change heat dissipation device comprises a shell, a power circuit board is arranged in the shell, an electric appliance element is integrated on the power circuit board, a first phase-change heat dissipation device used for dissipating heat of the electric appliance element is arranged in the shell, the first phase-change heat dissipation device is arranged in a 7 shape, and the first phase-change heat dissipation device is sequentially provided with an evaporation section, a heat insulation section and a condensation section from bottom to top; heat exchange fins are arranged on the evaporation section of the first phase change radiator, a fixing frame is fixedly arranged on the side, away from the transverse part, of the vertical part of the 7-shaped first phase change radiator, and a circulating fan is arranged on the side wall face of the fixing frame and used for blowing hot air flow in the inverter to the heat exchange fins; a wiring terminal of the inverter is arranged on one side of the shell, and radiating fins are arranged on the other side, parallel to the wiring terminal, of the shell. According to the device, dispersed heat sources in the prior art are integrated to one place for heat dissipation, and the problems that an inverter is too thick and heat dissipation is not concentrated are solved.

A three-dimensional vapor chamber module is configured to be thermally coupled to a heat source. The three-dimensional vapor chamber module includes a first vapor chamber, a second vapor chamber, at least one first heat pipe and a plurality of boiling enhancement structures. The first vapor chamber has a first fluid chamber, and the first vapor chamber is configured to be thermally coupled to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel, and the first fluid channel communicates with the first fluid chamber and the second fluid chamber. The boiling enhancement structures are respectively disposed on the first vapor chamber and the second vapor chamber.

The invention discloses a phase change integrated heat dissipation transformation method for improving the short-time overload capacity of ANPC topology. In order to solve the problems of high cost and poor compatibility caused by the fact that the overload capacity of the existing ANPC topology needs to depend on additional static redundancy capacity and additional devices, a phase change material integrated device is selected to be combined with a conventional device according to the loss characteristics of the devices at different positions. By utilizing the isothermal heat absorption characteristic of the phase change material at a specific temperature, the rapid rise of the junction temperature of the high-loss device during overload operation is effectively inhibited, the junction temperature ranges of the high-loss device and the low-loss device tend to be consistent, and the short-time overload operation capability of the system is remarkably improved.

The invention provides a phase change liquid cooling device and electronic equipment, the phase change liquid cooling device comprises a vaporization chamber, a gas outlet pipeline, a radiator and a liquid return pipeline which are communicated in sequence and form a loop, one end, far away from the radiator, of the liquid return pipeline is communicated with a vaporization chamber, and a cooling medium is arranged in the loop; a vaporization cavity is formed in the vaporization bin, the vaporization bin comprises a liquid return port, a capillary structure and an air outlet, the liquid return port is communicated with the liquid return pipeline, and the air outlet is communicated with the air outlet pipeline; the capillary structure is located between the liquid return opening and the air outlet and divides the vaporization cavity into a first cavity and a second cavity which are communicated only through the capillary structure. The phase change liquid cooling heat dissipation device can be used for electronic equipment, heat of a heat source is continuously taken away through phase change and condensation of a cooling medium, and the temperature rise amplitude of a system can be relatively low while a large amount of heat is absorbed.

The invention discloses a pump-driven two-phase liquid cooling system and a control method thereof. The pump-driven two-phase liquid cooling system comprises a cooling liquid circulation loop and two gas-liquid separation recirculation loops, the cooling liquid circulation loop comprises a closed loop formed by connecting a liquid storage tank, a liquid supplementing pump, an adjusting three-way pipe, two evaporators, two condensers and a control double-outlet device; the gas-liquid separation recycling loop comprises a gas-liquid separator, a gas compressor, a gas-liquid mixer and a pipeline connecting assembly. Two modes of automatic control and manual control are set, in the automatic control mode, the system is automatically adjusted according to data such as temperature and switching time, excessive manual intervention is not needed, intelligent operation is achieved, when manual control and adjustment are carried out, an operator can manually adjust the opening degree of the control valve through a rotating handle, and the control efficiency is improved. And the system can be flexibly adjusted according to actual requirements under special working conditions or during maintenance and overhaul, so that the flexibility and applicability of system control are improved.

An electronic device includes: a first heat dissipation system, including a first cold plate and a first heat dissipation pipe, where the first heat dissipation pipe is connected to the first cold plate and is configured to allow coolant to flow therethrough; a second heat dissipation system, including a second cold plate and a second heat dissipation pipe, the second heat dissipation pipe is configured to allow the coolant to flow through circulation; and a coolant distribution unit. The first heat dissipation pipe and the second heat dissipation pipe are connected to the coolant distribution unit, and the coolant distribution unit is configured to cool the coolant in the first cold plate and the second cold plate through circulation. The second cold plate is made of a flexible material, and power of the first heating element is greater than power of the second heating element.

The invention provides a self-adaptive variable multi-stage absorption refrigerating machine and a data center waste heat recovery cooling system. The refrigerator includes an evaporator; a condenser; the solution flow path switching module is used for adjusting the operation number of the absorption refrigeration subsystems; and at least two absorption refrigeration subsystems, in each of which the solution heat exchanger is simultaneously in fluid communication with the absorber and the generator. The mass coupling mechanism that refrigerant steam generated by a generator of the upper-stage absorption refrigeration subsystem directly enters an absorber of the lower-stage absorption refrigeration subsystem to be absorbed is utilized, a multi-stage absorption refrigeration cycle with the middle pressure gradient is constructed, and the temperature of an effective driving heat source is reduced to 45-50 DEG C. In addition, the solution flow path switching module is configured to dynamically reconstruct the solution flow path topology, and the unit can be adaptively and preferentially switched among multiple operation modes, so that efficient operation under the variable working conditions all the year round is kept.

The invention belongs to the related technical field of phase change materials, and discloses a silicon dioxide encapsulated binary eutectic fatty acid phase change microcapsule and a preparation method and application thereof.The phase change microcapsule is of a core-shell structure, the material of a shell is silicon dioxide, the material of a core is a binary eutectic fatty acid phase change material, and the phase change microcapsule is of a core-shell structure. The binary eutectic fatty acid phase change material is a eutectic mixture of two fatty acids. Wherein the phase-change temperature of the eutectic mixture is lower than the phase-change temperature of the two single fatty acids at the same time, so that the phase-change temperature of the phase-change microcapsule is reduced, and meanwhile, the eutectic mixture can be prepared from various different fatty acid phase-change materials, so that the phase-change temperature range of the phase-change microcapsule is widened; the application of the phase change microcapsule in a low-temperature scene is facilitated.

The invention relates to a thermopile chip testing device, and the device comprises a constant-temperature platform which comprises a housing, and a clamping assembly, a circuit board and a heating part which are disposed on the housing; the clamping assembly is used for clamping a thermopile chip to be detected; the circuit board is used for being electrically connected with the thermopile chip to be detected; the heating element is in heat conduction connection with the clamping assembly so as to heat the thermopile chip to be detected by means of the clamping assembly; and the first cooling system is in cold conduction connection with the clamping assembly so as to cool the thermopile chip to be detected by means of the clamping assembly. On one hand, the test temperature of the to-be-detected thermopile chip can be kept stable, and on the other hand, the test at a relatively low temperature can be realized.

An immersion cooling system is provided and includes a box body, a condensing unit, a flow guiding structure and a heat dissipation medium. The box body has a first accommodating space, a second accommodating space and a water collecting tank connected to the second accommodating space. The condensing unit is arranged in the second accommodating space. The flow guiding structure is located below the condensing unit. The heat dissipation medium is accommodated in the first accommodating space and the water collecting tank and is able to flow on the flow guiding structure.

A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using a non-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members. For example it can be used to cool a computer chip, a skin of a hypersonic flying object, parabolic solar collector, turbine or engine blade, or any other heat source that requires high heat flux.

A mechanical pump-free flow boiling heat sink, including an evaporator, a two-phase flow steam injector, a first condenser, a boiling pool and a second condenser. A vapor outlet of the evaporator is communicated with a vapor-phase inlet of the two-phase flow steam injector. A liquid-phase outlet of the evaporator is communicated with an inlet of the boiling pool. An outlet of the boiling pool is communicated with an inlet of the second condenser. An outlet of the second condenser is communicated with a liquid-phase inlet of the two-phase flow steam injector. An outlet of the two-phase flow steam injector is communicated with an inlet of the first condenser. An outlet of the first condenser is communicated with an inlet of the evaporator.

The invention belongs to the technical field of photoelectric detection, and discloses a refrigeration type handheld observation device and a dynamic temperature control method thereof. An infrared thermal imager is installed at the cold end of a semiconductor chilling plate and is connected with a heat dissipation structure through a composite phase change structure and a heat pipe array; acquiring environment parameters and equipment thermal state parameters by using an environment and equipment parameter acquisition unit; and the dynamic temperature control unit is used for matching the refrigeration power in real time according to the environment parameters and the equipment thermal state parameters, and the working current of the semiconductor refrigeration sheet is adjusted according to the target refrigeration power obtained through matching. The cooling efficiency of the refrigeration type handheld observation device is actively adjusted, the temperature control precision is improved, and heat management of the refrigeration type handheld observation device is optimized.

Provided in the embodiments of the present application are a heat dissipation device, an electronic assembly, and an electronic apparatus. The heat dissipation device is configured to dissipate heat from a heating element. The heat dissipation device comprises a jet structure, a heat dissipation structure and a supporting structure. The jet structure is spaced apart from the heat dissipation structure in a first direction, and the supporting structure provides support between the jet structure and the heat dissipation structure; and the surface of the heat dissipation structure away from the jet structure is configured to be in heat conduction connection with the heating element. The jet structure is provided with a liquid inlet, a jet opening, and a jet cavity, which brings the liquid inlet into communication with the jet opening. The jet opening faces the heat dissipation structure, and the jet opening is configured such that a refrigerant is ejected therethrough to the heat dissipation structure. Heat generated by the heating element can be conducted to the refrigerant via the heat dissipation structure, thereby causing the refrigerant to boil. After boiling, the refrigerant changes from liquid to gas, and detaches from the surface of the heat dissipation structure, thereby realizing heat dissipation for the heating element.

The invention relates to a multi-circulation-mode heat exchange device which comprises an outer shell, a heat dissipation substrate of a power element, an evaporation section and a condensation section, the evaporation section covers one side of the heat dissipation substrate in a sealing mode, an inner-layer heat exchange cavity is defined by the heat dissipation substrate, the evaporation section and the condensation section jointly, and a first working medium is arranged in the inner-layer heat exchange cavity; the liquid-state first working medium can absorb heat of the heat dissipation substrate and is gasified, and the gaseous-state first working medium can enter the inner-layer heat exchange cavity and is liquefied again. The outer shell is provided with an outer layer heat exchange cavity, the outer layer heat exchange cavity is provided with a liquid second working medium, the evaporation section and the condensation section are both arranged in the second working medium in an immersed mode, the liquid second working medium can take away heat on the surfaces of the evaporation section and the condensation section through temperature rising, and the heat of the second working medium can be transmitted to the atmospheric environment through an external heat dissipation system or the outer shell. According to the multi-circulation-mode heat exchange device, the problem that an existing cooling mode cannot meet the requirement for rapid heat dissipation of high-power power elements such as chips is solved.

The present application provides a heat dissipation assembly and a power conversion device. The power conversion device comprises a housing, power devices, and the heat dissipation assembly. The housing comprises a first cavity and a second cavity spaced apart in a first direction. The housing is provided with an air inlet hole and an air outlet hole which are communicated with the second cavity. The power devices are accommodated in the first cavity. A heat dissipation assembly comprises the heat dissipation device and a working medium pump which are accommodated in the second cavity. The heat dissipation device comprises a heat dissipation substrate, a plurality of flat condensation tubes, and a communication portion. The heat dissipation substrate comprises a first chamber and a second chamber obtained by division by means of a partition portion. In the first direction, the first chamber is located on the side of the second chamber close to the power devices. The top of the partition portion is provided with a through hole communicated with the first chamber and the second chamber. The plurality of flat condensation tubes are communicated with each other by means of the communication portion, are communicated with the second chamber, and are located between the air inlet hole and the air outlet hole. The first chamber, the second chamber, and the flat condensation tubes are all used for accommodating a cooling working medium. The working medium pump is used for driving the cooling working medium to flow to the first chamber. The present invention facilitates miniaturization.

Embodiments of this application relate to the field of electronic device technologies, and provide a vapor chamber and an electronic device. The vapor chamber includes: a housing, where the housing includes a first cover plate and a second cover plate, the first cover plate is connected to the second cover plate to enclose a closed cavity, and the cavity is provided with a cooling medium; a capillarity structure, disposed in the cavity; and a heat dissipation structure, disposed in an inner surface of the cavity, where the heat dissipation structure includes at least one structure of a protrusion and a groove. The vapor chamber and electronic device provided in embodiments of this application have good heat dissipation performance.

A display device includes a display panel, a heating element located on a back side of a light-emitting surface of the display panel, and a support component located on the back side of the light-emitting surface of the display panel. The support component includes a loop heat dissipation cavity located inside the support component and a working fluid located in the loop heat dissipation chamber. A part of the loop heat dissipation cavity overlaps the heating element, and the loop type heat dissipation cavity includes at least one anti-backflow channel.

The invention provides a data center chip backboard cooling system with a backflow working medium separation function, and the system comprises a condensation unit which is configured to carry out condensation processing on a refrigeration working medium; the refrigeration working medium comprises liquid carbon dioxide and / or liquid hypofluoro acid; the liquid cooling unit is configured to perform refrigeration by gasifying the cooling liquid; and the cooling liquid distribution unit is configured to adjust the refrigerating capacity of the liquid cooling unit according to the cooling requirement, perform separation treatment on a backflow working medium of the liquid cooling unit, and convey the separated working medium to the condensation unit for recooling treatment. By means of the system, the problem that an existing data center cooling system lacks a working medium separation function, so that the recooling efficiency of refrigerants becomes low is solved.