632results about "Modifications using liquid cooling" patented technology

The embodiment of the application provides a kind of power conversion equipment, it is related to power electronics field.The power conversion equipment includes shell, circuit board, radiator and first heat exchanger, power cavity is formed in shell, heat dissipation cavity is formed outside shell, shell includes the partition between power cavity and heat dissipation cavity, opening is arranged on the partition, circuit board is arranged in power cavity and the side of opening has first power device;Radiator is arranged in heat dissipation cavity and includes first substrate and first heat dissipation part, first substrate is arranged at opening and is in contact with first power device, first substrate is provided with first gas-liquid passage, first heat dissipation part is provided with second gas-liquid passage communicated with first gas-liquid passage, and cooling working medium for gas-liquid conversion is arranged in first gas-liquid passage;First heat exchanger is located in power cavity or heat dissipation cavity.Through the above technical scheme, the device that can be targeted to heat seriously in power conversion equipment is cooled, so that power conversion equipment is stably operated.

The present inventions pertains to an air conditioner for a control cabinet, the air conditioner being mountable on the control cabinet to provide air-conditioning in an internal space of the control cabinet that is separated from an ambient space outside the control cabinet, the air conditioner comprising an evaporator with a heat exchanger that is configured to be in fluid communication with the internal space to cool the air in the internal space when the air conditioner is mounted on the control cabinet, the heat exchanger comprising a pipe system through which a refrigerant is guidable, the pipe system comprising at least two, in particular parallel, straight pipe portions, the straight pipe portions being connected to each other on at least one of their ends by at least one piping bend, wherein the straight pipe portions are arranged in the heat exchanger such that they are in fluid communication with the internal space when the air conditioner is mounted on the control cabinet, and wherein the at least one piping bend is enclosed in a safety space which is separated from the internal space of the control cabinet and from the external space when the air conditioner is mounted on the control cabinet.

A three-dimensional vapor chamber module is configured to be thermally coupled to a heat source. The three-dimensional vapor chamber module includes a first vapor chamber, a second vapor chamber, at least one first heat pipe and a plurality of boiling enhancement structures. The first vapor chamber has a first fluid chamber, and the first vapor chamber is configured to be thermally coupled to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel, and the first fluid channel communicates with the first fluid chamber and the second fluid chamber. The boiling enhancement structures are respectively disposed on the first vapor chamber and the second vapor chamber.

The invention discloses a pump-driven two-phase liquid cooling system and a control method thereof. The pump-driven two-phase liquid cooling system comprises a cooling liquid circulation loop and two gas-liquid separation recirculation loops, the cooling liquid circulation loop comprises a closed loop formed by connecting a liquid storage tank, a liquid supplementing pump, an adjusting three-way pipe, two evaporators, two condensers and a control double-outlet device; the gas-liquid separation recycling loop comprises a gas-liquid separator, a gas compressor, a gas-liquid mixer and a pipeline connecting assembly. Two modes of automatic control and manual control are set, in the automatic control mode, the system is automatically adjusted according to data such as temperature and switching time, excessive manual intervention is not needed, intelligent operation is achieved, when manual control and adjustment are carried out, an operator can manually adjust the opening degree of the control valve through a rotating handle, and the control efficiency is improved. And the system can be flexibly adjusted according to actual requirements under special working conditions or during maintenance and overhaul, so that the flexibility and applicability of system control are improved.

An electronic device includes: a first heat dissipation system, including a first cold plate and a first heat dissipation pipe, where the first heat dissipation pipe is connected to the first cold plate and is configured to allow coolant to flow therethrough; a second heat dissipation system, including a second cold plate and a second heat dissipation pipe, the second heat dissipation pipe is configured to allow the coolant to flow through circulation; and a coolant distribution unit. The first heat dissipation pipe and the second heat dissipation pipe are connected to the coolant distribution unit, and the coolant distribution unit is configured to cool the coolant in the first cold plate and the second cold plate through circulation. The second cold plate is made of a flexible material, and power of the first heating element is greater than power of the second heating element.

The invention provides a self-adaptive variable multi-stage absorption refrigerating machine and a data center waste heat recovery cooling system. The refrigerator includes an evaporator; a condenser; the solution flow path switching module is used for adjusting the operation number of the absorption refrigeration subsystems; and at least two absorption refrigeration subsystems, in each of which the solution heat exchanger is simultaneously in fluid communication with the absorber and the generator. The mass coupling mechanism that refrigerant steam generated by a generator of the upper-stage absorption refrigeration subsystem directly enters an absorber of the lower-stage absorption refrigeration subsystem to be absorbed is utilized, a multi-stage absorption refrigeration cycle with the middle pressure gradient is constructed, and the temperature of an effective driving heat source is reduced to 45-50 DEG C. In addition, the solution flow path switching module is configured to dynamically reconstruct the solution flow path topology, and the unit can be adaptively and preferentially switched among multiple operation modes, so that efficient operation under the variable working conditions all the year round is kept.

An immersion cooling system is provided and includes a box body, a condensing unit, a flow guiding structure and a heat dissipation medium. The box body has a first accommodating space, a second accommodating space and a water collecting tank connected to the second accommodating space. The condensing unit is arranged in the second accommodating space. The flow guiding structure is located below the condensing unit. The heat dissipation medium is accommodated in the first accommodating space and the water collecting tank and is able to flow on the flow guiding structure.

A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using a non-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members. For example it can be used to cool a computer chip, a skin of a hypersonic flying object, parabolic solar collector, turbine or engine blade, or any other heat source that requires high heat flux.

The invention belongs to the technical field of photoelectric detection, and discloses a refrigeration type handheld observation device and a dynamic temperature control method thereof. An infrared thermal imager is installed at the cold end of a semiconductor chilling plate and is connected with a heat dissipation structure through a composite phase change structure and a heat pipe array; acquiring environment parameters and equipment thermal state parameters by using an environment and equipment parameter acquisition unit; and the dynamic temperature control unit is used for matching the refrigeration power in real time according to the environment parameters and the equipment thermal state parameters, and the working current of the semiconductor refrigeration sheet is adjusted according to the target refrigeration power obtained through matching. The cooling efficiency of the refrigeration type handheld observation device is actively adjusted, the temperature control precision is improved, and heat management of the refrigeration type handheld observation device is optimized.

The present application provides a heat dissipation assembly and a power conversion device. The power conversion device comprises a housing, power devices, and the heat dissipation assembly. The housing comprises a first cavity and a second cavity spaced apart in a first direction. The housing is provided with an air inlet hole and an air outlet hole which are communicated with the second cavity. The power devices are accommodated in the first cavity. A heat dissipation assembly comprises the heat dissipation device and a working medium pump which are accommodated in the second cavity. The heat dissipation device comprises a heat dissipation substrate, a plurality of flat condensation tubes, and a communication portion. The heat dissipation substrate comprises a first chamber and a second chamber obtained by division by means of a partition portion. In the first direction, the first chamber is located on the side of the second chamber close to the power devices. The top of the partition portion is provided with a through hole communicated with the first chamber and the second chamber. The plurality of flat condensation tubes are communicated with each other by means of the communication portion, are communicated with the second chamber, and are located between the air inlet hole and the air outlet hole. The first chamber, the second chamber, and the flat condensation tubes are all used for accommodating a cooling working medium. The working medium pump is used for driving the cooling working medium to flow to the first chamber. The present invention facilitates miniaturization.

Embodiments of this application relate to the field of electronic device technologies, and provide a vapor chamber and an electronic device. The vapor chamber includes: a housing, where the housing includes a first cover plate and a second cover plate, the first cover plate is connected to the second cover plate to enclose a closed cavity, and the cavity is provided with a cooling medium; a capillarity structure, disposed in the cavity; and a heat dissipation structure, disposed in an inner surface of the cavity, where the heat dissipation structure includes at least one structure of a protrusion and a groove. The vapor chamber and electronic device provided in embodiments of this application have good heat dissipation performance.

A display device includes a display panel, a heating element located on a back side of a light-emitting surface of the display panel, and a support component located on the back side of the light-emitting surface of the display panel. The support component includes a loop heat dissipation cavity located inside the support component and a working fluid located in the loop heat dissipation chamber. A part of the loop heat dissipation cavity overlaps the heating element, and the loop type heat dissipation cavity includes at least one anti-backflow channel.

The invention discloses a cascade self-adaptive distribution method and device for phase change immersion cooling waste heat of a data center, and relates to the technical field of liquid cooling waste heat distribution. Comprising the following steps that S1, cascade waste heat distribution data are collected in real time, and data preprocessing is carried out; s2, regulation and control parameters of a steam pump are judged, steam pumping is conducted according to the regulation and control parameters of the steam pump, and in the process that steam enters the plate heat exchanger, regulation and control parameters of a power pump are judged, and backflow of condensate is adjusted; s3, the waste heat distribution proportion of the first-stage branch, the second-stage branch and the third-stage branch is judged, and the three branches are driven to conduct waste heat distribution on the heat using end according to needs; and S4, continuously monitoring the operation state, and optimizing each algorithm. The problems that in an existing two-phase immersed cooling system, a large amount of waste heat is directly discharged, the waste heat utilization rate is low, cascade distribution and a dynamic self-adaptive regulation and control mechanism are lacked, energy is wasted, load fluctuation is difficult to cope with, and the requirements for high energy efficiency and low-carbon operation of a data center cannot be met are solved.

The embodiment of the invention relates to the field of energy storage, and provides an energy storage system, a control method of the energy storage system and energy storage equipment. The energy storage system comprises an energy storage module and a cooling module which are connected in sequence, the energy storage module comprises at least one battery, and the cooling module comprises a heat exchange device, a first cooling device, a second cooling device, a third cooling device and a compression device. An inlet of the heat exchange device is communicated with an outlet of the first cooling device and an outlet of the second cooling device, an outlet of the heat exchange device is communicated with an inlet of the second cooling device and an inlet of the compression device, an outlet of the compression device is communicated with an inlet of the third cooling device, and an outlet of the third cooling device is communicated with an inlet of the first cooling device. A cold source at an outlet of the first cooling device is in a gas-liquid mixed state, and a cold source at an outlet of the heat exchange device is in a gas state. The energy storage system provided by the embodiment of the invention at least can solve the fault problem of the energy storage system.

An energy storage cabinet includes a cabinet body, a battery assembly, an air cooling device, an upper air duct, a first and a second air ducts. The upper air duct is arranged in an accommodating cavity and located on the upper portion of the cabinet body. The upper air duct includes an upper air duct outlet and an upper air duct inlet communicated with an air outlet of the air cooling device. The first and the second air ducts are located on two sides of the battery assembly. The first air duct includes a first air duct inlet and a first air duct outlet. The second air duct includes a second air duct inlet and a second air duct outlet. The first and the second air duct inlets are communicated with the upper air duct outlet. The first and the second air duct outlets are communicated with the battery assembly.

A mixed mode modular cooling system can include two or more mixed mode refrigerant loops and plumbing to permit a working fluid to circulate through at least a portion of the loops. Each mixed mode refrigerant loop can include an evaporator, a condenser, a pump to pump a refrigerant through the evaporator and the condenser, and a compressor configured to compress the refrigerant between the evaporator and the condenser. As cooling demand varies, each mixed mode refrigerant loop can be brought online and operated in either compressed refrigerant mode or pumped refrigerant mode.

A thermosiphon is provided for a computing system. The thermosiphon includes an evaporating portion and a pool portion. The evaporating portion is operable to be in thermal communication with a computing component of the computing system. The evaporating portion is operable to retain an evaporating volume of fluid to lower a temperature of the computing component. The pool portion is in fluid communication with the evaporating portion. The pool portion is operable to receive excess fluid of the fluid from the evaporating portion when a volume of the fluid in the evaporating portion is greater than the evaporating volume.

The invention discloses a three-dimensional uniform temperature plate module, a server and an immersed liquid cooling system, and the three-dimensional uniform temperature plate module is used for being thermally coupled to a heat source and comprises a first uniform temperature plate, a second uniform temperature plate, at least one first heat pipe and a plurality of boiling assisting structures. The first vapor chamber is provided with a first fluid chamber and is used for being thermally coupled to a heat source. The second uniform temperature plate is provided with a second fluid chamber. The first heat pipe is provided with a first fluid channel, and the first fluid channel is communicated with the first fluid cavity and the second fluid cavity. The boiling assisting structures are arranged on the first temperature equalizing plate and the second temperature equalizing plate respectively.

A liquid-cooling heat dissipation system includes: a liquid-cooling vapor chamber, a liquid-cooling heat dissipation plate, a first and a second coolant pipelines connecting the two, a coolant circulation machine, a fan, and a cooling liquid. The liquid-cooling vapor chamber includes a liquid-cooling cover, a metallic top cover, and a metallic bottom cover. The liquid-cooling heat dissipation plate includes a heat dissipation bottom plate and a heat dissipation outer cover. The coolant circulation machine pumps the cooling liquid from the first coolant pipeline into the liquid cooling cover, and then flows into the liquid-cooling heat dissipation plate. The fan locked on the bottom plate outer surface blows air to the liquid-cooling heat dissipation plate, so that the cooling liquid is cooled when flowing through the second accommodation space in the liquid cooling heat dissipation plate, and then flows back to the coolant circulations machine for recirculation.

A method of controlling a hybrid adiabatic cooling system to cool an interior of a data center includes a step of cooling, by a hybrid adiabatic cooler, a first cooling liquid circulating from a return segment of an outer conduit loop to a feed segment of the outer conduit loop. The method includes a step of exchanging, by a direct liquid cooling unit, heat between a second cooling liquid and the first cooling liquid circulating in the outer conduit loop. The method includes a step of diverting a portion of the first cooling liquid circulating in the outer conduit loop to an inner conduit loop. The method includes a step of exchanging, by a room air handling unit, heat between indoor ambient air and the diverted portion of the first cooling liquid circulating in the inner conduit loop.

The invention discloses a heat dissipation system and method for a multi-face advertising machine, and belongs to the technical field of machine heat dissipation. The system comprises a multi-surface temperature monitoring module which is used for monitoring the heating temperature of a preset heating position on the multi-surface advertising machine in real time; the intelligent control module is used for comparing the heating temperature with a preset temperature threshold value, and / or determining the temperature difference condition of the display screens according to the heating temperature, and / or determining the temperature change trend of the multi-surface advertising machine according to the heating temperature, so as to control the display screens according to the comparison result and / or the temperature difference condition and / or the temperature change trend. Generating a heat dissipation strategy through a preset control algorithm; and the composite heat dissipation module is used for controlling the air cooling sub-module, the phase change collaborative heat dissipation sub-module and the vapor chamber auxiliary heat dissipation sub-module to execute corresponding heat dissipation operations according to the heat dissipation strategy. According to the system, a targeted heat dissipation strategy can be provided for the multi-face advertising machine, the heat dissipation efficiency is improved, and the temperature of each display screen is within a reasonable range.

The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body by bending or joining at least one metal panel member, in which the refrigerant flow space includes a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone excluding the vaporization zone of the first refrigerant flow path and configured to reinforce rigidity of the thermal conduction panel body configured to define one side surface and the other side surface of the refrigerant flow space, thereby significantly improving heat dissipation performance.

A datacenter dry cooling system and method for cooling a heat-generating source are provided. The configuration includes an evaporating pad disposed on an air-to-liquid heat exchanger panel and an evaporating cooling water distribution arrangement for applying a controlled measured amount cooling water to the evaporating pad. The applied water serves is to be evaporated while the evaporating pad is exposed to ambient airflow to dissipate thermal energy of warmed liquid received from the heat-generating sources. The evaporating pad incorporates at least one of a temperature sensor or a humidity sensor for detecting outside temperature or humidity levels. A controller communicatively-coupled to the temperature or humidity sensor controls the volume flow of the cooling water based on the detected temperature or humidity levels.

A method for preventing gas flow into and out of a first enclosure having a first volume by limiting changes of the pressure within the first enclosure which includes providing a second enclosure including a variable volume device having an interior second volume that varies responsive to the pressures inside and outside the second enclosure and providing fluid communication between the interior of the first enclosure and the interior of the second enclosure to maintain a substantially fixed collective volume of the combination of the first enclosure and the second enclosure despite ambient temperature.

Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. The liquid-phase working fluid permeates into the wick, and a boundary between the liquid phase working fluid and the vapor phase working fluid is formed in the wick. A stress generated in the wick due to compressive deformation is greater than a pressure loss that occurs during circulation of the working fluid from the vapor-phase side of the boundary via the condenser back to the liquid-phase side of the boundary.

The invention discloses an evaporator and power conversion equipment, and belongs to the technical field of radiators. The multiple supporting structures are connected between the first inner wall face and the second inner wall face, part of the supporting structures define a pressure relief area, the pressure relief area communicates with the evaporation cavity, and the strength of the pressure relief area is smaller than that of the area where the other supporting structures are located; the pressure relief part is arranged in the pressure relief area and is arranged close to one supporting structure which forms the pressure relief area in a surrounding mode. The geometric shape of the pressure relief area is suddenly changed at the pressure relief part through the pressure relief part, so that the edge of the part, located in the pressure relief area, of the pressure relief part generates stress concentration under the action of pressure, the yield limit or the breaking strength of a material is easily reached firstly, breakage occurs, and directional pressure relief is achieved. Due to the fact that the wall thicknesses of the shell in the corresponding pressure relief area and the non-pressure relief area are the same, the overall corrosion resistance and strength of the evaporator are improved, and the reliability of equipment is improved.

This application provides a heat dissipation apparatus, including an evaporator and a condenser. The evaporator includes a housing and a division plate. The housing has a sealed inner cavity. The division plate divides the inner cavity into a first sub-cavity and a second sub-cavity. A first pipeline communicates with the first sub-cavity. A second pipeline communicates with the second sub-cavity. A heat emitting element is further fastened in the first sub-cavity. The division plate is provided with a flow guiding hole communicating with the first sub-cavity and the second sub-cavity. The flow guiding hole is provided facing the heat emitting element. A cooling working fluid in the condenser is transmitted to the second sub-cavity through the second pipeline. The cooling working fluid flows into the first sub-cavity through the flow guiding hole, and after dissipating heat for the heat emitting element, flows back to the condenser through the first pipeline for cooling. According to the heat dissipation apparatus in this application, a flow path of the cooling working fluid is limited, to ensure that the cooling working fluid is in full contact with the heat emitting element. This improves heat dissipation effect of the heat dissipation apparatus. This application further provides several heat dissipation apparatuses and a power converter including the foregoing heat dissipation apparatus.

The application provides an electronic device, comprising a heat generating element and a heat dissipation module. The heat dissipation module comprises a centrifugal fan and a heat sink. The centrifugal fan comprises a volute, the volute has an air inlet and an air outlet, the air outlet has a first air outlet area and a second air outlet area, the heat sink comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, two adjacent first heat dissipation fins form a first heat dissipation channel which communicates with the first air outlet area, and two adjacent second heat dissipation fins form a second heat dissipation channel which communicates with the second air outlet area. The width dimension of the second heat dissipation channel closest to the first air outlet area is not less than the width dimension of any first heat dissipation channel, and in any two adjacent second heat dissipation channels, the width dimension of the second heat dissipation channel close to the first air outlet area is less than the width dimension of the second heat dissipation channel away from the first air outlet area. According to the electronic device of the application, the volume of the heat sink is small.

This invention discloses an intelligent single-phase grounding fault location and monitoring device, relating to the field of single-phase grounding fault location and monitoring devices. The invention includes an outer casing, a grounding transformer fixedly installed on one side inside the outer casing, and a substation main body fixedly installed on the other side inside the outer casing. Heat sinks with uniform spacing are fixedly installed around the grounding transformer. The interior and bottom of the outer casing are equipped with a heat dissipation device for cooling the grounding transformer and substation main body in high-temperature weather. The heat dissipation device includes a first heat dissipation component, a water collection component, and a second heat dissipation component. This invention solves the problems of poor heat dissipation effect in high-temperature weather with air cooling and the high water source requirements and limited application of water cooling methods in existing single-phase grounding fault location and monitoring devices by using air cooling and evaporative cooling.