763results about "Modifications using liquid cooling" patented technology

An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.

A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

The invention provides an overall cooling charging device for an electrical vehicle. The overall cooling charging device comprises a power supply side connector (100) and a vehicle side connector (200), and the power supply side connector (100) is connected with a charging cable (300) and comprises a first box (101) which comprises a magnetic coupling convex part (111), a first iron core vertical plate side cooling part (110) and a first coupling end face (112); the vehicle side connector comprises a second box (201) which comprises a magnetic coupling concave part (211), a circumferential cooling part (209), a second iron core vertical plate side cooling part (210) and a second coupling end face (212); the charging cable (300) comprises a cable core (302) and a cable cooling water channel (301) surrounding the periphery of the cable core; water entry of the cable cooling water channel (301) is communicated with that of the first iron core vertical plate side cooling part (110); the power supply side connector (100) is suitable for forming end face coupling while forming electromagnetic coupling with the vehicle side connector. The overall cooling charging device communicates the cable, the power supply side connector and the vehicle side connector into the overall cooling channel, and control over working temperature of the charging device is greatly enhanced.

An embodiment of the invention discloses radiating equipment. The weight of the radiating equipment can be lowered and the radiating efficiency of the radiating equipment can be improved. The radiating equipment comprises an evaporator (110), a first-stage pressure balancer (120), a collecting pipe (130), a condenser (140) and a second-stage pressure balancer (150), wherein multiple steam pipelines (111) are arranged in the evaporator (110); working mediums are added in the multiple steam pipelines (111); the upper side of the evaporator (110) is communicated with the lower side of the first-stage pressure balancer (120) through the multiple steam pipelines (111); the upper side of the first-stage pressure balancer (120) is communicated with the lower side of the collecting pipe (130); the upper side of the collecting pipe (130) is communicated with the lower side of the condenser (140); and the upper side of the condenser (140) is communicated with the lower side of the second-stage pressure balancer (150).

In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.

Apparatus for cooling electrical elements, comprising a heat sink (1, 101, 201) through which a coolant can flow, a plurality of electrical elements (2, 102, 202) which each have a bottom surface and a side surface, with the bottom surfaces being aligned essentially on one plane, with the heat sink (1, 101, 201) having at least one channel (4, 5, 104, 105, 204, 205) through which a coolant can flow and making thermal contact with the electrical elements (2, 102, 202), characterized in that the heat sink (1, 101, 202) extends essentially parallel to the plane of the bottom surfaces, with the channel (4, 5, 104, 105, 204, 205) in the heat sink having a profile which is matched to edges of the electrical elements (2, 102, 202).

The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

Disclosed is a cooling apparatus using thermoelectric modules. The cooling apparatus includes a cooling container, a first thermoelectric module contacting the cooling container at a first position, and a first heat dissipating module contacting the first thermoelectric module. The first heat dissipating module includes a loop heat pipe including a first evaporation unit contacting the first thermoelectric module and provided with a wick structure located therein, a first condensation unit located at the outside of the cooling container, a first vapor pipe line configured to interconnect one side of the first evaporation unit and one side of the first condensation unit such that gas is placed therein, and a first liquid pipe line configured to interconnect the other side of the first evaporation unit and the other side of the first condensation unit such that a working fluid is placed therein.

A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.

The invention discloses a composite hydrophilic/hydrophobic enhanced boiling heat transfer sheet with a columnar microstructure. The composite hydrophilic/hydrophobic enhanced boiling heat transfer sheet comprises a hydrophobic region in a columnar micro-structural array and a smooth hydrophilic channel and is used for enhancing a boiling heat transfer process. The columnar microstructure of the micro-structural array can capture incondensable gas and provide a nucleation site of nucleate boiling in the boiling heat transfer process; steam bubbles grow in the hydrophobic region, slip and retain in the hydrophilic channel, gather and combine; when diameters of the steam bubbles increase to the order of magnitude of a width of the smooth hydrophilic channel, the steam bubbles separate from a smooth surface rapidly. Thus the separation of the steam bubbles is effectively promoted while the efficient heat transfer performance on the surface of the columnar microstructure is retained on a surface of the heat transfer sheet, and the wall superheat is reduced and the phenomenon of a boiling crisis is delayed.

Provided are a rack mount server system, which has no damage to computation equipment even if a disorder occurs in a cooling device, which is easy to maintain, minimize power consumption, which has a simple structure, and which performs an efficient cooling, and a control method thereof. The system comprises: a rack housing; and a cooling zone which is placed in the rack housing, which stores a server, and which is forcibly cooled. The rack housing comprises a heat exchanger and an evaporator, which cool the cooling zone. The cooling methods of the cooling structure may be different in accordance with the internal temperature of the cooling zone and the external temperature of the cooling zone.

A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section.

To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.

In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.

A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.

A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.

The invention provides an active two-phase loop and phase change heat storage compound thermal control system, which belongs to the technical field of heat radiation and cooling. The system mainly comprises a heat absorber, a reservoir, a condenser, a steam line, a drive device, a liquid line and a blower fan. The heat absorber is of an integrated structure which is formed by packaging a head conducting housing, an evaporation chamber, a heat storage material and fins. The outlet of the evaporation chamber is communicated with the inlet of the condenser through the steam line, and the outlet of the condenser is connected with the reservoir and the drive device in sequence through the liquid line, and finally accesses to the inlet of the evaporation chamber, so as to form an enclosed loop. When the calorific value is small, heat can be absorbed by the heat storage material and radiated through the fins, so as to limit or delay the temperature rise; when the calorific value is larger, the drive device is started to operate the active two-phase loop. Specifically, when the heat changes dynamically or in a pulsed manner, the system maintains the good temperature control of the electronic chip or equipment, and has advantages of strong heat dissipation capacity, compact structure, safe temperature control, strong applicability, wide application range and the like.

The invention relates to the field of microelectronic heat radiation, and particularly relates to a high-power chip heat radiation device manufacturing method. In view of technical problems of high heat flux density and difficult heat radiation of the high-power chip existing in the prior art, the invention provides the high-power chip heat radiation device manufacturing method. A high-thermal conductivity diamond copper composite material is adopted as a heat sink for heat radiation of a high-power semiconductor, microfluidic channels are designed on the heat sink of the diamond copper, through liquid phase transition layers, a welding technology is adopted to form a steam chamber, vacuum pumping is then carried out, a working medium is injected, shell nosing is finally carried out, the high-power chip is directly welded on a diamond copper carrier with the steam chamber, the high thermal conductivity of the diamond copper and the liquid phase transition are used for heat radiation, and the heat radiation efficiency of the high-power chip is improved.

A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device.

A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.

A cooling apparatus using solid-liquid phase change material (solid-liquid PCM) is disclosed. The cooling apparatus includes a pipeline, a housing enclosing the pipeline, and the solid-liquid PCM filling in an interior of the pipeline and a space between the pipeline and the housing. The solid-liquid PCM can contact a heat source and absorb the heat generated by the heat source, so as to transform from solid state to liquid state. The solid-liquid PCM in the liquid state can circulate inside the pipeline and the space between the pipeline and the housing. Thus, the heat is dissipated by the means of thermal convection. Meanwhile, the heat also can be dissipated through the housing. Therefore, the heat dissipation can be achieved by thermal conduction and heat convection simultaneously.

A system for cooling components comprises a composite of a sponge or sponge-like material with liquid refrigerant absorbed thereon and encased in a containment material configured to rupture or otherwise release evaporating refrigerant when internal composite pressure reaches a threshold ΔP from the outside pressure and/or at a pre-selected composite temperature, and thermal conduction means in thermal contact with the composite and one or more components for directing thermal energy to cool the components.

The present invention discloses an air conditioner including: a printed circuit board (31) having a power element (33) mounted thereon; and a coolant jacket (20) which is connected to the power element (33) and in which a coolant used for the cooling cycle flows. The printed circuit board (31) is contained in a switch box. The coolant jacket (20) is fixed to the switch box (40) via a heat transmission plate (50). The coolant jacket (20) is connected to the printed circuit board (31) by the switch box (40).

A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.

An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.