1433results about "Modifications using liquid cooling" patented technology

An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.

A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

The invention provides an overall cooling charging device for an electrical vehicle. The overall cooling charging device comprises a power supply side connector (100) and a vehicle side connector (200), and the power supply side connector (100) is connected with a charging cable (300) and comprises a first box (101) which comprises a magnetic coupling convex part (111), a first iron core vertical plate side cooling part (110) and a first coupling end face (112); the vehicle side connector comprises a second box (201) which comprises a magnetic coupling concave part (211), a circumferential cooling part (209), a second iron core vertical plate side cooling part (210) and a second coupling end face (212); the charging cable (300) comprises a cable core (302) and a cable cooling water channel (301) surrounding the periphery of the cable core; water entry of the cable cooling water channel (301) is communicated with that of the first iron core vertical plate side cooling part (110); the power supply side connector (100) is suitable for forming end face coupling while forming electromagnetic coupling with the vehicle side connector. The overall cooling charging device communicates the cable, the power supply side connector and the vehicle side connector into the overall cooling channel, and control over working temperature of the charging device is greatly enhanced.

An embodiment of the invention discloses radiating equipment. The weight of the radiating equipment can be lowered and the radiating efficiency of the radiating equipment can be improved. The radiating equipment comprises an evaporator (110), a first-stage pressure balancer (120), a collecting pipe (130), a condenser (140) and a second-stage pressure balancer (150), wherein multiple steam pipelines (111) are arranged in the evaporator (110); working mediums are added in the multiple steam pipelines (111); the upper side of the evaporator (110) is communicated with the lower side of the first-stage pressure balancer (120) through the multiple steam pipelines (111); the upper side of the first-stage pressure balancer (120) is communicated with the lower side of the collecting pipe (130); the upper side of the collecting pipe (130) is communicated with the lower side of the condenser (140); and the upper side of the condenser (140) is communicated with the lower side of the second-stage pressure balancer (150).

In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.

Apparatus for cooling electrical elements, comprising a heat sink (1, 101, 201) through which a coolant can flow, a plurality of electrical elements (2, 102, 202) which each have a bottom surface and a side surface, with the bottom surfaces being aligned essentially on one plane, with the heat sink (1, 101, 201) having at least one channel (4, 5, 104, 105, 204, 205) through which a coolant can flow and making thermal contact with the electrical elements (2, 102, 202), characterized in that the heat sink (1, 101, 202) extends essentially parallel to the plane of the bottom surfaces, with the channel (4, 5, 104, 105, 204, 205) in the heat sink having a profile which is matched to edges of the electrical elements (2, 102, 202).

The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure.

Disclosed is a cooling apparatus using thermoelectric modules. The cooling apparatus includes a cooling container, a first thermoelectric module contacting the cooling container at a first position, and a first heat dissipating module contacting the first thermoelectric module. The first heat dissipating module includes a loop heat pipe including a first evaporation unit contacting the first thermoelectric module and provided with a wick structure located therein, a first condensation unit located at the outside of the cooling container, a first vapor pipe line configured to interconnect one side of the first evaporation unit and one side of the first condensation unit such that gas is placed therein, and a first liquid pipe line configured to interconnect the other side of the first evaporation unit and the other side of the first condensation unit such that a working fluid is placed therein.

A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.

The invention discloses a composite hydrophilic/hydrophobic enhanced boiling heat transfer sheet with a columnar microstructure. The composite hydrophilic/hydrophobic enhanced boiling heat transfer sheet comprises a hydrophobic region in a columnar micro-structural array and a smooth hydrophilic channel and is used for enhancing a boiling heat transfer process. The columnar microstructure of the micro-structural array can capture incondensable gas and provide a nucleation site of nucleate boiling in the boiling heat transfer process; steam bubbles grow in the hydrophobic region, slip and retain in the hydrophilic channel, gather and combine; when diameters of the steam bubbles increase to the order of magnitude of a width of the smooth hydrophilic channel, the steam bubbles separate from a smooth surface rapidly. Thus the separation of the steam bubbles is effectively promoted while the efficient heat transfer performance on the surface of the columnar microstructure is retained on a surface of the heat transfer sheet, and the wall superheat is reduced and the phenomenon of a boiling crisis is delayed.

Provided are a rack mount server system, which has no damage to computation equipment even if a disorder occurs in a cooling device, which is easy to maintain, minimize power consumption, which has a simple structure, and which performs an efficient cooling, and a control method thereof. The system comprises: a rack housing; and a cooling zone which is placed in the rack housing, which stores a server, and which is forcibly cooled. The rack housing comprises a heat exchanger and an evaporator, which cool the cooling zone. The cooling methods of the cooling structure may be different in accordance with the internal temperature of the cooling zone and the external temperature of the cooling zone.

A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section.

To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.

In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.