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1454results about "Modifications using liquid cooling" patented technology
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Immersion Server, Immersion Server Drawer, and Rack-Mountable Immersion Server Drawer-Based Cabinet
ActiveUS20150062806A1Avoid lostDigital data processing detailsCasings/cabinets/drawers detailsSurface layerVaporization
An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within / at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.
Owner:DELL PROD LP
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
InactiveUS7007506B2Dew pointAvoid condensationSemiconductor/solid-state device detailsCompression machines with non-reversible cycleEvaporationEngineering
Owner:FUJITSU LTD
Valve controlled, node-level vapor condensation for two-phase heat sink(s)
ActiveUS20130027884A1Easy to condenseEasy extractionDigital data processing detailsIndirect heat exchangersSteam condensationAutomatic control
A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and / or the liquid-cooling of the node-level condensation module.
Owner:IBM CORP
Container air handling unit and cooling method
A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.
Owner:SCHNEIDER ELECTRIC IT CORP
Heat sink structure with a vapor-permeable membrane for two-phase cooling
ActiveUS20130027878A1Easy to disassembleImprove cooling effectDigital data processing detailsIndirect heat exchangersElectronic structureEngineering
A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
Owner:IBM CORP
System and methods for cooling electronic equipment
ActiveUS9119326B2Stable toleranceImprove securityCompressorEfficient regulation technologiesAtmospheric airWet-bulb temperature
Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.
Owner:INERTECH IP
Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
ActiveUS9049800B2Avoid lostCasings/cabinets/drawers detailsModifications using liquid coolingSurface layerVaporization
An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within / at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.
Owner:DELL PROD LP
Overall cooling charging device for electrical vehicle
ActiveCN106347166AWon't leak inLarge currentBatteries circuit arrangementsCharging stationsElectromagnetic couplingWorking temperature
The invention provides an overall cooling charging device for an electrical vehicle. The overall cooling charging device comprises a power supply side connector (100) and a vehicle side connector (200), and the power supply side connector (100) is connected with a charging cable (300) and comprises a first box (101) which comprises a magnetic coupling convex part (111), a first iron core vertical plate side cooling part (110) and a first coupling end face (112); the vehicle side connector comprises a second box (201) which comprises a magnetic coupling concave part (211), a circumferential cooling part (209), a second iron core vertical plate side cooling part (210) and a second coupling end face (212); the charging cable (300) comprises a cable core (302) and a cable cooling water channel (301) surrounding the periphery of the cable core; water entry of the cable cooling water channel (301) is communicated with that of the first iron core vertical plate side cooling part (110); the power supply side connector (100) is suitable for forming end face coupling while forming electromagnetic coupling with the vehicle side connector. The overall cooling charging device communicates the cable, the power supply side connector and the vehicle side connector into the overall cooling channel, and control over working temperature of the charging device is greatly enhanced.
Owner:FEIZHOU GRP
Radiating equipment
ActiveCN105682423AMiniaturizationAchieve lightweightModifications using liquid coolingPulp and paper industryEvaporator
An embodiment of the invention discloses radiating equipment. The weight of the radiating equipment can be lowered and the radiating efficiency of the radiating equipment can be improved. The radiating equipment comprises an evaporator (110), a first-stage pressure balancer (120), a collecting pipe (130), a condenser (140) and a second-stage pressure balancer (150), wherein multiple steam pipelines (111) are arranged in the evaporator (110); working mediums are added in the multiple steam pipelines (111); the upper side of the evaporator (110) is communicated with the lower side of the first-stage pressure balancer (120) through the multiple steam pipelines (111); the upper side of the first-stage pressure balancer (120) is communicated with the lower side of the collecting pipe (130); the upper side of the collecting pipe (130) is communicated with the lower side of the condenser (140); and the upper side of the condenser (140) is communicated with the lower side of the second-stage pressure balancer (150).
Owner:HUAWEI TECH CO LTD
Flow boiling heat sink structure with vapor venting and condensing
ActiveUS20130027883A1Easy to disassembleImprove cooling effectSemiconductor/solid-state device detailsSolid-state devicesElectronic structureCoolant flow
A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).
Owner:IBM CORP
Cooling Arrangements For Drive Systems
ActiveUS20150003015A1Transformers/inductances coolingConversion constructional detailsTransformerProcess engineering
In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.
Owner:TECO WESTINGHOUSE MOTOR
Apparatus for cooling of electrical elements
ActiveUS20090059528A1Improve cooling effectOccupies little physical spaceHeat exhanger conduitsSecondary cellsThermal contactElectrical element
Apparatus for cooling electrical elements, comprising a heat sink (1, 101, 201) through which a coolant can flow, a plurality of electrical elements (2, 102, 202) which each have a bottom surface and a side surface, with the bottom surfaces being aligned essentially on one plane, with the heat sink (1, 101, 201) having at least one channel (4, 5, 104, 105, 204, 205) through which a coolant can flow and making thermal contact with the electrical elements (2, 102, 202), characterized in that the heat sink (1, 101, 202) extends essentially parallel to the plane of the bottom surfaces, with the channel (4, 5, 104, 105, 204, 205) in the heat sink having a profile which is matched to edges of the electrical elements (2, 102, 202).
Owner:BEHR GMBH & CO KG
Vapor condenser with three-dimensional folded structure
A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
Owner:IBM CORP
Valve controlled, node-level vapor condensation for two-phase heat sink(s)
InactiveUS20130077247A1Digital data processing detailsModifications using liquid coolingAutomatic controlNuclear engineering
A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and / or the liquid-cooling of the node-level condensation module.
Owner:INT BUSINESS MASCH CORP
Gaskets for thermal ducting around heat pipes
ActiveUS20130329357A1Reduce the soundSleeve/socket jointsFluid pressure sealed jointsHeat pipeGasket
The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
Owner:APPLE INC
Two-phase cooling system for electronic components
InactiveUS20130340978A1Semiconductor/solid-state device detailsSolid-state devicesWorking fluidEngineering
A two-phase heat exchanger for cooling at least one electronic and / or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and / or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.
Owner:ABB (SCHWEIZ) AG
Loop type pressure-gradient-drien low-pressure thermosiphon device
ActiveUS20120024499A1Increase pressureMaximum heat transferSemiconductor/solid-state device detailsSolid-state devicesWorking fluidEngineering
A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure.
Owner:ASIA VITAL COMPONENTS SHENZHEN CO LTD
Vapor condenser with three-dimensional folded structure
ActiveUS8941994B2Easy to shapeIncrease surface areaSolid-state devicesHeat exchanger casingsFolded structureCoolant
A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
Owner:INT BUSINESS MASCH CORP
Heat transport device, electronic apparatus, and heat transport manufacturing method
InactiveUS20100252237A1Improve heat transfer efficiencyEasy to manufactureSemiconductor/solid-state device detailsSolid-state devicesWorking fluidEvaporation
A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.
Owner:SONY CORP
Cooling apparatus using thermoelectric modules
InactiveUS20190203983A1Eliminate the problemThermoelectric device with peltier/seeback effectIndirect heat exchangersWorking fluidEvaporation
Disclosed is a cooling apparatus using thermoelectric modules. The cooling apparatus includes a cooling container, a first thermoelectric module contacting the cooling container at a first position, and a first heat dissipating module contacting the first thermoelectric module. The first heat dissipating module includes a loop heat pipe including a first evaporation unit contacting the first thermoelectric module and provided with a wick structure located therein, a first condensation unit located at the outside of the cooling container, a first vapor pipe line configured to interconnect one side of the first evaporation unit and one side of the first condensation unit such that gas is placed therein, and a first liquid pipe line configured to interconnect the other side of the first evaporation unit and the other side of the first condensation unit such that a working fluid is placed therein.
Owner:LG ELECTRONICS INC
Vapor condenser with three-dimensional folded structure
ActiveUS20140071626A1Easy to shapeIncrease surface areaSolid-state devicesMetal-working apparatusFolded structureCoolant
A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
Owner:IBM CORP
Water-cooling heat dissipation device and water block thereof
ActiveUS20160227672A1Rapidly generate heatFast heatingSemiconductor/solid-state device detailsModifications using liquid coolingWorking fluidWater block
A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
Owner:COOLER MASTER CO LTD
Composite hydrophilic/hydrophobic enhanced boiling heat transfer sheet with columnar microstructure
ActiveCN106102414AExtended service lifeHave mechanical strengthModifications using liquid coolingNucleationBoiling heat transfer
The invention discloses a composite hydrophilic / hydrophobic enhanced boiling heat transfer sheet with a columnar microstructure. The composite hydrophilic / hydrophobic enhanced boiling heat transfer sheet comprises a hydrophobic region in a columnar micro-structural array and a smooth hydrophilic channel and is used for enhancing a boiling heat transfer process. The columnar microstructure of the micro-structural array can capture incondensable gas and provide a nucleation site of nucleate boiling in the boiling heat transfer process; steam bubbles grow in the hydrophobic region, slip and retain in the hydrophilic channel, gather and combine; when diameters of the steam bubbles increase to the order of magnitude of a width of the smooth hydrophilic channel, the steam bubbles separate from a smooth surface rapidly. Thus the separation of the steam bubbles is effectively promoted while the efficient heat transfer performance on the surface of the columnar microstructure is retained on a surface of the heat transfer sheet, and the wall superheat is reduced and the phenomenon of a boiling crisis is delayed.
Owner:XI AN JIAOTONG UNIV
Rackmount server system and method for controlling same
ActiveUS20170325354A1No damageMinimize power consumptionCasings/cabinets/drawers detailsRack/frame constructionProcess engineeringMechanical engineering
Provided are a rack mount server system, which has no damage to computation equipment even if a disorder occurs in a cooling device, which is easy to maintain, minimize power consumption, which has a simple structure, and which performs an efficient cooling, and a control method thereof. The system comprises: a rack housing; and a cooling zone which is placed in the rack housing, which stores a server, and which is forcibly cooled. The rack housing comprises a heat exchanger and an evaporator, which cool the cooling zone. The cooling methods of the cooling structure may be different in accordance with the internal temperature of the cooling zone and the external temperature of the cooling zone.
Owner:DOBE COMPUTING CO LTD
Heat conveying structure for electronic device
ActiveUS20120180993A1Increase amount of heat transferredReduce noiseSemiconductor/solid-state device detailsSolid-state devicesEngineeringHeat spreader
A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section.
Owner:NEC CORP
Cooling arrangements for drive systems
ActiveUS9153374B2Transformers/inductances coolingConversion constructional detailsTransformerProcess engineering
In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.
Owner:TECO WESTINGHOUSE MOTOR
Heat exchanger including passageways
A heat exchanger includes a core defining a first passageway and a second passageway. The core includes a plurality of unit cells coupled together. Each unit cell of the plurality of unit cells includes a first wall and a second wall. The second wall is spaced from the first wall. The first wall at least partially defines a first passageway portion and a second passageway portion. The second wall at least partially defines the second passageway portion. The second wall extends about the first wall such that the first passageway portion is nested within the second passageway portion.
Owner:GENERAL ELECTRIC CO
Heat spreader
InactiveCN102693949AIncrease flow spaceEvenly distributedSemiconductor/solid-state device detailsSolid-state devicesRefluxWorking fluid
A heat spreader comprises an absorber plate, a heat releasing plate combined with the absorber plate, a first capillary structure on the absorber plate and a second capillary structure on the heat releasing plate, wherein a chamber is formed between the absorber plate and the heat releasing plate; the chamber is filled with a working fluid, and the first capillary structure and the second capillary structure are disposed in the chamber; the first capillary structure comprises several first grooves and second grooves which are arranged parallelly; each of the first grooves extends from one end of the absorber plate to the other end along a vertical direction; each of the first grooves and each of the second grooves are interlaced. Therefore, a gaseous working medium is enabled to simultaneously flow in the first grooves and the second grooves, the flowing space for the gaseous working medium and the contact area thereof with a cover plate are increased, and the heat conduction efficiency is improved due to the reduction of heat transfer resistance and reflux resistance.
Owner:FU ZHUN PRECISION IND SHENZHEN +1
Refrigeration system for electronic components having environmental isolation
InactiveUS6138469AConveniently removedAvoid corrosionBoiler absorbersDomestic cooling apparatusEngineeringElectronic component
To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.
Owner:ORACLE INT CORP
Heat sink structure with a vapor-permeable membrane for two-phase cooling
InactiveUS20130077246A1Easy extractionEasy to disassembleDigital data processing detailsIndirect heat exchangersElectronic structureEngineering
A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
Owner:INT BUSINESS MASCH CORP
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