50results about "Modifications using liquid cooling" patented technology

This application provides a heat dissipation device and electronic device, including: a condenser having an internally vacuumed and sealed cavity; a liquid pipe containing a liquid working fluid, one end of which is connected to the condenser; a compensation chamber having an internally vacuumed and sealed cavity, through which the liquid pipe passes and communicates with the compensation chamber, and a liquid-absorbing core covering the surface of the liquid pipe within the compensation chamber; an evaporator having an internally vacuumed and sealed cylindrical structure, comprising a vapor channel, a first capillary core, and a second capillary core stacked sequentially from the outer wall surface of the cylindrical structure to the central axis, the other end of which penetrates a portion of the evaporator, and the second capillary core covering a portion of the surface of the liquid pipe; a gas pipe, one end of which is connected to the vapor channel, and the other end of which is connected to the condenser; and a heat-conducting plate covering the outer surface of the evaporator. The heat dissipation device and electronic device provided in this application embodiment at least improve the heat dissipation efficiency of electronic devices.

A cooling system for performing a cooling operation, the cooling system comprising a coolant chamber; wherein during the cooling operation of the cooling system, liquid coolant and coolant vapor are located in the coolant chamber; wherein a plurality of circuit boards are disposed in the coolant chamber, and the cooling operation is performed by the liquid coolant contacting the plurality of circuit boards; wherein the cooling system performs a power-off procedure before the coolant chamber is unsealed; wherein the power-off procedure is used to remove the liquid coolant remaining on the plurality of circuit boards after the cooling operation before the coolant chamber is opened.

A refrigerant pipe through which a flammable refrigerant flows is disposed in a machine chamber. An electric component including a substrate on which a heat-generating component is mounted is disposed in a fan chamber. In a working fluid channel, a working fluid is circulated between an evaporator and a condenser. The evaporator causes heat exchange between the heat-generating component and the working fluid. The condenser causes heat exchange between the flammable refrigerant flowing through the refrigerant pipe and the working fluid.

Presented are passive temperature control systems for thermal management of electrical components, methods for making / using such thermal management systems, and aircraft equipped with smart-material activated temperature control systems for passive cooling of battery modules. A thermal management system is presented for passively cooling an electrical component stored inside a module housing. The thermal management system includes a cooling chamber that movably attaches adjacent a module housing that contains an electrical component, such as a rechargeable battery module. The cooling chamber contains a sublimable cooling agent, such as dry ice. A biasing member biases the cooling chamber away from the module housing. A smart material actuator is attached to and interposed between the cooling chamber and module housing. The smart material actuator extracts thermal energy from the module housing and, once heated to a phase transformation temperature, contracts and thereby pulls the cooling chamber into contact with the module housing.

Cryogenic analytical systems are provided that can include: a cryogenic fluid source; one or more analysis components; at least one cryogenic thermal conduit operably coupled between the cryogenic fluid source and the one or more analysis components; and a pressure control component operably engaged with the cryofluid source. Methods for performing cryogenic analysis are provided. The methods can include adjusting the pressure of cryofluid within a cryogenic fluid source to configure one or more analysis components with a cryogenic temperature. Methods for configuring a cryogenic analytical system to perform cryogenic analysis are also provided. The methods can include: increasing the pressure within a cryogenic fluid source to rapidly cool one or more analysis components to a first temperature; and decreasing the pressure within the cryogenic fluid source to reduce the first temperature of the one or more analysis components.

An electronic device according to an embodiment of the disclosure may include a first housing including a front surface, a rear surface opposite to the front surface, a side surface surrounding the space between the front surface and the rear surface, and a first inner wall facing an inner space, a first seating portion which is provided in the first housing and on which a first electronic component is placed, a second seating portion which is provided in the first housing and on which a second electronic component is placed, a first partition wall which extends from the first inner wall and partitions the first seating portion and the second seating portion, and a first heat dissipation member including a first heat exchanger which is located on the first seating portion to be in contact with the first electronic component, a second heat exchanger which is located in the second seating portion, and a first conduit which is at least partially placed on the first partition wall and the first inner wall to interconnect the first heat exchanger and the second heat exchanger. Various other embodiments may be possible.

The application discloses an emergency air conditioning system and method for electronic equipment rooms of a compressed air-based power station, which comprises a cold storage and supply module, a vortex tube cold supply module and a turbo expander cold supply module. The system uses compressed air in a power station gas storage device as an emergency energy source, and forms multiple redundant cold supply paths through four modes of cold storage tank pre-storage of cold energy, vortex tube combined heat and power, turbo expander combined heat and power and semiconductor refrigeration local temperature control, realizes precise temperature control combining the global and the local, and integrates solution dehumidification and membrane separation oxygen removal units to simultaneously guarantee constant temperature, constant humidity, constant oxygen and micro-positive pressure environment requirements by using waste heat. The system realizes self-sufficient and efficient cascade utilization of energy, has modular expansion and graded response ability based on air pressure, is beneficial to emergency environment guarantee for electronic equipment rooms under the condition of power failure of the whole plant, and has the characteristics of high reliability, high energy efficiency and economy.

The application discloses a high-performance visual energy storage adjustable heat-distribution plate and a use method thereof. The adjustable heat-distribution plate comprises a heat-distribution plate framework (1) which plays a supporting and positioning role and comprises a framework side plate, a framework partition upper plate and a framework partition lower plate; a phase change unit with adjustable thickness, the side edges of which are connected with the framework side plate and are arranged on the upper surface of the framework partition upper plate; a water-cooling heat-dissipation unit which comprises a heat exchanger water channel (10) arranged between the framework partition upper plate and the framework partition lower plate and internally provided with a turbulent flow exciting part, water inlets and outlets which are connected to the left and right sides of the heat exchanger water channel (10) and are used for inputting and outputting cooling liquid respectively; and front and rear visual transparent windows which are in the shape of transparent plates. By setting the phase change material filling space as adjustable thickness, the structural flexibility is effectively improved, different heating powers of heating elements can be coped with, the phase change material filling amount can be individually adjusted, and the application range of the heat-distribution plate is generalized.

The invention relates to a distribution cabinet for outdoor use, which has a refrigeration unit (20) in a superstructure (4).

A cooling system, configured to perform a cooling operation, the cooling system including a coolant chamber; wherein liquid coolant and coolant vapor are in the coolant chamber during the cooling operation of the cooling system; wherein circuit boards are disposed within the coolant chamber, and the cooling operation is performed via contact of the liquid coolant with the circuit boards; wherein the cooling system performs a power down sequence before the coolant chamber is unsealed; wherein the power down sequence is configured to remove the liquid coolant remained on circuit boards after the cooling operation before the coolant chamber is opened.

A cold plate for a heat exchanger system can include a base in thermal communication with a heat load, one or more walls extending from the base, a first fluid path through the cold plate, a plurality of particles disposed within the first fluid path, or any combination thereof. The first fluid path can have an inlet and an outlet and / or be bounded on at least two sides by the walls. The plurality of particles can be confined within the first fluid path fluidically between the inlet and the outlet. The plurality of particles can be loosely disposed within a vertical portion of the first fluid path.

A two-phase double-layer staggered enhanced microchannel heat sink, which includes a stacked upper cold plate and a lower cold plate. The upper cold plate is provided with a plurality of first fins arranged in an array and the lower cold plate is provided with a plurality of second fins arranged in an array, so as to form a first microchannel group in the upper cold plate and a second microchannel group in the lower cold plate. The first microchannel group and the second microchannel group are respectively configured to accommodate and guide a cooling working medium to flow through the upper cold plate and the lower cold plate; an extension direction of the first fins is perpendicular to an extension direction of the second fins, so that flow directions of the first microchannel group and the second microchannel group are vertically staggered.

The application discloses a kind of detector cryogenic systems, it is related to the technical field of equipment related to detector;Including being set on bracket container system, liquefaction system and vacuum system;The container system includes the detector container for installing detector, the detector container is connected with the liquefaction system by the argon pipe and liquid argon pipe of sealing heat preservation arrangement, the liquefaction system and container system are respectively connected with the vacuum system by vacuum pipeline, the vacuum system can respectively vacuumize the container system and liquefaction system, the liquefaction system is used to transport into the detector container after argon liquefaction.The detector cryogenic system provided in the application has good refrigeration effect, can continuously refrigerate, to provide stable low-temperature environment for detector.

A cooling system may include a compressor, a condenser, a first heat exchanger, a second heat exchanger, and a storage container configured to store refrigerant. The cooling system may include a set of entry control valves configured to control a flow of the refrigerant selectively to at least one of the first heat exchanger or the second heat exchanger. The cooling system may include a set of outlet control valves configured to control a flow of refrigerant between the first heat exchanger and the second heat exchanger.

The application discloses a cooling and heat dissipation method and system of an energy storage power supply, and the cooling and heat dissipation method comprises the following steps: acquiring the discharging power of the energy storage power supply in real time, and calculating the real-time heat generation of the energy storage power supply; comparing the size of the real-time heat generation and the heat generation threshold value; when the real-time heat generation of the energy storage power supply is lower than or equal to the heat generation threshold value, starting the cooling circulation single loop, and according to the real-time heat generation of the energy storage power supply, calculating the conventional refrigeration power of the liquid cooling unit, and controlling the liquid cooling unit to operate at the conventional refrigeration power; when the real-time heat generation of the energy storage power supply is higher than the heat generation threshold value, starting the cooling circulation double loop, and according to the real-time heat generation of the energy storage power supply, calculating the rapid refrigeration power of the liquid cooling unit, and controlling the liquid cooling unit to operate at the rapid refrigeration power. The application can accurately match the cooling power of the liquid cooling unit according to the heat dissipation state of the energy storage power supply, and has the function of rapid cooling when the energy storage power supply is subjected to large-rate charging and discharging.

A cold plate for cooling the electronic equipment inside the missile is disclosed. The cold plate includes a housing that encloses the compartment. The outlet manifold is located inside the compartment. The core is located inside the compartment and is adjacent to the outlet manifold. The liquid inlet is fluidly connected to the core. The vapor outlet fluidly connects the outlet manifold to the atmosphere or space.

A shelf system for use in a telecommunications or networking application, the shelf system including a shelf assembly and a circuit pack conformally inserted into the shelf assembly. The circuit pack includes a printed circuit board disposed in an enclosure, an integrated circuit chip coupled to the printed circuit board, and a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip. The ports of the plurality of ports are angled relative to a front faceplate of the enclosure such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.

An energy storage device includes a battery pack, a charging converter is electrically connected to a battery pack and configured to convert electric energy input to or output from the battery pack. A charging plug is electrically connected to the charging converter to deliver the electric energy converted by the charging converter. A temperature regulation flow channel of the battery pack and a temperature regulation flow channel of the charging converter are arranged in the first circulation unit. The second circulation unit and the first circulation unit are isolated from each other. The temperature regulation flow channel of the charging plug is in the second circulation unit. The first heat exchanger is arranged at least between the first circulation unit and the second circulation unit. The heat dissipation apparatus is arranged in one of the first circulation unit, the second circulation unit, and the first heat exchanger.

The present disclosure relates to the field of heat dissipation technologies, and provides a Vapor Chamber (VC) and an electronic device. The VC includes a first housing and a second housing that are disposed opposite to each other. The first housing and the second housing form a closed chamber. The first housing includes a bottom wall for making contact with a heat source. The second housing has a top wall facing the bottom wall. A first capillary structure is disposed on the bottom wall. The first capillary structure comprises a heat source region capillary structure and a non-heat source region capillary structure. The heat source region capillary structure includes a plurality of convex capillary structures and / or a plurality of first concave capillary structures.

Embodiments of the invention relate to a two-phase heat sink (100) for cooling an electrical heat source (200). The two-phase heat sink (100) comprises a chamber (110) which is configured to receive a cooling fluid (F). For improved cooling and heat dissipation, the chamber (110) in its inner surface (112´´) comprises a wick area (134) for converting the cooling fluid (F) from a liquid phase to a vapor phase. The wick area (134) and an attachment area (132) overlap with each other at least partly. Thereby, improved cooling is provided. Furthermore, embodiments of the invention also relate to a heat sink comprising two or more such two-phase heat sinks.

A two-phase spray type immersion cooling system for a data center. A cooling system and method of cooling that can increase efficiency. The cooling system is disposed within a server rack, the cooling system comprising a vaporization space in which liquid coolant is vaporized and a condensation space in which coolant vapor is condensed into condensed liquid coolant; wherein the vaporization space and the condensation space are isolated from each other and each closed except for a connection port between the vaporization space and the condensation space; wherein the vaporization space and the condensation space are separated from each other.

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, and a blended mode between the adiabatic mode and the evaporative mode, depending on environmental conditions. The blended mode can be enabled by a fluid transmission and retention device fluidically connected to the inlet and outlet of the evaporative cooler, the recovery coil outlet, and the heat load. The fluid transmission and retention device can variably distribute the cooling fluid exiting the recovery coil and the cooling fluid exiting the evaporative cooler to one or both of the heat load and the evaporative cooler inlet. In an example, the fluid transmission and retention device includes a manifold. In another example, the fluid transmission and retention device includes one or more tanks.

The application provides a spacecraft integrated active plate for non-uniform heat flow devices and a manufacturing method thereof, comprising an active mounting plate, which comprises a thin-walled cavity, a mounting hole embedded part, a heat pipe, a working medium filling hole and a space three-dimensional crystal network sandwich structure; the mounting hole embedded part, the heat pipe and the space three-dimensional crystal network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity; the mounting hole embedded part is used for mounting electronic equipment; the array cell of the space three-dimensional lattice network sandwich structure is in a Scherk's curved surface cell configuration; the working medium filling hole is arranged on the side wall of the thin-walled cavity; and the thin-walled cavity, the mounting hole embedded part, the heat pipe and the space three-dimensional crystal network sandwich structure are integrally manufactured. The application solves the problems of large interface thermal resistance, multi-point liquid leakage, poor temperature control and uniform temperature effect in local high heat flow area caused by the original SAR antenna active mounting plate gluing mode of more than 100 components, and meets the efficient temperature control and uniform temperature demand of the SAR antenna intermittent working surface array uniform TR component.

A vapor chamber for cooling a heat source is provided. The vapor chamber includes a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium, wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source, wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall, and wherein the vapor chamber further includes a channel, which is at least partially connected to the baseplate, with an inlet below a liquid level of the cooling medium and an outlet above the liquid level and which provides a bubble pump for transporting the liquid medium from the inlet to the outlet.

A cooling system, disposed within a server rack, the cooling system including a vaporization space in which coolant is vaporized; and a condensation space in which coolant vapor is condensed into condensed liquid coolant; wherein the vaporization space and the condensation space are isolated and enclosed except connecting port thereof; wherein the vaporization space and the condensation space are separated from each other.