1264results about "Modifications using liquid cooling" patented technology

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.

The invention provides an immersed liquid cooling device, a control method and a system, and relates to the technical field of heat dissipation, the temperature of an inlet and an outlet of a chip-level evaporator at a chip and the highest temperature of the chip are obtained in real time through a preset sensor, and the corresponding relation between the inlet and outlet temperature difference and a preset threshold value is determined; if the outlet temperature difference is smaller than the preset threshold value, the valve opening degree of a pipeline valve corresponding to the outlet temperature difference is controlled to be reduced along with increasing of the outlet temperature difference according to a preset adjusting method, and the valve opening degree is determined in real time; when the valve opening degree reaches the minimum value and the outlet temperature is still smaller than the preset threshold value, the target fan rotating speed is determined through a first preset formula according to the chip highest temperature and the chip heating power; and if the outlet temperature difference is equal to the preset threshold value, the target fan rotating speed is determined according to the chip highest temperature and the chip heating power. According to the invention, the problem that an immersed liquid cooling device, a control method and a system which are controllable in cooling object and cooling effect and wide in application range are lacked in the prior art is solved.

The invention belongs to the technical field of solid-liquid phase change heat dissipation, and discloses a memory alloy-based phase change expansion buffer structure, which comprises an elastic structure, a supporting structure, a thin wall, a cavity, a flaring, an electronic device, a heat sink, fins, a connecting structure and a phase change material, the thin wall is made of shape memory alloy and separates the internal cavity and the external phase-change material, the internal cavity is communicated with the external environment through the flaring, and in the flying process of the aerospace vehicle, external airflow flows into the flaring to take away heat stored by the phase-change material continuously. Based on the shape memory function of the memory alloy, additional space expansion buffering can be provided for the phase change material when the temperature changes, and stress damage caused by phase change expansion is avoided. The memory alloy thin wall and the elastic supporting structure are combined, the structure is simple, no moving part exists, circulating work in the high-temperature environment and the low-temperature environment can be achieved, local hot spots caused by internal gap movement of the phase change material in the circulating phase change process are reduced, and heat transfer deterioration is avoided.

The invention relates to the technical field of electricity meters, and particularly discloses a relay and an electricity meter thereof, comprising a mounting plate: a clamping frame is fixedly mounted on the front surface of the mounting plate, sliding grooves are formed in the upper and lower ends of the clamping frame, sliding plates are slidably connected to the inner sides of the sliding grooves, and heat dissipation fins of a heat conduction aluminum plate are attached to electronic components in the electricity meter. The n-pentane heat-conducting medium in the liquid storage box is heated and vaporized, the heat is absorbed, the heat dissipation capability is improved, the heat pushes the air cylinder to open the heat dissipation window, the air velocity in the electric meter is improved, the heat dissipation is enhanced, the temperature is continuously increased, and the heat-conducting medium is further vaporized, so that the inner current-conducting plate and the outer current-conducting plate are attached; and after the temperature is reduced, the heat-conducting medium is condensed, the air cylinder shrinks to block the heat dissipation window, the heat dissipation fan does not need to be automatically triggered by a temperature sensor, the consumption is reduced, the stability is improved, the cost is reduced, and the protection and moisture-proof performance is improved by the blocking window when the heat dissipation device is not used.

A modular data center and a method of building a modular data center. The modular data center includes a site microgrid including at least one power converter connected to a direct current (DC) bus and a digital power system. The digital power system includes at least one digital power transmitter, a set of transmission lines, and at least one digital power receiver. The modular data center design uses an adiabatic cooling system to cool the modular data center.

A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.

The invention belongs to the technical field of energy storage cooling, and particularly relates to a cooling circulation system and an equipment cooling method, and the cooling circulation system comprises a liquid inlet system, a heat exchange system and a liquid outlet system. The heat exchange system comprises a plurality of heat exchange units which are connected in parallel; the liquid inlet system is connected with the input end of the heat exchange system, and a pressure detection device, a liquid temperature measurement device I, a pollution discharge degassing tank and a liquid circulation driving unit are connected into the liquid inlet system; the liquid outlet system is connected with the output end of the heat exchange system, and a conductivity detection device, an outlet pressure detection device and a liquid temperature measurement device II are connected into the liquid outlet system. Through dynamic modular adjustment, multi-parameter intelligent control, energy-saving composite heat dissipation and high-reliability design, the problems of low heat dissipation efficiency, high energy consumption, high maintenance cost, poor adaptability and the like in the prior art are effectively solved; and particularly, the method has remarkable advantages in the aspects of precise heat dissipation of high-power-density equipment, stable operation under complex working conditions and full-life-cycle cost control.

Disclosed are a vapor chamber, a radiator and an electronic device. The vapor chamber includes: a bottom plate, a top plate, a side plate and a backflow piece. The bottom plate includes a first heat dissipation area and a second heat dissipation area provided at a peripheral side of the first heat dissipation area. The first heat dissipation area is provided with at least a first capillary structure layer on the side near the top plate, and the second heat dissipation area is provided with at least a second capillary structure layer on the side near the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that in the first capillary structure layer.

The invention relates to a heat dissipation optimization method and system for an air conditioner control panel, and belongs to the technical field of energy-saving air conditioner heat dissipation. Comparing the real-time temperature data with a preset temperature threshold value, and determining a heat dissipation mode; when the real-time temperature data is lower than a first threshold value, a first-stage heat dissipation mode is started, a heat dissipation fan is controlled to operate at the lowest rotating speed, and a basic heat conduction path of a cooling fin is activated; when the real-time temperature data is between a first threshold value and a second threshold value, a second-stage heat dissipation mode is started, the rotating speed of a heat dissipation fan is adjusted to be in linear proportion to the real-time temperature data, and an expansion heat conduction path of a cooling fin is started to increase the heat dissipation area; and when the real-time temperature data exceeds a second threshold value, starting a three-stage heat dissipation mode, switching to phase change material auxiliary heat dissipation, controlling a heat dissipation fan to operate at the maximum rotating speed, dynamically adjusting the heat conduction efficiency of a heat dissipation sheet through a pulse width modulation signal, and triggering a temperature alarm signal.

The present application provides a two-phase cold plate liquid cooling system and a control method. According to the present application, for parts which are cooled in series by the two-phase cold plate liquid cooling system, after a first evaporator cools a previous part, on the basis of the heat transfer requirements of a part cooled by a second evaporator, the quality of a refrigerant output from the first evaporator is adjusted to prevent the quality of the refrigerant from being too low or too high, and thus the refrigerant entering the second evaporator has proper quality, namely, the refrigerant entering the second evaporator has proper boiling point and heat exchange capacity, so that corresponding parts can be cooled to proper temperature, and large temperature difference between upstream and downstream parts is avoided. The solution solves the problem of the temperature of downstream parts in the series being lower than the temperature of upstream parts in the series, improves the temperature uniformity of multiple parts cooled in series, and then solves the problems of pressure oscillation, circulation stagnation and circulation reverse flow in the system, greatly improving the temperature uniformity of heat sources connected in series and the reliability of a series-parallel system.

The invention discloses a negative-pressure two-phase liquid cooling system based on film evaporation, which belongs to the technical field of two-phase liquid cooling, and comprises a closed negative-pressure heat dissipation module, a condensation filtering module, a liquid storage and supply module, a monitoring module, a vacuum pump and a controller, and is used for creating a vacuum environment for a whole loop; the output end of the closed negative pressure heat dissipation module is connected with the input end of the condensation filtering module, the output end of the condensation filtering module is connected with the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected with one end of a three-way ball valve, and the other two connectors of the three-way ball valve are connected with the vacuum pump and the input end of the closed negative pressure heat dissipation module respectively. The invention solves the problems that the critical heat flux density is not high enough in the current common cold plate liquid cooling technology; the problem that the reliability of the system is reduced due to the fluctuation of the system pressure and the flow of the cooling working medium caused by the disordered growth of boiling bubbles of the cooling working medium under the high heat flow density can be solved.

The invention relates to the technical field of control cabinets, in particular to an intelligent heat dissipation control system of a control cabinet, which comprises a control cabinet body, a sensor array is arranged on the inner wall of the control cabinet body, the sensor array is composed of temperature sensors, an independent cold air area is arranged at the bottom end of the control cabinet body, and the temperature sensors are arranged in the independent cold air area. A cold air area is arranged in the control cabinet body, a vortex fan is arranged in the cold air area, an air channel of the vortex fan faces the interior of the control cabinet body, a variable guide plate is further arranged at the bottom end of the control cabinet body and arranged at the upper end of the cold air area, and directional control blocks driven by motors are arranged at the two ends of the variable guide plate. The directional control block drives the variable flow guide plate to rotate so as to adjust the orientation angle of the variable flow guide plate, a motor driver is arranged on the motor, and the motor driver and the temperature sensor are connected with a core control unit.

This application provides a heat dissipation apparatus, including an evaporator and a condenser. The evaporator includes a housing and a division plate. The housing has a sealed inner cavity. The division plate divides the inner cavity into a first sub-cavity and a second sub-cavity. A first pipeline communicates with the first sub-cavity. A second pipeline communicates with the second sub-cavity. A heat emitting element is further fastened in the first sub-cavity. The division plate is provided with a flow guiding hole communicating with the first sub-cavity and the second sub-cavity. The flow guiding hole is provided facing the heat emitting element. A cooling working fluid in the condenser is transmitted to the second sub-cavity through the second pipeline. The cooling working fluid flows into the first sub-cavity through the flow guiding hole, and flows back to the condenser through the first pipeline for cooling.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention relates to the technical field of heat dissipation, and discloses a wick, a vapor chamber and electronic equipment. The liquid absorption core can be compatible with the advantages of different capillary structures through lap joint coupling of the different capillary structures, for example, the first capillary structure and the third capillary structure have high capillary force, and therefore the requirement for the liquid return speed is met. The second capillary structure has high porosity so as to meet the requirement for the evaporation speed. Therefore, the liquid absorption core can achieve the design of the optimal capillary force, the minimum liquid flow resistance and the minimum steam flow resistance, so that the performance of the vapor chamber is optimal, and the heat dissipation requirement of electronic equipment is met.

A heat sink for at least one microchip having a heat-conducting heat sink which has a channel structure for a cooling fluid with a feed and a return, wherein the heat sink has, on two opposite outer sides, in each case one cooling plate which is coupled thermally and mechanically to the channel structure. Furthermore, a corresponding cooling arrangement is described.

The invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber comprises an upper cover, a lower cover and a metal foil, the lower cover is connected with the upper cover, a containing cavity is formed between the lower cover and the upper cover, and a cooling medium is contained in the containing cavity; the metal foil is arranged in the containing cavity, a condensation cavity is formed between the metal foil and the upper cover, an evaporation cavity is formed between the metal foil and the lower cover, and a plurality of capillary holes are distributed in the metal foil and communicated with the condensation cavity and the evaporation cavity. According to the vapor chamber, the metal foil is arranged between the upper cover and the lower cover, backflow of a liquefied cold area medium in the condensation cavity into the evaporation cavity is achieved through the capillary holes formed in the metal foil, and the overall thickness of the whole vapor chamber can be set to be smaller due to the arrangement of the metal foil.

Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.

The invention provides a vapor chamber and electronic equipment, and relates to the technical field of electronic equipment. The problems that the heat dissipation performance is poor and the heat dissipation effect of internal elements of electronic equipment is poor due to the fact that the heat resistance of a vapor chamber is large are solved. The vapor chamber comprises the shell, the first wick and at least one second wick, the shell comprises a first cover plate and a second cover plate, and the first cover plate comprises an evaporation area and a condensation area. The first liquid absorption core is arranged in the shell, the first liquid absorption core is attached to the first cover plate, the first liquid absorption core and the second cover plate are arranged in a spaced mode, and the first liquid absorption core covers the evaporation area and the condensation area. The second liquid absorption core is arranged in the shell and covers the evaporation area, and the second liquid absorption core and the first liquid absorption core are arranged in a stacked mode.

A vehicle thermal management system includes: a cabin heating subsystem thermally connected to a cabin and including a cabin coolant circulation path configured to allow a cabin coolant to circulate; a power electronics (PE) cooling subsystem fluidly connected to a PE component and including a PE coolant circulation path configured to allow a PE coolant to circulate; and a battery cooling subsystem fluidly connected to a battery and including a battery coolant circulation path configured to allow a battery coolant to circulate. The vehicle thermal management system further includes a heat pump module thermally and fluidly connected to the cabin heating subsystem, the PE cooling subsystem, and the battery cooling subsystem. The heat pump module includes a refrigerant circulation path configured to allow a refrigerant to circulate.

The present application provides an energy storage device and a photovoltaic energy storage system. The energy storage device comprises a thermal management module, a battery module, a first power unit, a second power unit, and a radiator module. The thermal management module comprises a shell, and a multi-way valve, a first evaporator and a condenser which are arranged in the shell, and the shell comprises a plurality of first interfaces. Two coolant liquid ports of the first evaporator are connected to the multi-way valve, and two coolant liquid ports of the condenser are connected between the multi-way valve and one first interface. The battery module comprises a battery heat exchange plate, the first power unit comprises a first power circuit heat exchange plate, the second power unit comprises a second power circuit heat exchange plate, and the radiator module comprises a radiator. The battery heat exchange plate, the first power circuit heat exchange plate, the second power circuit heat exchange plate, and the radiator are connected to the multi-way valve respectively by means of the corresponding first interfaces. By using the energy storage device, the temperatures of a battery and two power circuit heat exchange plates can be efficiently regulated and controlled.

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.

The present invention provides a vapor chamber structure with fins and a manufacturing process therefor. The vapor chamber structure with fins comprises a supporting plate housing, supporting columns, a liquid injection port, liquid suction cores, and a fin cover plate. The supporting columns are arranged in the supporting plate housing in an array manner; the liquid injection port is formed in the outer side of the supporting plate housing and is communicated with the interior of the supporting plate housing; the liquid suction cores surround the supporting columns and are arranged in the supporting plate housing so as to form vapor cavities used for heat exchange, and a welding layer formed for connecting the supporting plate housing and the fin cover plate is provided between adjacent vapor cavities and located on the walls of the liquid suction cores; and the top end of the fin cover plate comprises a plurality of fins arranged in an array manner, and the fin cover plate covers and is fixed to the top end of the supporting plate housing and performs convection heat exchange with the outside by means of the fins. The present invention can effectively solve the problem of too low convection heat exchange efficiency of the vapor chamber, improving the convection heat dissipation efficiency of the vapor chamber.

The invention discloses a single-phase liquid cooling server heat pipe heat dissipation backboard, and belongs to the technical field of liquid cooling heat dissipation equipment. The single-phase liquid cooling server heat pipe heat dissipation backboard comprises a backboard body, an evaporation end, a condensation end and an intelligent control module, the evaporation end and the condensation end are arranged on the backboard body, and the condensation end is arranged above the evaporation end. The condensation end is composed of a plurality of stages of condensers, and each stage of condenser is a micro-channel heat exchanger. The pumpless heat pipe phase change heat dissipation technology is adopted, the dependence on a CDU can be effectively reduced through the intelligent control module, the gas-liquid dual-mode heat dissipation structure and the graded circulation design, the heat dissipation performance of the data center can be effectively improved through the unique air cooling and liquid cooling dual heat dissipation path design, and the maintenance cost is reduced. The single-phase liquid cooling server heat pipe heat dissipation backboard can adapt to different environmental conditions, can keep an efficient cooling effect under the working condition of a high-temperature environment, and has high adaptability and wide application prospects.

The invention discloses a flexible cable connecting device which is provided with a wiring assembly and a peeling assembly, a movable cutting plate and a fixed cutting plate are matched for use by pressing down the movable cutting plate, so that the outer sheath of a flexible cable sheath or an inner core body is cut, and then the movable cutting plate is pulled up to drive a movable clamping plate to move downwards, so that the outer sheath of the flexible cable sheath or the inner core body is peeled off. The flexible cable sheath or the inner core body sheath can be pressed and fixed through the movable clamping plate and the fixed clamping plate, then the length of the flexible cable is adjusted, when a cable connector plug is damaged, only the wiring assembly needs to be replaced, and when the end of the flexible cable is damaged or the length of the flexible cable needs to be adjusted, the wiring assembly is replaced. According to the flexible cable connecting device, redundant outer skin and sheath can be removed through the peeling assembly, so that the flexible cable is connected with the wiring assembly again, the use cost of the flexible cable is effectively reduced, a user does not need to carry an additional cutting tool, the convenience of reusing the flexible cable and the connecting device is improved, and the flexible cable connecting device is more flexible to use.

A cooling apparatus (100) cools a heat-generating instrument, such as an electronic instrument (2), installed in an installation apparatus. The cooling apparatus (100) includes a refrigerant flow path configured circularly by sequentially connecting a pump (1) that circulates a refrigerant in a liquid state, a cooler (3) that cools the heat-generating instrument with the refrigerant, and a radiator (5) that cools the refrigerant. The cooling apparatus (100) includes a discharge-side heat exchanger (7) provided in a flow path from the pump (1) to the cooler (3) in the refrigerant flow path, a suction-side heat exchanger (8) provided in a flow path from the radiator (5) to the pump (1) in the refrigerant flow path, and a Peltier device (9) that is provided between the discharge-side heat exchanger (7) and the suction-side heat exchanger (8), and transfers heat from the refrigerant flowing through the suction-side heat exchanger (8) to the refrigerant flowing through the discharge-side heat exchanger (7).

A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using anon-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members. For example it can be used to cool a computer chip, a skin of a hypersonic flying object, parabolic solar collector, turbine or engine blade, or any other heat source that requires high heat flux.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention discloses a two-phase immersed fluorine-containing cooling liquid, the fluorine-containing cooling liquid comprises a hexafluoropropylene dipolymer and hydrofluoroolefin, the molecular formula of the hexafluoropropylene dipolymer is C6F12, and the molecular formula of the hydrofluoroolefin is C6H2F10, the fluorine-containing cooling liquid not only has good electrical insulation performance, but also has the advantage of high heat transfer coefficient, and the fluorine-containing cooling liquid is suitable for being used as a cooling liquid for a motor vehicle. The fluorine-containing cooling liquid provided by the invention is continuously subjected to the phase change process from the liquid state to the gas state and then from the gas state to the liquid state in the circulating heat dissipation process, the evaporation latent heat of the cooling liquid is fully utilized, and the heat dissipation requirement of a high-power heating element can be met.