1780results about "Modifications using liquid cooling" patented technology

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.

The invention provides an immersed liquid cooling device, a control method and a system, and relates to the technical field of heat dissipation, the temperature of an inlet and an outlet of a chip-level evaporator at a chip and the highest temperature of the chip are obtained in real time through a preset sensor, and the corresponding relation between the inlet and outlet temperature difference and a preset threshold value is determined; if the outlet temperature difference is smaller than the preset threshold value, the valve opening degree of a pipeline valve corresponding to the outlet temperature difference is controlled to be reduced along with increasing of the outlet temperature difference according to a preset adjusting method, and the valve opening degree is determined in real time; when the valve opening degree reaches the minimum value and the outlet temperature is still smaller than the preset threshold value, the target fan rotating speed is determined through a first preset formula according to the chip highest temperature and the chip heating power; and if the outlet temperature difference is equal to the preset threshold value, the target fan rotating speed is determined according to the chip highest temperature and the chip heating power. According to the invention, the problem that an immersed liquid cooling device, a control method and a system which are controllable in cooling object and cooling effect and wide in application range are lacked in the prior art is solved.

A cooling system including an evaporator, a passive condenser, a heat exchanger, and a pump. The passive condenser is arranged in parallel with the heat exchanger relative to the fluid flow of a primary cooling medium. When a secondary cooling medium is provided to the heat exchanger, at least some of a primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves and supplies the primary cooling medium in the liquid phase to the evaporator. When the secondary cooling medium is not provided to the heat exchanger, the heat exchanger does not supply the primary cooling medium in the liquid phase to the evaporator. The pump is located in a liquid line fluidly connecting the evaporator to the passive condenser and the heat exchanger and pumps the primary cooling medium in the liquid phase to the evaporator.

An aircraft cooling system comprises an evaporator, condenser, an accumulator, and a pump system. The evaporator is configured to cool a set of heat loads in an aircraft using a liquid. The liquid forms a vapor in response to cooling the set of heat loads. The condenser is configured to receive the vapor from the evaporator and cool the vapor in which cooling the vapor forms the liquid. The accumulator is configured to receive the liquid from the condenser and store the liquid. The pump system is configured to pump the liquid stored in the accumulator to the evaporator.

A two-phase cold plate that includes a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body and a vaporization structure housed within the manifold body such that the fluid pathway is disposed over the vaporization structure. The vaporization structure includes a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface. The one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure and the porous surface includes a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.

The invention belongs to the technical field of solid-liquid phase change heat dissipation, and discloses a memory alloy-based phase change expansion buffer structure, which comprises an elastic structure, a supporting structure, a thin wall, a cavity, a flaring, an electronic device, a heat sink, fins, a connecting structure and a phase change material, the thin wall is made of shape memory alloy and separates the internal cavity and the external phase-change material, the internal cavity is communicated with the external environment through the flaring, and in the flying process of the aerospace vehicle, external airflow flows into the flaring to take away heat stored by the phase-change material continuously. Based on the shape memory function of the memory alloy, additional space expansion buffering can be provided for the phase change material when the temperature changes, and stress damage caused by phase change expansion is avoided. The memory alloy thin wall and the elastic supporting structure are combined, the structure is simple, no moving part exists, circulating work in the high-temperature environment and the low-temperature environment can be achieved, local hot spots caused by internal gap movement of the phase change material in the circulating phase change process are reduced, and heat transfer deterioration is avoided.

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and / or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

An immersion cooling system includes a work tank, a buffer tank, and a communication control assembly. The work tank has a work-tank gas-phase region and a work-tank liquid-phase region. The buffer tank has a buffer-tank gas-phase region and a buffer-tank liquid-phase region. The communication control assembly includes a first pipeline, a first pump, a second pipeline, and a second valve. In response to that the first pump is actuated, through the first pipeline, a fluid of the work-tank liquid-phase region is transported to the buffer-tank liquid-phase region, or a fluid of the buffer-tank liquid-phase region is transported to the work-tank liquid-phase region. In response to that the second valve is actuated, through the second pipeline, the work-tank gas-phase region is selectively in communication with the buffer-tank gas-phase region.

The invention discloses a trapezoidal manifold-microchannel cold plate with a micro-pin-fin porous structure, and belongs to the technical field of heat dissipation of electronic equipment. The device comprises an upper cover plate, a manifold layer, a micro-channel layer and a lower cover plate, the manifold layer comprises an inlet, an outlet, an inlet flow equalizing cavity, an outlet flow equalizing cavity, a manifold inlet channel and a manifold outlet channel, and the micro-channel layer comprises an acceleration section, a buffer section and a micro-pin-fin porous structure. Fluid is distributed to the manifold inlet channel through the flow equalizing cavity under the action of pump work, then enters the micro-channel layer through the manifold inlet channel and takes away heat transferred by the lower cover plate in the micro-channel, and the fluid absorbing heat enters the outlet flow equalizing cavity through the manifold outlet channel. And the manifold structure shortens the flow path, so that the flow is in a development stage, and heat exchange is enhanced while the flow resistance is reduced. The acceleration section of the micro-channel layer inhibits phase change backflow, and the acceleration section and the buffer section are formed by the micro-pin-fin porous structure, so that the formation of a vaporization core is accelerated, and the stability of two-phase boiling is improved.

The invention relates to the technical field of electricity meters, and particularly discloses a relay and an electricity meter thereof, comprising a mounting plate: a clamping frame is fixedly mounted on the front surface of the mounting plate, sliding grooves are formed in the upper and lower ends of the clamping frame, sliding plates are slidably connected to the inner sides of the sliding grooves, and heat dissipation fins of a heat conduction aluminum plate are attached to electronic components in the electricity meter. The n-pentane heat-conducting medium in the liquid storage box is heated and vaporized, the heat is absorbed, the heat dissipation capability is improved, the heat pushes the air cylinder to open the heat dissipation window, the air velocity in the electric meter is improved, the heat dissipation is enhanced, the temperature is continuously increased, and the heat-conducting medium is further vaporized, so that the inner current-conducting plate and the outer current-conducting plate are attached; and after the temperature is reduced, the heat-conducting medium is condensed, the air cylinder shrinks to block the heat dissipation window, the heat dissipation fan does not need to be automatically triggered by a temperature sensor, the consumption is reduced, the stability is improved, the cost is reduced, and the protection and moisture-proof performance is improved by the blocking window when the heat dissipation device is not used.

A modular data center and a method of building a modular data center. The modular data center includes a site microgrid including at least one power converter connected to a direct current (DC) bus and a digital power system. The digital power system includes at least one digital power transmitter, a set of transmission lines, and at least one digital power receiver. The modular data center design uses an adiabatic cooling system to cool the modular data center.

A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.

A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.

The invention belongs to the technical field of energy storage cooling, and particularly relates to a cooling circulation system and an equipment cooling method, and the cooling circulation system comprises a liquid inlet system, a heat exchange system and a liquid outlet system. The heat exchange system comprises a plurality of heat exchange units which are connected in parallel; the liquid inlet system is connected with the input end of the heat exchange system, and a pressure detection device, a liquid temperature measurement device I, a pollution discharge degassing tank and a liquid circulation driving unit are connected into the liquid inlet system; the liquid outlet system is connected with the output end of the heat exchange system, and a conductivity detection device, an outlet pressure detection device and a liquid temperature measurement device II are connected into the liquid outlet system. Through dynamic modular adjustment, multi-parameter intelligent control, energy-saving composite heat dissipation and high-reliability design, the problems of low heat dissipation efficiency, high energy consumption, high maintenance cost, poor adaptability and the like in the prior art are effectively solved; and particularly, the method has remarkable advantages in the aspects of precise heat dissipation of high-power-density equipment, stable operation under complex working conditions and full-life-cycle cost control.

The invention provides a light, storage, charging and vehicle heat management system. The thermal management system comprises a plurality of passages, a valve body assembly and a heat dissipation device, wherein the plurality of passages are communicated with the valve body assembly. Wherein the plurality of channels comprise one or more of a liquid cooling channel of the charging host, a liquid cooling channel of the charging gun and a liquid cooling channel of the vehicle-mounted battery. In addition, the channels further comprise a liquid cooling channel of the energy storage equipment and a liquid cooling channel where the heat dissipation device is located. The heat dissipation device is used for cooling the cooling liquid flowing in the liquid cooling channel where the heat dissipation device is located through a compressor or natural cooling. The valve body assembly is used for controlling one or more of the multiple channels to be communicated with the liquid cooling channel where the heat dissipation device is located. According to the thermal management system provided by the invention, thermal management in at least two application scenes is subjected to integrated design, so that the resource utilization rate can be effectively improved while the thermal management requirements of the scenes integrated in the thermal management system are met, and the operation energy efficiency of the thermal management system can be improved.

Disclosed are a vapor chamber, a radiator and an electronic device. The vapor chamber includes: a bottom plate, a top plate, a side plate and a backflow piece. The bottom plate includes a first heat dissipation area and a second heat dissipation area provided at a peripheral side of the first heat dissipation area. The first heat dissipation area is provided with at least a first capillary structure layer on the side near the top plate, and the second heat dissipation area is provided with at least a second capillary structure layer on the side near the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that in the first capillary structure layer.

The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

A vapor chamber includes a body sheet, and a first sheet stacked on the body sheet. The body sheet includes a vapor flow channel portion through which vapor of a working fluid flows and a liquid flow channel portion which is in communication with the vapor flow channel portion and through which liquid of the working fluid flows. The vapor flow channel portion includes a vapor passage extending in a first direction. The first sheet includes a first sheet inner surface facing the body sheet and a first sheet groove provided in the first sheet inner surface. The first sheet groove is provided at a position of overlapping with the vapor passage in a plan view and extends in a direction intersecting with the first direction.

The embodiment of the invention provides electronic equipment and a middle frame assembly. Relates to the technical field of electronics. The electronic equipment can reduce thermal resistance and improve the heat dissipation effect. The middle frame assembly comprises a middle frame and a cover plate, a heat source of the electronic equipment is arranged on one side of the middle frame, and the cover plate is arranged on the side, away from the heat source, of the middle frame; the cover plate is fixedly connected with the middle frame, a cavity is defined by the cover plate and the middle frame, cooling liquid is contained in the cavity, and a capillary structure is arranged on the wall face, used for defining the cavity, of the middle frame. The structure comprising the middle frame, the cover plate, the cooling liquid and the capillary structure can be understood as a vapor chamber structure, and the middle frame not only serves as a bearing part of a heat source, but also directly serves as a cover plate structure of the vapor chamber, so that the thermal resistance between the vapor chamber and the heat source is reduced, and the heat dissipation effect can be improved.

The invention relates to the technical field of electric energy metering boxes, and discloses an electric energy metering box with excellent heat dissipation, which comprises a box body, one side of the box body is provided with an accommodating groove capable of storing electrical elements, the box body is rotatably connected with a box door, and the top of the box body is provided with a storage box. The storage box can be filled with an organic matter phase change material prepared according to a specific formula, the solid-liquid conversion temperature range of the organic matter phase change material is close to the expected highest temperature under the normal operation condition of the metering box, and a micro-channel liquid cooling plate is arranged on the bottom wall of the containing groove; the micro-channel liquid cooling plate can be tightly attached to the electrical element. The metering box has the effect of improving the heat dissipation performance of the metering box.

The invention relates to a heat dissipation optimization method and system for an air conditioner control panel, and belongs to the technical field of energy-saving air conditioner heat dissipation. Comparing the real-time temperature data with a preset temperature threshold value, and determining a heat dissipation mode; when the real-time temperature data is lower than a first threshold value, a first-stage heat dissipation mode is started, a heat dissipation fan is controlled to operate at the lowest rotating speed, and a basic heat conduction path of a cooling fin is activated; when the real-time temperature data is between a first threshold value and a second threshold value, a second-stage heat dissipation mode is started, the rotating speed of a heat dissipation fan is adjusted to be in linear proportion to the real-time temperature data, and an expansion heat conduction path of a cooling fin is started to increase the heat dissipation area; and when the real-time temperature data exceeds a second threshold value, starting a three-stage heat dissipation mode, switching to phase change material auxiliary heat dissipation, controlling a heat dissipation fan to operate at the maximum rotating speed, dynamically adjusting the heat conduction efficiency of a heat dissipation sheet through a pulse width modulation signal, and triggering a temperature alarm signal.

A semiconductor chip package is described. The semiconductor chip package has a substrate. The substrate has side I / Os on the additional surface area of the substrate. The side I / Os are coupled to I / Os of a semiconductor chip within the semiconductor chip package. A cooling assembly has also been described. The cooling assembly has a passageway to guide a cable to connect to a semiconductor chip's side I / Os that are located between a base of a cooling mass and an electronic circuit board that is between a bolster plate and a back plate and that is coupled to second I / Os of the semiconductor chip through a socket that the semiconductor chip's package is plugged into.

An information handling system includes a processor, a memory device, and a PMU to provide power to the processor and memory device. The information handling system further includes an emitter-assisted heatpipe including an enclosed hollow chamber to house a working fluid capable of being vaporized upon application of heat at an evaporator end of the heatpipe, an ion emitter placed at the evaporator end of the heatpipe where the working fluid is vaporized upon application of heat to create a vapor within the enclosed hollow chamber of the heatpipe, the ion emitter to create ions within the vapor, an ion collector placed at a condenser end of the emitter-assisted heatpipe where the vapor condenses into a liquid, and an ionic driving circuit operatively coupled to the ion emitter, the generated ions to be attracted to the ion collector creating an ionic airflow of the vapor within the emitter-assisted heatpipe.

A thermosiphon is provided for a computing system. The thermosiphon includes an evaporating portion and a pool portion. The evaporating portion is operable to be in thermal communication with a computing component of the computing system. The evaporating portion is operable to retain an evaporating volume of fluid to lower a temperature of the computing component. The pool portion is in fluid communication with the evaporating portion. The pool portion is operable to receive excess fluid of the fluid from the evaporating portion when a volume of the fluid in the evaporating portion is greater than the evaporating volume.

The present application provides a two-phase cold plate liquid cooling system and a control method. According to the present application, for parts which are cooled in series by the two-phase cold plate liquid cooling system, after a first evaporator cools a previous part, on the basis of the heat transfer requirements of a part cooled by a second evaporator, the quality of a refrigerant output from the first evaporator is adjusted to prevent the quality of the refrigerant from being too low or too high, and thus the refrigerant entering the second evaporator has proper quality, namely, the refrigerant entering the second evaporator has proper boiling point and heat exchange capacity, so that corresponding parts can be cooled to proper temperature, and large temperature difference between upstream and downstream parts is avoided. The solution solves the problem of the temperature of downstream parts in the series being lower than the temperature of upstream parts in the series, improves the temperature uniformity of multiple parts cooled in series, and then solves the problems of pressure oscillation, circulation stagnation and circulation reverse flow in the system, greatly improving the temperature uniformity of heat sources connected in series and the reliability of a series-parallel system.

The invention discloses a negative-pressure two-phase liquid cooling system based on film evaporation, which belongs to the technical field of two-phase liquid cooling, and comprises a closed negative-pressure heat dissipation module, a condensation filtering module, a liquid storage and supply module, a monitoring module, a vacuum pump and a controller, and is used for creating a vacuum environment for a whole loop; the output end of the closed negative pressure heat dissipation module is connected with the input end of the condensation filtering module, the output end of the condensation filtering module is connected with the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected with one end of a three-way ball valve, and the other two connectors of the three-way ball valve are connected with the vacuum pump and the input end of the closed negative pressure heat dissipation module respectively. The invention solves the problems that the critical heat flux density is not high enough in the current common cold plate liquid cooling technology; the problem that the reliability of the system is reduced due to the fluctuation of the system pressure and the flow of the cooling working medium caused by the disordered growth of boiling bubbles of the cooling working medium under the high heat flow density can be solved.

A liquid cooling vapor chamber heat dissipation module includes a liquid cooling cover, a metallic top cover, and a metallic bottom cover. The liquid cooling cover includes a top portion, a sidewall and an accommodating space. The sidewall includes a liquid inlet and a liquid outlet. The outer heat-dissipating surface of the top cover has a plurality of columnar heat-dissipating structures. The inner evaporation surface of the metallic bottom cover has parallel bottom grooves and protrusive supporting structures disposed between the bottom grooves. An integrated vapor chamber is formed by engaging the metallic top and bottom covers. The liquid cooling cover engages with the outer heat-dissipating surface of the metallic top cover with the columnar heat-dissipating structures accommodating within the accommodating space, which allows cooling liquid to enter the accommodating space from the liquid inlet and flow through the columnar heat-dissipating structures, and flow out from the liquid outlet.

The invention relates to the technical field of control cabinets, in particular to an intelligent heat dissipation control system of a control cabinet, which comprises a control cabinet body, a sensor array is arranged on the inner wall of the control cabinet body, the sensor array is composed of temperature sensors, an independent cold air area is arranged at the bottom end of the control cabinet body, and the temperature sensors are arranged in the independent cold air area. A cold air area is arranged in the control cabinet body, a vortex fan is arranged in the cold air area, an air channel of the vortex fan faces the interior of the control cabinet body, a variable guide plate is further arranged at the bottom end of the control cabinet body and arranged at the upper end of the cold air area, and directional control blocks driven by motors are arranged at the two ends of the variable guide plate. The directional control block drives the variable flow guide plate to rotate so as to adjust the orientation angle of the variable flow guide plate, a motor driver is arranged on the motor, and the motor driver and the temperature sensor are connected with a core control unit.

The invention discloses an integrated liquid-cooled cabinet capable of circularly dissipating heat, and relates to the technical field of liquid-cooled cabinets, the integrated liquid-cooled cabinet comprises a machine body, a partition plate is fixedly connected to the inner wall of the middle of the machine body, a liquid-cooled cavity is formed in one side of the partition plate and on the same side with the machine body, and a side door is arranged on the outer side wall, close to the partition plate, of the machine body; the integrated liquid cooling cabinet capable of circulating heat dissipation comprises a circulating pressurization mechanism and an auxiliary liquid discharge mechanism, the circulating pressurization mechanism is arranged, an eccentric wheel is adopted to drive a telescopic rod and a disc to do reciprocating lifting motion, the flowing speed of heat transfer oil in a liquid cooling cavity can be slowed down, heat transfer efficiency is improved, and heat dissipation efficiency is improved. The flow speed of the heat transfer oil is adjusted in real time in cooperation with the variable-speed motor, heat transfer is more effective, the mode that a water pump is used for increasing high water pressure firstly and then a pressure reducing valve is used for reducing pressure is avoided, energy loss is reduced, and the heat dissipation effect is improved.