202 results about "Thermosiphon" patented technology

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and is flexible to vary the volume of the upper portion for modulating the flow of coolant fluid through the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to and below the axis (A) from the housing and a plurality of second condensing tubes extend axially and upwardly in the opposite direction at the same predetermined angle to and above the axis (A) from the housing. The volume of refrigerant in the housing is greater than the volume of the second condensing tubes and the volume of the boiling chamber.

A thermosiphon cooling assembly cools an electronic device with a first refrigerant disposed in the lower boiling chamber of a housing for liquid-to-vapor transformation and a second refrigerant disposed in an upper evaporating chamber of a housing for liquid-to-vapor transformation. The partition separating the lower boiling chamber of the housing from the upper evaporating chamber of the housing creates a series of vapor chambers within the lower boiling portion for condensing vapor boiled off the first refrigerant. The upper evaporating chamber contains a series of refrigerant pockets interleaved vertically with the vapor chambers to increase the surface area for heat transfer between the refrigerant vapor and the second refrigerant for absorbing heat by the second refrigerant for liquid-to-vapor transformation.

The invention discloses a microchannel cooling device, adapted for dissipating heat generated from an electronic device, which comprises: a heat sink, being arranged on the electronic device and having an inlet, an outlet and a plurality of microchannels embedded thereon for receiving a ferrofluid to flow therein; a condenser, having an outlet connected to the inlet of the heat sink and an inlet connected to the outlet of the heat sink; and a magnetocaloric pump, for providing a magnetic field to the ferrofluid flowing in the heat sink; wherein the magnetocaloric effect (MCE) caused by the working of the magnetic field on the ferrofluid flowing in the heat sink is used for driving the ferrofluid to flow through the plural microchannels of the heat sink while absorbing heat therefrom, and thereafter, the heated ferrofluid flow into the condenser for discharging heat and then the cool-down ferrofluid is guided back to the heat sink to complete a circulation. The invention make use of the high heat transfer performance of the plural microchannels, the nature circulation caused by the loop thermosyphone and the driving of the magnetocaloric pump so as to constitute a cooling device with no mechanically moving elements.

A loop thermosyphon includes a closed circuit configured of an evaporator, a condenser, a feed pope and a return pope, and the evaporator is an assembly including a header pipe associated with the feed pope, a header pipe associated with the return pipe, and a plurality of aligned pipes. Each of the aligned popes is a serpentine tube defined by a linear portion forming a plurality of stages in vertically parallel layers, and a curved portion connecting such linear portions together. The condenser is entirely inclined relative to a bottom surface of a casing mounting the loop thermosyphon such that the serpentine tube's linear portions have a bottommost linear portion inclined in a direction allowing the bottommost linear portion to be closer to the bottom surface of the casing as the bottommost linear portion approaches the header pipe associated with the return pipe.

The invention provides a heat exchanger assembly for cooling an electronic device wherein the upper portion of the housing includes a plurality of condensing tubes extending upwardly from the lower portion of the housing. A plurality of air heat transfer fins zigzag transversely to a primary axis (A) between adjacent ones of the condensing tubes for dissipating heat from vapor boiled off of the refrigerant. At least two next adjacent condensing tubes of the plurality diverge upwardly from the bottom ends toward the top distal ends thereof. Accordingly, the space containing the air heat transfer fins between the two next adjacent condensing tubes is greater at the top distal ends than at the bottom ends of the condensing tubes. The condensing tubes can either have a constant cross-section with diverging tube axes or can have a decreasing cross-section from bottom to top with parallel tube axes.

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

The invention provides systems and methods for cooling and/or heating a structure. Generally, a system for heating or cooling a structure can include at least one thermosiphon in thermal communication with a thermal storage material such as a volume of earth. The thermosiphon can be partially filled with a heat transfer fluid and a heat exchanger operatively connected to the thermosiphon which is in thermal communication with the structure. Thermal energy can be transferred between the thermal storage material and the structure in either a passive or assisted mode, depending on whether the system is charging or in use.

A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

The invention relates to a cooling system and an electronic apparatus using the same, and particularly aims to use a thermosiphon as the cooling system and derives an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface for different coolants. In a cooling system using a thermosiphon according to the invention, an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface of a heat receiving jacket that forms the cooling system is identified based on a critical radius of a steam bubble produced in an overheated liquid and the diameter of an air bubble departing from the heat transfer surface for a variety of coolants.

A loop-type thermosiphon capable of stable operation regardless of fluctuation of heat load and a Stirling refrigerator using the same are provided. The loop-type thermosiphon transferring heat from a high-temperature heat source using a working fluid includes a evaporator having a heat absorption portion and evaporating the working fluid by depriving the high-temperature heat source of heat through the heat absorption portion, a condenser located above the high-temperature heat source and condensing the working fluid that has evaporated in the evaporator, and a pipe connecting the evaporator and the condenser so as to form a loop. In the loop-type thermosiphon, the working fluid that has passed through the condenser is brought in contact with the heat absorption portion before it is pooled in a liquid pool for the working fluid in the evaporator, so as to exchange heat with the same

An electric machine includes a housing for accommodating a rotatably supported rotor and a stationary stator, and a cooling device for cooling heat-generating components of the rotor and the stator. The cooling device comprises a closed-flow system having an evaporator disposed in the housing, a condenser disposed outside the housing at a geodetically higher location, and a closed tube assembly, which connects the condenser and the evaporator, for circulating a coolant using a thermosiphon effect as a result of a difference in density between vapor and liquid portions of the coolant. The closed-flow system contains a liquid-vapor mixture of the coolant in a saturated state and includes a first tube for conducting coolant to the evaporator and a second tube for conducting coolant away from the evaporator. The first tube has hereby a cross section which is smaller than a cross section of the second tube.