An
optical module packaging structure comprises an upper shell and a lower shell, the upper shell and the lower shell form a
closed cavity, a plurality of devices are packaged in the cavity, the devices comprise a circuit board, an optical emission
assembly, an optical-
electricity conversion
assembly and an
optical fiber constraint clamp, the circuit board is arranged on the lower shell, the optical emission
assembly, the optical-
electricity conversion assembly and the
optical fiber constraint clamp are all arranged on the circuit board; there is a space for
optical fiber disc
fiber between the optical emission assembly and the optical-
electricity conversion assembly, the optical
fiber constraint clamp is arranged in the space, the optical emission assembly comprises two
light source assemblies, an optical combining assembly and an optical splitting assembly, the optical-electricity conversion assembly comprises two optical modulators, a
heat sink and a
signal processor, the two optical modulators and the
signal processor are sequentially arranged at the far ends of the two
light source assemblies. An
optical module packaging method is also proposed. The present application optimizes the
layout of the
light source assembly and the
optical modulator through independent light sources, and optimizes the
layout of the fusion
fiber joint and the optical fiber after fusion, reasonably arranges the positions of the devices and the optical fiber, and realizes the
optical module for long-distance and high-speed transmission.