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Temperature sensing device and cooking utensil

A technology for cooking utensils and temperature sensing, which is applied to the structure of cooking utensils, special materials for cooking utensils, and utensils with integral electric heating devices, etc., and can solve problems such as inability to accurately reflect the surface temperature of an inner pot.

Pending Publication Date: 2018-03-20
ZHEJIANG SUPOR ELECTRICAL APPLIANCES MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the inner pot with double-layer pot wall, the method of using temperature control devices in the lower half of the inner pot is generally used to realize the cooking of food. Due to the influence of the heated position, this method cannot accurately reflect the temperature of the inner pot. surface temperature

Method used

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  • Temperature sensing device and cooking utensil
  • Temperature sensing device and cooking utensil
  • Temperature sensing device and cooking utensil

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Experimental program
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Effect test

no. 1 approach

[0048] Below, refer to Figure 1 to Figure 3 A first embodiment of the present invention will be described. It can be understood that the cooking appliance 100 according to the present invention can be an electric rice cooker, an electric pressure cooker or other cooking appliances, and the cooking appliance 100 according to the present invention can also have various functions such as porridge cooking in addition to the function of cooking rice.

[0049] The cooking appliance 100 of this embodiment includes a pot body 110 and a cover body 120 . Such as figure 1As shown, the pot body 110 is basically in the shape of a rectangular parallelepiped with rounded corners, and has a cylindrical inner pot cavity. The inner pot 111 can be freely put into the inner pot cavity or taken out from the inner pot cavity to facilitate the inner pot. 111 cleaning. The inner pot 111 is generally made of metal material and has a circular opening on the upper surface, and is used to contain mat...

no. 2 approach

[0061] Refer to the following Figure 4 A second embodiment of the present invention will be described. For the purpose of simplification, descriptions of the same parts as those of the first embodiment are omitted in describing the second embodiment.

[0062] The inner pot of this embodiment includes an outer pot wall 2111, an inner pot wall 2112, and a vacuum closed cavity 2113 filled with a heat transfer medium. The inner pot utilizes molecular collisions of the heat transfer medium in the vacuum closed cavity 2113, Friction or phase change can transfer the heat of the heat receiving part to every place in the closed cavity 2113, so as to realize the temperature uniformity of the surface temperature of the inner pot.

[0063] The non-heating part of the outer pot wall 2111 has a through hole, and the through hole is provided with a connecting piece 290 (as an embodiment of the first connecting piece), and the connecting piece 290 has a hole communicating with the through h...

no. 3 approach

[0066] Refer to the following Figure 5 with Image 6 A third embodiment of the present invention will be described. For the purpose of simplification, description of the same parts as those of the first embodiment is omitted when describing the third embodiment.

[0067] The non-heated portion of the side wall of the inner pot of the cooking utensil in this embodiment includes a stepped sandwich structure, that is, the lower part of the side wall and the bottom wall of the inner pot between the outer pot wall 3111 and the inner pot wall 3112 The gap is larger, and the gap between the outer layer pot wall 3111 and the inner layer pot wall 3112 on the side wall top of the inner pot is smaller. The upper outer layer pot wall 3111 is provided with a through hole, and the temperature sensing element 330 is wrapped by the shell to sense the temperature of the heat transfer medium through the through hole, from Image 6 It can be seen that the shell is flush with the inner surfac...

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Abstract

The invention provides a temperature sensing device and a cooking utensil. The temperature sensing device is used for the cooking utensil with an inner pot. The inner pot is provided with an outer-layer pot wall and an inner-layer pot wall, a closed cavity is formed between the outer-layer pot wall and the inner-layer pot wall, and a medium capable of transferring heat is arranged in the closed cavity. The temperature sensing device comprises a temperature sensing element which is used for sensing the temperature of the medium. According to the temperature sensing device and the cooking utensil, it can be ensured that the temperature on the surface of the inner pot is consistently and stably sampled by the temperature sensing element.

Description

technical field [0001] The present invention generally relates to the field of electric heating appliances, and more particularly relates to a temperature sensing device and a cooking appliance. Background technique [0002] When using cooking utensils, the temperature of the inner pot is too high may be dangerous, so it is necessary to measure the temperature of the inner pot accurately. For the inner pot with double-layer pot wall, the method of using temperature control devices in the lower half of the inner pot is generally used to realize the cooking of food. Due to the influence of the heated position, this method cannot accurately reflect the temperature of the inner pot. surface temperature. [0003] Therefore, there is a need to provide a temperature sensing device and cooking appliance to at least partly solve the above-mentioned problems. Contents of the invention [0004] To at least partly solve the above technical problems, according to one aspect of the pr...

Claims

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Application Information

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IPC IPC(8): A47J36/00A47J27/00A47J36/02
CPCA47J27/002A47J27/004A47J36/00A47J36/02
Inventor 吕华
Owner ZHEJIANG SUPOR ELECTRICAL APPLIANCES MFG CO LTD
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