64results about "3D rigid printed circuits" patented technology

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

A printed circuit board which can be used as an identical part embodied in different exterior lighting devices of a motor vehicle. The printed circuit board includes a first connecting interface and a second connecting interface, each for accommodating a plug for establishing an electrical connection between the printed circuit board and at least one component that is otherwise separate from the printed circuit board, this connection being used for the power supply and / or control of at least one component that is arrangeable on the printed circuit board, and the second connecting interface of the printed circuit board being arranged on the printed circuit board in a manner offset both translationally and rotationally relative to the first connecting interface of the printed circuit board.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

The invention provides a component carrier and a method of manufacturing the same. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), where the at least one electrically insulating layer structure (106) has a first main surface (108) and an opposite second main surface (110), and at least one cavity (116), the at least one cavity (116) is formed in a first main surface (108) of the at least one electrically insulating layer structure (106) and is delimited by a bottom wall (112) and a side wall (114), a surface of the bottom wall (112) and a surface of the side wall (114) of the at least one cavity (116) have a roughness Ra different from a roughness of the first main surface (108) and / or a roughness of the second main surface (110) of the at least one electrically insulating layer structure (106).

An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.

A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

Disclosed are a printed circuit board and an electronic device comprising same. An electronic device according to various embodiments of the present invention comprises a substrate part on which at least one electrical component is disposed, wherein the substrate part may comprise: a printed circuit board comprising a metal wiring layer and a polymer base layer laminated on at least one side of the metal wiring layer and hot-formed to have a curved shape; and a bonding layer that comprises a solder for electrically bonding the electrical component to at least a portion of the metal wiring layer, and secures the electrical component on the substrate part.

A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

A circuit board structure includes a flexible core board, a first circuit layer, a first solder mask layer, a first protective layer, a rigid plate and a plurality of electrically-conductive members. The flexible core board includes a first surface and a second surface. The first circuit layer is formed on the first surface, and has a plurality of electrical connection portions. The first solder mask layer is coated on the first circuit layer and the first surface. The first solder mask layer has a plurality of opening portions aligned with the electrical connection portions. The first protective layer is disposed on the first solder resist layer and has a flat surface. The rigid plate is disposed on the second surface and corresponds to the opening portions. The electrically-conductive members are respectively formed on the electrical connection portion and exposed from the opening portion.

The present disclosure relates to radio frequency (RF) unit (100) formed from a ceramic material into a structure with a cavity (101), comprising an outer surface (102), a mounting surface (103) for soldering with a print circuit board (PCB) (200) by a surface mount technology process and an inner surface (104) that delimits the cavity (101), wherein the outer surface (102) is metalized to provide electromagnetic shielding for the RF unit, and the mounting surface (103) is at least partially electrically connected with the outer surface (102) to form a grounding surface therewith; wherein at least one device is arranged on the inner surface (104), the device using a metalized surface line as a transmission line for signal transmission. The present disclosure further relates to a radio structure comprising a PCB and one or more RF units (100) of the above discussed mounted on the PCB. With the RF unit of the present disclosure, a high integration level can be achieved by integrating as many devices as possible in the RF unit and the structural size of the radio system can be reduced at a lower cost and with a greatly reduced loss of the system.

Various embodiments may provide an additive manufacturing system for forming a composite structure. The system may include a first pool containing an activating solution for forming a first printed portion of the workpiece, the activating solution including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The system may also include a second pool containing an additional photocurable resin for forming a second printed portion of the workpiece, and a light source configured to provide light. The system may further include a mask configured to be positioned such that the light provided by the light source is irradiated through the mask onto the workpiece, and a third pool containing a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed may be configured to form a metal layer by an electroless deposition process, thereby forming a composite structure.

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a planar shape into a three-dimensional shape and which can be populated with components, to a method for producing an electronic assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronic assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d), in each case by means of two or more flexible connecting bridges (7) which are spaced apart from one another along a fold line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). A first and a second outer region (3a, 3d) comprise mutually complementary components (19, 21) of a snap connection (23) which, by the conversion of the carrier (1) from the planar shape into the three-dimensional shape, can be connected to each other in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape.

Method for manufacturing an electromechanical structure, comprising: producing (106) conductors and / or graphics on a substantially flat film, attaching (108) electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming (110) the said film housing the electronic elements into a substantially three-dimensional shape, using (112) the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement (500) for carrying out said method is also presented.

A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, an electronic component, and an encapsulant. The substrate has a lower surface and an upper surface opposite to the lower surface. The electronic component is disposed on the upper surface of the substrate. The encapsulant is disposed on the upper surface of the substrate. The encapsulant includes a first portion penetrating the substrate at a central region of the substrate and a second portion penetrating the substrate at a peripheral region of the substrate.

An in-mold electronic (IME) device includes a curved substrate, a first conductive layer, a dielectric layer, a gap compensation layer, and a second conductive layer. The curved substrate has a first surface. The first conductive layer is disposed on the first surface. The dielectric layer is disposed on the first conductive layer and has a first thickness. The gap compensation layer is disposed on the first surface and connected to the dielectric layer. The gap compensation layer has a second thickness. The second conductive layer is disposed on the gap compensation layer and electrically connected to the gap compensation layer. A curvature radius of the curved substrate is c, a ratio of the second thickness to the first thickness is r, and c and r satisfy a relationship: r=(1.5−0.02c)±15%.

This invention provides a dual-curing method for forming a solid polymeric structure. A one-terminated terminal imide prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine to form a curable resin composition. In a first step, this resin composition is irradiated under conditions that effectively polymerize the at least one olefinic monomer, thereby forming a scaffold composed of the prepolymer and a polyolefin, wherein the diamine is trapped within the scaffold. Then, the irradiated composition is heat-treated at a temperature that effectively induces transimidization of the prepolymer and the diamine, thereby releasing the end groups of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising a one-terminated terminal imide prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, and a related method of use are also provided.

The invention provides a semiconductor device. The semiconductor device comprises a substrate, an electronic component and a packaging material. The substrate is provided with a lower surface and an upper surface opposite to the lower surface. The electronic component is disposed on the upper surface of the substrate. The packaging material is disposed on the upper surface of the substrate. The encapsulation material includes a first portion penetrating the substrate in a central region of the substrate and a second portion penetrating the substrate in a peripheral region of the substrate.

An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board.

Manufacturing method of an electronic device comprising a non-flat laminar item (10) with a non-flat electronic circuit (20) thereon, by designing a flat electronic circuit (20') to become the non-flat electronic circuit (20) after the forming process, defining, for each surfacemounted component (22), an optimal adhesive distribution by determining first loads induced on a bond between the surface-mounted component and the flat laminar item; determining second loads induced on parts of the conductive track placed around a local stiffened region of the flat laminar item where the at least one adhesive is to be applied, the optimal adhesive distribution being selected to obtain a bond with a first breakage threshold above the first loads and to produce second loads below a predefined second breakage threshold of the conductive tracks.

The invention relates to the technical field of camera modules, in particular to a production method of a 3D circuit formed by bending after VCM base plane mounting, which comprises the following steps: S1, according to 3D structure precision calculation, generating a 2D expansion drawing with bending compensation and stress optimization, and according to a 2D plane drawing, designing a rigid-flexible composite base material and an automatic jig; s2, according to the designed FPC surface plate material with the reinforcing plate, the whole process of solder paste printing, solder paste thickness detection, micro component mounting and reflow soldering is completed at a time on an SMT chip mounter production line; and S3, precisely bending the produced planar circuit product into a 3D structure through automatic bending equipment according to a precision jig manufactured according to the drawing in combination with visual positioning and servo control technologies, and executing mechanical self-locking fixing operation. According to the invention, the difficulty of mounting the surface and the side wall of the three-dimensional structure in a three-dimensional space is effectively reduced, and efficient assembly line work is realized.

A housing for a luminaire or an operating device for the luminaire, wherein the housing is configured to accommodate at least one electronic component and / or a light source, and comprising a conductive housing component (2). The housing includes at least one line (1, 1′, 1″, 1″′, 1″″) for transmitting electric high frequency signals or for transmitting and / or receiving radio waves. The transmission line is formed by arranging a dielectric layer (4, 4a, 4b, 9) and a conductor (3, 3 . . . 3c, 7) on the housing component (2) such that the conductive housing component (2) serves as a reference plane, and the conductive housing component (2) and the conductor (3, 3 . . . 3c, 7) sandwich the dielectric layer (4, 4a, 4b, 9).

In one embodiment, a flexible circuit board includes a plurality of facet locations, each facet location corresponding to a particular rigid sensor facet of a plurality of rigid sensor facets and a particular rigid display facet of a plurality of rigid display facets. The flexible circuit board also includes a plurality of wiring traces that connect the plurality of facet locations in series. The facet locations are arranged in a plurality of facet columns. When the flexible circuit board is flat, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps. When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby allowing the plurality of rigid sensor facets to form a continuous sensing surface and the plurality of rigid display facets to form a continuous display surface.

A method of manufacturing an electronic device, the electronic device comprising a non-planar layered article (10) having a non-planar electronic circuit (20), by designing a planar electronic circuit (20 ') to become a non-planar electronic circuit (20) after a forming process, an optimal adhesive distribution is defined for each surface mount element (22) by: determining a first load borne on the bonding point between the surface mount element and the planar layered article; determining a second load borne by the conductive line portion around a locally hardened area of the planar layered article to which at least one adhesive is to be applied; the optimal adhesive distribution is selected such that a bonding point having a first fracture threshold higher than the first load is obtained, and a second load lower than a predetermined second fracture threshold of the conductive line is generated.

To provide a circuit board and a method of manufacturing the circuit board capable of significantly reducing manufacturing costs and management costs.SOLUTION: The circuit substrate includes a soft base material core substrate 10a, a first circuit layer, a first solder resist layer, a first protection layer, a rigid substrate, and a plurality of conductors. The soft base core substrate is flexible and has a first surface 10b and a second surface 10c. A first circuit layer having a plurality of electrical connections is disposed on the first surface 10b. The first solder resist layer is coated on the first circuit layer and the first surface 10b, wherein the first solder resist layer has a plurality of cavities, and the cavities are aligned with the electrical connecting portions. The first protective layer is disposed on the first solder resist layer, and a surface of the first protective layer is a flat surface. The rigid substrate is disposed on the first solder resist layer and corresponds to the cavity. A plurality of conductors are formed in the electrical connection portion and are exposed from the hollow portion.SELECTED DRAWING: Figure 1

A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.