103results about "3D rigid printed circuits" patented technology

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

Provided is a multilayer substrate manufacturing technology that enables manufacturing a multilayer substrate at low cost. First, a cover sheet (2) is superposed on a base material sheet (1) having the same shape and size as a shape and a size of the cover sheet. Wiring (11) is provided on one surface of the base material sheet (1). A hole (21) is made in the cover sheet (2) at a position through which an electronic component is to be mounted to the base material sheet (1) later. The superposed base material sheet (1) and cover sheet (2) are then folded so that the hole (21) is exposed to an outside. The electronic component is inserted into the hole (21), and the electronic component is mounted in continuity with the wiring (11) of the base material sheet (1).

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

A printed circuit board which can be used as an identical part embodied in different exterior lighting devices of a motor vehicle. The printed circuit board includes a first connecting interface and a second connecting interface, each for accommodating a plug for establishing an electrical connection between the printed circuit board and at least one component that is otherwise separate from the printed circuit board, this connection being used for the power supply and / or control of at least one component that is arrangeable on the printed circuit board, and the second connecting interface of the printed circuit board being arranged on the printed circuit board in a manner offset both translationally and rotationally relative to the first connecting interface of the printed circuit board.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

The invention provides a component carrier and a method of manufacturing the same. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), where the at least one electrically insulating layer structure (106) has a first main surface (108) and an opposite second main surface (110), and at least one cavity (116), the at least one cavity (116) is formed in a first main surface (108) of the at least one electrically insulating layer structure (106) and is delimited by a bottom wall (112) and a side wall (114), a surface of the bottom wall (112) and a surface of the side wall (114) of the at least one cavity (116) have a roughness Ra different from a roughness of the first main surface (108) and / or a roughness of the second main surface (110) of the at least one electrically insulating layer structure (106).

An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.

A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

To provide a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device including the resin multilayer substrate.SOLUTION: A resin multilayer substrate 101A includes a resin laminate 10. The resin laminate 10 has a first region A1, a second region A2, and a third region A3, as layer-direction regions. The resin multilayer substrate 101A includes a first resin material R1 affixed from the surface of the first region A1 to the third region A3 and a second resin material R2 formed within the third region A3. The second resin material R2 covers a portion of the first resin material R1, and covers the end portion of the first resin material R1 positioned in the third region A3. Assuming the Young's modulus of the first resin material R1 is expressed as E1 and the Young's modulus of the second resin material is expressed as E2, the relationship of E1<E2 is satisfied. Assuming the adhesion strength between the first resin material R1 and the resin laminate 10 is expressed as AD1, and the adhesion strength between the second resin material R2 and the resin laminate 10 is expressed as AD2, the relationship of AD2≥AD1 is satisfied.SELECTED DRAWING: Figure 1

Disclosed are a printed circuit board and an electronic device comprising same. An electronic device according to various embodiments of the present invention comprises a substrate part on which at least one electrical component is disposed, wherein the substrate part may comprise: a printed circuit board comprising a metal wiring layer and a polymer base layer laminated on at least one side of the metal wiring layer and hot-formed to have a curved shape; and a bonding layer that comprises a solder for electrically bonding the electrical component to at least a portion of the metal wiring layer, and secures the electrical component on the substrate part.

[Problem] The purpose of the present invention is to provide an embedded trace substrate that is less likely to experience reductions in conductivity and a production method for an embedded trace substrate with which it is possible to easily produce such an embedded trace substrate. An object of the present invention is also to provide an embedded trace substrate-integrated molded article using an embedded trace substrate that is less likely to experience reductions in conductivity. [Solution] An embedded trace substrate according to the present invention includes: a film; a circuit that includes a thin metal wire and that has a functional portion having an arbitrary pattern, a first wiring portion led out from one end of both ends of the functional portion, a second wiring portion led out from another end of both ends of the functional portion, and folded-back portions extending in a direction away from the functional portion from the first wiring portion and the second wiring portion, respectively, and folded back so as to be parallel to the film, the functional portion, the first wiring portion, and the second wiring portion being embedded in the film; and two electrode pads respectively fixed on the first wiring portion and the second wiring portion and having upper surfaces to which the folded-back portions are electrically connected.

A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

A circuit board structure includes a flexible core board, a first circuit layer, a first solder mask layer, a first protective layer, a rigid plate and a plurality of electrically-conductive members. The flexible core board includes a first surface and a second surface. The first circuit layer is formed on the first surface, and has a plurality of electrical connection portions. The first solder mask layer is coated on the first circuit layer and the first surface. The first solder mask layer has a plurality of opening portions aligned with the electrical connection portions. The first protective layer is disposed on the first solder resist layer and has a flat surface. The rigid plate is disposed on the second surface and corresponds to the opening portions. The electrically-conductive members are respectively formed on the electrical connection portion and exposed from the opening portion.

The invention relates to an interconnection device (1) intended to interconnect at least two circuit boards (50), the device comprising a body (10) made of at least one polymer material and a plurality of electrically conductive tracks (20) extending from a first face of the body (10) to a second face of the body (10). According to the invention, the interconnection device (1) comprises a first connector (41) fixedly mounted on the first face of the body (10) and a second connector (42) fixedly mounted on the second face of the body (10), wherein the first connector (41) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a first circuit board (51), and the second connector (42) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a second circuit board (52). The invention also relates to a method for manufacturing such an interconnection device (1). The invention also relates to an associated aircraft.

The present disclosure relates to radio frequency (RF) unit (100) formed from a ceramic material into a structure with a cavity (101), comprising an outer surface (102), a mounting surface (103) for soldering with a print circuit board (PCB) (200) by a surface mount technology process and an inner surface (104) that delimits the cavity (101), wherein the outer surface (102) is metalized to provide electromagnetic shielding for the RF unit, and the mounting surface (103) is at least partially electrically connected with the outer surface (102) to form a grounding surface therewith; wherein at least one device is arranged on the inner surface (104), the device using a metalized surface line as a transmission line for signal transmission. The present disclosure further relates to a radio structure comprising a PCB and one or more RF units (100) of the above discussed mounted on the PCB. With the RF unit of the present disclosure, a high integration level can be achieved by integrating as many devices as possible in the RF unit and the structural size of the radio system can be reduced at a lower cost and with a greatly reduced loss of the system.

Various embodiments may provide an additive manufacturing system for forming a composite structure. The system may include a first pool containing an activating solution for forming a first printed portion of the workpiece, the activating solution including a solvent, an activating seed soluble in the solvent, and a photocurable resin. The system may also include a second pool containing an additional photocurable resin for forming a second printed portion of the workpiece, and a light source configured to provide light. The system may further include a mask configured to be positioned such that the light provided by the light source is irradiated through the mask onto the workpiece, and a third pool containing a cleaning solution or mixture for cleaning the workpiece. The first printed portion including the activating seed may be configured to form a metal layer by an electroless deposition process, thereby forming a composite structure.

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a planar shape into a three-dimensional shape and which can be populated with components, to a method for producing an electronic assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronic assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d), in each case by means of two or more flexible connecting bridges (7) which are spaced apart from one another along a fold line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). A first and a second outer region (3a, 3d) comprise mutually complementary components (19, 21) of a snap connection (23) which, by the conversion of the carrier (1) from the planar shape into the three-dimensional shape, can be connected to each other in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape.

The present invention provides multilayer substrate manufacturing technology that makes it possible to manufacture a multilayer substrate at low cost.　First, a cover sheet (2) is superimposed on base material sheet (1) that is identical in shape and size. Wiring (11) is provided to one surface of the base material sheet (1). A hole (21) is opened at a position as which an electronic component will be attached to the base material sheet (1) after the cover sheet (2). Thereafter, the base material sheet (1) and the cover sheet (2) that have been superimposed are folded such that the hole (21) is exposed to the outside. The electronic component is inserted into the hole (21) and is attached in a state of electrical connection with the wiring (11) of the base material sheet (1).

Connection structure (16) configured to connect a printed circuit board (12) in which a through hole (12H1) is formed to an installation object (14) located at a distance from a first surface (12A) of the printed circuit board, comprising a support column element (18) extending in one direction from one end (E1) to an opposite end (E2), wherein one end is attached to the installation object and a threaded hole (18SH) is formed in the opposite end, wherein the support column element is configured so that it cannot be inserted into the through hole; a surrounding element (20) provided on the first surface of the printed circuit board and configured to surround an opening of the through-hole and to allow the opposite end of the support column element to be inserted into the surrounding element; and a fastening element (22) configured to fasten the support column element to the printed circuit board by screwing it into the threaded hole of the support column element inserted into the enclosure element from a second surface side (12B) opposite the first surface of the printed circuit board.

A three-dimensional molding machine includes a three-dimensional molding device configured to mold a three-dimensional molded object on a molding pallet, a circuit forming device configured to form a circuit pattern on the molded object during or after molding, a component mounting device configured to mount an electronic component on the circuit pattern formed on the molded object, a pallet conveyance device configured to convey the molded object together with the molding pallet between the three-dimensional molding device, the circuit forming device, and the component mounting device, and a component conveyance device configured to the electronic components into the component mounting device from an outside of the machine.

Disclosed are a printed circuit board and an electronic device comprising same. An electronic device according to various embodiments of the present invention comprises a substrate part on which at least one electrical component is disposed, wherein the substrate part may comprise: a printed circuit board comprising a metal wiring layer and a polymer base layer laminated on at least one side of the metal wiring layer and hot-formed to have a curved shape; and a bonding layer that comprises a solder for electrically bonding the electrical component to at least a portion of the metal wiring layer, and secures the electrical component on the substrate part.

Method for manufacturing a MID circuit carrier (1), comprising at least the following steps: injection molding technique formation of a one-piece injection molded body (3) having a substrate (7) and a contact area (2), structuring of a circuit surface area (4a) on the substrate (7) and a contact flag surface area (2a) on the contact area (2) by activating metal nuclei (16), wherein conductor track areas (105) are structured on the circuit surface area (4a) extending to the contact flag surface area (2a) of the contact area (2), applying a first metal layer (21) without external current to the structured circuit surface area (4a) and the contact flag surface area (2a) such that at least two conductor tracks (6) extend from the circuit surface area (4a) to at least one conductor junction (12) formed on the contact flag surface area (2a), wherein the conductor tracks (6) are contacted with each other via the at least one conductor junction (12), electrochemical formation of a second metal layer (18) on or with the first metal layer (21) by applying an electrical potential (V) to the conductor junction (12), and Remove at least the conductor joining (12) and electrically disconnect the conductor tracks (6).

Method for manufacturing an electromechanical structure, comprising: producing (106) conductors and / or graphics on a substantially flat film, attaching (108) electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming (110) the said film housing the electronic elements into a substantially three-dimensional shape, using (112) the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement (500) for carrying out said method is also presented.

A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, an electronic component, and an encapsulant. The substrate has a lower surface and an upper surface opposite to the lower surface. The electronic component is disposed on the upper surface of the substrate. The encapsulant is disposed on the upper surface of the substrate. The encapsulant includes a first portion penetrating the substrate at a central region of the substrate and a second portion penetrating the substrate at a peripheral region of the substrate.

An in-mold electronic (IME) device includes a curved substrate, a first conductive layer, a dielectric layer, a gap compensation layer, and a second conductive layer. The curved substrate has a first surface. The first conductive layer is disposed on the first surface. The dielectric layer is disposed on the first conductive layer and has a first thickness. The gap compensation layer is disposed on the first surface and connected to the dielectric layer. The gap compensation layer has a second thickness. The second conductive layer is disposed on the gap compensation layer and electrically connected to the gap compensation layer. A curvature radius of the curved substrate is c, a ratio of the second thickness to the first thickness is r, and c and r satisfy a relationship: r=(1.5−0.02c)±15%.