711results about "3D rigid printed circuits" patented technology

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

An antenna element made of an electrically conductive material pattern is printed and formed on a face of a casing made of an electrically nonconductive material having a circuit board housed therein, and the antenna element and the circuit board are electrically connected to each other by a connecting element.

A three-dimensional printer, system and method is provided for individually creating three-dimensional structural elements (individually termed fundamental structures) which are sequentially positioned into formation of a shaped object.

A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.

The current invention provides an endotracheal tube fabricated with an array of electrodes disposed on an inflatable cuff on the tube. The array of electrodes includes multiple sense electrodes and a current electrode. The array of electrodes on the inflatable cuff is applied using a positive displacement dispensing system, such as a MicroPen®. A ground electrode is disposed on the tube approximately midway between the inflatable cuff and the midpoint of the endotracheal tube. The endotracheal tube is partially inserted into a mammalian subject's airway such that when the inflatable cuff is inflated, thereby fixing the tube in position, the array of electrodes is brought into close contact with the tracheal mucosa in relative proximity to the aorta. The endotracheal tube is useful in the measurement of cardiac parameters such as cardiac output.

Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

A wiring substrate with a reinforcing member includes: a resin wiring substrate having a substrate principal surface, a substrate rear surface, and substrate side surfaces, forming a rectangular shape having four sides in plan view, and including a resin insulating layer and a conductor layer; and a reinforcing member formed in a rectangular frame shape which surrounds the four sides of the resin wiring substrate, and provided with an inner wall having a depression surface-joined to at least one of the substrate side surfaces, an outer peripheral portion of the substrate principal surface, and an outer peripheral portion of the substrate rear surface.

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.

An illumination device and method of making the device uses a three-dimensional (3D) substrate on which a number of light-emitting dies are mounted. The 3D substrate is configured to define an interior region. The illumination device includes electrical traces on at least one of the exterior surface and the interior surface of the 3D substrate.

A disk drive for use with a host electronic unit including spindle motor drive circuitry. The disk drive includes a disk drive housing, and a spindle motor rotatably attached to the disk drive housing. The spindle motor includes a stator. The disk drive further includes a host connector attached to the disk drive housing which is operably connectable to the spindle motor drive circuitry for receiving electrical signals from the spindle motor drive circuitry for controlling the spindle motor. The disk drive further includes a stator electrical trace integrally formed upon the disk drive housing from the stator to the host connector for electrically connecting the stator and the host connector.

Mass spectrometer systems for measuring mass/charge ratios of analytes are described. A mass spectrometer system includes a vacuum flange, a PCB base plate coupled to the vacuum flange, and an ion optic assembly coupled to the PCB base plate. The PCB base plate may include signal-processing electronics. The system may include an electrical cable coupled to the PCB base plate for supplying power, control, and I/O to the ion optic assembly and the signal processing electronics. Alternatively, a mass spectrometer system includes a PCB base plate and an ion optic assembly. The PCB base plate has a sealant portion and an electrical portion. The ion optic assembly is coupled to the electrical portion. The system may include a vacuum housing for enclosing the ion optic assembly. The vacuum housing is coupled to the sealant portion of the PCB base plate for sustaining a vacuum while the system is in operation.

A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and mounting such in a displaceable and rotatable mounting that is adapted to provide both axial and rotational motion. This is followed by forming at least one channel having a predetermined pattern in the polymer tube with a focused energy beam, the channel then being filled with an electrically conductive paste or electrically conductive slurry material. The polymer tube is then heated to temperatures less than 250° C. to cure the electrically conductive paste or electrically conductive slurry material. The electrically conductive paste or electrically conductive slurry material is then covered with a polymer layer.