153results about "3D rigid printed circuits" patented technology

The invention relates to a composition for making a film-forming masking coating adhering to at least part of a surface of a substrate intended to be thermoformed for manufacturing a selectively metallized three-dimensional item, said composition comprising at least one organic polymer matrix formed of one or more organic monomers and / or polymers, said polymer matrix being curable to form said masking coating that, after curing, for a thickness of between 0.1 μm and 50 μm, has a deformation ratio at break higher than 30%, at a temperature of between 20° C. and 270° C.The invention is particularly adapted for making a composition suitable for making a coating on the surface of a substrate intended to be thermoformed.

The invention relates to the technical field of micro-nano additive manufacturing and electronic manufacturing, in particular to a non-deployable curved surface micro conformal circuit additive manufacturing method based on electric field driving. A circuit pattern mask is needed at any non-deployable three-dimensional curved surface conformal manufacturing position, and an imprinting working soft mold consistent with the female mold plate in structure is prepared through secondary mold turning; secondly, conformal imprinting and shape restoring are carried out, and a groove structure consistent with the geometric pattern of the circuit is obtained on the curved-surface base material in the modes of etching, roughening treatment and the like; then, the groove is filled with a seed layer, and the groove is filled with high-conductivity metal through the electroplating technology; afterwards, dissimilar metal in the groove is molten and strengthened through laser, after the metal is cooled, the metal and the coarsened microstructure in the groove form an interlocking structure, and the binding force between the metal layer and the base material is greatly enhanced; and finally, performing post-treatment on the surface of the sample piece through processes such as polishing and the like to obtain the final curved surface conformal circuit with the embedded conductive circuit.

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

Provided is a multilayer substrate manufacturing technology that enables manufacturing a multilayer substrate at low cost. First, a cover sheet (2) is superposed on a base material sheet (1) having the same shape and size as a shape and a size of the cover sheet. Wiring (11) is provided on one surface of the base material sheet (1). A hole (21) is made in the cover sheet (2) at a position through which an electronic component is to be mounted to the base material sheet (1) later. The superposed base material sheet (1) and cover sheet (2) are then folded so that the hole (21) is exposed to an outside. The electronic component is inserted into the hole (21), and the electronic component is mounted in continuity with the wiring (11) of the base material sheet (1).

A thin electronic device includes a first sealing member, a second sealing member, a first circuit member, and a second circuit member. The first sealing member substantially includes a first film formed with an opening and includes a frame film. At least one of the first circuit member and the second circuit member includes an exposed portion and a sealing portion surrounding the exposed portion. The frame film has a thin film sealing portion and a circuit sealing portion. The thin film sealing portion is joined to the first film to surround the opening. The circuit sealing portion is joined to the sealing portion to surround the exposed portion. The device is formed with a closed space enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to an external space located outside the device. The device has a thinner structure.

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

The invention relates to a method for producing a measuring means having a layer composite, wherein: the conductor track layer and the isolation layer are joined together to form an initially deformable layer composite; the joining is in particular an integral joining; the layer composite is applied over a surface of a part or of the further part of the measuring means, in particular by integral bonding; and the conductor track of the conductor track layer extends in alignment with a profile of the surface at least in portions; in particular the layer composite is applied in such a way that the isolation layer isolates the conductor track layer from the surface.

Provided are a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device provided with the resin multilayer substrate. The resin multilayer substrate is provided with a resin laminate. The resin laminate has a first region, a second region, and a third region as a layer direction region. The resin multilayer substrate is provided with a first resin material that is bonded from the surface of the first region to the third region, and a second resin material that is formed in the third region. The second resin material covers a portion of the first resin material and covers an end portion of the first resin material present in the third region. When E1 represents the Young's modulus of the first resin member and E2 represents the Young's modulus of the second resin member, the Young's modulus of the first resin member and the Young's modulus of the second resin member are set to E1lt. And E2. When AD1 represents the adhesion force between the first resin member and the resin laminate, and AD2 represents the adhesion force between the second resin member and the resin laminate, AD2 > = AD1.

Method for manufacturing trim panels for vehicles having an electronic function comprising the steps of providing a first sheet comprising a flexible flat plastic film having a first area being flat; a first printing step by a two-dimensional printing process for configuring an electrical conductive track on the first sheet; forming the first sheet according to a three-dimensional shape in such a way that the first area has a three-dimensional shape; a second printing step by fluid dispensing or pad printing for configuring an electrical conductive pad on the first area; attaching an electronic component to the electrical conductive pad; injecting a plastic material on the first sheet forming a carrier sheet; and providing a decorative covering on the carrier sheet comprising a pictogram configured for cooperating with the electronic component.

A printed circuit board which can be used as an identical part embodied in different exterior lighting devices of a motor vehicle. The printed circuit board includes a first connecting interface and a second connecting interface, each for accommodating a plug for establishing an electrical connection between the printed circuit board and at least one component that is otherwise separate from the printed circuit board, this connection being used for the power supply and / or control of at least one component that is arrangeable on the printed circuit board, and the second connecting interface of the printed circuit board being arranged on the printed circuit board in a manner offset both translationally and rotationally relative to the first connecting interface of the printed circuit board.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

The invention provides a component carrier and a method of manufacturing the same. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), where the at least one electrically insulating layer structure (106) has a first main surface (108) and an opposite second main surface (110), and at least one cavity (116), the at least one cavity (116) is formed in a first main surface (108) of the at least one electrically insulating layer structure (106) and is delimited by a bottom wall (112) and a side wall (114), a surface of the bottom wall (112) and a surface of the side wall (114) of the at least one cavity (116) have a roughness Ra different from a roughness of the first main surface (108) and / or a roughness of the second main surface (110) of the at least one electrically insulating layer structure (106).

An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.

The present invention relates to a connection structure and an assembly. The connection structure (16) includes: a pillar member (18) that extends in one direction from one end portion (E1) to the other end portion (E2) and is not inserted through the through-hole (12H1), the one end portion (E1) being mounted on the disposed object (14), and a threaded hole (18SH) being formed at the other end portion (E2); an enclosing member (20) that is provided on one surface (12A) of the printed circuit board (12), encloses the opening of the through-hole (12H1), and allows the other end portion (E2) of the pillar member (18) to be inserted therethrough; and a fixing member (22) that fixes the pillar member (18) relative to the printed circuit board (12) by screwing from the side of the other surface (12B) of the printed circuit board (12) opposite to the one surface (12A) into the threaded hole (18SH) of the pillar member (18) inserted into the enclosing member (20).

A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

To provide a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device including the resin multilayer substrate.SOLUTION: A resin multilayer substrate 101A includes a resin laminate 10. The resin laminate 10 has a first region A1, a second region A2, and a third region A3, as layer-direction regions. The resin multilayer substrate 101A includes a first resin material R1 affixed from the surface of the first region A1 to the third region A3 and a second resin material R2 formed within the third region A3. The second resin material R2 covers a portion of the first resin material R1, and covers the end portion of the first resin material R1 positioned in the third region A3. Assuming the Young's modulus of the first resin material R1 is expressed as E1 and the Young's modulus of the second resin material is expressed as E2, the relationship of E1<E2 is satisfied. Assuming the adhesion strength between the first resin material R1 and the resin laminate 10 is expressed as AD1, and the adhesion strength between the second resin material R2 and the resin laminate 10 is expressed as AD2, the relationship of AD2≥AD1 is satisfied.SELECTED DRAWING: Figure 1

Disclosed are a printed circuit board and an electronic device comprising same. An electronic device according to various embodiments of the present invention comprises a substrate part on which at least one electrical component is disposed, wherein the substrate part may comprise: a printed circuit board comprising a metal wiring layer and a polymer base layer laminated on at least one side of the metal wiring layer and hot-formed to have a curved shape; and a bonding layer that comprises a solder for electrically bonding the electrical component to at least a portion of the metal wiring layer, and secures the electrical component on the substrate part.

[Problem] The purpose of the present invention is to provide an embedded trace substrate that is less likely to experience reductions in conductivity and a production method for an embedded trace substrate with which it is possible to easily produce such an embedded trace substrate. An object of the present invention is also to provide an embedded trace substrate-integrated molded article using an embedded trace substrate that is less likely to experience reductions in conductivity. [Solution] An embedded trace substrate according to the present invention includes: a film; a circuit that includes a thin metal wire and that has a functional portion having an arbitrary pattern, a first wiring portion led out from one end of both ends of the functional portion, a second wiring portion led out from another end of both ends of the functional portion, and folded-back portions extending in a direction away from the functional portion from the first wiring portion and the second wiring portion, respectively, and folded back so as to be parallel to the film, the functional portion, the first wiring portion, and the second wiring portion being embedded in the film; and two electrode pads respectively fixed on the first wiring portion and the second wiring portion and having upper surfaces to which the folded-back portions are electrically connected.

A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

A circuit board structure includes a flexible core board, a first circuit layer, a first solder mask layer, a first protective layer, a rigid plate and a plurality of electrically-conductive members. The flexible core board includes a first surface and a second surface. The first circuit layer is formed on the first surface, and has a plurality of electrical connection portions. The first solder mask layer is coated on the first circuit layer and the first surface. The first solder mask layer has a plurality of opening portions aligned with the electrical connection portions. The first protective layer is disposed on the first solder resist layer and has a flat surface. The rigid plate is disposed on the second surface and corresponds to the opening portions. The electrically-conductive members are respectively formed on the electrical connection portion and exposed from the opening portion.

The invention relates to an interconnection device (1) intended to interconnect at least two circuit boards (50), the device comprising a body (10) made of at least one polymer material and a plurality of electrically conductive tracks (20) extending from a first face of the body (10) to a second face of the body (10). According to the invention, the interconnection device (1) comprises a first connector (41) fixedly mounted on the first face of the body (10) and a second connector (42) fixedly mounted on the second face of the body (10), wherein the first connector (41) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a first circuit board (51), and the second connector (42) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a second circuit board (52). The invention also relates to a method for manufacturing such an interconnection device (1). The invention also relates to an associated aircraft.

A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

The present disclosure provides a semiconductor package including a locally thinned PCB (printed circuit board). The locally thinned PCB includes a first portion having a first height and a second portion having a second height less than the first height. The locally thinned PCB may be a single unitary structure or have different PCB portions. When the locally thinned PCB has different PCB portions, the flexible connector mechanically and electrically couples the PCB portions together. Due to the reduced thickness of the second portion, an additional semiconductor die may be added to the semiconductor die stack, thereby increasing the capability of the semiconductor package. In addition, the first portion includes contacts for the connector. The connector is used to communicatively couple the semiconductor package to an associated connector slot of a host device.

A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane and the second plane, and a second side surface connecting the first plane and the third plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate and extend along the first side surface to be embedded on the second plane.

The purpose of the present invention is to provide a circuit-embedded substrate in which electrical conductivity is not readily reduced, and a method for manufacturing a circuit-embedded substrate in which such a circuit-embedded substrate can be easily manufactured. The purpose of the present invention is also to provide a circuit-embedded-substrate integrally molded article using a circuit-embedded substrate of which the electrical conductivity is less likely to decrease. The circuit-embedded substrate is provided with: a film; and a circuit having a functional part, a first wiring part, a second wiring part, and a folded part, the functional part, the first wiring part, and the second wiring part being embedded in the film, the functional part comprising one metal thin wire and having an arbitrary pattern, the first wiring part being drawn out from one of both ends of the functional part, the second wiring part being drawn out from the other of both ends of the functional part, and the folded part being drawn out from the other of both ends of the functional part. The second wiring part is led out from the other of the two ends of the functional part, and the folded-back part extends from the first wiring part and the second wiring part to the side opposite to the functional part and is folded back in a mode of being parallel to the film; and two electrode pads fixed to the first wiring portion and the second wiring portion, respectively, and electrically connected to the folded-back portion on the upper surface.

The present disclosure relates to radio frequency (RF) unit (100) formed from a ceramic material into a structure with a cavity (101), comprising an outer surface (102), a mounting surface (103) for soldering with a print circuit board (PCB) (200) by a surface mount technology process and an inner surface (104) that delimits the cavity (101), wherein the outer surface (102) is metalized to provide electromagnetic shielding for the RF unit, and the mounting surface (103) is at least partially electrically connected with the outer surface (102) to form a grounding surface therewith; wherein at least one device is arranged on the inner surface (104), the device using a metalized surface line as a transmission line for signal transmission. The present disclosure further relates to a radio structure comprising a PCB and one or more RF units (100) of the above discussed mounted on the PCB. With the RF unit of the present disclosure, a high integration level can be achieved by integrating as many devices as possible in the RF unit and the structural size of the radio system can be reduced at a lower cost and with a greatly reduced loss of the system.