229results about "3D rigid printed circuits" patented technology

The present disclosure relates to a high-precision multilayer PCB and a 3D printing preparation method thereof. The method includes: S1, forming a 3D circuit layer on an upper surface of a substrate; S2, forming a metal pillar at a preset position of the current 3D circuit layer by stacking; S3, forming an insulating layer on an upper surface of the current 3D circuit layer, and leading the corresponding metal pillar out of the formed insulating layer in advance by drilling a hole in the insulating layer and filling the drilled hole with the nanoscale metal slurry; S4, forming a pad layer on an upper surface of the current insulating layer and executing step S5 if the current insulating layer is a top layer; repeatedly executing steps S1 and S2 by using the current insulating layer as a new substrate and executing step S6 if not; S5, connecting the corresponding metal pillar or leading it out in advance and connecting to the pad layer, to complete the preparation of the multilayer PCB; and S6, connecting the corresponding metal pillar or leading it out in advance and connecting to the current 3D circuit layer, and returning to step S3. According to the present disclosure, the high-precision multilayer PCB with high interconnect precision can be prepared.

The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.

A printed circuit board (PCB) has a dielectric substrate of fiber-reinforced polymer with opposite sides. Each side has channels formed by molding or machining the dielectric substrate. Conductive wires are inserted into the channels to define conductive traces.

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

The invention relates to a composition for making a film-forming masking coating adhering to at least part of a surface of a substrate intended to be thermoformed for manufacturing a selectively metallized three-dimensional item, said composition comprising at least one organic polymer matrix formed of one or more organic monomers and / or polymers, said polymer matrix being curable to form said masking coating that, after curing, for a thickness of between 0.1 μm and 50 μm, has a deformation ratio at break higher than 30%, at a temperature of between 20° C. and 270° C.The invention is particularly adapted for making a composition suitable for making a coating on the surface of a substrate intended to be thermoformed.

The invention relates to the technical field of micro-nano additive manufacturing and electronic manufacturing, in particular to a non-deployable curved surface micro conformal circuit additive manufacturing method based on electric field driving. A circuit pattern mask is needed at any non-deployable three-dimensional curved surface conformal manufacturing position, and an imprinting working soft mold consistent with the female mold plate in structure is prepared through secondary mold turning; secondly, conformal imprinting and shape restoring are carried out, and a groove structure consistent with the geometric pattern of the circuit is obtained on the curved-surface base material in the modes of etching, roughening treatment and the like; then, the groove is filled with a seed layer, and the groove is filled with high-conductivity metal through the electroplating technology; afterwards, dissimilar metal in the groove is molten and strengthened through laser, after the metal is cooled, the metal and the coarsened microstructure in the groove form an interlocking structure, and the binding force between the metal layer and the base material is greatly enhanced; and finally, performing post-treatment on the surface of the sample piece through processes such as polishing and the like to obtain the final curved surface conformal circuit with the embedded conductive circuit.

The joint body of the present invention has a structure formed by joining an insulating resin part made of insulating resin and a metal part made of metal, wherein the joining interface between the insulating resin part and the metal part is in a concave-convex shape with convex portions and concave portions, wherein the convex portion is formed by the metal part protruding toward the insulating resin part side, and the concave portion is formed by the metal part retreating from the insulating resin part side, at least one of the kurtosis Rku of the contour curve at the joining interface of the metal part and the kurtosis Sku of the contour surface at the joining interface of the metal part is within the range of greater than 2.75 and less than 6.00, and the overhang rate of the metal part is greater than 7%, and the overhang rate represents the length ratio of the area overlapping the stacking direction in the direction along the joining interface.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supply to a load. The multiphase power converter also includes a plurality of switching transistors disposed on the upper surface of the printed circuit board and configured to selectively conduct a relatively high current. The conductive layer includes at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting a signal for controlling operation of the plurality of switching transistors. The power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent the transistors.

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

Provided is a multilayer substrate manufacturing technology that enables manufacturing a multilayer substrate at low cost. First, a cover sheet (2) is superposed on a base material sheet (1) having the same shape and size as a shape and a size of the cover sheet. Wiring (11) is provided on one surface of the base material sheet (1). A hole (21) is made in the cover sheet (2) at a position through which an electronic component is to be mounted to the base material sheet (1) later. The superposed base material sheet (1) and cover sheet (2) are then folded so that the hole (21) is exposed to an outside. The electronic component is inserted into the hole (21), and the electronic component is mounted in continuity with the wiring (11) of the base material sheet (1).

A thin electronic device includes a first sealing member, a second sealing member, a first circuit member, and a second circuit member. The first sealing member substantially includes a first film formed with an opening and includes a frame film. At least one of the first circuit member and the second circuit member includes an exposed portion and a sealing portion surrounding the exposed portion. The frame film has a thin film sealing portion and a circuit sealing portion. The thin film sealing portion is joined to the first film to surround the opening. The circuit sealing portion is joined to the sealing portion to surround the exposed portion. The device is formed with a closed space enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to an external space located outside the device. The device has a thinner structure.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

The invention relates to a method for producing a measuring means having a layer composite, wherein: the conductor track layer and the isolation layer are joined together to form an initially deformable layer composite; the joining is in particular an integral joining; the layer composite is applied over a surface of a part or of the further part of the measuring means, in particular by integral bonding; and the conductor track of the conductor track layer extends in alignment with a profile of the surface at least in portions; in particular the layer composite is applied in such a way that the isolation layer isolates the conductor track layer from the surface.

Provided are a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device provided with the resin multilayer substrate. The resin multilayer substrate is provided with a resin laminate. The resin laminate has a first region, a second region, and a third region as a layer direction region. The resin multilayer substrate is provided with a first resin material that is bonded from the surface of the first region to the third region, and a second resin material that is formed in the third region. The second resin material covers a portion of the first resin material and covers an end portion of the first resin material present in the third region. When E1 represents the Young's modulus of the first resin member and E2 represents the Young's modulus of the second resin member, the Young's modulus of the first resin member and the Young's modulus of the second resin member are set to E1lt. And E2. When AD1 represents the adhesion force between the first resin member and the resin laminate, and AD2 represents the adhesion force between the second resin member and the resin laminate, AD2 > = AD1.

Method for manufacturing trim panels for vehicles having an electronic function comprising the steps of providing a first sheet comprising a flexible flat plastic film having a first area being flat; a first printing step by a two-dimensional printing process for configuring an electrical conductive track on the first sheet; forming the first sheet according to a three-dimensional shape in such a way that the first area has a three-dimensional shape; a second printing step by fluid dispensing or pad printing for configuring an electrical conductive pad on the first area; attaching an electronic component to the electrical conductive pad; injecting a plastic material on the first sheet forming a carrier sheet; and providing a decorative covering on the carrier sheet comprising a pictogram configured for cooperating with the electronic component.

The invention relates to a method for manufacturing a printed circuit board. The method comprises the following steps: - supplying (401) at least one metal connector into an injection mold, the mold having a shape defining a substrate for said printed circuit board, said connector being in contact at two of its ends with the mold so as to protrude on each side of said substrate, - injection molding (402) of plastic into said mold, - printing (404) an electrical circuit on one face of the substrate, - placing (405) electronic components on the printed face of the substrate in at least one flat area, - connecting the components (406). The invention also relates to the printed circuit board thus obtained and to its use in a vehicle lighting device. Figure 4

A printed circuit board which can be used as an identical part embodied in different exterior lighting devices of a motor vehicle. The printed circuit board includes a first connecting interface and a second connecting interface, each for accommodating a plug for establishing an electrical connection between the printed circuit board and at least one component that is otherwise separate from the printed circuit board, this connection being used for the power supply and / or control of at least one component that is arrangeable on the printed circuit board, and the second connecting interface of the printed circuit board being arranged on the printed circuit board in a manner offset both translationally and rotationally relative to the first connecting interface of the printed circuit board.

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

Provided is a connection structure for a semiconductor package which includes: a first passivation layer having an opening; a first conductive pattern that penetrates the first passivation layer and protrudes upwardly from the first passivation layer; a second passivation layer on the first passivation layer and covering the first conductive pattern; a second conductive pattern on the second passivation layer and electrically connected to the first conductive pattern; a third passivation layer on the second passivation layer and covering the second conductive pattern; and an external terminal in the opening and electrically connected to the first conductive pattern, wherein the first conductive pattern is thicker than the second conductive pattern.

The invention provides a component carrier and a method of manufacturing the same. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), where the at least one electrically insulating layer structure (106) has a first main surface (108) and an opposite second main surface (110), and at least one cavity (116), the at least one cavity (116) is formed in a first main surface (108) of the at least one electrically insulating layer structure (106) and is delimited by a bottom wall (112) and a side wall (114), a surface of the bottom wall (112) and a surface of the side wall (114) of the at least one cavity (116) have a roughness Ra different from a roughness of the first main surface (108) and / or a roughness of the second main surface (110) of the at least one electrically insulating layer structure (106).

An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.

The present invention relates to a connection structure and an assembly. The connection structure (16) includes: a pillar member (18) that extends in one direction from one end portion (E1) to the other end portion (E2) and is not inserted through the through-hole (12H1), the one end portion (E1) being mounted on the disposed object (14), and a threaded hole (18SH) being formed at the other end portion (E2); an enclosing member (20) that is provided on one surface (12A) of the printed circuit board (12), encloses the opening of the through-hole (12H1), and allows the other end portion (E2) of the pillar member (18) to be inserted therethrough; and a fixing member (22) that fixes the pillar member (18) relative to the printed circuit board (12) by screwing from the side of the other surface (12B) of the printed circuit board (12) opposite to the one surface (12A) into the threaded hole (18SH) of the pillar member (18) inserted into the enclosing member (20).

A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

An input device is provided, including a housing, a circuit board disposed in the housing, an optical module disposed on the circuit board, a movable member movably connected to the housing, and a switch element disposed on the circuit board. When the input device moves to a reference surface, the movable member contacts the reference surface, and the movable member is pushed by the reference surface to actuate the switch element.