587results about "Conductive pattern layout details" patented technology

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

A multilayer board structure includes a plurality of light emitting devices, each light emitting device of the plurality of light emitting devices having a plurality of electrodes formed on a terminal surface thereof, and a multilayer board including a plurality of stacked substrates and implemented with the plurality of light emitting devices. An uppermost substrate of the plurality of stacked substrates has a surface formed with metal layers coupling electrodes of the plurality of light emitting devices. Remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers, respectively. A number of metal layers located directly below the electrodes of the plurality of light emitting devices is the same for each of the electrodes.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.

The present disclosure relates to the technical field of circuit boards, and provides a method for manufacturing a chip-embedded circuit board, and a chip-embedded circuit board. The method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the pre-manufactured circuit board, respectively; and forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface of the pre-manufactured circuit board, providing through holes in the dielectric layer and the conductive layer to expose electrodes of the chip packaging unit, and filling the through holes with a conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins in such a way that the heat dissipation fins are flush with the lower surface of the pre-manufactured circuit board. The manufacturing method of the present disclosure can manufacture a chip-embedded circuit board with a robust structure that meets the operational performance and the heat dissipation performance.

The application provides a driving circuit board, a display module and a display device, relates to the technical field of display, and can increase the number of output channels of a driving chip, reduce the size of a binding area connected with the driving chip, and make the high-resolution requirement of a display substrate adapt to the narrow-frame requirement. The driving circuit board comprises a driving chip, a circuit board body, a plurality of driving pins and a signal circuit, the driving pins comprise first driving pins and second driving pins, the first driving pins are used for electrically connecting a display substrate, the second driving pins are electrically connected with the signal circuit, the driving chip is electrically connected with the circuit board body through the driving pins, the first driving pins are arranged in at least three rows along a first direction, the first driving pins are arranged in at least three rows along a second direction, the first direction intersects with the second direction, the circuit board body comprises at least two conductive layers, and the number of conductive layers electrically connected with the at least two rows of first driving pins arranged along the second direction is different.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

The application discloses a circuit trace, a circuit element and an electronic device. The circuit trace comprises a solid-state metal trace, a liquid-state metal trace and a connecting structure. The connecting structure is connected between the solid-state metal trace and the liquid-state metal trace to realize physical isolation and electrical connection between the solid-state metal trace and the liquid-state metal trace. The circuit trace provided by the application avoids corrosion of the liquid-state metal trace on the solid-state metal trace by arranging the connecting structure, improves the reliability of the circuit trace, and thus effectively enhances the integrity of signals transmitted through the circuit trace.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

The antenna substrate of the embodiment includes a substrate, an antenna pattern layer on the substrate, a first insulating layer containing a resin and an inorganic filler on the substrate and the antenna pattern layer, and a second insulating layer containing a resin and an inorganic filler on the first insulating layer, wherein the second insulating layer has a greater dielectric constant and thickness than the first insulating layer.

This wiring substrate comprises a substrate and a mesh wiring layer. The wiring substrate has an electromagnetic wave transmission / reception function. The substrate has transparency. The mesh wiring layer is configured as an antenna, and has wires. Two or more openings are formed by being surrounded by the wires. The planar shape of each of the openings is a polygon in which opposing sides are paralleled to each other. The distances between the sides extending in a first direction in the respective openings are each denoted as d. The average value of the distances between the sides extending in the first direction in 100 sequentially adjacent openings or all of the openings is denoted as D. In this case, at least 95% of openings, of the 100 openings or all of the openings, satisfy the relationship of 0.70D≤d≤0.98D or the relationship of 1.02D≤d≤1.30D.

This invention provides a multilayer substrate structure that improves heat dissipation while suppressing mounting defects in light-emitting devices. [Solution] The multilayer substrate structure 100 of the present invention comprises an LED device 10 having a plurality of electrodes 30R, 30G, 30B, and 30C formed on its terminal surface, and a multilayer substrate 200 on which the plurality of LED devices 10 are mounted. A metal pattern Q1 including electrode pads R, G, and B for connecting each electrode of the LED device 10 is formed on the surface of the uppermost substrate 210. Another metal pattern Q2, Q3, and Q4 are formed on the surfaces of the remaining substrates 220, 230, and 240 of the multilayer substrate so that the number of metal layers located directly beneath each electrode of the LED device 10 is consistent.

The invention belongs to the technical field of audio equipment and communication, and discloses a sound card audio transmission device and interaction system, which comprises host transmitter equipment and at least one receiver equipment, and the host transmitter equipment is in wireless pairing connection with the receiver equipment; the host emitter device integrates a sound card function and a UHF wireless audio emission function and comprises a host shell, and a host circuit board is arranged in the host shell. A control circuit on the host circuit board is connected with a monitoring jack, a stepping roller knob, a startup sliding block, an adjustable audio input interface, a charging signal port, a radio frequency antenna, a light guide key and a luminous logo lamp; the host transmitter is connected to audio input equipment through the adjustable audio input interface; through combination of hardware innovation and software intelligence, an efficient, stable and user-friendly audio transmission solution is provided, the aspects of audio quality, equipment reliability and operation convenience are remarkably improved, and the method is suitable for wide application fields.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

A composite ceramic substrate and method for producing the same. The composite ceramic substrate includes a ceramic substrate, a circuit board, and a composite adhered structure adhered to the ceramic substrate and the circuit board. The composite adhered structure includes a first active metal layer adhered to the ceramic substrate, a second active metal layer adhered to the circuit board, and a solder layer arranged between the first active metal layer and the second active metal layer. The first active metal layer includes titanium hydride. The second active metal layer includes tin, copper, and titanium hydride. The solder layer includes tin, copper, and titanium hydride.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.

The invention relates to the technical field of radio altimeter Sip integration design, and discloses an FMCW radio altimeter transceiver Sip integration device and method, and the device comprises an integration box and an integrated circuit board. The integrated box comprises a shell, an upper cover plate and a lower cover plate; the upper cover plate and the lower cover plate are respectively fixed at the top and the bottom of the shell; the integrated circuit board is assembled in the integrated shell; the shell is provided with a DB15 connector, an information receiving hole and an information transmitting hole. The DB15 connector is connected to the integrated circuit board, an information receiving end and an information transmitting end of the integrated circuit board are connected with external signals through an information receiving hole and an information transmitting hole respectively, and the information receiving end and the information transmitting end are used for generating, amplifying and transmitting radio-frequency signals and carrying out amplification, frequency conversion and signal processing on the received radio-frequency signals; and outputting a height signal and an alarm signal. According to the invention, miniaturization of the FMCW radio altimeter transceiver is realized.

To provide a wiring circuit board which can be manufactured with simple facilities and processes and can reduce transmission loss, and to provide a method of manufacturing the wiring circuit board.SOLUTION: The wiring circuit board 1 sequentially includes a metal supporting board 2, a metal particle-containing layer 3 containing metal particles 31, an insulating layer 4, and a conductive pattern 5 toward one side in a thickness direction.SELECTED DRAWING: Figure 1

A circuit board according to an embodiment of the disclosure can include a substrate layer on a first portion of the circuit board and a second portion of the circuit board different from the first portion, a power line on the first portion of the circuit board, a signal line on the second portion of the circuit board, a shield layer spaced apart from the power line and the signal line, and a cover layer between the substrate layer and the shield layer, wherein the cover layer includes a cover substrate layer on the first portion and the second portion of the circuit board, a conductive layer on the first portion of the circuit board corresponding to the power line and between the cover substrate layer and the shield layer, and an insulating layer on the second portion of the circuit board corresponding to the signal line and disposed between the cover substrate layer and the shield layer.

The invention discloses a multi-layer aluminum core copper-clad plate based on a plasma anodic oxidation coating and further discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: pretreating an aluminum core; performing plasma anodic oxidation by adopting a pulse power supply, and generating an aluminum oxide ceramic insulating layer on the surface of the aluminum core in situ; positioning and drilling the aluminum core, and sealing the hole with insulating resin; adhering copper foils to the two sides of the aluminum core to form a double-sided plasma anodic oxidation copper-clad aluminum plate; performing pattern manufacturing on the surface of the double-sided plasma anodic oxidation copper-clad aluminum plate, overlapping multiple layers of copper-clad aluminum plates, and performing hot-pressing curing; carrying out through hole processing and hole metallization on the copper-clad plate subjected to multi-layer lamination; and performing pattern manufacturing and anti-oxidation treatment on the surface of the copper-clad plate to obtain the multi-layer aluminum core copper-clad plate. The multi-layer aluminum core copper-clad plate has excellent mechanical reliability, insulation stability, longitudinal heat conduction efficiency and high-frequency signal transmission performance.

To provide a circuit board that can reduce signal degradation. [Solution] The circuit board 100 of the present disclosure comprises a wiring board 101, a connector 103 mounted on the wiring board 101 having a main terminal and a sub terminal, a power supply circuit mounted on the wiring board 101 having an input terminal and an output terminal, a signal circuit mounted on the wiring board 101 having a first terminal and a second terminal, and a signal transmitting and receiving circuit 102 mounted on the wiring board 101 having a power terminal and a signal terminal, wherein the main terminal and the sub terminal penetrate the wiring board 101, and the wiring board 101 has a first wire 104 connecting the main terminal and the input terminal, a second wire 105 connecting the input terminal and the first terminal without going through the main terminal, a third wire 108 connecting the output terminal and the power terminal, and a fourth wire 107 connecting the second terminal and the signal terminal, wherein the second wire 105 passes between the main terminal and the sub terminal.

An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

The present invention relates to the field of electric machines and discloses a structure for cooling a lead frame and winding coils of an electric generator or motor and an electric generator or motor. The stator core comprises a plurality of circumferentially distributed stator teeth. The lead frame electrically connects a first inverter to a first set of coil windings mounted on the stator core of the electric motor or generator. The lead frame comprises a printed circuit board having a plurality of layers of circuit board, wherein each layer of circuit board comprises an insulating substrate and an electrically conductive layer disposed on the insulating substrate. The lead frame is positioned between a cooling channel and the stator teeth. A potting material is positioned between the cooling channel and the lead frame, wherein the potting material acts as a heat transfer between the cooling channel and the lead frame. The cooling channel is formed in the stator housing. The present invention increases the cooling of the lead frame mounted on the stator. The arrangement of the lead frame provides a large current between the inverter and the coil windings of the electric motor or generator, thereby producing a large torque and power value.

An information acquisition assembly includes a circuit board and a conductive bar. The circuit board includes a circuit board body and a plurality of circuit board branches. The conductive bar includes a plurality of conductive components. At least one of the circuit board branches is electrically connected between the circuit board body and one of the conductive components, and is separate from the circuit board body and the one of the conductive components.

The invention discloses a circuit substrate which is provided with an active region and a peripheral region at least partially surrounding the active region. The circuit substrate comprises a substrate layer and a first planarization layer. The first planarization layer is disposed on the substrate layer and extends from the active region to the peripheral region. The first planarization layer has a first edge region. A first edge clamping angle of the first planarization layer in the first edge region is in a range of 10 degrees to 20 degrees.