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254 results about "Time pattern" patented technology

Knowledge extraction and prediction

Methods and systems for knowledge extraction and prediction are described. In an example, a computerized method, and system for performing the method, can include receiving historical data pertaining to a domain of interest, receiving predetermined heuristics design data associated with the domain of interest, and using the predetermined heuristics design and historical data, automatically creating causal maps including a hierarchy of nodes, each node of the hierarchy of nodes being associated with a plurality of quantization points and reference temporal patterns, the plurality quantization points being known reference spatial patterns. In an example the computerized method, and system for performing the method, can further include receiving, at each node, a plurality of unknown patterns pertaining to a cause associated with the domain of interest, automatically mapping the plurality of unknown patterns to the quantization points using spatial similarities of the unknown patterns and the quantization points, automatically pooling the quantization points into a temporal pattern, the temporal pattern being a sequence of spatial patterns that represent the cause, automatically mapping the temporal pattern to a reference temporal pattern, automatically creating a sequence of the temporal patterns, and automatically recognizing the cause using the sequence of temporal patterns.
Owner:USAA

Super thick copper PCB plate production method and its circuit board

The invention discloses a super thick copper PCB plate production method and its circuit board. The method comprises the following steps: dividing a plate substrate with a bottom copper; suspending and placing the PCB plate to be processed into an electroplating jar in a way of positive, negative clamping plates to electroplate the PCB plate for four times, until the thickness of the electroplating layer is more than 350-400Mum; etching the PCB plate; performing silk-screen printing using epoxy resin, leveling up circuit clearances by the epoxy resin and roasting the plate to solidify the epoxy resin; grinding the solidified epoxy resin and removing the residual resin layer on the surface of the circuit; drilling the plate, depositing the copper and electroplating the whole plate; performing the second time pattern electroplating and circuit etching on the plate to accomplish the circuit pattern. The super thick copper PCB plate production method and its circuit board use the multiple electroplating way and the epoxy resin leveling-up way between circuits, so as to realize the practical production technology of the super thick copper PCB plate, the copper on the circuit of the circuit board is uniform to satisfy the basis requirement of the circuit board.
Owner:SHENZHEN KINWONG ELECTRONICS
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