167results about "Circuit artworks manufacture" patented technology

Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.

A pattern design of a film for manufacturing a printed circuit board is made by using a CAD system, and a plurality of types of Gerber data are produced in which a series of various data has been encoded. For example, a pattern film is formed by combining pattern Gerber data with pattern cut Gerber data. Data for check marks whose sizes are different from each other is added as well as pattern data to each Gerber data such that their central coordinates are to be the same. In this manner, a judgment mark having the check marks combined therewith is formed on the pattern film having the items of Gerber data combined therewith.

A mask used for exposing a porous substrate to form a first region and a second region, the first region being filled with a conductive material piercing through the entire thickness of the porous substrate to constitute an interfacial conductive portion, the second region being filled with a conductive material not piercing the entire thickness of the porous substrate to constitute a non-interfacial conductive portion. The mask includes a first light-transmitting region for exposing the first region, and a second light-transmitting region for exposing the second region, said second light-transmitting region including an aggregation of fine patterns of which an average aperture ratio is not more than 50% of an average aperture ratio of the first light-transmitting region and a size of said fine patterns of the second light-transmitting region being in the range of 0.1 μm to 10 μm.

Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.

The invention provides a method and system for determining a signal line reference layer, and the method comprises the steps: setting a line width range of the signal line; determining attribute parameters of a printed circuit board, and setting a wiring layer and a resistance value corresponding to the signal line; according to the attribute parameters, the wiring layer and the resistance value, determining a reference layer when simulated line width of the signal line is in the line width range; when an interval laminating layer being arranged between the wiring layer and the reference layer, and according to the wiring position of the signal line on the wiring layer, performing hollowing operation on at least one interval laminating layer. According to the scheme, the signal line realizing more signal functions in a proper line width can be guaranteed.

The present invention provides a pattern checking device which can get the two sides of transmitted illuminating picture and reflected illuminating picture with scanning the camera unit and lighting unit once and the resolution is not reduced. When the checking pattern (5a) of the TAB strip (5) is fetched, the scanning is executed by that the transmitted illuminating unit (1a) and the reflected illuminating unit (1b) irradiate respectively transmission illuminating light and reflected illuminating light and the checking pattern (5a) wholly passes through the checking part (1) by the scanning unit (2). Thereby the transmitted illuminating picture and the reflected illuminating picture of the checking pattern (5a) are read and stored to the control part (4). The control part (4) compares the stored transmitted picture with the reference pattern used for transmission illuminating, checks whether the wiring pattern of the transmitted illuminating picture is in the scope of the fixed dimension relative to the reference pattern, namely checks whether a ''wide part'' or a ''thin part'' exists in the wiring pattern and judges whether the checking pattern (5a) is excellent.

The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

The present invention is configured such that a wiring pattern, formed by forming an etching resist on metal foil that has been layered on an insulating resin board and performing etching via this etching resist, is provided with a circuit pattern constituting an electronic circuit and a dummy pattern provided in the vicinity of and separated from the circuit pattern, such that side etching of the circuit pattern is suppressed by mitigating the rate at which etching advances for the circuit pattern.

The present invention relates to a photosensitive resin composition of an excellent reliability and a method for manufacturing the same, in particular to a photocuring and thermocuring resin composition which can guarantee the important characteristics, such as the PCT resistance, the HAST resistance, the non-electrolytic gold plating resistance, the thermal shock resistance, etc., of a semiconductor package solder resist, and also can form a cured film having the excellent flexibility, a method for manufacturing the same, a dry film, a cured material, and a printed circuit board formed by the cured film forming the solder resist and the like.

The invention discloses a manufacturing method of an ultralow-resistance flexible conductive circuit. The method comprises the following steps of firstly preparing a fabric substrate, a precursor solution and ink; taking a proper amount of precursor solution to completely wet the fabric substrate, and placing the fabric substrate on a metal substrate; putting a proper amount of ink into a piezoelectric spray head of a micro-droplet jetting device, starting the micro-droplet jetting device to print the ink on the fabric substrate on the metal substrate drop by drop until the ink forms a printing circuit after multi-layer printing; and finally, cleaning the printed circuit with alcohol and deionized water in sequence, putting the printed circuit into a curing oven for heating and curing treatment, and cooling to obtain the ultralow-resistance flexible conductive circuit. According to the manufacturing method of the ultralow-resistance flexible conductive circuit, the problems that in theprior art, a flexible conductive circuit is complex in preparation process, the resistance value of the conductive circuit is high, and the bonding performance of the conductive circuit and fabric ispoor are solved.

The embodiment of the invention provides a mask plate. The mask plate comprises a plurality of baffles, a frame body and a light transmission region. The framework is provided with a supporting part and a movable part. Each baffle is configured to the light transmission region used for shielding. The supporting part is configured to a baffle for supporting the light transmission region. The movable part is configured to move the baffles to positions for shielding the light transmission region. With the adoption of the mask plate provided by the embodiment of the invention, one mask plate can be used for producing different MMG products; in a production process, the mask plate does not need to be replaced and irradiation and orientation can be carried out; the mask plate does not need to be detached in a normal service life range; and a production process is optimized and the cost is effectively reduced.

The invention relates to the field of electronic equipment, and discloses a design method and a welding method of a printed board assembly based on inter-board vertical interconnection, and the method carries out the special design of a printed board bonding pad of a surface-mounted connector and an opening of a screen printed by soldering paste, thereby achieving the self-positioning of the surface-mounted connector. A printed board anti-deformation design and an anti-deformation welding clamp are adopted to control buckling deformation in the processing and welding processes of the printed board, and accurate positioning and reliable welding of the surface-mounted connector on the printed board assembly based on inter-board vertical interconnection are achieved. According to the design method and the welding method of the printed board assembly based on the vertical interconnection between the boards, the problems that the position of the surface-mounted connector on the printed board assembly is deviated, the connector is inclined and floated, and the printed board is warped and deformed are solved, so that the realizability and the reliability of the vertical interconnection between the boards are improved.

A projection exposure apparatus and a method for producing a printed circuit board wherein, the whole pattern including pieces 10 and coupons 12 to be exposed on a print circuit board 2 is depicted on a photo mask 1 divided in six areas by divide line 19, the exposure will be made with respect to the each divided area of the photo mask 1 mounted on a movable photo mask stage 5 with using a masking device 3 masking other area than the exposing area.

The invention relates to the technical field of flexible circuit board production, and particularly discloses a manufacturing process of a flexible circuit board. The process comprises the following steps that an adhesive film part is provided; conductive ink and silk-screen printing equipment are provided, wherein the conductive ink is printed on one side of the adhesive film part by using the silk-screen printing equipment to form a conductive circuit; and an injection mold is provided, wherein a plastic part is formed on the adhesive film part in an injection molding mode by using the injection mold, the conductive circuit formed by printing the conductive ink on the adhesive film part is clamped between the adhesive film part and the plastic part, and the adhesive film part, the conductive ink and the plastic part are combined to form the flexible circuit board. Processes of electroless plating copper, etching and the like of a flexible circuit board in the prior art are cancelled,so that a production process flow of the flexible circuit board is greatly simplified, the production of the flexible circuit board is simpler and more controllable, the production efficiency of theflexible circuit board is improved, and the manufacturing cost of the flexible circuit board is reduced.

The invention belongs to the field of high-power pulses, and particularly relates to a closed planar three-electrode spark switch and a preparation method thereof. The closed planar three-electrode spark switch sequentially comprises a bottom layer PCB, a circuit layer, a PP layer and a top layer PCB, and the bottom layer PCB is a substrate of a switch circuit layer; the circuit layer comprises ananode, a cathode, a trigger electrode and a bonding pad connected with the anode, the cathode and the trigger electrode; pad windows are formed in the PP layer corresponding to the bonding pad, and electrode windows are formed in the PP layer corresponding to the electrodes; a bonding pad groove is formed in the position, corresponding to the bonding pad, of the top layer PCB, and a blind grooveis formed in the position, corresponding to the electrode, of the top layer PCB; the PP layer is used as a dielectric layer for bonding the top layer PCB and the bottom layer PCB, and the bottom layerPCB and the bottom layer PCB are laminated by using the PP layer, so that a cavity is formed in the whole switch. The planar three-electrode spark switch is made into a closed type by using a printedcircuit board technology, so that the working environment of the switch is stabilized, the high overload resistance of the switch is improved, the cost is greatly reduced, and the planar three-electrode spark switch can be widely applied to pulse power systems such as exploding foil exploders and electric cannons.

The invention discloses a three-dimensional conductive circuit and a preparation method thereof. A designed circuit groove formed by an organic material layer is adopted, the depth of the groove is 1-1.25 times of the height of a conductive circuit, the designed circuit groove formed by the organic material layer is filled with conductive slurry, the conductive slurry is solidified, then the organic material layer is removed, and the conductive circuit is formed through heat treatment of the conductive slurry. According to the three-dimensional conductive circuit, the organic material layer isused as a groove die orifice, the depth of the groove is 1-1.25 times of the height of the conductive circuit, the groove precision is high, the shape and the circuit precision are controlled to be close to ideal design values, and the high-precision conductive circuit can be prepared.

The invention discloses a high speed rigid-flexible PCB design method. The high speed rigid-flexible PCB design method comprises steps that S101, a number of layers, thickness, base materials of a flexible region and a rigid region, a length of a flexible region, and an impedance expected control value are determined; S102, the laminated structure of the rigid-flexible PCB is determined; S103, impedance, a line width, and a line interval of a rigid region are calculated, and the difference wiring parameters of the rigid region are determined; S104, a grid copper wire width and the line width are determined according to the difference wiring parameters of the rigid region; S105, the design of the high speed rigid-flexible PCB is completed according to the laminated structure and rigid-flexible region wiring constraints. By adopting the reasonable laminated structure, a mutual influence problem of adjacent single chip impedances caused by the bending of the flexible region of the rigid-flexible PCB is solved, and the grid copper wires are used to constrain the wiring parameters of the flexible region and the rigid region to be consistent with each other, and reflection caused by a variable wire width of a flexible-rigid transition region is prevented; by controlling intervals among the high speed signal lines of the flexible region, signal integrity is prevented from being damaged by crosstalk between the high speed signal lines.

A vehicle-mounted Ethernet circuit board relates to the field of automobile electronic technologies, and aims at solving the technical problem in anti-interference. The circuit board comprises a PCB substrate, and an Ethernet driving module and an Ethernet connecting piece mounted on the PCB substrate; the PCB substrate is printed with differential and backflow lines through which the Ethernet driving module is mounted with the Ethernet connecting piece, differential and backflow lines are laid on layers not adjacent to each other, and the differential line is provided with first and second common-mode inductors, first and second static inhibition diodes, first to fourth filtering capacitors and first to fourth filtering resistors. The circuit board provided by the invention is high in anti-interference capability.

The invention provides a mismatch compensation method and a mismatch compensation device for a radio-frequency transmission line. The mismatch compensation method for the radio-frequency transmission line comprises the following steps: extracting scattering parameters of the radio-frequency transmission line within the working frequency range of the radio-frequency transmission line; calculating an impedance value for which the radio-frequency transmission line needs to be compensated according to the scattering parameters; and based on the impedance value for which the radio-frequency transmission line needs to be compensated, determining parameters of an open-circuit transmission line that needs to be added to the radio-frequency transmission line, so that mismatch compensation of the radio-frequency transmission line can be carried out based on the added open-circuit transmission line. The mismatch compensation method and the mismatch compensation device adopting the technical scheme have the advantages that through the addition of the transmission line, the radio-frequency transmission line can be compensated for the mismatched impedance within the working frequency range of the radio-frequency transmission line, so that the mismatch problem of the radio-frequency transmission line can be effectively solved.

The invention discloses a technological process for manufacturing a rigid bent plate. The technological process comprises the steps of selecting a proper copper-clad substrate for cutting operation when the rigid bent plate is manufactured; attaching a circuit board printed in the earlier stage to the copper-clad substrate on the cut copper-clad substrate; etching the circuit after transfer printing, and cleaning the circuit board when the copper film exposed on the circuit board is completely etched; additionally arranging a copper-clad substrate on the etched circuit board, and laminating the copper-clad substrate and the circuit board; metalizing resin and glass fiber of the non-conductor part on the hole wall of the circuit board, and carrying out electro-coppering on the circuit board; mounting an outer layer circuit according to the requirement of manufacturing the circuit board; carrying out copper plating and tin plating on the outer-layer circuit; etching a dry film on the circuit board and the copper under the protection of the dry film, and printing solder mask ink on the circuit board through silk-screen printing; and adopting a depth-controlled milling machine and a Cvertical special milling tool. The rigid bent plate designed by the invention can be bent according to installation requirements so as to adapt to different installation environments.

The invention provides an efficient method and a system for detection of defect for which need grows more and more. In the multiple illumination path system for detection of defect, a plurality of illumination paths irradiate an object simultaneously during the initial scanning of the object to segment the object to a segment in respons to a detected signal acquired during initial scanning, while during scanning for detection of defect of the segment an illumination path is selected to be active phase for each segment in respons to at least a parameter selected from the main material of the segment and surface roughness level of the segment, each segment of the object is illuminated by only the illumination path selected for the object, and a detected signal is generated indicating defect in respons to the illumination step concerned.

The invention relates to a method of realizing a grounding circuit to improve matching characteristics of a microwave multi-layer board. The method comprises the steps of carrying out reasonable distribution verification of metal through holes vertical to the direction of a substrate through simulation software; meanwhile through a signal return path displayed by the simulation software, interconnecting printed boards on the signal path by connecting a radio frequency ground plane with a large ground plane of the back of the multi-layer substrate in a printed board edge gilding manner; and then welding the ground plane of the back of the substrate onto a carrier of a microwave signal common ground plane to reduce the impedance between a micro-strip ground plane and the microwave signal common ground plane and thus optimize the radio frequency path performance.