229 results about "Laser exposure" patented technology

When a ratio R between a total angle φ of a widening angle in a median intensity of light of a light source (a GaN based semiconductor laser) and a total angle 2/φ of a widening angle of light defining a numerical aperture NA of a collimator optical system (collimator lens) is defined as R=(sin⁻¹NA)×2/φ, the numerical aperture of the collimator optical system (collimator lens) is set so that 2.0≧R≧0.58. Thus, an image exposure device is provided that can suppress stray light of a light source that emits a large amount of stray light.

Consistent with the present invention, tissue adhesive compositions and an associated laser exposure system are provided for bonding or sealing biological tissues. The compositions are comprised of chemically derivatized soluble collagen which is formulated to concentrations ranging from 300 mg/ml (30%) to 800 mg/ml (80%) collagen protein. In particular, Type I collagen, for example, is first prepared by extraction from bovine or porcine hide and purified. The collagen preparations are then chemically derivatized with sulfhydryl reagents to improve cohesive strength and with secondary derivatizing agents, such as carboxyl groups, to improve the adhesive strength of the solder to the tissue. The compositions are then formed into viscous solutions, gels or solid films, which when exposed to energy generated from an infrared laser, for example, undergo thermally induced phase transitions. Solid or semi-solid protein compositions become less viscous enabling the high concentration protein to penetrate the interstices of treated biological tissue or to fill voids in tissue. As thermal energy is released into the surrounding environment, the protein compositions again become solid or semi-solid, adhering to the treated tissue or tissue space.

A lithographic printing plate precursor is disclosed, comprising a metal support having formed thereon an anodic oxide film, and an image-forming layer containing a light-to-heat converting agent, or a light-sensitive layer capable of image-forming with infrared laser exposure provided in this order from the support.

A laser-ablatable element for direct laser engraving has a laser-ablatable, relief-forming layer that has a relief-image forming surface and a bottom surface. This relief-forming layer includes a laser-ablatable polymeric binder and an infrared radiation absorbing compound that is present at a concentration profile such that its concentration is greater near the bottom surface than the image-forming surface. This arrangement of the infrared radiation absorbing compound provides improved ablation efficiency, particularly when laser exposure is carried out adiabatically.

The invention discloses a nanolithography method and a nanolithography device in the technical field of nanolithography. The device comprises a femtosecond laser device, a light transmittance base plate, a photoetching mask plate, photoresist and a substrate. A specific super-diffraction limit graph is formed on the photoetching mask plate through the femtosecond laser device; a plasma excimer excitation structure on the upper surface of the photoetching mask plate is changed, and an exposure wavelength is adjusted by controlling the material of the photoetching mask plate, so that the shape, the distribution and the size of the super-diffraction limit graph can be controlled; moreover, a two-photon absorption phenomenon of the photoresist is introduced; and the line width of an exposure graph of the photoresist is controlled by controlling the power of a femtosecond laser exposure light source.

According to the present invention there is provided a method for lithographic printing comprising the following steps: preparing a lithographic printing plate by image-wise laser exposing a heat-sensitive non-ablatable wasteless imaging element comprising a compound capable of transferring light into heat and having on a support as top layer a heat sensitive image forming layer comprising a heat-switchable binder which layer becomes more hydrophilic or more hydrophobic under the action of image-wise laser exposure; mounting said printing element on the press prior to or after the exposure; and applying a fountain solution and ink, characterized in that said fountain solution comprises at least one water insoluble compound selected from the group consisting of silica, alumina, titanium oxide, tin oxyde, china clay, smectic clay and zirconium oxide.

Embodiments of the instant invention are directed to laser exposure system that employs a pulsed solid state laser to provide a reactive response wavelength and a pulse repetition rate specifically optimized for application to solidification of a liquid photopolymer in a stereolithographic process. The solid state laser employs two second harmonic crystals for generating an emission wavelength at about 320-345 nm and a pulse repetition rate, wherein the pulse repetition rate is selected such that a pulse separation at the target surface results which is less than a diameter of the beam when the beam is being scanned at a desired velocity and an average exposure deposited by the beam is equal to a desired amount.

A color image-forming material capable of drawing an image by infrared laser exposure and excellent in image visibility, storage stability and white light stability, and an on-press development or non-processing (non-development) type lithographic printing plate precursor ensuring high sensitivity and high press life and being excellent in image visibility, on-press developability and the like, are provided, which are a color image-forming material comprising an image recording layer capable of drawing an image by infrared laser exposure, the color image-forming material forming a color image without passing through a development processing step after image recording, wherein the image recording layer comprises (A) an infrared absorbent, (B) a cyclic color-forming compound having a cyclic structure within the molecule and forming a dye by a ring opening, and (C) a dye stabilizer which is a compound interacting with the cyclic color-forming compound to stabilize the ring-opened dye body and cause color formation and which is released from the interaction upon laser exposure to decrease in the color formation; and a lithographic printing plate precursor using this color image-forming material.

Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an aminoantraquinone skeleton, a photopolymerization initiator (C), and a compound (D) having two or more ethylenically unsaturated groups within one molecule thereof, the composition being sufficiently colored while controlling absorption in the ultraviolet region using the coloring agent composed of a compound having an aminoantraquinone skeleton, having high sensitivity to ultraviolet and laser exposure, and providing good dry tack in a state of a dry coating film.

An n-type TFT and a p-type TFT are realized by selectively changing only a cover coat without changing a TFT material using an equation for applying the magnitude of a difference in the Fermi energy between an interface of semiconductor and an electrode and between an interface of semiconductor and insulator. At this time, in order to configure a predetermined circuit, the process is performed, as a source electrode and a drain electrode of the p-type TFT and a source electrode and a drain electrode of the n-type TFT being connected all, respectively, and an unnecessary interconnection is cut by irradiating light using a scanning laser exposure apparatus or the like.

The invention discloses a fan-out package method of an embedded silicon substrate. The fan-out package method comprises the following steps of firstly, embedding a chip onto a silicon substrate wafer in a wafer level; secondly, laminating a plurality of silicon substrate wafers on a panel for panel level package during a fan out process; and finally, fabricating salient points or planting welding balls in the wafer level. According to the fan-out package method, the chip is embedded onto the silicon substrate wafer and then panel level package is carried out, the maneuverability and the accuracy of package are improved, and the warpage of a panel is reduced; the comprehensive alignment accuracy is improved by respective alignment adjustment on each wafer during direct laser exposure in the panel level process, so that fan-out package processing of a fine-pitch bonding pad chip is facilitated; and during the process from wafer level package to panel level package, the advantages of wide metal wiring line width, small line distance and high accuracy of wafer level package and the multiplied package quantity of the panel level package are combined, the package quality and efficiency are obviously improved, and the package cost is greatly reduced.

The invention discloses preparation equipment for a large-size fine embossed metal plate. The preparation equipment comprises a control device, a movable beam, an X-axis grating ruler, a stand, an X-axis motor driving assembly, a Y-axis motor driving assembly, a Y-axis grating ruler, a laser exposure head and a Z-axis automatic ranging lifter; a backer plate and a locating point are arranged on the stand; two sides of the stand are provided with X-axis moving guide rails, and at least one side of the stand is provided with the X-axis grating ruler; the movable beam is arranged on the X-axis moving guide rails at two sides; the movable beam is driven by the X-axis motor driving assembly to move along the X-axis and detected and located by the X-axis grating ruler; and the movable beam is provided with Y-axis moving guide rails, the Y-axis grating ruler and the Y-axis motor driving assembly, i.e., the movable beam is provided with the laser exposure head moving along the Y-axis and a mounting support is driven by the Y-axis motor driving assembly along the Y-axis moving guide rails and located by the Y-axis grating ruler.

The invention provides a planographic printing plate precursor that is writable by laser exposure and is composed of a support, a photosensitive recording layer formed on the support, and a backcoat layer containing an epoxy resin, the backcoat layer being formed on the side of the support opposite to the photosensitive recording layer side; and a stack of the planographic printing plate precursors. According to the invention, scratches on the photosensitive recording side of the planographic printing plate precursor can be prevented when brought into contact with another planographic printing plate precursor in the stack without interleaving slip sheets, and productivity in a plate making process can be improved.

The invention provides a planographic printing plate precursor that is capable of providing a planographic printing plate in which ablation at the time of infrared laser exposure is inhibited and which has excellent developability of a non-image portion and printing durability of an image portion. The photosensitive planographic printing plate precursor, includes: an image recording layer on a hydrophilic support, the image recording layer including: (A) an infrared absorber; and (B) a copolymer having a repeating unit having a zwitterionic structure in a side chain thereof, and a repeating unit having a heteroalicyclic structure or a repeating unit having a hetero atom and an alicyclic structure in the main chain thereof.

A method for manufacturing a resin-embedded semiconductor light-emitting device that is capable of preventing a semiconductor film from being damaged when a growth substrate is delaminated using a laser lift-off method, and that is capable of preventing foreign matter from adhering to the semiconductor film when a resin material is applied. A laser exposure step to delaminate the growth substrate from the semiconductor film comprises a first laser exposure step for performing laser exposure at an energy density at which the resin is broken down but the semiconductor film is not broken down, in a range including a portion adjacent to at least one section of the semiconductor film divided by dividing grooves and at least one section of resin, and a second exposure step for performing laser exposure at an energy density at which the semiconductor film can be broken down in a range including at least one section.

A method of on-press developing a laser sensitive lithographic printing plate with ink and/or fountain solution is described. The printing member comprises on a substrate a photosensitive layer soluble or dispersible in ink and/or fountain solution and capable of hardening upon exposure to a laser. The plate is exposed with a laser and on-press developed with ink and/or fountain solution. The exposure and development are performed with the plate under lightings that contain no or substantially no radiation below a wavelength selected from 400 to 650 nm, or in the dark or substantially dark.

The invention discloses a production process for an anti-counterfeiting tamper-evident traceable holographic fixing label. The production process comprises the following steps of: performing holographic laser exposure on a photosensitive material, treating to obtain an embossment type phase hologram, manufacturing a master plate of a die pressing holograph, filling convex and concave interference fringes on the surface of the master plate, electroplating metal nickel on the surface of the master plate to manufacture a metal master plate for batch printing, copying the interference fringes on the holographic master plate on the metal master plate, mounting the metal master plate on a die press, using a die-pressed holographic thin film material for the holographic anti-counterfeiting heating of paper money, pressing the metal master plate on the thin film material under the pressure of 0.2 to 0.4Pa, separating the metal master plate from the thin film material after the thin film material is cooled and formed to form the fringes completely the same as those of the metal master plate on the surface of the holographic material, and manufacturing the holographic laser label by using the fringes which form the die pressing hologram. The problem of secondary transfer of an anti-counterfeiting trademark is solved; and when the label is torn from a package, an image on the label is beyond recognition, and cannot be reused, so that a temper-evident aim is fulfilled.

Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.

An embedded die package and method of manufacture, the die package comprising a die having I/O contact pads in a passivation layer wherein the die contact pads are coupled to a first side of a feature layer by an adhesion/barrier layer, and a layer of pillars extends from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material and wherein the feature layer comprises routing lines that are individually drawn by laser exposure of photoresist under guidance of an optical imaging system for good alignment with both the I/O contact pads of the die and with the subsequently to be deposited pillars that are positioned with respect to the package edges.