24 results about "Laser exposure" patented technology

The invention provides an ATR low-power-consumption laser exposure method, system and device and a storage medium, is applied to a laser transmitter, and comprises the following steps: respectively determining a first time exposure window and a second time exposure window according to preset ATR pre-frame and post-frame counting parameters; obtaining a target point image data stream in real time and synchronously extracting a field synchronization signal; outputting a first pulse driving signal based on the field synchronization signal and the first time exposure window, and driving a laser to perform pre-exposure; and after the pre-exposure is finished, outputting a second pulse driving signal based on the field synchronization signal and the second time exposure window to drive the laser to finish formal exposure, thereby realizing low-power-consumption laser exposure control. According to the method, the system, the equipment and the storage medium, heating of the laser is reduced by adopting a pulse driving mode, and the imaging quality and stability are ensured through stage laser time sequence control on the premise of ensuring synchronous acquisition of target point image data streams.

Embodiments of the present disclosure include optical elements and methods of forming the same using light-based patterning in solidified molten halide material. Other embodiments include systems that include such optical elements. The light-based patterning may be performed, for example, by forming silver-comprising nanostructure inclusions in a solidified silver halide film using ultraviolet (UV) laser exposure.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

The utility model relates to the technical field of feeding and discharging of exposure machines, in particular to an automatic feeding and discharging mechanism suitable for a PCB (printed circuit board) laser exposure machine, which comprises an exposure machine and a support frame, an exposure workbench is arranged on the exposure machine, and a feeding transmission mechanism and a discharging transmission mechanism are arranged on the support frame. The feeding conveying mechanism and the discharging conveying mechanism are located at the two ends of the supporting frame respectively, the exposure workbench is located between the feeding conveying mechanism and the discharging conveying mechanism, and the supporting frame is provided with a feeding arm used for conveying PCBs between the feeding conveying mechanism and the exposure workbench. The supporting frame is further provided with the discharging arm used for conveying the PCB between the exposure workbench and the discharging conveying mechanism, the feeding arm and the discharging arm are arranged on the supporting frame, and the feeding arm and the discharging arm operate independently and do not interfere with each other, so that the working efficiency is improved.

The application discloses a laser ranging method and device. The laser ranging method comprises the following steps: a first storage space is arranged, and an adjustment difference value is arranged; the first storage space is used for storing a data; laser exposure is started; a data output by a TDC in real time is compared with a first data in the first storage space; according to a comparison result, the first data is added or subtracted by the adjustment difference value to be saved in the first storage space as updated data, wherein the first data is preset with an initial value; until the exposure is finished, the comparison step is stopped; and a distance measurement value of an object is determined according to the value of the first data. The laser ranging method can reduce the use of a memory, so that the area of a ranging chip is significantly reduced.

Embodiments of the present application provide a kind of laser direct writing image detection method, system and related equipment, through the detection of the offset of the light spot of different lasers in the same time in horizontal direction, the accurate positioning of image deformation area position on complete exposure range and the measurement of deformation amount are realized.The method comprises: setting multiple groups of non-repeating binary images in horizontal direction to form image sequence, and the position of laser exposure point is obtained by binary processing image sequence;In the process of synchronous scanning of multiple lasers in laser array, the mapping position of exposure point in photosensitive coating in image sequence is exposed by each laser under the control of synchronous switch command, to form latent image of image sequence in the scanning area of each laser respectively;If multiple developed image sequences are not aligned in horizontal direction from the same ordered target binary image, then the coordinate value of difference point of target binary image in each developed image sequence in horizontal direction is detected.

The present application embodiment discloses a method for improving laser exposure accuracy, which is applied to the field of laser direct writing technology, including: Step 1: obtaining M rows of image strips to be exposed corresponding to any laser of the laser direct writing device, and each row of image strips is divided into N image segments, totaling M*N compensation values; Step 2: The control module of the laser direct writing device controls the laser to emit light based on the M*N compensation values, exposing the M rows of image strips row by row in order from first to last, so that the M rows of image strips are accurately exposed. This method improves image exposure accuracy by first dividing each row of the M rows of image strips exposed by each laser into N segments, obtaining M*N image segments, and then accurately exposing each image segment based on the M*N compensation values.

The invention relates to the technical field of metal 3D printing, and discloses an LPBF metal 3D printing method and system based on discrete point dynamic regulation, and the method comprises the steps: decomposing a slice layer contour range of a 3D model into a dot matrix with set density and uniformly distributed scanning points; setting laser parameters of each scanning point in the dot matrix, wherein the laser parameters comprise power and exposure time; based on a dot matrix, planning a scanning sequence of all scanning points as a scanning path; controlling the laser to scan according to the scanning path, and scanning each scanning point on the scanning path by adopting the corresponding laser parameter; and converting to the next layer of slice of the 3D model, and repeating the steps until the scanning of the whole 3D model is completed. According to the method, a traditional one-dimensional vector line scanning path is converted into a zero-dimensional and programmable dot matrix, each scanning point is independently endowed with scanning power and laser exposure time, inertia-free scanning of any geometric path and complex characteristics is achieved, and the method is suitable for aerospace lightweight dot matrix structures, medical porous implants and other application scenes.

FIELD: ophthalmology.SUBSTANCE: used to determine the boundaries and area of a hidden peripheral retinal break. First, a linear segmental wide-field OCT scan is performed and a hidden peripheral retinal tear is identified. Using targeted OCT angiography, the scanning lines of two structural B-scans are aligned horizontally and vertically in the rupture zone. Points are identified along the border of the retinal break, these points are transferred and marked on the frontal OCTA image in the “Draw” mode of the Angio Retina program. The boundaries of the hidden gap are determined and the gap area is automatically calculated using the Angio Analytics program.EFFECT: ability to dynamically monitor the size of a hidden retinal tear, including before and after laser exposure, for timely prevention of the development of rhegmatogenous retinal detachment due to objective visualization of the hidden boundaries of the defect and automated high-precision measurement of its area in real time.1 cl, 3 ex

The invention discloses laser exposure equipment and a circuit board production process, the laser exposure equipment comprises a fixed rack, a laser exposure assembly is fixedly arranged on the upper surface of the fixed rack, a cleaning module is further arranged on the fixed rack, and a copper plate bearing assembly is composed of a movable base and a bearing plate. In the irradiation exposure processing process of a common exposure device for a copper-clad plate, due to the risk that the copper-clad plate is polluted again in the process that the copper-clad plate is carried to the exposure device after being cleaned, the exposure device with the cleaning module is designed, the copper plate can be automatically moved to the cleaning module through the arrangement of the copper plate bearing assembly, and the cleaning efficiency is improved. The copper plate is automatically blown and cleaned through the shielding unit and the blowing unit, the lifting unit is adopted, a one-way inclined air channel is automatically formed, foreign matter directional movement and one-way clean air flow during cleaning are achieved, and pollutants are prevented from being reversely diffused.

The invention provides LDI solder resist ink and a preparation method thereof, and the preparation method comprises the following steps: mixing hyperbranched polyester polyol and composite epoxy resin in a first solvent in an inert atmosphere, adding a functional additive in the heating process, and reacting to obtain hyperbranched photosensitive resin; the preparation method comprises the following steps: under the protection of nitrogen, heating and polymerizing a hydroxyl-containing acrylate monomer and flexible polyol in a first solvent, and then adding anhydride and isocyanate for esterification and addition reaction to obtain polyurethane acrylic resin with carboxyl and a double-bond structure; and dispersing and mixing the hyperbranched photosensitive resin, the polyurethane acrylic resin and the filler under the condition of constant temperature, and filtering and defoaming to obtain the LDI solder resist ink. A resin structure with flexible support and photosensitive double bonds is constructed, so that the finally obtained LDI solder resist ink can be imaged under a high-energy density laser exposure condition, and the problems of pattern collapse and unclear side walls of the traditional solder resist ink in a laser direct writing process are solved.

The application relates to the technical field of metal 3D printing, and discloses an LPBF metal 3D printing method and system based on dynamic regulation and control of discrete points, which decomposes the slice layer contour range of a 3D model into a dot matrix with a set density and uniform distribution of scanning points; laser parameters of each scanning point in the dot matrix are set, including power and exposure time; based on the dot matrix, the scanning sequence of all scanning points is planned as a scanning path; the laser is controlled to scan according to the scanning path, and each scanning point on the scanning path is scanned by using the corresponding laser parameter thereof; the next slice of the 3D model is converted, and the above steps are repeated until the scanning of the entire 3D model is completed. The application converts a conventional one-dimensional vector line scanning path into a zero-dimensional and programmable dot matrix, each scanning point is independently given scanning power and laser exposure time, inertia-free scanning of an arbitrary geometric path and complex features is realized, and the application is suitable for application scenarios such as aerospace lightweight dot matrix structures, medical porous implants and the like.

The invention relates to the technical field of precision manufacturing and measurement, in particular to a method for marking on the surface of a product through a spatial size marking device. Comprising a spraying unit, a target unit, a data acquisition and fitting unit and a laser exposure unit which form continuous connection in front and back logic: a developer firstly completes the process from liquid storage, regulation and control to atomized deposition through the spraying unit, and a uniform photosensitive film is formed on the surface of a product; then, a target unit is fixed in the film coverage area and corresponds to an optical system of the data acquisition and fitting unit, and a reliable three-dimensional coordinate reference is established; on the basis, a data acquisition and fitting unit acquires point cloud according to a coordinate reference and completes operation processing, and a fitting result is converted into a control parameter; and finally, the laser exposure unit receives and executes the parameters, and drives the ultraviolet laser and the micro-displacement platform to form a physical mark on the developer layer. The method is higher in precision and suitable for large complex products such as spacecraft skins, automobile metal plates and wind power blades.

The utility model relates to the technical field of laser engraving, in particular to a laser engraving device. The device comprises a sliding guide rail, a first fixing plate, a second fixing plate, a first rotating shaft, a second rotating shaft and a laser generator, the first fixing plate and the second fixing plate are arranged at the two ends of the sliding guide rail respectively, the first rotating shaft and the second rotating shaft are fixed to the two ends of the sliding guide rail respectively, and the first rotating shaft is rotationally arranged on the first fixing plate; the second rotating shaft is rotatably arranged on the second fixing plate. The laser generator is slidably arranged on the sliding guide rail. Compared with the prior art, according to the laser engraving device, the laser generator is slidably arranged on the sliding guide rail so that horizontal movement can be achieved, meanwhile, the sliding guide rail can drive the laser generator to rotate, and therefore the engraving direction is changed, and engraving or cutting can be conducted from the side face of an object; the laser engraving device can avoid the danger of laser exposure caused by heightening of the laser engraving device, additional accessories are not added, and the cost is reduced.

A substrate with a marking consisting of microscopic metallurgical structures (3) randomly arranged on the substrate's surface, each exhibiting at least one physical and / or chemical property that differs from the rest of the substrate. At least one structure comprises an element where exposure to radiation, an external electric or magnetic field, chemical attack, or mechanical, thermal, or electrical stress causes a temporary or permanent change in at least one physical or chemical property of the structure. The structures may consist of a first alloy (31) and a second alloy (32) that differ from each other. Alloy 31 permanently and stably changes color upon exposure to laser radiation, while alloy 32 exhibits high reflectivity and is therefore stable against laser exposure.

The invention discloses a laser exposure system and method. The system comprises a control module and a laser emission module in signal connection with the control module, a plurality of exposure formulas are stored in the control module, and each exposure formula is associated with a specific material number identifier and comprises at least two groups of laser control parameters; the laser emission module comprises at least one multi-attribute laser light source, and the multi-attribute laser light source is configured to generate at least two laser outputs with different exposure attributes; wherein the control module is configured to call a corresponding exposure formula in response to selection of a target material number, control the multi-attribute laser light source to sequentially or synchronously output corresponding laser according to a plurality of groups of laser control parameters in the formula, and improve the exposure quality and uniformity through formulated multi-attribute laser cooperative control, so that the exposure quality and uniformity of the target material number are improved. The flexibility of equipment is greatly enhanced, the operation is simplified, and the process stability is ensured.

The invention discloses a processing method for manufacturing a precise circuit. The processing method comprises the following steps of: drilling a copper-clad substrate by using a drilling machine; generating a circuit pattern on the surface of the copper foil coated with the photosensitive dry film by using a laser beam according to a design file; putting the copper-clad substrate subjected to laser exposure treatment into a developing solution, and removing the photosensitive dry film in an unexposed area to expose the surface of the copper foil; after the exposed copper foil is pretreated, a first copper plating layer is deposited on the surface of the copper foil through chemical copper plating; the first copper plating layer is covered with the photoresist dry film again for secondary exposure, the part needing to be metalized is reserved, and electroplating thickening is carried out to obtain a second copper plating layer; and removing the photoresist dry film by using strong base, and removing the redundant copper layer by using flash etching liquid to obtain the circuit board. According to the invention, the required circuit copper is plated, then the redundant bottom copper is etched, and the local secondary copper plating is carried out, so that a plurality of procedures in the traditional process are reduced, the production period is shortened, the yield is improved, the usage amount of chemical agents is reduced, and the risk of environmental pollution is reduced.

A flange plate and a protective gas nozzle of the gas protection device are respectively arranged at the top end and the bottom end of a protective gas cylinder body, a protective gas input hole is formed in the side wall of the top end of the protective gas cylinder body, and a spiral semicircular groove is formed in the outer wall of the protective gas cylinder body from top to bottom. The cooling pipeline is spirally embedded in the spiral semicircular groove, and a cooling water inlet and a cooling water outlet are formed in the two ends of the cooling pipeline respectively. The device is simple in structure, convenient to disassemble and assemble, small in size and convenient to maintain, surrounding protection of a laser exposure area and protection of inert gas of a molten pool are achieved, it is ensured that the cladding process and the shape, quality and performance of a cladding layer are controllable, cooling of the device in the machining process is achieved, overheating of the device in the cladding process is avoided, and the service life of the device is prolonged. And the risks that the whole system is damaged and loses efficacy, and machining is forced to stop are greatly reduced.

The application relates to a back contact solar cell manufacturing method, which comprises the following steps: dividing a second main surface of a semiconductor substrate into a first semiconductor area and a second semiconductor area; sequentially forming a first conductive type film layer, a first insulating film layer and a laser absorption sacrifice layer on the second main surface of the semiconductor substrate; the laser absorption sacrifice layer comprises a silicon-based laser absorption film layer, a second insulating film layer and a protective film layer which are sequentially formed on the first insulating film layer; removing part of the film layer of the laser absorption sacrifice layer on the second semiconductor area by using a first laser to expose the second semiconductor area by using a laser exposure ablation process; sequentially removing the laser absorption sacrifice layer, the first insulating film layer and the first conductive type film layer remaining in the first laser exposure area by using a chemical etching process to form an opening of the second semiconductor area; and then performing chemical cleaning to expose the silicon-based laser absorption film layer of the first semiconductor area. The application aims to ensure production efficiency and prevent the problem of heterojunction film thermal decay.

The invention provides an exposure process for enhancing the refractive index variation of a chalcogenide glass film, and belongs to the technical field of film optical performance regulation and control. Comprising the following steps: preparing a chalcogenide glass film on a soda-lime glass substrate; placing the thin film in a preset atmosphere environment; a laser with the wave band matched with the absorption wave band of the chalcogenide glass thin film is adopted for carrying out laser exposure treatment on the thin film, the refractive index of the thin film can be changed, and the refractive index change amount higher than that in the air atmosphere can be obtained in the oxygen-enriched atmosphere. According to the invention, the refractive index change amount of the chalcogenide glass film can be obviously enhanced only by regulating and controlling the environmental atmosphere during laser exposure.

The invention provides a liquid crystal polarizing body grating and a preparation method thereof, and relates to the technical field of liquid crystal optical element preparation, and the preparation method of the liquid crystal polarizing body grating depends on the photo-orientation polarization holographic technology of a 405nm wavelength laser, takes a single-layer glass substrate as a carrier, and adopts a single-layer glass substrate as a substrate. The double-sided polarizer grating structure with opposite chirality and matched parameters is accurately prepared according to the process of double-sided coating of a light alignment agent, fractional laser exposure and fractional coating and curing of liquid crystal. The polarization body grating layers with opposite inherent chiral induction directions and matched grating parameters are accurately prepared on the front face and the back face of the single-layer glass substrate, the preparation technology is remarkably simplified, the production cost is reduced, the structural stability and the optical performance of a product are effectively improved, and meanwhile the thickness and the weight of the optical waveguide module are greatly reduced.

The application discloses a kind of laser exposure equipment and circuit board production process, comprising: fixed frame, the upper surface of the fixed frame is fixed with laser exposure component, the fixed frame is also provided with cleaning module, the copper plate bearing assembly is made of moving base and bearing plate, to solve the prior art, ordinary exposure equipment in the process of irradiation exposure processing to copper-clad plate, since copper-clad plate is contaminated again after being cleaned, the process of being transported to exposure equipment, the application designs the exposure equipment with cleaning module, by the setting of copper plate bearing assembly, copper plate can be automatically moved to cleaning module, by shielding unit and spray unit, automatically spray and clean copper plate, and lifting unit is used, automatically form unidirectional inclined air duct, realize the directional movement of foreign matter when cleaning, unidirectional flow of clean air flow, prevent the reverse diffusion of pollutants.

The present disclosure relates to a lensed optical fiber having a lens applied onto an end face of an optical fiber by laser beam processing. The lens having a radius of curvature that is greater than the diameter of the optical fiber. The lens is applied onto the end face of the optical fiber by laser beam processing in which a laser beam is applied onto the end face of the optical fiber to create the lens. The laser beam has a wavelength ranging between 2.65 microns and 2.85 microns.

The invention relates to a side wiring manufacturing method of a double-sided circuit substrate, which is characterized in that an upper metal circuit layer and a lower metal circuit layer are arranged on the upper surface and the lower surface of a substrate body of the provided double-sided circuit substrate, a side circuit substrate layer is formed on the side surface of the provided double-sided circuit substrate, and a photoresist substrate layer covers the outer surface of the side circuit substrate layer. Laser irradiation exposure and development are carried out on the photoresist base material layer to form a patterned photoresist layer, then etching is carried out to form a side face wire connecting the upper metal circuit layer and the lower metal circuit layer, and the patterned photoresist layer is removed. Wherein the light resistance substrate layer is irradiated by laser for exposure and then is developed to form the patterned light resistance layer, so that a user can design the pattern and the position of the patterned light resistance layer according to different product requirements by means of the performance that the laser irradiation position can be modulated and controlled, and a mask with a specific pattern does not need to be used.