898results about How to "Reliable removal" patented technology

An intravascular obstruction removing wire includes an elongate wire body, at least two non-branched wire portions having distal ends and proximal ends which are connected to a distal end of the wire main body, and a plurality of filament portions extending across the wire portions. The non-branched wire portions and the filament portions form a trapping portion. The trapping portion is deformable from a large-diameter state in which the non-branched portions branch to the distal end of the wire body forward in different directions and the filament portions are separated from each other, so that a space surrounded by the non-branched wire portions and the filament portions is formed to trap therein an obstruction in a blood vessel, to a small-diameter state in which the non-branched wire portions are positioned so that a distance between the wire portions is smaller than that of the wire portions in the large-diameter state.

An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be processed along a line to cut are separated from each other on the expandable tape 23. This electric action causes particles remaining on cut sections of the semiconductor chips 25 to eject therefrom even when a molten processed region is formed in the cut sections Therefore, particles remaining on the cut sections of the chips 25 can reliably be removed.

A portable, lightweight digital imaging device uses a slit scanning arrangement to obtain an image of the eye, in particular the retina. In at least one embodiment, a digital retinal imaging device includes an illumination source operable to produce a source beam, wherein the source beam defines an illumination pathway, a scanning mechanism operable to cause a scanning motion of the illumination pathway in one dimension with respect to a target, an optical element situated within the illumination pathway, the optical element operable to focus the illumination pathway into an illumination slit at a plane conjugate to the target, wherein the illumination slit is slit shaped, a first two dimensional detector array operable to detect illumination returning from the target and acquire one or more data sets from the detected illumination, wherein the returning illumination defines a detection pathway, and a shaping mechanism positioned within the illumination pathway, wherein the shaping mechanism shapes the source beam into at least one arc at a plane conjugate to the pupil. In at least one exemplary embodiment, the digital retinal imaging device is operable to minimize at least one aberration from the optical element or an unwanted reflection from the target or a reflection from a device.

A pressure barrier apparatus 2 for providing a removable pressure barrier in a borehole is described. The apparatus comprises a housing 6, 8 defining a central bore 10 having a first part 20 and a second part 22 separated by an erodeable pressure barrier member 18. The housing also defines a second fluid flow passage 12 for connecting the first part to the second part, and a plurality of conduits 24 for directing fluid onto the barrier member. A sleeve 30 has a first condition in which fluid communication between the first part 20 and the second fluid flow passage 12 is prevented, and a second condition in which fluid is permitted to flow from the first part to the second fluid flow passage to cause erosion of the barrier member.

An adhesive sheet for an artificial nail comprises a releasable protective film having, at a tip end side of a bare nail to which a double-sided adhesive sheet member is attached, a peeling tongue piece having a width smaller than the width of the double-sided adhesive sheet member and projecting outward from the double-sided adhesive sheet member, wherein the double-sided adhesive sheet member and the releasable protective film are chamfered in a convex R shape from a base end of the peeling tongue piece toward both sides in a width direction.

An LED illumination device includes LED lamp modules 34 coupled in a vertical direction. Each of said LED lamp modules 34 includes a base 12, a bus bar circuit 35 formed on the base 12, and a cover 25 connected to the base 12 to cover the bus bar circuit 35. A locking frame 14 (coupling portion) to be coupled with the upper LED lamp module 34 is formed on said base 12. A locking arm 32 (mating coupling portion) to be coupled with said locking frame 14 on the base 12 of the lower LED lamp module 34 is formed on said cover 25. Further, a guiding groove 18, into which said locking arm 34 is inserted, is formed on said base 12 near the locking frame 14, and a guiding hole 27, into which said locking frame 14 is inserted, is formed on the cover 25 near the locking arm 32.

A non-stick coating, which inhibits frozen moisture accumulation, is applied to exterior exposed portions of heating and cooling systems where ice or other frozen moisture can accumulate and impair system design operational efficiencies; where heat exchange tubing and fins are downwardly sloped or angled; with an optional protective shell encasement which can be shaped to provide a vena contracta effect; with an optional electric fan to enhance airflow for heat exchange; with an optional electric vibrator to enhance inhibition of frozen moisture accumulation; with a downwardly sloped base to direct falling frozen moisture away from the heat exchange equipment; for use in conjunction with an air source heat pump system, an evaporative cooling system or a chiller, or as a supplement to a water-source heat pump system or to a direct expansion heat pump system; and for use with any other refrigerant-based heating system or cooling system.

The present invention relates to a method and a device for removing a cover from a storage box that is closed using a lid-like cover attached thereto at the edges. For removal, the adhesive strength of the cover is reduced in the region of a few of the sealed edges and the cover is then removed by peeling it off the storage box, whereby the cover is peeled off by rolling it onto a roller.

In an ink jet head using a thermal energy for ejecting ink, this invention aims to reliably and uniformly remove kogations deposited on a heat application portion in contact with the ink. To realize this objective, the upper protective layer is arranged in an area including the heat application portion so that it can be electrically connected to serve as an electrode which causes an electrochemical reaction with the ink. The upper protective layer is formed of a material containing a metal which is dissolved by the electrochemical reaction and which does not form, on heating, an oxide film which hinders the dissolution. With this arrangement, a reliable electrochemical reaction can be produced to dissolve a surface layer of the upper protective layer, thereby removing kogations on the heat application portion reliably and uniformly.

Etching interleaved structures of semiconductor material forming fins of finFETs and local isolation material interposed between the fins is performed alternately and cyclically by alternating etchants cyclically such as by alternating gases during reactive ion etching. Etchants are preferably alternated when one of the semiconductor material and the local isolation material protrudes above the other by a predetermined distance. Since protruding surfaces are etched more rapidly than recessed surfaces, the overall etching process is accelerated and completed in less time such that erosion of other materials to which the etchants are less than optimally selective is reduced and allow improved etching of trenches for improved isolation structures to be formed.

The following devices are successively disposed in the following order from an upstream side to a downstream side in an exhaust gas duct of a combustion apparatus: an air preheater, preheating combustion air for use in an exhaust gas treating apparatus; a heat recovery unit, recovering exhaust gas heat at an exit of the air preheater; a precipitator, collecting soot/dust contained in an exhaust gas at an exit of the heat recovery unit; a wet flue gas desulfurizer, removing sulfur oxides contained in the exhaust gas at the exit of the precipitator; and a reheater, heating the exhaust gas at the exit of the wet flue gas desulfurizer. Each of the heat recovery unit and the reheater has a heat exchanger tube, and a circulation line is disposed to connect the heat exchanger tubes. A sulfur trioxide (SO₃) removing agent is supplied to the upstream side of the heat recovery unit, and the temperature of the exhaust gas at the exit of the heat recovery unit is adjusted to not more than a dew point of sulfur trioxide. As the sulfur trioxide removing agent, use is preferably made of at least one among a sulfur trioxide adsorbent, a sulfur trioxide reducing agent, and a sulfur trioxide neutralizing agent. Thus, even when coal with a high sulfur content is used as fuel, heavy metals contained in the exhaust gas can be removed effectively from the exhaust gas.

A degassing device (10), a hydrogen dissolving device (12), and a palladium catalyst column (17) are provided in that order downstream of a high-purity water production device (1), and an impurity removal device (19) is connected to the exit side of treated water of the palladium catalyst column (17). The impurity removal device (19) removes impurity ions which are eluted into the water to be treated or impurity particulates which mix in with the water to be treated during the treatment in the palladium catalyst column (17). The impurity removal device (19) comprises an ion exchange device (20) and a membrane treatment device (21) such as a ultrafiltration membrane device, a reverse osmosis membrane device or the like. By providing an impurity removal device (19) in this manner, it is possible to remove impurities generated during hydrogen peroxide removal treatment by the palladium catalyst and to prevent degradation in quality of hydrogen-dissolved water.

An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.

A method for manufacturing a magnetic recording medium with excellent production efficiency is provided in which the recording layer can be processed into a desired concavo-convex pattern with high precision and the resin layer can reliably and thoroughly be removed. A sub-mask layer having corrosion resistance against an oxygen-containing gas is provided over a main mask layer composed mainly of carbon. Furthermore, an intermediate mask layer is provided between the main mask layer and the sub-mask layer. The intermediate mask layer has corrosion resistance against the oxygen-containing gas, and its etching rate is higher for a halogen-containing gas than for the oxygen-containing gas. The resin layer removing step is conducted between the sub-mask layer processing step and the intermediate mask layer processing step (the main mask layer processing step). The resin layer removing step uses the oxygen-containing gas, and the intermediate mask layer processing step uses the halogen-containing gas.

In a method of fabricating a bonded wafer, an oxide film is first formed on the surface of at least one of two mirror-polished silicon wafers. The two silicon wafers are superposed such that the mirror-polished surfaces come into close contact with each other, and heat treatment is performed in order to join the wafers together firmly. Subsequently, the thickness of one of the wafers is reduced so as to yield a thin film, the surface of which is then polished and subjected to vapor-phase etching in order to make the thickness of the thin film uniform. Optionally, the vapor-phase-etched surface is then mirror-polished. The surface of the bonded wafer is oxidized, and the generated surface oxide film is then removed. In the method, the thickness of the oxide film formed on the surface of the bonded wafer is made not greater than 50 nm. The method reliably eliminates damage and crystal defects generated during etching in accordance with PACE method or subsequent mirror polishing, and thereby enables relatively simple and low cost manufacture of bonded wafers having a very thin SOI layer that has good thickness uniformity and excellent crystallinity.

In a replacement gate approach in sophisticated semiconductor devices, the place-holder material of gate electrode structures of different type are separately removed. Furthermore, electrode metal may be selectively formed in the resulting gate opening, thereby providing superior process conditions in adjusting a respective work function of gate electrode structures of different type. In one illustrative embodiment, the separate forming of gate openings in gate electrode structures of different type may be based on a mask material that is provided in a gate layer stack.

The process for laying a non-full width course of fiber composite tape in a part is designed to ensure that all of the scrap portion of the tape surrounding the non-full width course is deposited in the scrap area and not in the part. An extra cut is made in tape downstream of the non-full width course, between the non-full width course and next course. After the tape head attempts to lay the scrap in the scrap area in the forward direction, the tape head makes a pass in the scrap area with the tape feed and the tape head moving in the reverse direction, and the scrap is laid beginning from the portion of the tape having the extra cut, and progressing to the non-full width course. The method may be used to remove scrap from around non-full width courses having any shape.