342results about How to "Reduced adhesion strength" patented technology

Various embodiments of the present invention are directed to patches for medical devices. In various embodiments, an adhesive patch of a medical device may have selective areas with adhesive material of varying adhesion strengths. In other embodiments, an adhesive patch of a medical device may include adhesive material that may be activated by a catalyst to increase or decrease the adhesion strength of the adhesive material. In further embodiments, a medical device may include a pierceable membrane containing an agent, the pierceable membrane positioned to be pierced by a needle and to cause some of the agent to be carried to the user-patient.

New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

An absorbent article comprises a liquid-permeable top sheet, a liquid-impermeable back sheet, and an absorber mounted between the top sheet and the back sheet. A coating region to which an adhesive is applied is formed in a flat surface direction, on a surface of the back sheet which faces clothing. An endothermic material is provided inside the absorber. A region which, with respect to the thickness direction of the absorbent article, does not face an arrangement region in which the heat endothermic material is provided is formed in at least a part of the coating region to which the adhesive is applied.

The present invention relates to a novel composite for preventing ice adhesion. A superhydrophobic or superhydrophilic surface with a hydrophobic, low freezing point liquid adsorbed onto surface asperities results in a durable, renewable anti-icing surface. The preparation method for novel icing and rain protecting surface is disclosed.

The present invention aims to provide an ink for ink jet recording that is excellent in storage stability and discharge stability and attains high coloration on regular paper or gloss paper and high glossiness on gloss paper. The ink for ink jet recording of the invention includes: water; and a pigment dispersed by using a polymer which is obtained by polymerizing at least 50% by weight or more of benzylacrylate and 15% by weight or less of (meth)acrylic acid as components of the polymer and has an acid value of no less than 50 mgKOH/g and no more than 120 mgKOH/g and a weight average molecular weight of no less than 10000 and no more than 120000.

Hydrogel compositions are provided (a) that have a continuous hydrophobic phase and a discontinuous hydrophilic phase, (b) that have a discontinuous hydrophilic phase and a continuous hydrophilic phase, or (c) that are entirely composed of a continuous hydrophilic phase. The hydrophobic phase, if present, is composed of a hydrophobic polymer, particularly a hydrophobic pressure-sensitive adhesive (PSA), a plasticizing elastomer, a tackifying resin, and an optional antioxidant. The discontinuous hydrophilic phase, if present, is composed of a crosslinked hydrophilic polymer, particularly a crosslinked cellulosic polymer such as crosslinked sodium carboxymethylcellulose. For those hydrogel compositions containing a continuous hydrophilic phase, the components of the phase include a cellulose ester composition or an acrylate polymer or copolymer, and a blend of a hydrophilic polymer and a complementary oligomer capable of hydrogen bonding thereto. Films prepared from hydrogel compositions containing or entirely composed of the aforementioned continuous hydrophilic phase can be made translucent, and may be prepared using either melt extrusion or solution casting. A preferred use of the hydrogel compositions is in wound dressings, although numerous other uses are possible as well.

A method for separating an integrated circuit formed by a thin film having a novel structure or a method for transfer-ring the integrated circuit to another substrate, that is, so-called transposing method, has not been proposed. According to the present invention, in the case that an integrated circuit having a thin film having a novel structure formed over a substrate via a release layer is separated, the release layer is removed in the state that the thin film integrated circuit is fixated, the thin film integrated circuit is transposed to a supporting substrate having an adhesion surface, and the thin film integrated circuit is transposed to another substrate having an adhesion surface with higher strength of adhesion than that of the supporting substrate.

A plastic lined steel pipe characterized by having an adhesive layer on an inner surface of a steel pipe, having a plastic layer on its further inner side, and having an initial shearing adhesion strength between the steel pipe and the plastic layer of 2.0 MPa or more, said steel pipe being a steel pipe given substrate treatment on its inner surface in advance, said substrate treatment comprising forming a phosphate chemical treatment coating treated for grain refinement, and preferably having an epoxy primer layer between the steel pipe and the adhesive layer. A method for producing a plastic lined steel pipe characterized by inserting a plastic pipe having an outside diameter smaller than the inside diameter of the steel pipe subjected to the substrate treatment and having an adhesive layer on its outer surface into the steel pipe, reducing the outside diameter of the steel pipe so as to make the plastic pipe closing contact it, and heating the result at a temperature not less than a melt end temperature of the adhesive layer and less than a melt start temperature of the plastic pipe.

A battery module includes a battery cell, a flexible shell and a supporting seat. The battery cell has a main body and two electrodes extended outwardly from the main body; the flexible shell has an upper and lower lid plates, both of which are connected and cooperated to each other to envelop the battery cell, and which are provided for the electrodes to extend out and respectively have an upper and lower adhesive parts, both of which are adhered to each other; and, the supporting seat is provided for arranging the flexible shell, in which the flexible shell further has an extending part, which is extended from one of the upper, lower adhesive parts towards the supporting seat and has an adhesive layer adhered to the supporting seat by a thermal pressing process, such that the flexible shell and the supporting seat can be connected securely.

A surface-protecting pressure-sensitive adhesive sheet includes: a substrate; and a pressure-sensitive adhesive layer that is provided on at least one side of the substrate and made from a polyester-based pressure-sensitive adhesive composition containing a crosslinking agent and a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit. The dibasic acid unit includes a dimer acid, the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of −70 to −20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C./minute, the polyester-based pressure-sensitive adhesive composition has a hydroxyl value of 20 to 60 mgKOH/g, and the pressure-sensitive adhesive layer has a gel fraction of 85 to 99% by weight.

The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.

A solar cell module is discussed. The solar cell module includes a junction box, a solar cell panel including a plurality of strings of solar cells, each string including a plurality of solar cells that are arranged in a row and are electrically connected to one another, an interconnector for electrically connecting adjacent ones of the plurality of solar cells to one another belonging to at least one of the plurality of strings, a first adhesive member positioned between an electrode part of one of the adjacent solar cells and the interconnector, a lead wire for electrically connecting one end of the interconnector to the junction box, and a second adhesive member positioned between the interconnector and the lead wire. At least one of the interconnector and the lead wire is formed of a lead-free material containing an amount of lead equal to or less than 1,000 ppm.

This invention aims at improvement in reliability of a semiconductor device. In this invention, a semiconductor wafer is irradiated with laser light so as to have a fractured layer formed in the interior of the semiconductor wafer, the semiconductor wafer is mounted on a dicing tape via paste (adhesive layer), then the paste of the dicing tape is hardened by UV irradiation or cooling, and subsequently the semiconductor wafer is bent (breaking). By this process, shifting and movement of semiconductor chips can be prevented because the paste has been hardened at the time of the bending. As a result, the semiconductor chip can be prevented from interfering with adjacent chips and can also be inhibited from generating chipping; therefore, the reliability of a semiconductor device can be improved.

A compound of the formula (I), a lubricant and a magnetic disk using the compound

A—CH₂CF₂O(CF₂CF₂O)m-(CF₂O)n-CF₂CH₂—B   (I)

wherein A is amino group having hydroxyl group, B is hydroxyl group, or amino group having or not having hydroxyl group, wherein m is a real number of 5 to 36, and n is a real number of from 4 to 30.

A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.

The adhesive sheet contains a substrate film and an adhesive layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. The adhesive sheet of the present invention can be used for electronic parts and the like exposed to high temperature particularly because warpage and distortion thereof caused by a high temperature treatment are suppressed, and can improve quality and yield of electronic parts and the like.

In an electrode for an electric double layer capacitor of the present invention, the peak value of particle size distribution of graphite particles added to a conductive adhesive is in a range of 2.6 to 3.2 mum, not less than 100,000 dimples having a largest outer diameter in a range of 4 to 10 mum and a depth in a range of 4 to 15 mum are formed on the surface of the collector sheet per 1 cm<2>, and the occupied area of the dimples to the entire surface area of the collector sheet is not more than 50%. By determining the saponification value of polyvinylalcohol which is used as a binder component of the conductive adhesive in a range of 90.0 to 98.5, adhesiveness of the collector sheet and the electrode forming sheet is improved. Furthermore, by substituting H atoms contained in the polyvinylalcohol with Si atoms, adhesiveness of the collector sheet and the electrode forming sheet can be further improved.

There is provided a method for manufacturing a polyester fiber cord for reinforcing rubber materials that has an excellent adhesive property to rubber materials, and maintains a good adhesive property even after exposed to high temperatures in a state being compounded with rubber materials. Said method is characterized in that a first aqueous processing liquid comprising a blocked polyisocyanate compound is applied to a polyester fiber that has been beforehand provided with an epoxy compound during a yarn manufacturing process or in a state of a twisted cord in an amount of 0.5 to 5.0% based on the fiber weight in terms of solids of the blocked isocyanate compound; the treated yarn is dried at a yarn temperature of >=(A+20)° C., wherein A° C. is a dissociation temperature of the blocked isocyanate, and then subjected to heat treatment; and a second processing liquid comprising resorcin-formalin-rubber latex is applied to the yarn, followed by heat treatment.

In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.

The invention provides preparation methods of a two-component waterborne wear-resisting and low-ice-adhesion anti-icing coating and a coating layer thereof. The two-component waterborne anti-icing coating is composed of a component A containing a core-shell structure polymer emulsion and inorganic nanoparticles and a component B containing a curing agent. An outer layer of the core-shell structure polymer emulsion in the component A of the anti-icing coating is a hydrophilic shell layer, so that polymer emulsion particles can be stably dispersed in water, and the advantages of being green and environmentally friendly are provided. The inorganic nano particles in the component A are rigid particles, can improve the mechanical properties of the anti-icing coating layer, endow the coating layer with excellent wear resistance and prolong the service life of the coating layer. After the coating is cured into a film, the hydrophilic shell layer of the polymer emulsion particles can absorb moisture, and thus a water lubricating layer is formed on the surface of the coating layer; when the coating layer surface is iced, due to the existence of the water lubricating layer, the acting force between ice and the coating layer is decreased, besides, the substrate surface roughness is also reduced, and the contact area between the ice and the substrate is decreased.

A composition comprising a silicone oil or fluorosilicone fluid infused in a cross-linked silicone resin matrix. The silicone oil or fluorosilicone fluid may comprise a linear or branched polymeric siloxane that may be functionalized with one or more of: alkyl, fluoroalkyl, aryl, benzyl, halo, hydride, hydroxyl, -alkyl-OH, -alkyl-SH, halo, -aryl-halogen, -alkyl-COOH, -alkyl(COOH)-alkyl-COO-alkyl, alkenyl, vinyl, -alkyl-acryloyl, -alkylamino, -alkyl-NH-alkyl-NH2, -alkyl-OOC—NH-alkyl-NCO, -alkyl-O-oxiranyl, monofluoromethyl, difluoromethyl, trifluoromethyl, or alkeneoxide co-polymer.