Adhesive sheet, metal-laminated sheet and printed wiring board

a technology of printed circuit board and adhesive sheet, which is applied in the direction of transportation and packaging, synthetic resin layered products, chemical instruments and processes, etc., can solve the problems inability to solve, and easy occurrence of warpage and distortion, etc., to reduce the adhesion strength of flexible metal foil laminate, the effect of suppressing the gelling of polyamic acid and small molecular weigh
US20090056995A1Inactive Publication Date: 2009-03-05TOYOBO CO LTD
17 Cites 25 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
TOYOBO CO LTD
Publication Date
2009-03-05
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The adhesive sheet contains a substrate film and an adhesive layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. The adhesive sheet of the present invention can be used for electronic parts and the like exposed to high temperature particularly because warpage and distortion thereof caused by a high temperature treatment are suppressed, and can improve quality and yield of electronic parts and the like.
Need to check novelty before this filing date? Find Prior Art

Description

REFERENCE TO RELATED APPLICATIONS

[0001] This application is a national stage application under 35 USC 371 of International Application No. PCT / JP2005 / 012624, filed Jul. 1, 2005, which claims the priority of Japanese Applications Nos. 2005-122566, 2005-122567, 2005-122568 and 2005-122569, each filed on Apr. 20, 2005. The contents of the International Applications and the prior Japanese applications are herein incorporated by reference.FIELD OF THE INVENTION

[0002] The present invention relates to an adhesive sheet, a metal-laminated sheet and a printed circuit board. More particularly, the present invention relates to an adhesive sheet used for forming an insulating layer for a printed circuit board and the like to be used for a flexible printed circuit substrate and the like aiming at down-sizing and reducing weight of electronic devices and electronic parts, a metal-laminated sheet wherein a metal foil is laminated on the adhesive sheet and a printed circuit board obtained by processi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More