137 results about "Thermoplastic polyimide" patented technology

The invention discloses a high-cohesiveness polyimide composite film capable of being used for a flexible copper-clad plate and a preparation method of the high-cohesiveness polyimide composite film. The polyimide composite film is composed of a thermosetting polyimide supporting layer and a thermoplastic polyimide bonding layer arranged on at least one face of the thermosetting polyimide supporting layer. An interface layer formed by reacting amino-terminated hyperbranched polyamide grafted silicon dioxide particles with thermosetting polyamide acid is embedded between the thermosetting polyimide supporting layer and the thermoplastic polyimide bonding layer, and an end group of thermoplastic polyimide contains an imidazole ring capable of forming a complex with copper. The amino-terminated hyperbranched polyamide grafted silicon dioxide particles are embedded into the interface of the thermosetting layer and the thermoplastic layer, so that the contact area of the supporting layer and the adhesive layer is increased; the polyimide composite film with high cohesiveness, high dimensional stability, high heat resistance and low glass transition temperature is prepared.

The invention discloses supercritical fluid foaming polyimide wave-absorbing foam and a preparation method thereof.The thermoplastic polyimide is prepared by the steps that aromatic dianhydride, aromatic diamine and aliphatic diamine serve as comonomers, polyimide acid is generated through solution polymerization, and then high-temperature cyclization is conducted; wherein the mole number of the aliphatic diamine accounts for 10-50% of the total mole number of the diamine, and the free volume and glass transition temperature of a molecular chain are effectively regulated and controlled by introduction of the aliphatic diamine; the wave-absorbing foam is prepared by taking polyimide as a matrix, doping 1-20wt% of wave-absorbing filler, and foaming for 1-3 hours in a supercritical carbon dioxide or nitrogen environment at the temperature of 180-220 DEG C and the pressure of 9-25MPa, through molecular structure design, the adsorption capacity and impact resistance of polyimide to carbon dioxide are remarkably improved, and the prepared foam has the advantages of light weight, high porosity, uniform foam structure and excellent heat resistance, can realize effective electromagnetic wave absorption in an X wave band, and is suitable for the fields of aerospace stealth and electromagnetic compatibility protection.

The invention belongs to the technical field of high-performance polymer materials, and relates to thermal-crosslinkable polyimide, polyimide foam and a preparation method and application thereof. Aiming at the problem that the foaming performance of the existing polyimide foaming material is poor due to the fact that the melt strength and the chain segment activity are difficult to balance, the invention provides a method for regulating and controlling the rheological property by controlling the number-average molecular weight (Mn = 15-45kDa) of a precursor and introducing a thermally-crosslinkable end-capping group. The precursor can form a parison with a specific elastic network structure through hot-pressing cross-linking, and then the polyimide foam which is high in foaming rate, uniform and fine in foam hole, low in density and excellent in heat resistance can be prepared through a two-step method of supercritical fluid saturation pressure relief and high-temperature secondary foaming. The method realizes predictable control from molecular parameters to foaming performance, is suitable for various thermoplastic polyimide systems, and has a wide application prospect in the fields of aerospace heat insulation and the like.

The invention provides a thermoplastic polyimide prepreg preparation method and a special device thereof, and the preparation method comprises the steps of unwinding, cloth storage and desizing, primary impregnation, secondary impregnation, pre-drying, tertiary impregnation, drying and the like. The solvent method for preparing the high-performance thermoplastic prepreg is realized, and the problems that the prepreg is low in resin content, insufficient in impregnation, insufficient in flatness, easy to have air holes, hard spots and the like are solved; the method is high in preparation efficiency and low in abrasion, and the prepared prepreg fiber is uniform in impregnation, flat and smooth in surface and uniform in thickness, has high strength and impact resistance, can be stored for a long time and can be recycled; the method is suitable for manufacturing the resin prepreg which is high in melt viscosity and can be dissolved in a proper single or mixed solvent, and the prepared prepreg can be applied to manufacturing of light-weight high-performance parts in the fields of rail transit, aerospace, weapons and the like.

The invention discloses a thermoplastic polyimide composite material for piston ring, a preparation method and a piston ring, which are composed of the following materials by mass percentage: thermoplastic polyimide 60-70; polyetheretherketone 10-20; modified carbon fiber 10-15; graphene oxide 5-10; chain extender 1-3; lubricant 1-2; antioxidant 0.5-1. The disadvantages of high wear rate, high linear expansion coefficient and inability to withstand high temperature of traditional piston rings are solved; the modification of carbon fiber reduces the probability of fiber shedding during the wear process, and reduces furrow wear and adhesive wear. The addition of graphene oxide further reduces the friction coefficient of the composite material, and a stable lubrication transfer film can be generated under long-term high load, solving many difficulties in the melt blending processing of thermoplastic polyimide high-temperature materials.

The invention discloses a three-layer co-extrusion multi-layer thermosetting and thermoplastic combined corona-resistant PI film and a preparation method thereof, and relates to the technical field of polyimide films. According to the invention, titanium dioxide and aluminum hydroxide are used as inorganic fillers, and layered shielding is formed by using the structural characteristics of aluminum hydroxide structure lamination and additional tight filling of spherical titanium dioxide, so that the movement of charges is hindered; meanwhile, a three-layer film layer structure is utilized, a high-performance thermosetting polyimide film is used as a supporting carrier, and thermoplastic polyimide resin containing aluminum hydroxide and titanium dioxide is used on the upper portion and the lower portion as functional layers to be attached to the surfaces of the thermosetting polyimide film layers, so that the tensile strength and the elongation at break are kept excellent; and the high-temperature resistance and high-voltage breakdown resistance of the film surface are further improved.

This non-thermoplastic polyimide film (11) contains a non-thermoplastic polyimide. The non-thermoplastic polyimide includes a 3,3',4,4'-biphenyl-tetracarboxylic acid dianhydride residue, a 4,4'-oxydiphthalic acid anhydride residue, a p-phenylenediamine residue, and a 1,3-bis(4-aminophenoxy)benzene residue. The relationships A1 + A2 ≥ 80, B1 + B2 ≥ 80, and (A1 + B1) / (A2 + B2) ≤ 3.50 are satisfied, where A1 mol% is the 3,3',4,4'-biphenyl-tetracarboxylic acid dianhydride residue content, A2 mol% is the 4,4'-oxydiphthalic acid anhydride residue content, B1 mol% is the p-phenylenediamine residue content, and B2 mol% is the 1,3-bis(4-aminophenoxy)benzene residue content.

The invention belongs to the technical field of high polymer material preparation, and relates to a hydrophilic-hydrophobic thermoplastic polyimide resin flexibilizer and a preparation method thereof. The glass transition temperature of the thermoplastic polyimide resin flexibilizer is increased to 250 DEG C or above, and meanwhile, the flexibilizer has the hydrophilic and hydrophobic integrated molecular structure characteristic, that is, the flexible part of a molecular chain of the flexibilizer is similar to the molecular structure of thermosetting polyimide resin and is soluble, and the rigid part of the molecular chain of the flexibilizer is insoluble with the thermoplastic polyimide resin. After the thermoplastic polyimide resin flexibilizer and the thermosetting polyimide resin are mixed at a high temperature, the particle morphology of the thermoplastic resin can be partially reserved, so that the purpose of soluble-insoluble synergistic toughening is achieved, and the high-temperature-resistant toughening of the thermosetting polyimide resin is realized.

The invention discloses preparation and application of thermoplastic polyimide acid resin and a polyimide film, the thermoplastic polyimide acid resin is formed by polymerizing one or more of diamine and dianhydride monomers in a polar solvent, and the thermoplastic polyimide film is formed by heating and curing the thermoplastic polyimide acid resin in a drying oven. The thermoplastic polyimide film has good thermodynamic properties and low water absorption and can meet the requirements for preparing a two-layer flexible copper-clad plate with high peel strength by using a lamination method, and the peel strength of the thermoplastic polyimide film reaches 0.70 kgf / cm or above and reaches 1.17 kgf / cm at most. In addition, the preparation method of the thermoplastic polyimide acid resin and the polyimide film provided by the invention is simple, green and environment-friendly, and the two-layer flexible copper-clad plate prepared from the thermoplastic polyimide acid resin and the polyimide film has excellent high moisture resistance and high heat resistance, can still keep excellent thermal stability and high peel strength in a high-moisture-heat environment, and has a wide industrial production prospect.

This invention discloses a high-modulus, high-toughness bismaleimide resin composition, a carbon fiber prepreg, and a preparation method thereof, belonging to the field of composite material technology. The bismaleimide resin composition of this invention comprises the following raw materials in parts by weight: 40-80 parts bismaleimide resin, 10-20 parts o-diallyl bisphenol A, and 5-10 parts a powder toughening agent containing phenolphthalein side chains. The carbon fiber prepreg of this invention is made from the above resin composition and carbon fibers, with thermoplastic polyimide felt interlayered to form an integrated structure. This allows the composite material prepared from the carbon fiber prepreg to maintain high modulus and high temperature resistance while significantly improving its toughness, impact damage tolerance, and interlayer delamination resistance. Furthermore, the prepreg of this invention has good processability and is suitable for manufacturing high-performance complex components.

The multilayer polyimide film (10) has a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) disposed on at least one surface of the non-thermoplastic polyimide layer (11). A non-thermoplastic polyimide contained in the non-thermoplastic polyimide layer (11) has, as a tetracarboxylic acid dianhydride residue, a tetracarboxylic acid dianhydride residue containing a benzophenone skeleton, and has, as a diamine residue, a diamine residue containing a biphenyl skeleton. Furthermore, in the multilayer polyimide film (10), the content of diamine residues containing a biphenyl skeleton in the non-thermoplastic polyimide is 30-100 mol% with respect to the total diamine residues constituting the non-thermoplastic polyimide.

The invention discloses a flexible copper-clad plate with high thermal conductivity and low dielectric property and a preparation method of the flexible copper-clad plate. The flexible copper-clad plate comprises an insulating substrate, the composite film is a thermoplastic polyimide / heat-conducting low-dielectric ePTFE / thermoplastic polyimide insulating composite film which is composed of a middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane and thermoplastic polyimide layers on the two sides of the middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane. And the flexible conductive metal foil is compounded with the single surface, double surfaces or multiple layers of the insulating substrate through a thermal forming compounding process. Through the mode, the flexible copper-clad plate can have excellent peel strength under the adhesive-free condition through structure optimization and process innovation, low dielectric constant and low dielectric loss tangent value can be realized under the high-frequency condition, and meanwhile, the heat conductivity coefficient is remarkably improved. And through continuous production, the efficiency is greatly improved, and a high-reliability base material is provided for the high-end electronic fields such as new energy vehicles, 5G / 6G communication and wearable equipment.

The present application relates to the field of polyimide film, provide a kind of thermoplastic polyimide film steel plate preparation method and device, including the following steps;Provide steel foil, and prepare polyamide acid solution;Coated with a layer of polyamide acid solution on the rough surface of steel foil;The steel foil coated with polyamide acid solution obtained is placed on the rack in the furnace body and baked, and the steel foil covered with polyamide acid film is obtained;The steel foil covered with polyamide acid film obtained is subjected to thermal imidization, and the polyimide film steel plate is obtained.By being provided with the rack of metal material in the furnace body, the rack divides the furnace body into two heating cavities, and the two heating cavities are communicated through gap, and the heating pipe in lower chamber is heated towards the polyamide acid film on one side of copper foil, and the other side of polyamide acid film is not placed heating pipe, so that the heat in lower heating cavity is conducted to upper chamber through gap, and the other side of polyamide acid film is heated, and the heating efficiency is improved.

The invention discloses a precise TPI-copper-based metal composite binding agent grinding tool and a preparation method thereof. The grinding tool comprises the following components in parts by weight: 100 parts of a grinding material, 10-30 parts of a resin binding agent, 60-90 parts of a copper-based metal binding agent and 2 parts of a wetting agent. The thermoplastic polyimide TPI is added into the formula, a large number of ether bonds, alkyl groups and rigid group benzene rings are introduced into the molecular structure of the TPI, the processability of the TPI is improved, meanwhile, the defect of insufficient heat resistance is overcome, and therefore the TPI resin binding agent better in temperature matching performance with a copper-based metal binding agent is obtained. In the composite superhard grinding tool prepared from the copper-based metal binding agent and the TPI resin binding agent, the existence of the metal binding agent plays a role in supporting a framework, and the strength and hardness of the grinding tool are guaranteed; the TPI resin binding agent increases the elasticity and the self-sharpening property of the grinding tool, so that the self-sharpening property of the grinding tool in the working process is improved, and better workpiece processing surface quality can be obtained.

An insulated wire and a preparation method therefor, a coil, and an electronic / electrical device are provided. In the preparation method, the thermoplastic polyimide is extruded to mold by adopting the extrusion process, so as to form the insulating layer on the core material, which can significantly improve the production efficiency compared to the traditional multiple-time coating process. The preparation process of the bonding layer and the extrusion process are optimized; the bonding layer is prepared by a specific bonding layer formulation; and then the insulating layer is extruded under a specific negative pressure, so that the prepared thermoplastic polyimide insulating layer has fewer bubbles, and the size of the bubbles is smaller, which ensures the insulating layer to have a higher breakdown voltage.

The invention provides a composite wear-resistant material. The composite wear-resistant material comprises a supporting layer, a transition layer and a wear-resistant layer which are sequentially stacked, the supporting layer comprises thermoplastic polyetherimide, first reinforced fibers and inorganic filler, the heat deformation temperature of the supporting layer is T1 DEG C, and the compression strength at 150 DEG C is P1 MPa; the transition layer comprises thermoplastic polyimide, thermoplastic polyetherimide and second reinforced fibers, the thermal deformation temperature of the transition layer is T2 DEG C, and the compression strength at 150 DEG C is P2 MPa; the wear-resistant layer comprises thermoplastic polyimide, third reinforced fibers and a solid lubricant, the thermal deformation temperature of the wear-resistant layer is T3 DEG C, the compression strength at 150 DEG C is P3 MPa, the friction coefficient of the wear-resistant layer is 0.18-0.27, the absolute value of the difference between any two of T1, T2 and T3 is within 10, and the absolute value of the difference between any two of P1, P2 and P3 is within 5.

An insulated wire and a preparation method therefor, a coil, and an electronic / electrical device are provided. In the preparation method, the thermoplastic polyimide is extruded to mold by adopting the extrusion process, so as to form the insulating layer on the core material, which can significantly improve the production efficiency compared to the traditional multiple-time coating process. The preparation process of the bonding layer and the extrusion process are optimized; the bonding layer is prepared by a specific bonding layer formulation; and then the insulating layer is extruded under a specific negative pressure, so that the prepared thermoplastic polyimide insulating layer has fewer bubbles, and the size of the bubbles is smaller, which ensures the insulating layer to have a higher breakdown voltage.

The invention relates to a composition comprising: a poly(ether ketone ketone), PEKK1; a thermoplastic polyimide having a glass transition temperature greater than or equal to 230°C, TPI; and optionally, a poly(aryl ether ketone), PAEK, PAEK being distinct from PEKK1. PEKK1 represents at least 50% by weight, relative to the total weight of PEKK1, TPI and, where applicable, PAEK, of the composition. PAEK is necessarily present when the TPI content is greater than or equal to 20% by weight, and preferably when the TPI content is greater than or equal to 15% by weight, relative to the total weight of PEKK1 and TPI of the composition.

The present application provides an insulated wire and a preparation method therefor, a winding wire, and an electrical device, relating to the technical field of electrochemical elements. The insulated wire includes a conductor and an intermediate layer and an insulation layer sequentially coated on the conductor; the insulation layer includes thermoplastic polyimide and polyetheretherketone; a mass percentage of the thermoplastic polyimide in the insulation layer ranges from 85% to 95%, and a mass percentage of the polyether ether ketone in the insulation layer ranges from 5% to 15%; the number of bubbles with a pore size of 30 µm or more in the insulation layer is not more than 5 per 100 m. The present application further provides a preparation method for the above insulated wire, and a winding wire and an electrical device using the above insulated wire. The insulated wire provided in the present application overcomes the defect in the prior art that bubbles are easy to appear, when the thermoplastic polyimide is taken as the insulating layer, to cause a local breakdown voltage to be low.

This invention belongs to the field of pressure vessel and hydrogen energy technology, and discloses a method for preparing a Type IV gas cylinder with a thermoplastic polyimide composite winding layer. The method involves preparing a monomer resin solution using dianhydride and diamine monomers, placing it in an impregnation tank, and then transversely penetrating it with continuous fiber bundles. Heating causes in-situ amidation polymerization to form a polyamic acid prepreg, which is then wound onto the surface of the Type IV plastic gas cylinder liner. Heating is then used to produce thermoplastic polyimide, and airtightness testing is performed. This invention proposes a method for impregnating fibers with polyimide monomers, which effectively improves the degree of fiber impregnation, thereby significantly enhancing the strength and reliability of the entire gas cylinder. Compared to the original process, the improved process is less complex, reduces resin performance degradation, and improves preparation efficiency. Both the gas cylinder liner and the winding layer resin matrix are made of thermoplastic resin, which is recyclable and meets national environmental protection policy requirements. The gas cylinder liner is made of plastic, and the working pressure can reach 35 MPa.

The invention discloses a low-CTE polyimide aerogel base material and a preparation method thereof, and relates to a polyimide aerogel base material and a preparation method thereof. The problems that the thermal expansion coefficient of existing thermoplastic polyimide aerogel is not matched with that of copper foil, a rigid chain aerogel base material cannot deform, and the shrinkage rate is large in the forming process of a flexible chain aerogel base material are solved. The low-CTE polyimide aerogel base material is prepared from a polyamide acid salt solution containing a rigid chain, a polyamide acid salt solution containing fluorine and aliphatic diamine. The preparation method comprises the following steps: 1, preparing a polyamide acid salt solution containing a rigid chain; 2, preparing a fluorine-containing polyamide acid salt solution; (3) weighing; 4, blending; 5, freeze drying; and 6, carrying out a thermal imidization reaction. The invention relates to a low-CTE polyimide aerogel base material and a preparation method thereof.

The invention discloses a method for continuously synthesizing thermoplastic polyimide through polymerization-extrusion granulation, and relates to the technical field of high-performance polymer synthesis, and the method comprises the following specific steps: mixing dianhydride and diamine monomer according to a ratio, and reacting in a water-containing solvent or a pure water phase to obtain an oligomer mixture; carrying out flash evaporation under the negative pressure of-0.01 to-0.1 MPa to recover the solvent / water, so as to obtain polyimide oligomer powder; drying the powder, mixing the dried powder with an auxiliary agent and other flexibilizers, carrying out stepped heat treatment in a nitrogen atmosphere, conveying the mixture into a screw machine through a screw, extruding, and pelletizing to obtain thermoplastic polyimide particles; the continuous production of the thermoplastic polyimide is realized by integrating core procedures, and the material loss and the time cost are reduced; and auxiliary materials such as the antioxidant and the flexibilizer are added, so that the product performance is improved, the application range is widened, and efficient and low-carbon production is realized.

The utility model relates to the technical field of film heaters, in particular to an irradiation-resistant heater, which comprises an electric heating layer, a pair of leads and a pair of insulating layers. The electric heating layer is fixedly arranged between the pair of insulating layers; the head ends of the pair of wires are electrically connected with the positive electrode of the electric heating layer and the negative electrode of the electric heating layer respectively. According to the utility model, the thermoplastic connecting layer made of the thermoplastic polyimide material is adopted to replace a bonding layer of a film heater in the prior art, so that the total radiation-resistant dose of the device is improved to 1.0 * 1010rad (SI), and the device can meet the requirements of the use environment outside a spacecraft cabin; the defect that a film heater in the prior art is poor in environment adaptability is overcome.

The application provides a high thermal and oxidative stability polyimide composite film and a preparation method thereof.The high thermal and oxidative stability polyimide composite film comprises a non-thermoplastic polyimide layer and a first thermoplastic polyimide layer, and the first thermoplastic polyimide layer is located on the first side of the non-thermoplastic polyimide layer; the non-thermoplastic polyimide layer and the first thermoplastic polyimide layer both contain rare earth oxides; and the first thermoplastic polyimide layer contains a toughening agent with a -COOH, -N-H or -C=O polar group.The film is modified by the toughening agent, the bonding strength is improved, the overall thermal and oxidative stability of the film is improved by the rare earth oxides, and the adverse influence of the toughening agent on the mechanical properties of the resin is reduced as much as possible, so that the thermal and oxidative stability of the film is improved as a whole.

The present application relates to the technical field of 5G high-frequency copper-clad plate, and particularly relates to polyimide, a preparation method thereof, a composition and a polyimide film. The polyimide is shown as formula 1, wherein n is an integer of 10-100; A is selected from one or more of substituted or unsubstituted aromatic hydrocarbon groups, saturated or unsaturated aliphatic groups; R1 is selected from substituted or unsubstituted saturated aliphatic hydrocarbon groups; and R is selected from one or more of substituted or unsubstituted aromatic hydrocarbon groups, saturated or unsaturated aliphatic groups. The present application adopts an anhydride containing a terminal carboxyl structure, seals the polyimide to form an oligomer prepolymer containing a carboxyl group, and then introduces a fatty alcohol containing a terminal hydroxyl group to form an ester group structure, so as to obtain a polyester polyimide. The material has a lower dielectric constant and higher adhesion. The polyimide is applied to thermoplastic polyimide (TPI), and the pressure bonding temperature is lower.

A copper clad laminate film, and a component and a device which comprise same are disclosed. The disclosed copper clad laminate film comprises: a substrate; an adhesion enhancement layer disposed on the substrate; a tie layer disposed on the adhesion enhancement layer; and a copper layer disposed on the tie layer, wherein the adhesion enhancement layer can include a thermoplastic polyimide-based resin and a silane coupling agent. The copper clad laminate film has low transmission loss at a high frequency while enhancing the coat properties of a substrate, and can have improved room-temperature adhesive strength and high-temperature adhesive strength between the substrate and the copper layer.

In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (Sq) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N / cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

The application provides a thermoplastic polyimide prepreg preparation method and a special device thereof, and preparation includes unwinding, cloth storage and desizing, one-time impregnation, secondary impregnation, pre-drying, three-time impregnation and drying and the like. The application adopts three-time impregnation process and special one-time impregnation device and drying device, realizes solvent method preparation of high-performance thermoplastic prepreg, and solves the problems of low resin content, insufficient impregnation, insufficient flatness of the prepreg, and defects such as air holes and pitting. The method has high preparation efficiency and less wear, the prepared prepreg has uniform fiber impregnation, smooth surface, uniform thickness, high strength and impact resistance, can be stored for a long time and recycled, and is suitable for manufacturing of resin prepreg with high melt viscosity and soluble in proper single or mixed solvent. The prepared prepreg can be applied to the manufacturing of lightweight high-performance parts in the fields of rail transportation, aerospace, weapons and the like.

A coated sheet comprising - a non-metallic sheet, and - a coating on at least one side of the non-metallic sheet, wherein the coating comprises a thermoplastic polymer, wherein the thermoplastic polymer is selected from the group consisting of a polyaryletherketone (PAEK), a polyarylene sulfide, a thermoplastic polyimide, a thermoplastic polyamideimide, or a mixture of two or more thereof; wherein the coating does not comprise a fluoropolymer and preferably does not comprise bisphenol and / or polyethersulfone.

To provide a piston ring that has low content of a sulfur atom, eliminates the need for a special exposing device and a strict safety measure, and is low in cost. A piston ring 1 is used in a reciprocating compressor that compresses gas and is formed of a resin composition containing at least polyetheretherketone resin or thermoplastic polyimide resin as a main component. The resin composition contains carbon material in which the content of a sulfur atom is 200 ppm or less. The carbon material is at least one of carbon fiber, graphite, and coke powder. The resin composition contains total 5-35 volt of the carbon material relative to the whole of the resin composition.