572 results about "Thermoplastic polyimide" patented technology

The invention relates to a preparation method of high temperature resistant single-component solventless epoxy adhesive. The method comprises the following steps: adding aromatic binary primary amine and strongly polar non-proton organic solvent in a reaction tank, stirring at room temperature to dissolve, adding aromatic binary acid anhydride to perform refluxing and water-segregating reaction at 120-150 DEG C for 6-12h, cooling, adding the reaction solution in a stamp tank with precipitant to precipitate solid powder, namely white thermoplastic polyimide powder, adding white thermoplastic polyimide powder and tertiary amine compound or imidazole compound in epoxy resin to react for 1-2h, adding active diluent and latent curing agent to stir evenly and obtaining the product. The production process is easy and the cost is low so as to realize industrialized production; the tensile shear intensions of the epoxy adhesive at room temperature and 120 DEG C are respectively up to 28Mpa and26Mpa and the epoxy adhesive has broad application prospect in fields such as electronics and microelectronics, electrical motors, aviation and aerospace and the like.

The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 μm to 1 μm measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.

A laminate which comprises a thermoplastic polyimide layer and a metal layer, or comprises a non-thermoplastic polyimide film layer and, formed on one or both surfaces, a thermoplastic polyimide layer and a metal layer; and a printed wiring board comprising the laminate. The laminate can be used for forming a high density circuit thereon, exhibits good resistance to further processing such as desmearing and excellent adhesion, and is excellent in adhesion reliability in a high temperature atmosphere.

A tire assembly with integrated power generation features includes one or more piezoelectric devices and power conditioning modules. Piezoelectric devices may include a plurality of piezoelectric fibers embedded in a generally unidirectional fashion within an epoxy matrix, a piezoceramic wafer provided on a substrate and substantially surrounded by a protective casing, or a piezoceramic unimorph structure adhered with a thermoplastic polyimide to respective top and bottom conductive layers. Each piezoelectric device may include multiple piezoelectric elements connected in series and/or parallel arrangements, configured with respective poling directions in opposing or in-phase arrangements and/or configured in d33 or d31 displacement modes. Piezoelectric devices are preferably mounted within a tire or wheel assembly such that electric charge is generated therein as the wheel assembly moves along a ground surface and is subsequently stored in one or more energy storage devices. Stored energy may then be used to power electronics such as a tire monitoring system that wirelessly transmits such information as tire pressure, temperature and identification variables to a remote receiver location.

The present invention provides a circuit wiring board that has micro wiring circuits and excellent adhesive performance. The board is formed through the following steps: (1) a thermoplastic polyimide layer is formed on one side or both sides of a non-thermoplastic polyimide film so as to form a two-layer or three-layer structure; then Venus treatment is done on the thermoplastic polyimide layer so as to prepare a laminated body; (2) a polymer film is arranged; a layer of the combination of polyimide resin that has a specific structure and polyimide resin that contains thermoset component is arranged on one side or two sides of the film; and (3) at least one side is provided with a resin film and a laminated body thereof; wherein, the resin film has a surface shape, in which Ra1 is 0.05 Mu m to 1 Mu m when the critical value of arithmetic average roughness is 0.002mm and the ratio between Ra1 and Ra2 is 0.4 to 1 when the critical value is 0.1mm.

The invention provides a thermoplastic polyimide which is prepared by polymerizing a diamine monomer and a dianhydride monomer. The thermoplastic polyimide is characterized by comprising at least one of structural units expressed by a general formula (1), a general formula (2) and a general formula (3) as shown in specification, wherein the proportion of the structural unit expressed by the general formula (1) is more than 30mol%, the proportion of the structural unit expressed by the general formula (2) is more than 10mol%, the proportion of the structural unit expressed by the general formula (3) is more than 10mol%, and n in the general formula (3) is an positive integer greater than 1; Ar1, Ar2 and Ar3 are quadrivalent aromatic groups, Ar4 is a bivalent aromatic group containing hetero atoms, and Ar5 is a bivalent aromatic group without hetero atoms. The thermoplastic polyimide is mainly terminated with the anhydride group, and can be applied to the production of a no-adhesive flexible copper-clad plate by a two layer method.

The invention discloses a low-melt-viscosity thermoplastic polyimide material which is used for 3D printing. Molecular structure of the thermoplastic polyimide material is subjected to a modification process (such as introducing a special flexibility structure unit, a large side group or solvophilic group, a twisted and non-coplaner structure, characteristic atoms such as a heterocycle and a fluorine silicon and the like, and carrying out a main chain copolymerization reaction) to enable the polyimide material to be meltable and thus to have good processability a well processing performance. The polyimide material, after being mixed with a heat stabilizer and a reinforcing agent, is manufactured into a high-performance polyimide product in a manner of melting 3D printing technology. The polyimide material widens a selectable range of present 3D printing materials. With the high-performance and low-melt-viscosity thermoplastic polyimide as a 3D printing material, the high-performance polyimide product prepared from the polyimide material has excellent high temperature resistance performance, corrosion resistance performance and mechanical strength.

The present invention relates to a polyimide resin composition including an organic thiol compound and a thermoplastic polyimide resin, a polymeric film containing the polyimide resin, a laminate including the same, and a printed circuit board. By using the polyimide resin composition, it is possible to form an electroless plating film having high adhesive strength even under high-temperature, high-humidity conditions in spite of the fact that the surface roughness of the insulating layer is extremely low. Furthermore, by using the polymeric film and a laminate including the polymeric film and a metal layer, it is possible to obtain a printed circuit board capable of forming high-density circuit and having excellent adhesiveness, and excellent adhesion reliability in a high-temperature, high-humidity environment.

The invention discloses a novel mould-pressing polyimide foamed plastic and a preparation method thereof. The foamed plastic comprises the following chemical components based on 100 mass parts of aromatic dianhydride: 100 parts of aromatic dianhydride, 60-70 parts of solvent, 60-65 parts of aromatic diamine, 100-130 parts of fatty alcohol, 1-5 parts of a foam stabilizing agent, 0.5-1 part of a catalyst and 20-30 parts of a foaming agent. The preparation method comprises the following steps of: (1) esterifying the aromatic dianhydride and the fatty alcohol to prepare diacid diester; (2) reacting the diacid diester with the aromatic dianhydride to prepare a precursor solution; (3) preparing a surfactant and a catalyst removal solvent by the precursor solution, drying and grinding into powder; (4) preparing a melt by taking the water as a foaming agent; (5) by a microwave foaming process, preparing a thermoplastic polyimide foam body; and (6) cutting the foam body and carrying out mould-pressing to prepare polyimide foam boards differing in density. The novel mould-pressing polyimide foamed plastic disclosed by the invention is simple in preparation process, dense and uniform in foam bubbles, low in preparation cost and easy in industrial production.

The invention discloses a preparation method of a dual-layer glue-free type double-face flexible copper-clad plate. The plate is composed of a thermosetting polyimide layer, a thermoplastic polyimide layer, and two copper foil layers. The preparation method comprises the following steps: painting a thermosetting polyimide precursor solution on a copper foil to form a non-imidized precursor dry membrane; then painting a thermoplastic polyimide precursor solution on the copper foil to form a thermoplastic polyimide precursor dry membrane; then subjecting the polyimide precursor dry membranes to high-temperature imidization, covering a copper foil on the membrane-covered copper foil, and pressing. In the provided preparation method, only one high-temperature heat treatment is required during the production process, and thus the production cost is reduced. Moreover, the problem that layering easily appears between the multiple polyimide layers of the double-face flexible copper-clad plate is also solved by the preparation method, and the obtained polyimide layers are tightly bonded, so the performance of the copper-clad plate is more excellent, and the copper-clad plate is more practical.

The invention discloses a thermoplastic polyimide adhesive film as well as a preparation method and application thereof. A structural formula of a polymer for manufacturing the adhesive film is as shown in a formula I in the specification. The preparation method comprises the following steps of: (1) uniformly mixing aromatic diamine, aromatic tetracid dianhydride and a blocking agent in an organic solvent to obtain a homogeneous solution, then adding methylbenzene and isoquinoline to be mixed uniformly, heating to 170-190 DEG C and reacting for 10-24 hours to evaporate the methylbenzene, stopping heating after heating a reaction system to above 200 DEG C, precipitating after cooling to 80-120 DEG C; and (2) dissolving the obtained polymer in an organic solvent to obtain a glue solution of polyimide, coating the glue solution of polyimide on a baseplate, and drying to obtain the polyimide adhesive film. The adhesive film has excellent room-temperature and high-temperature splicing performance when being used for splicing metal materials, resin composite materials and the like.

A thermoplastic polyimide composite material with high-thermal conductivity and its production are disclosed. The raw materials consist of thermoplastic polyamide acid, thermal-conducting filler 1 and thermal-conducting filler 2. The process is carried out by adding thermal-conducting 1 into thermoplastic polyamide acid solution proportionally, high-speed agitating to obtain polyamide solvent impregnated resin containing thermal-conducting filler, dip-coating onto thermal-conducting filler 2, dip coating fiber cloth, putting into baker, imine treating to obtain polyimide composite embryo-cloth. It's simple and convenient, has excellent comprehensive performances and higher thermal-conducting coefficient.

The invention relates to an aromatic block polymer, and a preparation method and application thereof as a compatibilizer. Amino-terminated polyetheretherketone oligomer and acid-anhydride-terminated polyimide oligomer are subjected to nucleophilic polycondensation reaction in an organic solvent to obtain the polyetheretherketone-polyimide block polymer. The polymerization degree of the two oligomers can be regulated to prepare the block polymer, so that the number-average molecular weight of the prepared polyetheretherketone block and polyimide block is 1000-6000, and the number-average molecular weight of the block polymer is 20000-40000. When being adding into a polyetheretherketone-thermoplastic polyimide blend system as a compatibilizer, the block polymer is beneficial to improving the compatibility of the blend system, thereby preparing the high-polymer alloy material with excellent comprehensive properties, such as mechanical properties, working properties, thermal properties and the like.

This invention relates to one polyamide-imides foil deposition layer to process flexible print circuit board, which comprises copper foil, heat fixing polyamide layers, heating plastic polyamide layers and copper foil. This invention method comprises the following steps: coating heated fix polyamide copper foil structure; then using plastic polyamide adhesive structure for heat fix polyamide layers; finally binding and pressing to the invention product.

The invention relates to a thermoplastic polyimide (TPI) material used for preparing a two-layer flexible copper clad laminate (2L-FCCL). The excellent dissolvability TPI material is obtained through generating a polyamide acid copolymer by using main reaction components 4-ethoxydiphenol-3,5-diaminobenzoate and 2,2-bis(4-aminophenyl)hexafluoropropane according to a specific molar ratio, a corresponding diamine and a corresponding acid anhydride, and processing the copolymer by utilizing a chemical imidization process. The 2L-FCCL with good comprehensive performances of dimensional stability, dip soldering resistance, peeling performance and the like can be obtained through dissolving powder of the TPI material and compositing the TPI material with a thermosetting polyimide film and copper foil.