19 results about "Thermoplastic polyimide" patented technology

This invention discloses a high-modulus, high-toughness bismaleimide resin composition, a carbon fiber prepreg, and a preparation method thereof, belonging to the field of composite material technology. The bismaleimide resin composition of this invention comprises the following raw materials in parts by weight: 40-80 parts bismaleimide resin, 10-20 parts o-diallyl bisphenol A, and 5-10 parts a powder toughening agent containing phenolphthalein side chains. The carbon fiber prepreg of this invention is made from the above resin composition and carbon fibers, with thermoplastic polyimide felt interlayered to form an integrated structure. This allows the composite material prepared from the carbon fiber prepreg to maintain high modulus and high temperature resistance while significantly improving its toughness, impact damage tolerance, and interlayer delamination resistance. Furthermore, the prepreg of this invention has good processability and is suitable for manufacturing high-performance complex components.

The invention relates to a composition comprising: a poly(ether ketone ketone), PEKK1; a thermoplastic polyimide having a glass transition temperature greater than or equal to 230°C, TPI; and optionally, a poly(aryl ether ketone), PAEK, PAEK being distinct from PEKK1. PEKK1 represents at least 50% by weight, relative to the total weight of PEKK1, TPI and, where applicable, PAEK, of the composition. PAEK is necessarily present when the TPI content is greater than or equal to 20% by weight, and preferably when the TPI content is greater than or equal to 15% by weight, relative to the total weight of PEKK1 and TPI of the composition.

A method for manufacturing an electrically conductive member, which includes: attaching a powder to a surface of a metal member by an electrostatic coating method, the powder containing a thermoplastic polyimide containing a structural unit represented by formula (1); and forming an insulating coating film by melting the attached powder by heating, in an IR spectrum of the insulating coating film, at least one of the following conditions is satisfied: a ratio I ‑1 / I 1487 of an absorption intensity I ‑1 at 1487 cm 1778 to an absorption intensity I 1487 at 1778 cm 1778 is 3.0 to 5.0; and a ratio I ‑1 / I 1232 of an absorption intensity I ‑1 at 1232 cm 1778 to an absorption intensity I 1232 at 1778 cm 1778 is 3.0 to 5.0.

The present application relates to the technical field of high-performance resin film, and particularly relates to a polyimide modified thermotropic liquid crystal resin composition and double-sided copper clad plate. The composition comprises a polyimide resin and a thermotropic liquid crystal resin, wherein the polyimide resin comprises a structure shown in formula (1) and each group in formula (1) has a specific selection. The present application significantly improves the cohesion and orientation of the resin from the chemical structure and condensed state structure by using a thermoplastic polyimide resin with a specific structure to blend and modify the thermotropic liquid crystal resin. The double-sided copper clad plate prepared therefrom has high peeling strength and excellent isotropy, and has a good application prospect in the field of high-frequency flexible microwave circuit and the like. Formula (1).

This invention provides a multilayer film, a metal-clad laminate, and a circuit board. The multilayer film has outer layers comprising multiple polyimide layers on both sides of an inner layer including an adhesive layer, ensuring dimensional stability while further improving dielectric properties. The multilayer film includes multiple polyimide layers and an adhesive layer, wherein the multilayer film satisfies: a) the total thickness of the thermoplastic polyimide layer and the non-thermoplastic polyimide layer stacked on one side of the adhesive layer is in the range of 2 μm or more and 20 μm or less; b) 65 < P P / P AD <1,550, by P P =P P1 +P P2 P P1 =(E' P100 +E' P200 )×thickness of polyimide layer [μm], P P2 =(E' P100 +E' P200 )×thickness of polyimide layer [μm], P AD =(E' AD100 +E' AD200 E' represents the thickness of the adhesive layer [μm]. P100 、E' P200 E' is the storage elastic modulus [GPa] of the polyimide layer at 100℃ and 200℃. AD100 、E' AD200 c) The storage elastic coefficient [GPa] of the adhesive layer at 100℃ and 200℃; c) As a whole multilayer film, the dielectric loss tangent at 20 GHz measured using an SPDR resonator is less than 0.0029.

This invention relates to a fiber-reinforced thermoplastic polyimide laminate, its preparation method, and its application. The preparation method includes the following steps: S1: Prepare a diamine solution, add a dianhydride to the diamine solution to obtain a precursor solution, and prepare a diluent; S2: Add the diluent to the precursor solution to obtain an impregnation resin; S3: Coat the impregnation resin onto the surface of a substrate to form a wet film, and then perform a first drying treatment on the wet film to obtain an adhesive film; impregnate a fiber fabric with the impregnation resin or coat the surface of the fiber fabric with the impregnation resin to obtain an impregnated fabric, and then perform a second drying treatment on the impregnated fabric to obtain a prepreg; S4: Stack m prepreg sheets and n adhesive films alternately along the thickness direction to form a laminate, wherein m≥1, n≥1, and then hot-press the laminate to obtain a thermoplastic polyimide laminate. This invention has a simple process, high preparation efficiency, and the resulting laminate has excellent mechanical properties.

This invention belongs to the field of high-performance polymer materials technology, and relates to a thermally crosslinkable polyimide, polyimide foam, its preparation method, and applications. Addressing the problem of poor foaming performance in existing polyimide foam materials due to the difficulty in balancing melt strength and chain segment mobility, this invention proposes to control the number-average molecular weight of the precursor (…). M n The precursor (with a molecular weight of 15-45 kDa) is introduced with thermally crosslinkable end-cap groups to regulate its rheological properties. This precursor, after hot-press crosslinking, forms a preform with a specific elastic network structure. Then, through a two-step method of supercritical fluid saturation depressurization and high-temperature secondary foaming, polyimide foams with high foaming ratio, uniform and fine pores, low density, and excellent heat resistance can be prepared. This invention achieves predictable control from molecular parameters to foaming performance, is applicable to various thermoplastic polyimide systems, and has broad application prospects in aerospace insulation and other fields.

The purpose of the present invention is to provide: a combined filament yarn having excellent flexibility and strength in a fiber length direction of a continuous reinforcing fiber; a method for producing a molded article; and a method for producing the combined filament yarn.　The combined filament yarn according to the present invention comprises continuous thermoplastic polyimide resin fibers (2) and continuous reinforcing fibers (1), wherein the ratio of the fineness of the continuous thermoplastic polyimide resin fibers (2) to the fineness of the continuous reinforcing fibers (1) (the fineness of the continuous thermoplastic polyimide resin fibers (2) / the fineness of the continuous reinforcing fibers (1)) is 0.009-0.090, the combined filament yarn is configured with intertwining of at least some of the continuous thermoplastic polyimide resin fibers (2) and at least some of the continuous reinforcing fibers (1) at a proportion of 1-500 locations per 500 m, and in the other portions, the continuous thermoplastic polyimide resin fibers (2) and the continuous reinforcing fibers (1) are arranged in parallel with linearity in the fiber length direction.

The present invention provides a thermoplastic polyimide film comprising a thermoplastic polyimide (TPI) including polymerization units of a dianhydride monomer and a diamine monomer, and having surface oxygen concentration of 2.5 to 8.5% as measured by depth XPS analysis, and provides a composite film comprising the thermoplastic polyimide film on one or both surfaces of a non-thermoplastic polyimide layer and having surface oxygen concentration of 2.5 to 8.5% as measured by depth XPS analysis, and a method for manufacturing the composite film.

The present application relates to a kind of thermoplastic polyimide composite and its preparation method, part, belong to the technical field of polymer compound composition.The thermoplastic polyimide composite of the present application includes the following components by weight fraction: thermoplastic polyimide 40~70 parts, semi-aromatic nylon 30~60 parts, compatible agent 3~6 parts;The compatible agent is maleic anhydride grafted polyetherimide.The thermoplastic polyimide composite has good mechanical properties and excellent wear resistance at high temperature.

The invention relates to a composition comprising: a poly(ether ketone), PEKK1; a thermoplastic polyimide having a glass transition temperature greater than or equal to 230 °C, TPI; and optionally, a poly(aryl ether ketone), PAEK, PAEK being distinct from PEKK1. PEKK1 represents at least 50% by weight, relative to the total weight of PEKK1, TPI, and, where applicable, PAEK, of the composition. PAEK is necessarily present when the TPI content is greater than or equal to 20% by weight, and preferably when the TPI content is greater than or equal to 15% by weight, relative to the total weight of PEKK1 and TPI of the composition.

The present disclosure provides an insulated wire and a preparation method therefor, a winding wire, and an electrical device, relating to the technical field of electrochemical elements. The insulated wire includes a conductor and an intermediate layer and an insulating layer sequentially coated on the conductor; the insulating layer includes thermoplastic polyimide and polyetheretherketone; a mass percentage of the thermoplastic polyimide in the insulating layer ranges from 85% to 95%, and a mass percentage of the polyetheretherketone in the insulating layer ranges from 5% to 15%; the number of bubbles with a pore size of 30 μm or more in the insulating layer is not more than 5 per 100 m.

This invention relates to the field of polymer composite materials technology, and provides a thermoplastic polyimide / thermotropic liquid crystal polymer composite film containing coordination units and its preparation method. The composite film is obtained by melt extrusion casting of raw materials containing the following components: (a) a thermoplastic polyimide resin containing coordination units; (b) a thermotropic liquid crystal polymer resin; wherein the thermoplastic polyimide resin containing coordination units comprises structural units derived from nitrogen-containing heterocyclic diamine monomers, and the nitrogen-containing heterocyclic diamine monomers contain at least one heteroatom coordination group selected from pyridine rings, thiazole rings, imidazole rings, or benzothiazole rings. This invention overcomes the shortcomings of the prior art, has a reasonable design, and a compact structure. By introducing nitrogen-containing heterocyclic (pyridine, thiazole, etc.) coordination units into the polyimide molecular chain, this invention enables the resin to form stable coordination bonds with the copper foil surface during hot pressing, thereby significantly enhancing the interfacial adhesion.

The present invention relates to a multilayer polyimide film with improved plating adhesion and a method for manufacturing same and, more specifically, to a multilayer polyimide film and a method for manufacturing same, wherein the multilayer polyimide film has excellent room-temperature and heat-resistant plating adhesion even with a very thin thickness by comprising a non-thermoplastic polyimide layer and a thermoplastic polyimide layer coated on one or both surfaces of the non-thermoplastic polyimide layer.

This invention discloses a method for preparing oriented long fiber reinforced polyimide foam material, comprising: adding fatty alcohol, aromatic dianhydride and end-capping agent to a solvent for esterification reaction; adding diamine to continue the reaction; drying to remove solvent and obtain RTM-type foamable precursor; mixing and extruding linear thermoplastic polyimide resin with RTM-type foamable precursor, uniformly distributing long fibers on the inner wall of a custom die head, achieving tight encapsulation of oriented long fibers during extrusion; cutting the material to a fixed length and completing volumetric foaming in a foaming mold. This invention also discloses an oriented long fiber reinforced polyimide foam material, using long fibers as reinforcement and a mixed extrudate of linear thermoplastic polyimide resin and RTM-type foamable precursor as the matrix, which improves the flexural strength, compressive strength and toughness of the polyimide foam material, and can be applied to foam sandwich materials in the aerospace field, radar dome sandwich materials, etc.

The present application relates to a coaxial polyimide nanofiber membrane preparation method, by the rigid anhydride containing ester group structure and rigid diamine is polymerized into the polyamide acid solution with crystallization characteristics, and the heat conduction filler is mixed in it as the core layer spinning solution, then it is with the thermoplastic polyimide solution as the sheath layer, by coaxial electrospinning-thermal imidization processing mode is prepared into composite polyimide nanofiber membrane, and then through high-temperature hot-pressing process, while the core layer still maintains the complete crystalline structure, the sheath layer structure occurs thermal bonding and produces crosslinking effect, thereby preparing the coaxial polyimide nanofiber membrane membrane with low dielectric properties and high thermal conductivity characteristics, which can be widely used in various fields such as communication base station, aerospace, microelectronic packaging and integrated circuit.

The application provides a manufacturing method of a circuit board, comprising the following steps: providing a core board, wherein the core board comprises a first base material layer and an inner circuit structure arranged on the first base material layer, and the core board is provided with a first opening which penetrates through the first base material layer and the inner circuit structure; arranging a second base material layer on the inner circuit structure, and part of the second base material layer is filled into the first opening to form a U-shaped groove body which is connected with the first base material layer; the first base material layer and the second base material layer are thermoplastic polyimide; arranging an adhesive layer on the second base material layer, and the adhesive layer is provided with a second opening, and part of the second opening is arranged corresponding to the U-shaped groove body; arranging a copper foil layer on the adhesive layer, part of the copper foil layer is filled into the second opening, and part of the copper foil layer in the second opening is filled into the U-shaped groove body; arranging an electroplating layer on the copper foil layer, and etching the copper foil layer and the electroplating layer to form an outer circuit layer, so as to obtain the circuit board. In addition, the application further provides a circuit board.