Laminate, printed wiring board and method for manufacturing them

A technology of laminates and metal layers, which is applied in the fields of printed circuit manufacturing, printed circuits, chemical instruments and methods, etc., and can solve the problem of low tolerance

Inactive Publication Date: 2006-01-11
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods presuppose the treatment of non-thermoplastic polyimide resin, and have low resistance to the decontamination process as described above.

Method used

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  • Laminate, printed wiring board and method for manufacturing them
  • Laminate, printed wiring board and method for manufacturing them
  • Laminate, printed wiring board and method for manufacturing them

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0182] The polyimide film was prepared by coating one side of the non-thermoplastic polyimide film with a thickness of 25 μm prepared by the preparation method A, B or C by coating the polyamic acid solution prepared by the production method X or Y. The thickness of the thermoplastic polyimide layer is 3 μm.

[0183]Next, nickel was sputtered for 1 minute on the thermoplastic polyimide layer to form a nickel film with a thickness of 6 nm. Copper sputtering was continuously performed for 9 minutes to form a copper film with a thickness of 100 nm to obtain a metal layer / polyimide thin film laminated body. On the obtained sputtered film, a copper layer having a thickness of 18 μm was formed by electrolytic plating. The adhesive strength at room temperature, the adhesive strength after the pressure retort test, and the decontamination resistance of the laminate were measured. The results are shown in Table 2.

[0184] Example

[0185] From the results, it can be seen ...

Embodiment 7～14

[0187] The polyamic acid solution prepared by the production method Y was coated on both sides of the non-thermoplastic polyimide film with a thickness of 25 μm prepared by the production method C to prepare samples forming thermoplastic polyimide layers with different thicknesses. Nickel was sputtered for 1 minute on this thin film to form a nickel film with a thickness of 6 nm. Copper sputtering was continuously performed for 9 minutes to form a copper film with a thickness of 100 nm to obtain a metal layer / polyimide thin film laminated body. Using the obtained sputtered film as a power supply layer, a copper layer having a thickness of 18 μm was formed by electrolytic plating. The adhesive strength at room temperature, the adhesive strength after the pressure cooking test, the decontamination resistance, and the thermal expansion coefficient of the obtained laminate were measured. The results are shown in Table 3. Here, regarding the thermal expansion rate, the thermal ex...

Embodiment 15～22

[0191] On both sides of the non-thermoplastic polyimide film with a thickness of 7.5 μm, 12.5 μm, 25 μm and 50 μm prepared by the preparation method C, the polyamic acid solution prepared by the preparation method Y is coated, and the formation of 1 μm, 5 μm and 10 μm is made by this method The thickness of the thermoplastic polyimide laminated body.

[0192] Nickel was sputtered for 1 minute on this thin film to form a nickel film with a thickness of 6 nm. Copper sputtering was continuously performed for 9 minutes to form a copper film with a thickness of 100 nm to obtain a metal layer / polyimide thin film laminated body. Using the obtained sputtered film as a power supply layer, a copper layer having a thickness of 5 nm was formed by electrolytic plating. The adhesive strength at room temperature, the adhesive strength after the pressure cooking test, the decontamination resistance, and the thermal expansion coefficient of the obtained laminate were measured. The results ar...

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Abstract

The invention provides a laminate which can be used for forming a high density circuit thereon, with good resistance to further processing such as decontamination and excellent adhesion, and excellent adhesion reliability in a high temperature atmosphere, as well as a print circuit wiring board, that is, the invention relates to a laminate and a print circuit wiring board, comprising a thermoplastic polyimide film layer and a metal layer which are formed on one side or two sides thereof or a non-thermoplastic polyimide film layer.

Description

technical field [0001] The present invention relates to a laminate in which a copper metal layer is formed on a polymer film having a smooth surface and a method for manufacturing a printed wiring board formed using the laminate, which are widely used in electrical and electronic equipment. In particular, it relates to a metal layer / polyimide film layer laminate with a two-layer structure, a metal layer / polyimide film layer / metal layer, and a metal layer / polyimide film layer, which are most suitable for circuit board production. / copper foil layer, or metal layer / polyimide film layer / adhesive layer three-layer laminated body. In more detail, it relates to the manufacturing process of a common printed wiring board, such as a through-hole forming process and a desmearing process, which is excellent in adhesiveness and environmental stability, and can be used in a high-density flexible printed wiring board, Multilayer flexible printed wiring boards laminated with flexible printe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08H05K3/00H05K3/14C08J7/00
Inventor 西中贤伊藤卓田中滋村上睦明
Owner KANEKA CORP
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