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200results about How to "Improve bond reliability" patented technology
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One component resin composition curable with combination of light and heat and use of the same
InactiveUS20070096056A1Improve curing effectAvoid pollutionLiquid crystal compositionsPhotomechanical apparatusEpoxyMethacrylate
A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.
Owner:MITSUI CHEM INC +1
Stabilizer bushing
InactiveCN1766362AReduce axial flowReduce stress concentrationInterconnection systemsRubber-like material springsElastomerAdhesive
The invention relates to a stabilizer bar bushing (12), comprising a rubber elastic body (16); a bracket (14) and a middle part embedded in the rubber elastic body along the axis vertical direction so as to extend substantially the entire axial direction of the rubber elastic body An intermediate plate (18) extending in length, whereby the rubber elastic body is divided by the intermediate plate into an inner rubber layer (16-1) and an outer rubber layer (16-2) with a spring constant smaller than the inner rubber layer. The stabilizer bar bushing is composed of two circumferential divisions (12A, 12A), wherein the bracket and the middle plate are integrally vulcanized with the divisions, and the divisions are assembled together to clamp the stabilizer bar along the vertical direction of the axis ( 10) and withstand the compression along the vertical direction of the axis, so that the inner surface of the through hole (20) is bonded to the outer peripheral surface of the stabilizer bar through the adhesive (S).
Owner:TOYOTA JIDOSHA KK +1
Automotive fuel hose and method for producing the same
InactiveUS20050208248A1Low layerSimple molding processSynthetic resin layered productsLaminationEngineeringAutomotive fuel
An automotive fuel hose excellent in interlaminar adhesion between a low permeability resin layer and a rubber layer, wherein the low permeability resin layer and the rubber layer are directly adhered to each other without forming an adhesive layer at the interface between both layers. The automotive fuel hose has a laminated structure of a low permeability resin layer and a rubber layer, the low permeability resin layer is formed by the following (A) and the rubber layer is formed by the following (B). (A) a polyphenylene sulfide resin containing a softening component, or a modified fluororesin. (B) a rubber composition composed of at least one of an amine additive and an amine vulcanizing agent as an essential component.
Owner:SUMITOMO RIKO CO LTD
Semiconductor device and method of fabricating the same
InactiveUS20050161803A1Improve bond reliabilityImprove reliabilitySpecific water treatment objectivesSemiconductor/solid-state device detailsInterconnectionEngineering
A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base member around the semiconductor constructing body. An interconnection of at least one layer is formed on one sides of the semiconductor constructing body and insulating layer, electrically connected to the external connecting electrode of the semiconductor constructing body, and having a connecting pad portion, the semiconductor substrate is fixed to the base member by fixing force of the base member.
Owner:AOI ELECTRONICS CO LTD
Method of fabricating a semiconductor package utilizing a thermosetting resin base member
InactiveUS7112469B2Improve bond reliabilityImprove reliabilitySpecific water treatment objectivesSemiconductor/solid-state device detailsSemiconductor packageEngineering
A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base member around the semiconductor constructing body. An interconnection of at least one layer is formed on one sides of the semiconductor constructing body and insulating layer, electrically connected to the external connecting electrode of the semiconductor constructing body, and having a connecting pad portion, the semiconductor substrate is fixed to the base member by fixing force of the base member.
Owner:AOI ELECTRONICS CO LTD
Method of producing fuel hose and fuel hose obtained thereby
InactiveUS6602565B1Improve bond reliabilityAdhesive strengthLayered product treatmentSynthetic resin layered productsEngineeringThermal aging
A method of producing a fuel hose having superior adhesive reliability with superior initial adhesive strength between a tubular fluororesin inner layer and a thermoplastic resin outer layer and with restrained deterioration in adhesive strength after heat aging and immersion into fuel under severe conditions such as an inside of an engine compartment. The method includes plasma treatment on a peripheral surface of the tubular fluororesin inner layer, at least one treatment of water treatment and silane coupling agent treatment on the plasma treated surface and formation of the thermoplastic resin outer layer on the treated peripheral surface.
Owner:SUMITOMO RIKO CO LTD
Laminate, printed wiring board and method for manufacturing them
InactiveCN1720136AImproves bond stabilityImprove bond reliabilityPrinted circuit manufactureMetal layered productsHigh densityEngineering
The invention provides a laminate which can be used for forming a high density circuit thereon, with good resistance to further processing such as decontamination and excellent adhesion, and excellent adhesion reliability in a high temperature atmosphere, as well as a print circuit wiring board, that is, the invention relates to a laminate and a print circuit wiring board, comprising a thermoplastic polyimide film layer and a metal layer which are formed on one side or two sides thereof or a non-thermoplastic polyimide film layer.
Owner:KANEKA CORP
Bonding body, power module substrate, and heat-sink-attached power module substrate
ActiveUS20160035660A1Improve bond reliabilityAvoid it happening againSemiconductor/solid-state device detailsSolid-state devicesBond interfaceCopper
A bonding body includes: an aluminum member composed of aluminum; and a metal member composed of any one of copper, nickel, and silver, wherein the aluminum member and the metal member are bonded together. In a bonding interface between the aluminum member and the metal member, a Ti layer and an Al—Ti—Si layer are formed, the Ti layer being disposed at the metal member side in the bonding interface, and the Al—Ti—Si layer being disposed between the Ti layer the aluminum member and containing Si which is solid-solubilized into Al3Ti. The Al—Ti—Si layer includes: a first Al—Ti—Si layer formed at the Ti layer side; and a second Al—Ti—Si layer formed at the aluminum member side and a Si concentration of which is lower than a Si concentration of the first Al—Ti—Si layer.
Owner:MITSUBISHI MATERIALS CORP
Optical-use pressure-sensitive adhesive sheet
ActiveCN102051133AStripping does not produceImprove bond reliabilityMonocarboxylic acid ester polymer adhesivesOpticsConstant loadPeel force
The invention provides an optical-use adhesive sheet excellent in adhesiveness under bending, twisting or distorting stress. The optical-use adhesive sheet has an adhesive layer having a storage elastic modulus at 80 DEG C of at least 2.0X10 4 Pa and a loss elastic modulus at 80 DEG C of at least 1.0X10 4 Pa, the optical-use adhesive sheet is characterized in that the adhesive sheet has a peel force, as measured in the L-shape peel test, of at least 0.16 MPa, and has a peel distance, as measured in the constant-load peel test, of at most 50 mm. In the L-shape peel test, an L-shaped stainless steel clamp is adhered with an acrylicresin plate through the adhesive sheet, the acrylicresin plate and the stainless steel clamp are processed for 15 minutes at 50 DEG C under 5 atm, and then, the stainless steel clamp is drawn along a direction vertical to a surface of the acrylicresin plate so as to test the peel force. In the constant-load peel test, a double-faced adhesive sheet is adhered on the acrylicresin plate, then, the acrylicresin plate and the double-faced adhesive sheet are processed for 10 minutes at 50 DEG C under 5 atm, and then, a load of 100gf is applied along the direction vertical to the surface of the acrylicresin plate on a tail end in a length direction of the adhesive sheet so as to test the peel distance of the adhesive sheet after 3 hours.
Owner:NITTO DENKO CORP
Display device and manufacturing method thereof
ActiveUS20160268356A1Increased strengthIncrease reliabilitySolid-state devicesSemiconductor/solid-state device manufacturingEngineeringDisplay device
A display device includes: a first substrate including: a display area including a plurality of pixels, and a peripheral area positioned around the display area; a thin film transistor positioned on the first substrate; a pixel electrode layer positioned on the thin film transistor and including more than one pixel electrodes positioned in the display area; and a pixel definition layer positioned on the pixel electrode layer and including a peripheral portion overlapping a voltage transmission electrode. The peripheral portion includes a spacer and an inclination portion connected to the spacer and positioned at a first side of the spacer, and the inclination portion has a concave inclination surface.
Owner:SAMSUNG DISPLAY CO LTD
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
InactiveUS20080171187A1Efficient cuttingImprove bond reliabilityGroup 4/14 element organic compoundsSynthetic resin layered productsBreaking strengthDicing tape
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
Owner:INADA TEIICHI +2
Joined body and method of producing joined body
InactiveUS20130011670A1Improve bond reliabilityFilm/foil adhesivesSynthetic resin layered productsPolymer sciencePolyvinyl chloride
A joined body includes: an adherend; a primer layer provided on the adherend; and a pressure-sensitive adhesive layer provided on the primer layer. The primer layer contains, as an effective component, at least one of chlorinated polypropylene and chlorinated polyethylene and an amount of the effective component per unit area is 0.5 [mg / cm2] or less. The surface of the adherend may be formed of at least one of polypropylene (PP), polyvinyl chloride (PVC), and ethylene-propylene-diene rubber (EPDM).
Owner:NITTO DENKO CORP
High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof
ActiveCN103242767AImprove bond reliabilityHigh temperature resistance hasNon-macromolecular adhesive additivesFilm/foil adhesivesTemperature resistanceGlass transition
The invention provides a high-temperature-resistant bismaleimide resin carrier structure adhesive film and a preparation method thereof, and relates to a high-temperature curing high-temperature-resistant structure adhesive. The invention aims to solve the problems that the conventional bismaleimide adhesive film does not have high temperature-resistant grade and high toughness. The adhesive film consists of bismaleimide resin, a technical modifier, a toughening modifier, a compatibilizer and a thixotropic agent. The preparation method comprises the following steps of: performing prepolymerization on the bismaleimide resin and the technical modifier to obtain a bismaleimide resin prepolymer; mixing the bismaleimide resin prepolymer, the toughening modifier, the compatibilizer and the thixotropic agent uniformly by a mechanical blending method to prepare an adhesive material; and preparing the adhesive by using a three-roller coating film-making machine under the film-forming assistance of the carrier. The adhesive has the characteristics of high-temperature resistance and high toughness, wherein the glass-transition temperature reaches above 280 DEG C and the honeycomb roller peeling strength reaches about 75.0 N.m / m. The adhesive is applied to adhesion of metal or composite material high-temperature-resistant structure members in the field of aerospace.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Heat-releasable pressure -sensitive adhesive tape or sheet
InactiveUS20120058334A1Improve adhesionEasy peelabilityLayered productsAdhesive processes with adhesive heatingCarbon numberPolymer science
The present invention provides a pressure-sensitive adhesive tape or sheet exhibiting good adhesiveness to a variety of adherends and further having both characteristics of repelling resistance and easy peelability. The heat-releasable pressure-sensitive adhesive tape or sheet according to the present invention has a heat-releasable pressure-sensitive adhesive layer containing: as an essential component, an acrylic copolymer formed of a monomer mixture comprising the following monomer (ml) and monomer (m2), with a content of the monomer (m1) being from 40 to 97.5% by weight and a content of the monomer (m2) being from 0.5 to 20% by weight, relative to the whole of monomer components; and a thermal foaming agent:
(m1) an alkyl(meth)acrylate monomer having an alkyl group with a carbon number of from 1 to 12, represented by the following formula (1):
[Chem. 1]
CH2═C(R1)COOR2 (1)
(in the formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group with a carbon number of from 1 to 12); and
(m2) an N-hydroxyalkyl(meth)acrylamide monomer having a hydroxyalkyl group with a carbon number of from 1 to 4, represented by the following formula (2):
[Chem. 2]
CH2═C(R3)CONHR4 (2)
(in the formula (2), R3 represents a hydrogen atom or a methyl group, and R4 represents a hydroxyalkyl group with a carbon number of from 1 to 4).
Owner:NITTO DENKO CORP
Rigid flexible printed circuit board and method of fabricating same
InactiveUS20060193970A1Excellent reliabilityImprove bond reliabilityPrinted circuit aspectsLiquid/solution decomposition chemical coatingPolyimidePrinted circuit board
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD
Chip package structure, package substrate and manufacturing method thereof
ActiveUS20060076659A1Similar thermal expansion coefficientImprove bond reliabilitySemiconductor/solid-state device detailsPrinted circuit aspectsInterposerEngineering
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit layer disposed on a surface thereof. The interposer includes a second substrate and a second circuit layer formed thereon. The second circuit layer comprises a plurality of bonding pads and traces. The traces are electrically connected to the corresponding bonding pads. Furthermore, the bonding pads are used for being connected to the bumps. The second circuit layer of the interposer is physically and electrically connected to the first circuit layer of the first substrate, and the second substrate and the first substrate are made of different materials.
Owner:ADVANCED SEMICON ENG INC
Semiconductor device
ActiveUS20080258317A1Suppress stressLong processSemiconductor/solid-state device detailsSolid-state devicesDevice materialSemiconductor chip
A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a<b, where “a” is difference in length in the direction from the center of the board towards the edges between the first resin layer and the second resin layer, and “b” is difference in length in the direction from the center of the board towards the corners between the first resin layer and the second resin layer.
Owner:RENESAS ELECTRONICS CORP
Metal bonding method of three-dimensional chip structure and bonding structure
ActiveCN103107128AStop the spreadImprove bonding qualitySemiconductor/solid-state device detailsSolid-state devicesBond qualityThin layer
The invention relates to the field of semiconductor fabrication, in particular to a metal bonding method of a three-dimensional chip structure and a bonding structure. The method comprises that copper of a top chip is processed in a chemical machinery planarization mode, a silicon nitride layer is deposited on the surface after being processed in a chemical machinery planarization mode, the silicon nitride layer attached to the copper of the top chip is etched, a groove is formed, the bottom of the groove is the copper of the top chip, copper of a bottom chip is processed in a chemical machinery planarization mode, a bottom silica layer is etched, the copper is enabled to be protruded, activating treatment is carried out to the surface after etch of the copper of the bottom chip is achieved, the copper of the top chip and the copper of the bottom chip are aligned and bonded, and annealing treatment is carried out to the chips after being bonded. According to the metal bonding method of the three-dimensional chip structure and the bonding structure, silicon oxide and silicon nitride are used for being matched with metal and metal bonding, bonding quality is enabled to be better, a silicon nitride layer thin layer can prevent the metal from diffusing into around materials, and goals that a technology process is simplified, temperature needed by bonding is reduced, bonding reliability is improved, bonding efficiency is improved, and bonding cost is reduced can be achieved.
Owner:WUHAN XINXIN SEMICON MFG CO LTD
Pressure-sensitive adhesive composition
ActiveUS20140016067A1Improve cohesionIncreased durabilityFilm/foil adhesivesLayered productsExtended timePhysical property
A pressure-sensitive adhesive composition is provided. The pressure-sensitive adhesive composition shows stable antistatic performance, and in particular, stably maintains its antistatic performance even when the pressure-sensitive adhesive composition is kept for an extended time under extreme conditions or conditions in which environmental changes are severe, and also has excellent general physical properties such as pressure-sensitive adhesive properties, durability and workability.
Owner:LG CHEM LTD
Thermoplastic resin composition, adhesive film and wiring film using the same
InactiveCN102382382AImprove adhesionImprove bond reliabilityFilm/foil adhesivesAdhesive articlesLow dissipationElastomer
The present invention relates to a thermoplastic resin composition having a low dielectric constant, a low dissipation factor and excellent adhesiveness to a substrate film or a conductor wiring, an adhesive film and a wiring film using the same. The thermoplastic resin composition includes a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer. .
Owner:HITACHI CABLE
Circuit device and manufacturing method thereof
InactiveUS7329957B2Improve bond reliabilityReduce formationPrinted circuit assemblingSemiconductor/solid-state device detailsEngineering
A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.
Owner:SANYO ELECTRIC CO LTD
Antistatic ionic compound, oligomer thereof, copolymer thereof, and pressure-sensitive adhesive composition
InactiveUS20110021691A1Excellent reliabilityExcellent anti-static propertyOrganic chemistryAcid polymer adhesivesPressure sensitiveOligomer
A pressure-sensitive composition contains an ionic compound, or an oligomer or co-polymer of the ionic compound which is composed of a ((meth) acryloyloxy) alkyl ammonium cation and (CF3SO2)2N− anion, or a combination thereof, to obtain a pressure-sensitive adhesive sheet having excellent antistatic properties without adhesion deterioration.
Owner:DAXON TECH INC
Solvent-free polyimide silicone resin composition and cured product thereof
A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent.
Owner:SHIN ETSU CHEM IND CO LTD
Heat dissipating structure and semiconductor package with the same
InactiveUS20050056926A1Easy to checkImprove bond reliabilitySemiconductor/solid-state device detailsSolid-state devicesAdhesiveSemiconductor package
A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.
Owner:SILICONWARE PRECISION IND CO LTD
Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets, and double-sided pressure-sensitive adhesive tapes
InactiveCN1824722AImprove bond reliabilityPrevent static electricityFilm/foil adhesivesEster polymer adhesivesOligomerGlass transition
An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a pressure-sensitive adhesive tapes when separators are peeled off, and has reduced stainability in an adherend, and excellent in transparency, and prevention of occurrence of peeling off and separation, and an antistatic pressure-sensitive adhesive sheet and a double-sided pressure-sensitive adhesive tape using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, a (meth)acryl-based oligomer of weight-average molecular weight of 1,000 to 50,000, and a (meth)acryl-based polymer of glass transition temperature (Tg) of 0°C or less as base polymer.
Owner:NITTO DENKO CORP
Chip package structure, package substrate and manufacturing method thereof
ActiveUS7327018B2Similar thermal expansion coefficientImprove bond reliabilitySemiconductor/solid-state device detailsPrinted circuit aspectsInterposerEngineering
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit layer disposed on a surface thereof. The interposer includes a second substrate and a second circuit layer formed thereon. The second circuit layer comprises a plurality of bonding pads and traces. The traces are electrically connected to the corresponding bonding pads. Furthermore, the bonding pads are used for being connected to the bumps. The second circuit layer of the interposer is physically and electrically connected to the first circuit layer of the first substrate, and the second substrate and the first substrate are made of different materials.
Owner:ADVANCED SEMICON ENG INC
UV-curable optical resin adhesive composition
InactiveCN102464952ACapable of reprocessing (repair) operabilityHigh transparencyEster polymer adhesivesOrganic non-macromolecular adhesiveUV curingSide chain
A UV-curable optical resin adhesive composition is provided, which is excellent in transparency, adhesive reliability and durability and suitable for rework (repair) without an adverse influence on the brightness, the contrast and the Quality of a display image. The UV-curable optical resin adhesive composition is used for filling a gap between an image display panel and a protective cover plate, and comprises: (A) an acryl polymer having a (meth)acryloyl group at its side chain; and (B) a photopolymerization initiator.
Owner:NITTO DENKO CORP
Rigid flexible printed circuit board and method of fabricating same
InactiveUS7347950B2Improve bond reliabilityImprove reliabilityPrinted circuit aspectsLiquid/solution decomposition chemical coatingEngineeringCopper
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD
Organic light emitting diode display, manufacturing method thereof, and rotating device for circuit film
ActiveUS20140103315A1Reduce dead spaceSimple working processSolid-state devicesSemiconductor/solid-state device manufacturingLED displayDisplay device
A manufacturing method of an organic light emitting diode (OLED) display includes: supplying a circuit film on the pad area of the display panel and bonding a first end portion of the circuit film to the pad area; vertically standing and inserting the display panel in a bonding device; holding a portion of the circuit film including a second end portion to be horizontal by using a rotating device including a vacuum absorbing portion; supplying a flexible printed circuit (FPC) into a space under the second end portion of the circuit film, and attaching the flexible printed circuit to the second end portion of the circuit film; and operating the rotating device to move the second end portion to a vertical position, and separating the circuit film from the vacuum absorbing portion.
Owner:SAMSUNG DISPLAY CO LTD
Liquid ejection head
InactiveUS20090179965A1Improve bond reliabilityLow production costInking apparatusEngineeringSealant
A liquid ejection head is constituted by a liquid ejection substrate comprising a liquid supply port for supplying liquid, an ejection outlet for ejecting the liquid supplied from the liquid supply port, and ejection energy generating devices for generating energy for ejecting the liquid; and a supporting member having a supporting surface for supporting the liquid ejection substrate and a liquid supply hole for supplying liquid to the liquid ejection substrate, the liquid supply hole communicating with the liquid supply port of the liquid ejection substrate to form a communicating portion, a periphery of which is sealed by a sealant. The liquid supply hole of the supporting member has an opening larger than that of the liquid supply port of the liquid ejection substrate. The support member has an inner wall portion including an edge line portion defined by the liquid supply hole on a side where the liquid ejection substrate is to be disposed. The inner wall portion is covered with the sealant.
Owner:CANON KK
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