9results about How to "Improve bond reliability" patented technology

A ground structure of a USB board end connector and the board end connector, wherein the ground structure comprises a shielding shell of the USB board end connector and a ground terminal arranged on the shielding shell, a lug directly extended from the shielding shell is arranged on the rear side of the shielding shell, the lug comprises an extension section and an inward bending section, one end of the extension section is connected with the shielding shell, the other end of the extension section is connected with one end of the inward bending section through a first circular arc section; a terminal lug extending outward is arranged on one side of the ground terminal, the lower part of the terminal lug is cut off, and the cut-off part is bent backward to form a stop lug; the inward bending section abuts against the terminal lug and is tightly contacted with the stop lug. The application has the advantage that the ground of the ground terminal is very reliable.

This invention provides an alloy powder capable of forming a bonding layer that meets environmental limitations, operates at high temperatures, and exhibits excellent bonding reliability. The alloy powder of this invention has an AgSi eutectic structure, and when selecting one particle from an image obtained by photographing a particle profile using SEM at a magnification of 2000 to 50000x, and performing the following method on any of its ten adjacent particles, the proportion of the aforementioned AgSi eutectic structure in at least eight of them is 10% or more. The method includes: measuring the total outer perimeter of the particle, and the length of the outer perimeter containing the eutectic structure in a region of 0.2 μm from the outer perimeter towards the center of the particle, excluding regions completely devoid of eutectic structure, and calculating the proportion relative to the total outer perimeter as the proportion of the aforementioned AgSi structure on the particle surface.

This utility model relates to the field of building decoration materials technology, specifically to a crack-resistant splicing structure for lightweight partition boards. The crack-resistant splicing structure for lightweight partition boards provided by this utility model includes a first wall panel and a second wall panel. The upper end of the splicing end face of the first wall panel is provided with a protruding male tenon, and the upper end of the splicing end face of the second wall panel is provided with a grooved female tenon matching the male tenon. Simultaneously, the lower end of the splicing end face of the first wall panel is provided with the same female tenon as the second wall panel, and the lower end of the splicing end face of the second wall panel is provided with the same male tenon as the first wall panel. The front end of the male tenon is slidably connected to an insert tenon via a guide groove, and the lower inner side of the female tenon is provided with a positioning groove matching the shape of the insert tenon. An elastic crack-resistant layer is embedded on both sides of the male tenon, protruding 0.5-2mm from the surface of the male tenon. The female tenon is located above the positioning groove and has a limiting insertion hole matching the positioning groove, through which a positioning pin is inserted.

The invention provides a method and device for casting a metallized ceramic matrix and the metallized ceramic matrix, and relates to the field of electronic ceramic surface metallization. The method comprises the following steps: pre-punching ceramic substrates, carrying out surface treatment, and fixing a plurality of ceramic substrates in a mold cavity; then pressing the liquid metal into a mold cavity provided with the ceramic matrix through pressure, and cooling the mold cavity and an internal contained object to room temperature under the protection atmosphere of inert gas; and finally, after the mold is removed, the required multi-layer interconnected metallized ceramic matrix can be prepared. Compared with the prior art, the process is simple and convenient, the multiple layers of ceramic matrixes and the metal layers are integrally cast through the casting technology, interconnection of any layers of the multiple layers of ceramic matrixes is achieved by pressing in the liquid metal, and the metallized ceramic matrixes of any three-dimensional structure which are interconnected in a three-dimensional mode are obtained through the liquid metal.

The application discloses a forming method of a special-shaped structure and relates to the technical field of composite heat-proof layer forming. The method comprises the following steps: preparing a bearing body, a heat protection structure, a sleeving tool and auxiliary materials, horizontally installing the bearing body and the heat protection structure on two sides of a sleeving platform respectively and making special-shaped surfaces face downward, forming a glue layer prefabricated body on a vertical surface of the bearing body, preparing sleeving glue after detecting a gap and interference in the sleeving test, preparing the sleeving glue and brushing the glue on bonding surfaces in different regions, pushing the heat protection structure into the bearing body to form an assembly, and obtaining the special-shaped structure after solidification, cleaning of accumulated glue and demolding.

The application discloses a kind of anticorrosive mortar for pipeline and preparation method thereof, belong to building material technical field.The anticorrosive mortar for pipeline, by weight parts, including: by silicate cement 100-200 parts, slag 100-200 parts and gypsum 20-30 parts constitute low-heat micro-expansion cementitious system, high-alumina cement 20-30 parts, mechanism sand 500-600 parts, latex powder 15-20 parts, water reducing agent 0.5-1 part, inorganic antibacterial agent 0.5-3 parts and water 90-110 parts.The application constructs binary cementitious system by utilizing low-heat micro-expansion system and high-alumina cement, utilizes the synergistic reaction of slag, gypsum and cement hydration product, directional generation appropriate ettringite to compensate shrinkage, significantly improves the bonding strength of anticorrosive layer and pipeline base surface, while high-alumina cement hydration produces calcium aluminate hydrate and aluminum hydroxide colloid, endows mortar with excellent acid, alkali and salt corrosion resistance.The process of the application is simple, low in cost and green, and can effectively solve the corrosion failure problem of water supply and drainage pipeline in complex chemical environment.

The utility model relates to chip processing field, specifically disclose a material guiding unit and chip bonding device for chip bonding, the material guiding unit among them includes material guiding frame and drive mechanism, the material guiding frame is set up and is opened to material guiding groove, the material guiding groove one end open setting forms material guiding export, the material guiding groove be equipped with the pressing piece, the pressing piece with the bottom surface rotatory movable joint of material guiding groove, just the pressing piece with material guiding frame between be equipped with elastic part, the pressing piece is equipped with first inclined plane away from material guiding export one end, first inclined plane towards one of the side walls of material guiding groove set, the drive mechanism includes drive insert plate and driving piece, drive insert plate insert into material guiding groove, just the one end of drive insert plate is equipped with with first inclined plane corresponding second inclined plane, the material guiding unit above can reliably guide and limit metal lead, effectively improve the bonding reliability.

There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieves a favorable bond reliability of the 2nd bonded part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices is characterized in that the bonding wire includes: a core material of Cu or Cu alloy; and a coating layer containing conductive metal other than Cu formed on a surface of the core material, wherein the coating layer has a region containing Pd as a main component on a core material side, and has a region containing Ni and Pd in a range from a wire surface to a depth of 0.5d when a thickness of the coating layer is defined as d (nm) in a thickness direction of the coating layer, the thickness d of the coating layer is 10 nm or more and 130 nm or less, a ratio CNi / CPd of a concentration CNi (mass%) of Ni to a concentration CPd (mass%) of Pd relative to the entire wire is 0.02 or more and 0.7 or less, a position indicating a maximum concentration of Ni is present in the range from the wire surface to a depth of 0.5d in a concentration profile in a depth direction of the wire, and the maximum concentration of Ni is 10 atomic% or more, and at least one of the following conditions (i) and (ii) is satisfied: (i) a concentration of In relative to the entire wire is 1 ppm by mass or more and 100 ppm by mass or less (ii) a concentration of Ag relative to the entire wire is 1 ppm by mass or more and 500 ppm by mass or less.

The invention relates to an electrode assembly and a preparation method, and the preparation method comprises the steps: providing a pole and a sleeve, the sleeve comprises a cylinder body, one end of the cylinder body is provided with a flanging flange, and the sleeve is made of 316L stainless steel; the pole and the sleeve are positioned, so that the pole is located in the sleeve, the space between the pole and the sleeve is filled with glass powder to form an assembly, and the thermal expansion coefficient of the glass powder is as follows; heating the assembly to melt the glass powder so as to seal the pole and the sleeve together; and cooling the assembly until the molten glass powder is completely solidified to form the glass ring. The invention also discloses an electrode assembly. The reliability and long-term stability of the sealing structure can be improved, and the damage risk is reduced.