Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1069 results about "Silver coating" patented technology

Low-silver-loaded electromagnetic wave shielding fabric preparation method

The invention belongs to the technical field of electromagnetic wave shielding material and relates to a low-silver-loaded electromagnetic wave shielding fabric preparation method, comprising the following specific steps: modifying the surface of polyester fabric, introducing an active group--sulphydryl under the premise of not increasing the surface area of the fabric, and then plating silver with ultrasonic wave; wherein, Ag-S chemical bond is formed between sulphydryl and silver so that the compactness of the silver coating and the adhesion force of the fabric substrate are increased; in the process of chemical plating, fresh plating solution is always on the surface of the fabric and the materials which are absorbed on the surface of the fabric through physical adsorption are removed timely owning to the action of ultrasonic wave so that the continuity and compactness of the silver coating can be improved further; the silver loading content of the prepared silver-loaded electromagnetic wave shielding fabric is 6.7-7.0% by weight; the fabric is more resistant to the corrosion of the air and water, the electromagnetic shielding effectiveness is more than 32dB in the range of 0.01-18GHz, namely the anti-electromagnetic radiation rate is more than 99.9%; the fabric can be widely used in electromagnetic wave antiradiation clothes and in the field of electromagnetic wave shielding for special departments such as military, national defense and the like.
Owner:FUDAN UNIV

Broadband low-profile dielectric patch antenna with anisotropic characteristics

The invention discloses a broadband low-profile dielectric patch antenna with anisotropic characteristics. The antenna comprises a lower dielectric substrate, a metal reflection floor, an upper dielectric substrate and a dielectric patch which are sequentially laminated from bottom to top. The lower surface of the lower dielectric substrate is provided with a microstrip feeder line used for coupling feed. A gap is formed on the vertical split surface of the metal reflection floor, and the projection of the microstrip feeder line on the metal reflection floor is perpendicularly intersected withthe gap; the dielectric patch is provided with two pairs of grooves with inner walls printed with metal and symmetrically arranged relative to the center line of the dielectric patch, and the openingdirection of the grooves is perpendicular to the microstrip feeder line. The anisotropic characteristics of a dielectric patch resonator are firstly utilized to improve the gain of the antenna. Moreover, the larger the dielectric constant difference between the dielectric patch and the upper dielectric substrate is, the higher the gain of the antenna is. And then, the multi-mode property of the dielectric patch is fully utilized, and the high-order mode TM121 mode is close to the TM101 mode by introducing a silver coating groove, so that the bandwidth of the antenna is expanded.
Owner:ZHONGTIAN BROADBAND TECH +1

Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents

The invention relates to sheet/branch silver-coated copper powder, a green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents, and a preparing method of the electrically conductive adhesive. The morphology of the sheet/branch silver-coated copper powder is in a sheet shape and/or a branch shape. The silver coating area rate on the surface of copper powder is 90-95%. The content of a zinc-aluminum alloy in the silver-coated copper powder is lower than 15 wt%. The electrically conductive adhesive comprises following raw materials by weight: 60-90% of the sheet/branch silver-coated copper powder, 0-30% of micron order silver power, 6-12% of epoxy resin, 1-8% of an active diluting agent, 1-6% of toughening resin, 1-3% of a curing agent, 0-1% of a curing promoter and 0.5-2% of a coupling agent. The sheet/branch silver-coated copper powder is high in silver coating rate on the surface of Cu and excellent in electrically conductive performance, so that the electrically conductive adhesive prepared from the sheet/branch silver-coated copper powder is excellent in performance, low in cost and good in intrinsic conductivity.
Owner:重庆邦锐特新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products