1241 results about "Electrically conductive adhesive" patented technology

The invention relates to the technical field of cross-linked polyethylene cables, in particular to a mining cross-linked polyethylene insulated armored self-repairing cable and a manufacturing method thereof.The mining cross-linked polyethylene insulated armored self-repairing cable comprises a center conductor unit, a cross-linked polyethylene insulating layer, a shielding layer and an armored layer sequentially wrap the outer side of the center conductor unit from inside to outside, and an outer sheath layer is extruded on the outer side of the armored layer; the shielding layer comprises a semi-conductive shielding layer wrapping the outer side of the cross-linked polyethylene insulating layer, and the outer side of the semi-conductive shielding layer is wrapped with a copper strip shielding layer. By arranging the composite conductor structure in the central conductor unit and cooperating with the graphene heat dissipation filaments and the paraffin heat absorption and heat dissipation layer, the heat dissipation performance of the cable is improved, the temperature of the cable during operation is effectively reduced, faults caused by overheating are reduced, and the service life of the cable is prolonged; the armor layer and the copper strip shielding layer realize multipoint equipotential grounding through a sectional conductive adhesive tape, electromagnetic interference can be effectively shielded, and fault current diffusion is limited.

The invention discloses a method for measuring the particle size of metal powder by using a scanning electron microscope, which comprises the following steps: step 1, sample treatment: adhering a small conductive adhesive tape on a sample table, sprinkling metal powder on the adhered conductive adhesive tape, and purging to obtain the conductive adhesive tape adhered with the metal powder; step 2, parameter setting: setting acceleration voltage, working distance, diaphragm, image contrast, brightness, magnification times and scanning speed of a scanning electron microscope to observe the conductive adhesive tape adhered with the metal powder obtained in the step 1 to obtain an electronic image of metal powder particles; and processing and calculating the electronic image of the metal powder particles by using software to obtain the average particle size of the metal powder particles. According to the method disclosed by the invention, a solvent is not needed to disperse the sample, pollution of the solvent to the sample is effectively avoided, and the result is more accurate than that of directly measuring the particle size by using length software.

The invention relates to a high-thermal-conductivity epoxy resin conductive adhesive containing a composite conductive filler and a preparation method of the high-thermal-conductivity epoxy resin conductive adhesive. The high-thermal-conductivity epoxy resin conductive adhesive containing the composite conductive filler comprises 6-16% of graphene oxide modified epoxy resin, 0.6-3% of a curing agent, 0-1% of a curing accelerator, 2-7% of epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes, 3-7% of carbon fibers, 3-7% of nano silver powder, 40-70% of micron silver powder, 5.0-15.0% of a surface treating agent, 0.3-2.7% of a coupling agent, 0.5-1.5% of a dispersing agent, 0.1-0.3% of an antioxidant and 0.1-0.3% of a lubricant. 0.5% and the balance of a solvent. The graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes are utilized to improve the dispersion stability of the filler, the modified single-layer / multi-layer carbon nanotubes are adopted as a short-range conductive additive, the carbon fibers are adopted as a long-range conductive additive, and the graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes and the carbon fibers cooperate to improve the conductivity. The conductive adhesive disclosed by the invention is high in heat conductivity, low in volume resistivity and high in tensile strength and bending strength, and has a wide application prospect in the fields of automotive electronics, wind power photovoltaics, LEDs (Light Emitting Diode), LCDs (Liquid Crystal Display) and the like.

The present invention discloses a low-temperature conductive adhesive, which is prepared by weight using raw materials including 70-80 parts of silver powder, 20-30 parts of resin matrix, 1-10 parts of curing agent, 0.1-0.5 parts of silane coupling agent, 0.1-0.5 parts of stabilizer, and 0.1-0.5 parts of metal salt. The present invention introduces an organic metal salt into the resin matrix to reduce the contact resistance of the colloid, and after wet heat aging, maintains a lower contact resistance increase rate. The present invention adopts a combination of epoxy resin, acrylate and modified epoxy acrylic resin, and the weight of epoxy resin and acrylate is less than or equal to the weight of modified epoxy acrylic resin, so that low-temperature curing can be achieved. The present invention can achieve 60-80 ° C, 20-40 min curing, and the conductive adhesive elongation at break obtained can reach more than 8%, and before and after wet heat aging, there is a more stable and relatively small contact resistance, which is particularly suitable for the electronic field with high requirements for contact resistance.

The invention belongs to the technical field of conductive adhesives, and particularly relates to a salt-fog-resistant waterborne conductive adhesive and a preparation method thereof.The salt-fog-resistant waterborne conductive adhesive is mainly prepared from, by weight, 5-10 parts of salt-fog-resistant waterborne polyurethane; 5 to 10 parts of water-based tackifying resin; 30 to 50 parts of conductive silver powder; 10 to 20 parts of ethanol; 2-10 parts of an anti-hydrolysis agent; and 10-30 parts of deionized water. According to the salt-fog-resistant aqueous conductive adhesive, polyurethane resin with polytetrahydrofuran alcohol and polycaprolactone polyol as main structures is used as matrix resin, a system is endowed with excellent water resistance and salt-fog resistance, the salt-fog-resistant aqueous conductive adhesive shows outstanding hydrolysis-resistant stability after being cured, and the salt-fog-resistant aqueous conductive adhesive and the conductive silver powder have a synergistic effect, so that the anti-settling performance is effectively improved.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The application belongs to the technical field of conductive glue, and particularly relates to a conductive glue, a preparation method and application thereof, wherein the conductive glue is made of the following raw materials in parts by weight: 40-60 parts of synthetic acrylic resin, 5-15 parts of epoxy resin, 25-45 parts of conductive filler, 5-15 parts of latent curing aid, 80-120 parts of diluent and 5-8 parts of auxiliary agent. By adding the latent curing aid, the application can reduce the potential possibility of the reaction of the acrylic resin and the epoxy resin at room temperature, thereby improving the storage effect of the conductive glue, improving the overall performance of the electronic product and meeting different application scenarios with different requirements. The preparation method directly mixes the raw materials such as the acrylic resin, the epoxy resin, the conductive filler, the auxiliary agent, the diluent and the latent curing aid uniformly in the preparation process without the need of separation and storage, thereby reducing the production cost, simplifying the use process of the user, improving the production efficiency of the conductive glue and the product quality.

Improvements in the technical field of solar panel (2) manufacturing are provided. To this effect, a process for manufacturing solar panels (2) is disclosed in which rows (4) of solar elements (3) are bonded together by an electrically conductive adhesive, with the electrically conductive adhesive being applied to the solar elements (3) during a transfer movement of the rows (4) of solar elements (3).

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention belongs to the technical field of wafer polishing, and discloses a silicon carbide wafer electrochemical mechanical polishing device and a silicon carbide wafer electrochemical mechanical polishing process. The polishing head is provided with an electric brush, a metal ring, a copper spring and a copper column and is connected with a power supply anode through a wire; through holes are punched in the surface of the polishing pad, and the silicon carbide wafer adheres to the surface of the copper cylinder through conductive glue. In the rough polishing stage, hard abrasive particles are used for polishing under high potential, and surface scratches and deep damage are rapidly removed; and in the fine polishing stage, soft abrasive particles are used, potential is gradually reduced for polishing, shallow layer damage is removed, and the smooth and defect-free silicon carbide wafer is obtained. According to the electrochemical mechanical polishing device and process for the silicon carbide wafer, the silicon carbide slice can be rapidly machined into a smooth and defect-free surface within a short time, the polishing process of the silicon carbide is simplified, meanwhile, edge breakage and serious scratches generated by grinding are avoided, and the machining time and cost needed in the manufacturing process of the silicon carbide wafer are reduced.

A display panel is provided, which is capable of removing a Greenish phenomenon by preventing a shift phenomenon arising inside a panel layer by improving conductivity of a component disposed at an upper portion of the panel layer. The display panel can include a cover window, the panel layer disposed below the cover window, and a support member disposed below the panel layer.

The invention discloses a high-bonding-strength conductive adhesive and a preparation method and application thereof.The preparation method comprises the following steps that S1, epoxy resin E51 is placed in a three-neck flask, acetone is added, stirring is conducted till the epoxy resin E51 is completely dissolved, and ethidene diamine is slowly dropwise added; s2, under the protection of nitrogen, heating to 70-80 DEG C, adding a catalyst triphenylphosphine, carrying out a constant-temperature reaction, after the reaction is completed, cooling to 35-45 DEG C, adding deionized water, and stirring; s3, acetone and unreacted ethylenediamine are removed, then deionized water is used for washing, an obtained product is placed in a vacuum drying oven to be dried, and amino modified epoxy resin of faint yellow viscous liquid is obtained; s4, mixing the amino modified epoxy resin with an anhydride curing agent, a conductive filler, a diluent and a coupling agent; and S5, fully stirring the mixture, carrying out vacuum defoaming, and uniformly stirring to obtain the conductive adhesive. According to the invention, the shearing strength of the chip and the copper bracket can be improved to more than 30MPa.

The invention discloses a high-performance conductive adhesive doped with conductive nanoparticles, and belongs to the technical field of conductive adhesives. The high-performance conductive adhesive provided by the invention is prepared from the following raw materials in parts by weight: 50 to 100 parts of vinyl liquid silicone rubber, 100 to 400 parts of modified silver coated copper powder, 1 to 10 parts of nano silver powder I, 1 to 10 parts of epoxy silane modified prepolymer, 3 to 30 parts of hydrogen-containing silicone oil, 0.1 to 5 parts of platinum catalyst and 0.05 to 1 part of inhibitor. The silver-coated copper powder and the epoxy silane are modified, so that the conductivity and the binding power of the conductive adhesive are greatly improved, and the epoxy silane modified prepolymer can form strong covalent bond combination with the surface of an adhered object through a high-density epoxy group of the epoxy silane modified prepolymer; the nano-silver bulges on the surface of the modified silver coated copper powder increase the effective contact area and the number of contact points among the conductive filler particles, so that the conductive adhesive has the characteristics of high conductivity, low resistance, high adhesive strength and strong toughness.

The invention belongs to the technical field of angle sensors, and particularly relates to a tilt angle sensor and a preparation method and application thereof. The tilt angle sensor provided by the invention comprises a base body and a micro-channel communicated with any two points in the base body, the micro-channel is filled with gallium-based alloy liquid, the surface of the micro-channel contains a plurality of bulges, and the average height of the bulges is 50-200 microns; the two ends of the micro-channel are sealed by conductive adhesive; the conductive adhesive is connected with the electrode; the matrix is prepared from polydimethylsiloxane. The micro-channel containing the micron-sized bulge structure is arranged in the base body, so that local capillary force gradient can be generated, and the body response speed of the gallium-based alloy liquid is accelerated; and meanwhile, the special structure of the micro-channel has directional textures, so that asymmetric flow resistance and multi-path conductive paths can be generated, and differential resistance changes are generated during inclination to realize multi-directional inclination angle detection. The detection sensitivity and the anti-noise capability of the tilt angle sensor are remarkably improved by inducing a nonlinear flow control effect through the bulges in the micro-channel.

The invention provides a composite photo-initiation system electronic adhesive as well as a preparation method and application thereof, and relates to the technical field of anisotropic conductive adhesive films. The adhesive comprises a thermoplastic resin solution, an acrylate monomer, epoxy resin, a polyfunctional oligomer solution containing a carbon-carbon double bond and an epoxy group, an insulating inorganic filler, conductive particles and a composite photoinitiator solution, wherein the composite photoinitiator is composed of a free radical photoinitiator and a cationic photoinitiator, and acrylate free radical chain polymerization and epoxy resin cationic ring opening polymerization are synchronously triggered through ultraviolet light; and the polyfunctional oligomer is used as a molecular bridge to bond the two-phase curing network to form an interpenetrating cross-linked structure. The electronic adhesive provided by the invention realizes low-temperature rapid curing for 1-15 seconds, the curing shrinkage rate is reduced to below 1%, the reliability defect caused by oxygen inhibition, high shrinkage rate and phase separation of a traditional single system is solved, and the electronic adhesive is suitable for low-temperature efficient packaging of high-precision electronic components.

The invention discloses conductive nickel powder, a preparation method and an electronic product, relates to the technical field of conductive materials, and aims to improve the conductivity of nickel powder while giving consideration to the electromagnetic shielding function of the conductive nickel powder. According to the preparation method, the nickel powder coating the surface of the carbon nano tube is prepared, so that the prepared nickel powder is easier to break through the infiltration phenomenon, and in order to further improve the application performance of the conductive nickel powder, a polyaniline chain segment introduced with a camphorsulfonic acid structure is further prepared and formed on the surface of the nickel powder; the conductivity of a polyaniline structure is improved, the surface polarity of the nickel powder is improved, and the compatibility with resin is improved; finally, the conductive nickel powder can have high dispersity and high compatibility while having high conductivity in the conductive adhesive, and the use performance of the conductive nickel powder is improved.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

Disclosed are a stretchable microneedle adhesive patch (SNAP) capable of performing high-quality electrophysiological (EP) signal measurement without skin preparation, such as exfoliating the skin or removing sweat, a SNAP system, and an operating method thereof. The disclosed SNAP capable of performing skin preparation-free high-quality EP signal measurement includes an electrically conductive adhesive (ECA) layer configured to attach to a user's skin to obtain an EP signal regardless of the user's skin condition; a microneedle sensor including a microneedle array configured to penetrate the stratum corneum by passing through the ECA layer and to directly contact the skin epidermis of the user; and conductive wire-based stretchable interconnects having a serpentine structure that is electrically and mechanically connected to the microneedle sensor to dynamically adapt to skin deformation of the user.

The invention discloses an ultraviolet curing organic silicon conductive adhesive and a preparation method thereof, and relates to the technical field of conductive materials, the ultraviolet curing organic silicon conductive adhesive comprises the specific components of organic silicon matrix resin, a photosensitive curing agent, a conductive filler, a reactive diluent, a coupling agent and a thixotropic agent; the photosensitizer further comprises carborane cluster particles, a phosphazene silane nanocage, a sulfur-doped tungstate nanosheet, a potassium fluoride modified hollow graphene ball and an additive of a germanoxane photosensitizer. The material is prepared based on the materials. According to the preparation method, multiple functional additives are introduced into a traditional ultraviolet curing organic silicon conductive adhesive system, a multi-dimensional conductive path is constructed on the molecular and nanoscale, and the photocuring initiation efficiency and the interface stability are optimized, so that the prepared conductive adhesive not only realizes low resistivity, but also can be rapidly and deeply cured in an adhesive layer with relatively high thickness; and meanwhile, excellent damp-heat resistance and corrosion resistance are achieved.

The application relates to the technical field of all-vanadium redox flow batteries, and discloses an integrated electrode plate and a preparation method and application thereof, which comprises the following steps: mixing and calcining a metal organic framework material and polyvinylpyrrolidone to obtain a porous carbon material; uniformly melting and mixing the porous carbon material, resin and conductive carbon material, and performing die forming to obtain a modified bipolar plate; using silver-coated copper powder as a conductive filler, and using epoxy modified acrylic resin as an organic carrier to prepare ultraviolet light curing silver-coated copper conductive adhesive; and bonding the electrode and the modified bipolar plate through ultraviolet light curing to prepare the integrated electrode plate. The porous carbon is obtained by using a polyvinylpyrrolidone-assisted limited carbonization method, the conductivity of the bipolar plate is improved, epoxy modified acrylic resin is used as the organic carrier, the silver-coated copper powder is uniformly distributed in the organic carrier, the conductivity of the conductive adhesive is improved, and the integrated electrode plate improves the performance of the flow battery.

The invention relates to a nanometer enhanced intelligent monitoring silicone rubber cable and a preparation method thereof, and the cable comprises a conductor unit and a nanometer composite insulating layer which is extruded at the outer side of the conductor unit; the gradient shielding structure is sequentially arranged on the outer side of the nano composite insulating layer in a sleeving mode, the gradient shielding structure, the inner tinned monofilament braid layer and the middle aluminum-plastic composite heat insulation wrapping tape are bonded through a conductive adhesive layer, and fiber bundles of the outer basalt fiber braid layer are embedded into surface grooves of the middle aluminum-plastic composite tape to form a mechanical interlocking structure; the distributed sensing unit is embedded between the middle shielding layer and the outer shielding layer, and the outer sheath layer is extruded on the outer side of the gradient shielding structure. According to the invention, the problems of poor aging resistance, weak shielding and sensing distortion of a traditional cable are solved. The tensile strength retention rate after aging at 150 DEG C is greater than or equal to 85%, the electromagnetic interference attenuation is improved by 14dB, the signal distortion rate during bending is less than or equal to 5%, and the cable is suitable for intelligent monitoring in high-temperature, high-humidity and strong-corrosion environments.

The invention discloses a method for preparing a section sample of a new energy automobile battery powder material, and relates to the technical field of battery material analysis, and the method comprises the following steps: uniformly mixing a battery powder material with a liquid conductive adhesive solution; pouring the mixture into a mold for curing, and demolding to obtain a conductive sample block with a regular shape; directly loading the conductive sample block in an ion beam cutting system for ion cutting to obtain a flat sample section; and surface metal spraying treatment is not needed, and electron microscope observation and analysis are directly carried out. According to the preparation method, the conductive adhesive solution is adopted for inlaying and is combined with mold forming, so that time-consuming mechanical grinding and polishing procedures in a traditional method are omitted, and the preparation period is greatly shortened; and meanwhile, an in-situ conductive network formed after the glue solution is cured is utilized to effectively inhibit the charge effect, so that direct observation without metal spraying is realized, sample preparation damage and plating interference are avoided, and the authenticity and accuracy of an analysis result are ensured. The method is simple and convenient to operate and good in repeatability.

The invention discloses a functional current collector with high ductility and binding power as well as a preparation method and application thereof, and relates to the field of battery manufacturing. The preparation method comprises the following steps: 1, kneading silicone rubber and white carbon black to obtain a base material; adding the nickel-coated graphite powder, a cross-linking agent, a coupling agent and a catalyst into the base material, and uniformly mixing to obtain conductive slurry; 2, coating the surface of the substrate layer with conductive slurry, and vulcanizing to obtain a conductive adhesive layer; the membrane is a composite membrane; and step 3, plating a metal layer on the surface of the composite film through a water plating process to obtain the functional current collector. The preparation method has the beneficial effects that the functional current collector prepared by the preparation method has excellent ductility and binding power.

The invention discloses a pit filling type current collector transfer welding structure and a conductive insulating coating process thereof, and relates to the technical field of lithium battery manufacturing. The current collector transfer welding structure comprises a polymer film base material, metal layers on the two sides of the polymer film base material, periodic pits formed in the surfaces of the metal layers through ultrasonic roll welding, conductive adhesive filled in the periodic pits and insulating adhesive covering the surfaces of the conductive adhesive and the metal layers from inside to outside. A functional coating containing fluorinated polyurethane-epoxy hybrid resin, an intelligent anti-corrosion microcapsule and a flame-retardant component can be selectively introduced between the conductive adhesive and the insulating adhesive; and a roll welding-micro spraying-UV-thermal gradient curing process is adopted for preparation. After the structure is applied, the volume resistivity of the pit area is low, the resistance of a welding loop is reduced, the breakdown voltage of the insulation paste is greater than or equal to 5kV, and the safety and the reliability of the power battery are remarkably improved.

The invention relates to the technical field of electromagnetic shielding devices, and discloses an electromagnetic shielding structure for a keyboard chip, a manufacturing method of the electromagnetic shielding structure and a wireless keyboard applying the electromagnetic shielding structure, and the method comprises the following steps: a first circuit layer is provided with a signal wire and a grounding wire, and is connected to a second circuit layer provided with a welding pad and a false welding pad through a via hole; the chip is welded on the welding pad, and the false welding pad is electrically connected with the grounding wire; an insulating layer and a third circuit layer are formed outside the chip, and a coverage area is connected with the false welding pad through a via hole; the electromagnetic shielding layer is arranged on the solder mask layer, and the electromagnetic shielding layer is electrically connected with the grounding wire through the conductive adhesive layer, so that the chip is wrapped and shielded in all directions. The structure can effectively reduce electromagnetic interference and improve the stability of wireless keyboard signals, and is suitable for thin keyboard circuit design.

The invention belongs to the technical field of lithium ion batteries, and particularly relates to a preparation method of graphite-silicon mixed negative electrode slurry, a negative electrode plate and a lithium ion battery. Comprising the following steps: firstly, adding a polyacrylic acid PAA glue solution, conductive agent slurry and conductive agent powder into a pulping machine, and quickly stirring to obtain conductive adhesive slurry; then adding silicon powder into the obtained conductive adhesive slurry, and rapidly stirring to obtain silicon slurry; adding the graphite powder into another pulping machine, slowly stirring for a short time, adding a sodium carboxymethyl cellulose (CMC) glue solution and water, slowly stirring for a long time, and adjusting the solid content of the slurry to 62-68% to obtain graphite slurry; and adding the silicon slurry into the obtained graphite slurry in three times, and adding water to adjust the solid content of the slurry to be 45-55%. And finally, adding a styrene butadiene rubber SBR emulsion into the obtained slurry, slowly stirring, vacuumizing and sieving to obtain the final slurry. According to the preparation method of the slurry, the dispersion uniformity of silicon in graphite can be effectively improved, the volume expansion in the silicon circulation process is inhibited, the connection of the conductive agent and the silicon particles is promoted and the silicon conductivity is improved through the hydrogen bond bonding between the polyacrylic acid PAA with strong bonding force and the silicon particles, so that the resistance of a pole piece is reduced, and the cycle performance of the whole battery is improved.

The invention relates to the technical field of batteries, and discloses a negative plate and a secondary battery, the negative plate comprises a negative current collector, a first active layer and a second active layer, the first active layer is located between the negative current collector and the second active layer, the first active layer comprises a first active material and a mixed conductive adhesive, and the second active layer comprises a second active material and a mixed conductive adhesive. The surface of the first active material is coated with the mixed conductive adhesive, and the mixed conductive adhesive and the first active material form a core-shell structure; the mixed conductive adhesive comprises a first conductive agent, a first binder and an additive A; the additive A is a metal organic framework compound and is uniformly dispersed in the shell layer. According to the negative electrode plate provided by the invention, the additive A in the mixed conductive adhesive and the mixed conductive adhesive are arranged on the bottom layer of the negative electrode active layer, so that the purposes of improving the wettability of an electrolyte, improving the mechanical stability, reducing the ion / electron transmission impedance and further improving the cycle performance are achieved on the premise of ensuring the energy density; particularly, the low-temperature cycle performance can be improved.

The invention relates to a photovoltaic module and a production method thereof. The photovoltaic module comprises a plurality of battery pieces and a welding strip connected with the plurality of battery pieces. The battery piece comprises a battery main body, grid lines, welding points, an insulating layer and conductive adhesive, the grid lines are distributed on the surface of the battery main body, the welding points and the conductive adhesive are respectively distributed on the grid lines and are conductively connected with the grid lines, the insulating layer covers the grid lines along the grid lines, the welding points and the conductive adhesive are exposed out of the insulating layer, and the welding points and the conductive adhesive are respectively connected to the welding strips. According to the photovoltaic module and the production method thereof, the conductive adhesive is distributed on the grid line, the welding strip is pre-fixed by using the conductive adhesive when the welding strip is welded, displacement and pseudo soldering of the welding strip in the welding process can be prevented, and the welding strip is further connected with the welding point, so that the series welding tension can be effectively improved, and the reliability of the module is improved.

The invention relates to a preparation method of a receiving sensing array, the receiving sensing array and an imaging sonar, and the method comprises the steps: enabling a first matching layer to block the matching layer slurry in a process that the matching layer slurry is solidified to form a second matching layer, so as to prevent the matching layer slurry from entering a positioning hole through the permeation of a conductive adhesive tape. The first matching layer and the second matching layer jointly form the matching layer, and the situation that the thickness of the matching layer on the surface of the conductive adhesive tape is insufficient is effectively avoided by ensuring the thickness of the second matching layer.

The invention relates to a display panel, a manufacturing method thereof and a display device, and the display panel comprises a first substrate which comprises at least one first hole; the first metal layer comprises a plurality of first binding terminals; the circuit board comprises a plurality of second binding terminals; the first adhesive material is positioned between the circuit board and the first substrate; the second adhesive material comprises a plurality of conductive parts, and the second adhesive material is conductive adhesive; wherein the at least one first through hole and the at least one second through hole are arranged corresponding to a second binding terminal; the first through hole at least partially penetrates through the circuit board and the first adhesive material; the second through hole at least partially penetrates through the circuit board; the conductive part comprises a first sub-conductive part at least filled in the corresponding first through hole and a second sub-conductive part at least filled in the corresponding second through hole, the second binding terminal is electrically connected with the corresponding first binding terminal through the corresponding first sub-conductive part, and the conductive part is connected with the first adhesive material through the corresponding second sub-conductive part. The reliability is improved.