1932 results about "Electrically conductive adhesive" patented technology

The invention relates to the technical field of cross-linked polyethylene cables, in particular to a mining cross-linked polyethylene insulated armored self-repairing cable and a manufacturing method thereof.The mining cross-linked polyethylene insulated armored self-repairing cable comprises a center conductor unit, a cross-linked polyethylene insulating layer, a shielding layer and an armored layer sequentially wrap the outer side of the center conductor unit from inside to outside, and an outer sheath layer is extruded on the outer side of the armored layer; the shielding layer comprises a semi-conductive shielding layer wrapping the outer side of the cross-linked polyethylene insulating layer, and the outer side of the semi-conductive shielding layer is wrapped with a copper strip shielding layer. By arranging the composite conductor structure in the central conductor unit and cooperating with the graphene heat dissipation filaments and the paraffin heat absorption and heat dissipation layer, the heat dissipation performance of the cable is improved, the temperature of the cable during operation is effectively reduced, faults caused by overheating are reduced, and the service life of the cable is prolonged; the armor layer and the copper strip shielding layer realize multipoint equipotential grounding through a sectional conductive adhesive tape, electromagnetic interference can be effectively shielded, and fault current diffusion is limited.

The invention relates to the technical field of solar cells, in particular to a back contact solar cell interconnection method, which comprises the following steps of: arranging positive fine grid lines and negative fine grid lines on the back surfaces of cells in a staggered manner; printing conical insulating glue on the negative electrode fine grid lines and printing conductive glue on the positive electrode fine grid lines at the positions, corresponding to the positive electrode welding strips, of the discontinuous openings; printing a conical insulating adhesive on the positive electrode fine grid line and printing a conductive adhesive on the negative electrode fine grid line at the position of the discontinuous opening corresponding to the negative electrode welding strip; printing isolation glue on the edge of the cell corresponding to the positive electrode solder strip and the negative electrode solder strip; laying a positive electrode welding strip and a negative electrode welding strip on the conductive adhesive in a staggered manner; and then carrying out lamination welding treatment. Connection is achieved by printing the conductive adhesive between the fine grid lines, traditional main grid line connection is removed, and the use amount of silver paste is reduced; and a welding strip in a specific shape can be directly laid on the conductive adhesive for pre-curing, so that the welding strip is ensured to be fully connected with the fine grid through the conductive adhesive, and the problem of insufficient welding in later lamination is effectively solved.

The invention belongs to the technical field of sodium-ion batteries, and relates to sodium-ion battery positive electrode slurry and a preparation method thereof, and the sodium-ion battery positive electrode slurry comprises a positive electrode active material, a conductive agent, a binder, a dispersant, a slurry stabilizer and a solvent; the positive electrode active material is a transition metal layered oxide material, the conductive agent is one or a combination of more of conductive carbon black, ketjen black, conductive graphite and a carbon nanotube, the binder is polyvinylidene fluoride, the dispersant is polyvinylpyrrolidone, the slurry stabilizer is one or a combination of more of iron oxide, aluminum oxide, zirconium oxide and titanium boride, and the positive electrode active material is a positive electrode active material. The solvent is N-methyl pyrrolidone; in the slurry preparation step, a binder and a solvent are mixed and dissolved to prepare a glue solution; adding a conductive agent and a dispersing agent for dispersing to obtain a conductive adhesive; adding a positive active material and a slurry stabilizer, and dispersing to obtain final slurry; the invention can effectively solve the problem of slurry flocculation in the homogenizing process of the sodium ion battery positive electrode material.

The invention relates to the technical field of LED display, and discloses a Mini / Micro LED and a manufacturing method thereof. The manufacturing method comprises the following steps: preparing metal conductive particle balls through a mechanical separation process or a spraying process; coating an insulating coating on the surface of the metal conductive particle ball and air-drying to form an insulating film; putting the metal conductive particle balls coated with the insulating films into provided insulating glue and stirring to form anisotropic conductive glue; printing anisotropic conductive adhesive on a bonding pad of the provided substrate through the provided hydrophobic nano steel mesh; stripping the hydrophobic nano steel mesh; the provided Mini / Micro LED chip is mounted on the anisotropic conductive adhesive located on the bonding pad, the insulating film is longitudinally broken by heating and pressurizing to expose the metal conductive particle balls wrapped in the insulating film, the metal conductive particle balls are respectively in contact with the Mini / Micro LED chip and the bonding pad to form a vertical conductive path, and the insulating adhesive is preliminarily cured to obtain the Mini / Micro LED, so that stable welding quality is realized; and the maintenance difficulty and the maintenance cost are low.

The invention provides a vertical structure ultraviolet photoelectric detector and a preparation method thereof. The ultraviolet photoelectric detector is of a vertical structure, the design facilitates light absorption of the ultraviolet photoelectric detector, the light utilization rate of the ultraviolet photoelectric detector is improved, and compared with a horizontal structure, the transmission distance is shortened, and the cost is low; the ultraviolet photoelectric detector provided by the invention has a relatively high switching ratio of light and dark current and relatively small dark current, and also has a very high response speed under the condition of keeping the switching ratio of light and dark current and the dark current; a PN junction is formed between the nickel oxide hole transport layer and the beta-phase gallium oxide single crystal, so that the ultraviolet photoelectric detector has self-driving performance; in the manufacturing process, the substrate is used as a supporting frame, and the extraction electrode is packaged in one step through the conductive adhesive tape, so that 3-5 photoetching steps of a traditional horizontal structure are omitted, the process is simplified, and the process manufacturing is simpler.

The invention discloses a method for measuring the particle size of metal powder by using a scanning electron microscope, which comprises the following steps: step 1, sample treatment: adhering a small conductive adhesive tape on a sample table, sprinkling metal powder on the adhered conductive adhesive tape, and purging to obtain the conductive adhesive tape adhered with the metal powder; step 2, parameter setting: setting acceleration voltage, working distance, diaphragm, image contrast, brightness, magnification times and scanning speed of a scanning electron microscope to observe the conductive adhesive tape adhered with the metal powder obtained in the step 1 to obtain an electronic image of metal powder particles; and processing and calculating the electronic image of the metal powder particles by using software to obtain the average particle size of the metal powder particles. According to the method disclosed by the invention, a solvent is not needed to disperse the sample, pollution of the solvent to the sample is effectively avoided, and the result is more accurate than that of directly measuring the particle size by using length software.

The invention relates to a high-thermal-conductivity epoxy resin conductive adhesive containing a composite conductive filler and a preparation method of the high-thermal-conductivity epoxy resin conductive adhesive. The high-thermal-conductivity epoxy resin conductive adhesive containing the composite conductive filler comprises 6-16% of graphene oxide modified epoxy resin, 0.6-3% of a curing agent, 0-1% of a curing accelerator, 2-7% of epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes, 3-7% of carbon fibers, 3-7% of nano silver powder, 40-70% of micron silver powder, 5.0-15.0% of a surface treating agent, 0.3-2.7% of a coupling agent, 0.5-1.5% of a dispersing agent, 0.1-0.3% of an antioxidant and 0.1-0.3% of a lubricant. 0.5% and the balance of a solvent. The graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes are utilized to improve the dispersion stability of the filler, the modified single-layer / multi-layer carbon nanotubes are adopted as a short-range conductive additive, the carbon fibers are adopted as a long-range conductive additive, and the graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes and the carbon fibers cooperate to improve the conductivity. The conductive adhesive disclosed by the invention is high in heat conductivity, low in volume resistivity and high in tensile strength and bending strength, and has a wide application prospect in the fields of automotive electronics, wind power photovoltaics, LEDs (Light Emitting Diode), LCDs (Liquid Crystal Display) and the like.

The present invention discloses a low-temperature conductive adhesive, which is prepared by weight using raw materials including 70-80 parts of silver powder, 20-30 parts of resin matrix, 1-10 parts of curing agent, 0.1-0.5 parts of silane coupling agent, 0.1-0.5 parts of stabilizer, and 0.1-0.5 parts of metal salt. The present invention introduces an organic metal salt into the resin matrix to reduce the contact resistance of the colloid, and after wet heat aging, maintains a lower contact resistance increase rate. The present invention adopts a combination of epoxy resin, acrylate and modified epoxy acrylic resin, and the weight of epoxy resin and acrylate is less than or equal to the weight of modified epoxy acrylic resin, so that low-temperature curing can be achieved. The present invention can achieve 60-80 ° C, 20-40 min curing, and the conductive adhesive elongation at break obtained can reach more than 8%, and before and after wet heat aging, there is a more stable and relatively small contact resistance, which is particularly suitable for the electronic field with high requirements for contact resistance.

The invention discloses an electromagnetic shielding film and a circuit board, the electromagnetic shielding film comprises a first shielding layer, a flexible conductive adhesive layer and a second shielding layer which are stacked in sequence, and the flexible conductive adhesive layer is arranged between the first shielding layer and the second shielding layer, so that the bending resistance of the electromagnetic shielding film is effectively improved, interference signals are effectively weakened, and the electromagnetic shielding effect is improved. According to the electromagnetic shielding film, the shielding performance is improved, the elastic modulus of the flexible conductive adhesive layer is set between 80 MPa and 120 MPa, the elastic modulus of the flexible conductive adhesive layer is limited within a reasonable range, the bending resistance of the electromagnetic shielding film is better improved, and the electromagnetic shielding film is suitable for products needing to be folded or opened and closed for a long time and at high frequency.

The invention belongs to the technical field of conductive adhesives, and particularly relates to a salt-fog-resistant waterborne conductive adhesive and a preparation method thereof.The salt-fog-resistant waterborne conductive adhesive is mainly prepared from, by weight, 5-10 parts of salt-fog-resistant waterborne polyurethane; 5 to 10 parts of water-based tackifying resin; 30 to 50 parts of conductive silver powder; 10 to 20 parts of ethanol; 2-10 parts of an anti-hydrolysis agent; and 10-30 parts of deionized water. According to the salt-fog-resistant aqueous conductive adhesive, polyurethane resin with polytetrahydrofuran alcohol and polycaprolactone polyol as main structures is used as matrix resin, a system is endowed with excellent water resistance and salt-fog resistance, the salt-fog-resistant aqueous conductive adhesive shows outstanding hydrolysis-resistant stability after being cured, and the salt-fog-resistant aqueous conductive adhesive and the conductive silver powder have a synergistic effect, so that the anti-settling performance is effectively improved.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The application belongs to the technical field of conductive glue, and particularly relates to a conductive glue, a preparation method and application thereof, wherein the conductive glue is made of the following raw materials in parts by weight: 40-60 parts of synthetic acrylic resin, 5-15 parts of epoxy resin, 25-45 parts of conductive filler, 5-15 parts of latent curing aid, 80-120 parts of diluent and 5-8 parts of auxiliary agent. By adding the latent curing aid, the application can reduce the potential possibility of the reaction of the acrylic resin and the epoxy resin at room temperature, thereby improving the storage effect of the conductive glue, improving the overall performance of the electronic product and meeting different application scenarios with different requirements. The preparation method directly mixes the raw materials such as the acrylic resin, the epoxy resin, the conductive filler, the auxiliary agent, the diluent and the latent curing aid uniformly in the preparation process without the need of separation and storage, thereby reducing the production cost, simplifying the use process of the user, improving the production efficiency of the conductive glue and the product quality.

The invention discloses a high-dispersion graphene conductive adhesive solution for a battery and a preparation method of the high-dispersion graphene conductive adhesive solution, and belongs to the technical field of conductive adhesive solutions. The high-dispersion graphene conductive adhesive solution for the battery prepared by the invention is prepared from the following raw material components in parts by mass: 6 to 8 parts of high-dispersion graphene, 4.5 to 13.5 parts of an adhesive and 60 to 90 parts of a solvent, the preparation method comprises the following steps: ultrasonically dispersing graphene in a mixed solution of hexadecyl triyl ammonium bromide and deionized water, sequentially adding hexadecyl triyl ammonium bromide, sodium molybdate dehydrate, bismuth nitrate pentahydrate and cerium nitrate hexahydrate, uniformly stirring and dispersing, performing hydrothermal reaction, washing, drying, grinding and sieving to obtain the high-dispersion graphene. The adhesive is prepared from an amphiphilic polyethylene glycol-polycaprolactone block copolymer and amphiphilic polyacrylate.

The invention provides a detachable high-adaptation conductive adhesive test seat and adaptation equipment thereof, and relates to the technical field of chip tests.The test seat comprises a base, a bottom plate and a connecting frame, two connecting blocks are arranged in the base, the opposite faces of the two connecting blocks are fixedly connected with fixing blocks, the base is internally provided with a test seat, and the test seat is fixedly connected with the bottom plate. The control system determines corresponding clamping parameters including the stroke of the air cylinder, the clamping force and the like according to the type and the specification of the chip, the control system sends out an instruction to drive the air cylinder to start acting, a piston rod of the air cylinder stretches out and drives the clamping block to move towards the chip, and the clamping block accurately clamps the chip according to the preset position and force. According to the automatic chip testing device, the chips are ensured to be stable in the testing process, so that automatic adaptive fixation of different chips is realized, the identification and adjustment processes can be quickly completed through automatic identification and adaptive functions after the chips are put into the device, the manual intervention time is greatly shortened, and the overall automation degree and the testing efficiency are improved.

The present invention proposes a sputtering cleaning system and cleaning method for the inner wall of the ionization chamber of a radio frequency ion thruster. The system is composed of a gas distributor, a potential control line, a radio frequency coil, an ionization chamber, a screen grid, an acceleration grid, a positive DC voltage source, a radio frequency power supply, a negative DC voltage source and a conductive tape. The method includes: 1. The radio frequency ion thruster is started, and plasma is formed in the ionization chamber; 2. A positive voltage is applied to the screen grid, and ions are drawn out by the grid system, and the thruster enters a working state; 3. When the conductive film is thicker and the power input is weakened, the positive DC power supply is turned off, and no ions are drawn out of the thruster; 4. The negative DC power supply is turned on, and a negative voltage is slowly applied to the potential control line to increase the energy of ions hitting the inner wall of the ionization chamber; 5. The conductive film on the inner wall of the ionization chamber is bombarded by ions, and particles are sputtered out. The particles are neutral and are discharged from the ionization chamber under the action of the neutral particle flow, thereby achieving cleaning of the inner wall of the ionization chamber.

Improvements in the technical field of solar panel (2) manufacturing are provided. To this effect, a process for manufacturing solar panels (2) is disclosed in which rows (4) of solar elements (3) are bonded together by an electrically conductive adhesive, with the electrically conductive adhesive being applied to the solar elements (3) during a transfer movement of the rows (4) of solar elements (3).

The invention belongs to the technical field of solid-state batteries, and relates to a preparation method of sulfide all-solid-state battery positive electrode slurry. The preparation method comprises the following steps: (1) dividing a conductive adhesive into three parts, mixing the first part of conductive adhesive with a positive active material, and granulating; (2) adding a second part of conductive adhesive into the granulated slurry, and kneading; (3) adding sulfide electrolyte slurry into the kneaded slurry, and dispersing; and (4) adding a third part of conductive adhesive into the dispersed slurry, and dispersing again to obtain the positive electrode slurry, wherein based on the total mass of the conductive adhesive, the mass percent of the first part of conductive adhesive is 20-30%, the mass percent of the second part of conductive adhesive is 30-40%, and the mass percent of the third part of conductive adhesive is 40-50%. The sulfide all-solid-state battery positive electrode slurry prepared by the preparation method provided by the invention has obviously higher solid content, obviously lower fineness and better stability.

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.

The invention discloses a preparation method and application of circumferentially limited supercritical foaming self-packaging TENG, and the preparation method comprises the following steps: uniformly mixing a PDMS precursor and a curing agent, pouring the mixture into a mold, and putting the mold into a vacuum oven for curing to obtain a PDMS film; adhering the PDMS film to the middle position of the PI film through a double-sided nickel conductive adhesive tape, then putting the PDMS film into a mold, putting a thermoplastic elastomer on the upper layer, and performing hot pressing by using a vacuum auxiliary hot press to obtain a prefabricated sample; putting the prefabricated sample into a supercritical foaming reaction kettle, controlling the temperature to 70-130 DEG C, injecting supercritical fluid into the foaming reaction kettle, after the prefabricated sample and the supercritical fluid form a saturated and stable blending system, maintaining for 0.8-1.5 hours, taking out the blended system, and naturally cooling to room temperature, so as to obtain the TENG. The preparation method has the beneficial effects that the self-assembled and self-packaged TENG with the bionic dome structure is successfully prepared through cooperation of a supercritical fluid technology and a limited foaming strategy, and the technical scheme of the self-assembled and self-packaged TENG obtains breakthrough progress in the aspects of the preparation process, the structural design and the environmental adaptability.

The invention relates to the technical field of current collectors, in particular to a diversion method of a functional current collector. The composite carbon nanotube is obtained by sequentially carrying out oxidation treatment, acylating chlorination treatment, modification treatment, amination treatment and graft polymerization treatment on a multi-wall carbon nanotube. Uniformly mixing the PET resin, the composite carbon nanotubes, a surfactant and a coupling agent, and carrying out standing, melt extrusion, tape casting, sheet casting treatment and two-way stretching to obtain the PET base film. The preparation method comprises the following steps: sequentially sputtering a copper layer on the surface of a PET (Polyethylene Terephthalate) base film, carrying out water electroplating on the copper layer, then coating the surface of the copper layer with an active substance, and then directly dipping a conductive adhesive solution in a lug position which is not plated with copper to obtain a pole piece; and stacking a plurality of pole pieces together, and inserting a current collector at the center of the stack to obtain the functional current collector. The functional current collector prepared by the method has good conductivity and mechanical property, so that the functional current collector has a wide application prospect in the technical field of current collectors.

The invention discloses a carbon nanotube film, a conductive prepreg and a preparation method thereof. Comprising the following steps: step 1, preparing a carbon nanotube film; 2, rolling and compounding: carrying out rolling and compounding on the carbon nanotube film and a required adhesive film through a compounding machine to form a conductive adhesive film, and compounding the conductive adhesive film and fibers to form a conductive prepreg; or carrying out rolling compounding on the carbon nanotube film and the required prepreg through a compounding machine to form a conductive prepreg; step 3, cutting and curing to obtain a conductive prepreg with a required specification; according to the carbon nanotube film, the conductive prepreg and the preparation method of the conductive prepreg, the cost of the carbon nanotube film can be effectively reduced, the preparation efficiency of the carbon nanotube film is improved, the storage and transportation modes of the carbon nanotube film are optimized, the carbon nanotube film can be conveniently cut and spliced, the resistance controllability of the conductive prepreg is improved, and the service life of the conductive prepreg is prolonged. And the patterned resistance distribution arrangement can be realized.

The invention discloses a packaging structure and a packaging method of a Mini / Micro LED (Light Emitting Diode) chip. The packaging method comprises the following steps: respectively carrying out electrostatic polarization treatment with opposite charge polarities on conductive particles and a bonding pad of a substrate, and adsorbing the conductive particles on the bonding pad of the substrate; each conductive particle comprises a metal conductive ball and a conductive adhesive coating the surface of the metal conductive ball; an LED chip is attached to the substrate in a counterpoint mode, and a bonding pad on the LED chip makes contact with the corresponding conductive particles; hot-pressing the LED chip, melting the conductive adhesive through heat conduction, and fixing the LED chip on the substrate through the conductive adhesive after cooling; and coating a plastic packaging material on the substrate to wrap the LED chip, and curing to complete packaging of the LED chip. According to the technical scheme, the LED chip packaging process can be simpler, more convenient and faster, stable mechanical connection and excellent electrical connection between the LED chip and the substrate can be achieved, and the problem of chip damage caused by too high temperature is effectively avoided.

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention discloses a semi-dry method electrode and a preparation method thereof. The semi-dry method electrode preparation method is different from the existing wet method and dry method electrode preparation technology, on one hand, the atomized and dispersed conductive glue solution is formed by mixing the binder and the conductive agent and then atomizing and dispersing the mixture, and on the other hand, the electrode material is dispersed into suspended particles in the gas-phase medium; and then carrying out solid-liquid mixing and sedimentation on the obtained atomized and dispersed conductive adhesive solution and suspended particles to form an aggregate, collecting the obtained aggregate, spreading and compounding on a current collector, and drying. In the process of carrying out solid-liquid mixing and sedimentation on the conductive glue solution and the suspended particles to form the aggregate, as the binder can be in full contact with and coats the surface of the active material, a better bonding effect can be realized, the usage amount of a solvent and the binder is reduced while the bonding effect is ensured, less solvation is realized, and the service life of the conductive glue solution is prolonged. The energy consumption is low, the pole piece mechanical strength is higher, the loading capacity is higher, the active material structure is not damaged, and the advantages of a wet method and a dry method are achieved.

The invention belongs to the technical field of wafer polishing, and discloses a silicon carbide wafer electrochemical mechanical polishing device and a silicon carbide wafer electrochemical mechanical polishing process. The polishing head is provided with an electric brush, a metal ring, a copper spring and a copper column and is connected with a power supply anode through a wire; through holes are punched in the surface of the polishing pad, and the silicon carbide wafer adheres to the surface of the copper cylinder through conductive glue. In the rough polishing stage, hard abrasive particles are used for polishing under high potential, and surface scratches and deep damage are rapidly removed; and in the fine polishing stage, soft abrasive particles are used, potential is gradually reduced for polishing, shallow layer damage is removed, and the smooth and defect-free silicon carbide wafer is obtained. According to the electrochemical mechanical polishing device and process for the silicon carbide wafer, the silicon carbide slice can be rapidly machined into a smooth and defect-free surface within a short time, the polishing process of the silicon carbide is simplified, meanwhile, edge breakage and serious scratches generated by grinding are avoided, and the machining time and cost needed in the manufacturing process of the silicon carbide wafer are reduced.

The invention relates to the technical field of LED display, and discloses a welding method of an LED chip of a Mini / Micro LED. The welding method comprises the steps that a provided hydrophobic nano steel mesh with a plurality of steel holes is placed on a provided substrate with a plurality of bonding pads and aligned, so that each steel hole is aligned with each bonding pad correspondingly; adding the provided anisotropic conductive adhesive to the hydrophobic nano steel mesh, and uniformly blade-coating the anisotropic conductive adhesive on the hydrophobic nano steel mesh, so that the anisotropic conductive adhesive is printed on the bonding pad; stripping the hydrophobic nano steel mesh; mounting the provided LED chip on the anisotropic conductive adhesive on the bonding pad; and heating and pressurizing the LED chip positioned on the anisotropic conductive adhesive, so that the insulating film is longitudinally broken to expose the metal conductive particle balls wrapped in the insulating film, the metal conductive particle balls are respectively in contact with the LED chip and the bonding pad to form a vertical conductive path, and the insulating adhesive is preliminarily cured, so that the LED chip is welded on the substrate. The welding quality is stable, the maintenance difficulty is small, and the maintenance cost is low.

The invention relates to the technical field of semiconductor chip mounting equipment, in particular to a solder paste printing mechanism applied to a semiconductor die bonder and clamping and welding equipment, which comprises a jacking assembly, and the jacking assembly is responsible for jacking a lead frame to a certain height from a chip passing track mechanism; the printing assembly is responsible for completing the solder paste printing action on the jacked lead frame; through cooperation of the jacking assembly and the printing assembly, the jacking assembly is responsible for jacking the lead frame to a certain height from the inside of the sheet passing track mechanism, the printing assembly is responsible for completing the solder paste printing action on the jacked lead frame, and after the printing is completed, the lead frame is printed on the sheet passing track mechanism. The lead frame is lowered into the sheet passing track through the jacking assembly and is clamped and conveyed to the next working procedure through the clamping jaw, the precision of UPH and tin paste points on the lead frame is effectively improved, meanwhile, the device can be used for tin paste printing and can also be used for printing of conductive adhesive or silver paste, and the universality of the device is improved.

A display panel is provided, which is capable of removing a Greenish phenomenon by preventing a shift phenomenon arising inside a panel layer by improving conductivity of a component disposed at an upper portion of the panel layer. The display panel can include a cover window, the panel layer disposed below the cover window, and a support member disposed below the panel layer.

The invention discloses a high-bonding-strength conductive adhesive and a preparation method and application thereof.The preparation method comprises the following steps that S1, epoxy resin E51 is placed in a three-neck flask, acetone is added, stirring is conducted till the epoxy resin E51 is completely dissolved, and ethidene diamine is slowly dropwise added; s2, under the protection of nitrogen, heating to 70-80 DEG C, adding a catalyst triphenylphosphine, carrying out a constant-temperature reaction, after the reaction is completed, cooling to 35-45 DEG C, adding deionized water, and stirring; s3, acetone and unreacted ethylenediamine are removed, then deionized water is used for washing, an obtained product is placed in a vacuum drying oven to be dried, and amino modified epoxy resin of faint yellow viscous liquid is obtained; s4, mixing the amino modified epoxy resin with an anhydride curing agent, a conductive filler, a diluent and a coupling agent; and S5, fully stirring the mixture, carrying out vacuum defoaming, and uniformly stirring to obtain the conductive adhesive. According to the invention, the shearing strength of the chip and the copper bracket can be improved to more than 30MPa.

The invention discloses a high-performance conductive adhesive doped with conductive nanoparticles, and belongs to the technical field of conductive adhesives. The high-performance conductive adhesive provided by the invention is prepared from the following raw materials in parts by weight: 50 to 100 parts of vinyl liquid silicone rubber, 100 to 400 parts of modified silver coated copper powder, 1 to 10 parts of nano silver powder I, 1 to 10 parts of epoxy silane modified prepolymer, 3 to 30 parts of hydrogen-containing silicone oil, 0.1 to 5 parts of platinum catalyst and 0.05 to 1 part of inhibitor. The silver-coated copper powder and the epoxy silane are modified, so that the conductivity and the binding power of the conductive adhesive are greatly improved, and the epoxy silane modified prepolymer can form strong covalent bond combination with the surface of an adhered object through a high-density epoxy group of the epoxy silane modified prepolymer; the nano-silver bulges on the surface of the modified silver coated copper powder increase the effective contact area and the number of contact points among the conductive filler particles, so that the conductive adhesive has the characteristics of high conductivity, low resistance, high adhesive strength and strong toughness.