1497 results about "Electrically conductive adhesive" patented technology

The invention relates to the technical field of cross-linked polyethylene cables, in particular to a mining cross-linked polyethylene insulated armored self-repairing cable and a manufacturing method thereof.The mining cross-linked polyethylene insulated armored self-repairing cable comprises a center conductor unit, a cross-linked polyethylene insulating layer, a shielding layer and an armored layer sequentially wrap the outer side of the center conductor unit from inside to outside, and an outer sheath layer is extruded on the outer side of the armored layer; the shielding layer comprises a semi-conductive shielding layer wrapping the outer side of the cross-linked polyethylene insulating layer, and the outer side of the semi-conductive shielding layer is wrapped with a copper strip shielding layer. By arranging the composite conductor structure in the central conductor unit and cooperating with the graphene heat dissipation filaments and the paraffin heat absorption and heat dissipation layer, the heat dissipation performance of the cable is improved, the temperature of the cable during operation is effectively reduced, faults caused by overheating are reduced, and the service life of the cable is prolonged; the armor layer and the copper strip shielding layer realize multipoint equipotential grounding through a sectional conductive adhesive tape, electromagnetic interference can be effectively shielded, and fault current diffusion is limited.

The invention provides a vertical structure ultraviolet photoelectric detector and a preparation method thereof. The ultraviolet photoelectric detector is of a vertical structure, the design facilitates light absorption of the ultraviolet photoelectric detector, the light utilization rate of the ultraviolet photoelectric detector is improved, and compared with a horizontal structure, the transmission distance is shortened, and the cost is low; the ultraviolet photoelectric detector provided by the invention has a relatively high switching ratio of light and dark current and relatively small dark current, and also has a very high response speed under the condition of keeping the switching ratio of light and dark current and the dark current; a PN junction is formed between the nickel oxide hole transport layer and the beta-phase gallium oxide single crystal, so that the ultraviolet photoelectric detector has self-driving performance; in the manufacturing process, the substrate is used as a supporting frame, and the extraction electrode is packaged in one step through the conductive adhesive tape, so that 3-5 photoetching steps of a traditional horizontal structure are omitted, the process is simplified, and the process manufacturing is simpler.

The invention discloses a method for measuring the particle size of metal powder by using a scanning electron microscope, which comprises the following steps: step 1, sample treatment: adhering a small conductive adhesive tape on a sample table, sprinkling metal powder on the adhered conductive adhesive tape, and purging to obtain the conductive adhesive tape adhered with the metal powder; step 2, parameter setting: setting acceleration voltage, working distance, diaphragm, image contrast, brightness, magnification times and scanning speed of a scanning electron microscope to observe the conductive adhesive tape adhered with the metal powder obtained in the step 1 to obtain an electronic image of metal powder particles; and processing and calculating the electronic image of the metal powder particles by using software to obtain the average particle size of the metal powder particles. According to the method disclosed by the invention, a solvent is not needed to disperse the sample, pollution of the solvent to the sample is effectively avoided, and the result is more accurate than that of directly measuring the particle size by using length software.

The invention relates to a high-thermal-conductivity epoxy resin conductive adhesive containing a composite conductive filler and a preparation method of the high-thermal-conductivity epoxy resin conductive adhesive. The high-thermal-conductivity epoxy resin conductive adhesive containing the composite conductive filler comprises 6-16% of graphene oxide modified epoxy resin, 0.6-3% of a curing agent, 0-1% of a curing accelerator, 2-7% of epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes, 3-7% of carbon fibers, 3-7% of nano silver powder, 40-70% of micron silver powder, 5.0-15.0% of a surface treating agent, 0.3-2.7% of a coupling agent, 0.5-1.5% of a dispersing agent, 0.1-0.3% of an antioxidant and 0.1-0.3% of a lubricant. 0.5% and the balance of a solvent. The graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes are utilized to improve the dispersion stability of the filler, the modified single-layer / multi-layer carbon nanotubes are adopted as a short-range conductive additive, the carbon fibers are adopted as a long-range conductive additive, and the graphene oxide modified epoxy resin and the epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes and the carbon fibers cooperate to improve the conductivity. The conductive adhesive disclosed by the invention is high in heat conductivity, low in volume resistivity and high in tensile strength and bending strength, and has a wide application prospect in the fields of automotive electronics, wind power photovoltaics, LEDs (Light Emitting Diode), LCDs (Liquid Crystal Display) and the like.

The present invention discloses a low-temperature conductive adhesive, which is prepared by weight using raw materials including 70-80 parts of silver powder, 20-30 parts of resin matrix, 1-10 parts of curing agent, 0.1-0.5 parts of silane coupling agent, 0.1-0.5 parts of stabilizer, and 0.1-0.5 parts of metal salt. The present invention introduces an organic metal salt into the resin matrix to reduce the contact resistance of the colloid, and after wet heat aging, maintains a lower contact resistance increase rate. The present invention adopts a combination of epoxy resin, acrylate and modified epoxy acrylic resin, and the weight of epoxy resin and acrylate is less than or equal to the weight of modified epoxy acrylic resin, so that low-temperature curing can be achieved. The present invention can achieve 60-80 ° C, 20-40 min curing, and the conductive adhesive elongation at break obtained can reach more than 8%, and before and after wet heat aging, there is a more stable and relatively small contact resistance, which is particularly suitable for the electronic field with high requirements for contact resistance.

The invention belongs to the technical field of conductive adhesives, and particularly relates to a salt-fog-resistant waterborne conductive adhesive and a preparation method thereof.The salt-fog-resistant waterborne conductive adhesive is mainly prepared from, by weight, 5-10 parts of salt-fog-resistant waterborne polyurethane; 5 to 10 parts of water-based tackifying resin; 30 to 50 parts of conductive silver powder; 10 to 20 parts of ethanol; 2-10 parts of an anti-hydrolysis agent; and 10-30 parts of deionized water. According to the salt-fog-resistant aqueous conductive adhesive, polyurethane resin with polytetrahydrofuran alcohol and polycaprolactone polyol as main structures is used as matrix resin, a system is endowed with excellent water resistance and salt-fog resistance, the salt-fog-resistant aqueous conductive adhesive shows outstanding hydrolysis-resistant stability after being cured, and the salt-fog-resistant aqueous conductive adhesive and the conductive silver powder have a synergistic effect, so that the anti-settling performance is effectively improved.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The application belongs to the technical field of conductive glue, and particularly relates to a conductive glue, a preparation method and application thereof, wherein the conductive glue is made of the following raw materials in parts by weight: 40-60 parts of synthetic acrylic resin, 5-15 parts of epoxy resin, 25-45 parts of conductive filler, 5-15 parts of latent curing aid, 80-120 parts of diluent and 5-8 parts of auxiliary agent. By adding the latent curing aid, the application can reduce the potential possibility of the reaction of the acrylic resin and the epoxy resin at room temperature, thereby improving the storage effect of the conductive glue, improving the overall performance of the electronic product and meeting different application scenarios with different requirements. The preparation method directly mixes the raw materials such as the acrylic resin, the epoxy resin, the conductive filler, the auxiliary agent, the diluent and the latent curing aid uniformly in the preparation process without the need of separation and storage, thereby reducing the production cost, simplifying the use process of the user, improving the production efficiency of the conductive glue and the product quality.

The invention discloses a high-dispersion graphene conductive adhesive solution for a battery and a preparation method of the high-dispersion graphene conductive adhesive solution, and belongs to the technical field of conductive adhesive solutions. The high-dispersion graphene conductive adhesive solution for the battery prepared by the invention is prepared from the following raw material components in parts by mass: 6 to 8 parts of high-dispersion graphene, 4.5 to 13.5 parts of an adhesive and 60 to 90 parts of a solvent, the preparation method comprises the following steps: ultrasonically dispersing graphene in a mixed solution of hexadecyl triyl ammonium bromide and deionized water, sequentially adding hexadecyl triyl ammonium bromide, sodium molybdate dehydrate, bismuth nitrate pentahydrate and cerium nitrate hexahydrate, uniformly stirring and dispersing, performing hydrothermal reaction, washing, drying, grinding and sieving to obtain the high-dispersion graphene. The adhesive is prepared from an amphiphilic polyethylene glycol-polycaprolactone block copolymer and amphiphilic polyacrylate.

The present invention proposes a sputtering cleaning system and cleaning method for the inner wall of the ionization chamber of a radio frequency ion thruster. The system is composed of a gas distributor, a potential control line, a radio frequency coil, an ionization chamber, a screen grid, an acceleration grid, a positive DC voltage source, a radio frequency power supply, a negative DC voltage source and a conductive tape. The method includes: 1. The radio frequency ion thruster is started, and plasma is formed in the ionization chamber; 2. A positive voltage is applied to the screen grid, and ions are drawn out by the grid system, and the thruster enters a working state; 3. When the conductive film is thicker and the power input is weakened, the positive DC power supply is turned off, and no ions are drawn out of the thruster; 4. The negative DC power supply is turned on, and a negative voltage is slowly applied to the potential control line to increase the energy of ions hitting the inner wall of the ionization chamber; 5. The conductive film on the inner wall of the ionization chamber is bombarded by ions, and particles are sputtered out. The particles are neutral and are discharged from the ionization chamber under the action of the neutral particle flow, thereby achieving cleaning of the inner wall of the ionization chamber.

Improvements in the technical field of solar panel (2) manufacturing are provided. To this effect, a process for manufacturing solar panels (2) is disclosed in which rows (4) of solar elements (3) are bonded together by an electrically conductive adhesive, with the electrically conductive adhesive being applied to the solar elements (3) during a transfer movement of the rows (4) of solar elements (3).

The invention belongs to the technical field of solid-state batteries, and relates to a preparation method of sulfide all-solid-state battery positive electrode slurry. The preparation method comprises the following steps: (1) dividing a conductive adhesive into three parts, mixing the first part of conductive adhesive with a positive active material, and granulating; (2) adding a second part of conductive adhesive into the granulated slurry, and kneading; (3) adding sulfide electrolyte slurry into the kneaded slurry, and dispersing; and (4) adding a third part of conductive adhesive into the dispersed slurry, and dispersing again to obtain the positive electrode slurry, wherein based on the total mass of the conductive adhesive, the mass percent of the first part of conductive adhesive is 20-30%, the mass percent of the second part of conductive adhesive is 30-40%, and the mass percent of the third part of conductive adhesive is 40-50%. The sulfide all-solid-state battery positive electrode slurry prepared by the preparation method provided by the invention has obviously higher solid content, obviously lower fineness and better stability.

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.

The invention discloses a preparation method and application of circumferentially limited supercritical foaming self-packaging TENG, and the preparation method comprises the following steps: uniformly mixing a PDMS precursor and a curing agent, pouring the mixture into a mold, and putting the mold into a vacuum oven for curing to obtain a PDMS film; adhering the PDMS film to the middle position of the PI film through a double-sided nickel conductive adhesive tape, then putting the PDMS film into a mold, putting a thermoplastic elastomer on the upper layer, and performing hot pressing by using a vacuum auxiliary hot press to obtain a prefabricated sample; putting the prefabricated sample into a supercritical foaming reaction kettle, controlling the temperature to 70-130 DEG C, injecting supercritical fluid into the foaming reaction kettle, after the prefabricated sample and the supercritical fluid form a saturated and stable blending system, maintaining for 0.8-1.5 hours, taking out the blended system, and naturally cooling to room temperature, so as to obtain the TENG. The preparation method has the beneficial effects that the self-assembled and self-packaged TENG with the bionic dome structure is successfully prepared through cooperation of a supercritical fluid technology and a limited foaming strategy, and the technical scheme of the self-assembled and self-packaged TENG obtains breakthrough progress in the aspects of the preparation process, the structural design and the environmental adaptability.

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention discloses a semi-dry method electrode and a preparation method thereof. The semi-dry method electrode preparation method is different from the existing wet method and dry method electrode preparation technology, on one hand, the atomized and dispersed conductive glue solution is formed by mixing the binder and the conductive agent and then atomizing and dispersing the mixture, and on the other hand, the electrode material is dispersed into suspended particles in the gas-phase medium; and then carrying out solid-liquid mixing and sedimentation on the obtained atomized and dispersed conductive adhesive solution and suspended particles to form an aggregate, collecting the obtained aggregate, spreading and compounding on a current collector, and drying. In the process of carrying out solid-liquid mixing and sedimentation on the conductive glue solution and the suspended particles to form the aggregate, as the binder can be in full contact with and coats the surface of the active material, a better bonding effect can be realized, the usage amount of a solvent and the binder is reduced while the bonding effect is ensured, less solvation is realized, and the service life of the conductive glue solution is prolonged. The energy consumption is low, the pole piece mechanical strength is higher, the loading capacity is higher, the active material structure is not damaged, and the advantages of a wet method and a dry method are achieved.

The invention belongs to the technical field of wafer polishing, and discloses a silicon carbide wafer electrochemical mechanical polishing device and a silicon carbide wafer electrochemical mechanical polishing process. The polishing head is provided with an electric brush, a metal ring, a copper spring and a copper column and is connected with a power supply anode through a wire; through holes are punched in the surface of the polishing pad, and the silicon carbide wafer adheres to the surface of the copper cylinder through conductive glue. In the rough polishing stage, hard abrasive particles are used for polishing under high potential, and surface scratches and deep damage are rapidly removed; and in the fine polishing stage, soft abrasive particles are used, potential is gradually reduced for polishing, shallow layer damage is removed, and the smooth and defect-free silicon carbide wafer is obtained. According to the electrochemical mechanical polishing device and process for the silicon carbide wafer, the silicon carbide slice can be rapidly machined into a smooth and defect-free surface within a short time, the polishing process of the silicon carbide is simplified, meanwhile, edge breakage and serious scratches generated by grinding are avoided, and the machining time and cost needed in the manufacturing process of the silicon carbide wafer are reduced.

A display panel is provided, which is capable of removing a Greenish phenomenon by preventing a shift phenomenon arising inside a panel layer by improving conductivity of a component disposed at an upper portion of the panel layer. The display panel can include a cover window, the panel layer disposed below the cover window, and a support member disposed below the panel layer.

The invention discloses a high-bonding-strength conductive adhesive and a preparation method and application thereof.The preparation method comprises the following steps that S1, epoxy resin E51 is placed in a three-neck flask, acetone is added, stirring is conducted till the epoxy resin E51 is completely dissolved, and ethidene diamine is slowly dropwise added; s2, under the protection of nitrogen, heating to 70-80 DEG C, adding a catalyst triphenylphosphine, carrying out a constant-temperature reaction, after the reaction is completed, cooling to 35-45 DEG C, adding deionized water, and stirring; s3, acetone and unreacted ethylenediamine are removed, then deionized water is used for washing, an obtained product is placed in a vacuum drying oven to be dried, and amino modified epoxy resin of faint yellow viscous liquid is obtained; s4, mixing the amino modified epoxy resin with an anhydride curing agent, a conductive filler, a diluent and a coupling agent; and S5, fully stirring the mixture, carrying out vacuum defoaming, and uniformly stirring to obtain the conductive adhesive. According to the invention, the shearing strength of the chip and the copper bracket can be improved to more than 30MPa.

The invention discloses a high-performance conductive adhesive doped with conductive nanoparticles, and belongs to the technical field of conductive adhesives. The high-performance conductive adhesive provided by the invention is prepared from the following raw materials in parts by weight: 50 to 100 parts of vinyl liquid silicone rubber, 100 to 400 parts of modified silver coated copper powder, 1 to 10 parts of nano silver powder I, 1 to 10 parts of epoxy silane modified prepolymer, 3 to 30 parts of hydrogen-containing silicone oil, 0.1 to 5 parts of platinum catalyst and 0.05 to 1 part of inhibitor. The silver-coated copper powder and the epoxy silane are modified, so that the conductivity and the binding power of the conductive adhesive are greatly improved, and the epoxy silane modified prepolymer can form strong covalent bond combination with the surface of an adhered object through a high-density epoxy group of the epoxy silane modified prepolymer; the nano-silver bulges on the surface of the modified silver coated copper powder increase the effective contact area and the number of contact points among the conductive filler particles, so that the conductive adhesive has the characteristics of high conductivity, low resistance, high adhesive strength and strong toughness.

The invention belongs to the technical field of angle sensors, and particularly relates to a tilt angle sensor and a preparation method and application thereof. The tilt angle sensor provided by the invention comprises a base body and a micro-channel communicated with any two points in the base body, the micro-channel is filled with gallium-based alloy liquid, the surface of the micro-channel contains a plurality of bulges, and the average height of the bulges is 50-200 microns; the two ends of the micro-channel are sealed by conductive adhesive; the conductive adhesive is connected with the electrode; the matrix is prepared from polydimethylsiloxane. The micro-channel containing the micron-sized bulge structure is arranged in the base body, so that local capillary force gradient can be generated, and the body response speed of the gallium-based alloy liquid is accelerated; and meanwhile, the special structure of the micro-channel has directional textures, so that asymmetric flow resistance and multi-path conductive paths can be generated, and differential resistance changes are generated during inclination to realize multi-directional inclination angle detection. The detection sensitivity and the anti-noise capability of the tilt angle sensor are remarkably improved by inducing a nonlinear flow control effect through the bulges in the micro-channel.

The invention provides a capacitor electrode plate, a preparation method thereof and a capacitor using the capacitor electrode plate. The capacitor electrode plate comprises an electrode active material layer and a conductive adhesive layer compounded with the electrode active material layer. The capacitor electrode plate has good conductivity and mechanical properties, and can improve the energy density and cycling stability of a capacitor using the capacitor electrode plate.

The invention relates to the technical field of photovoltaic cells, in particular to a back contact photovoltaic module, a glue printing screen printing plate and a back contact solar laminated module. The back contact photovoltaic module at least comprises two stacked and connected battery pieces, and the adjacent stacked battery pieces are electrically connected through a conductive adhesive. And in two adjacent stacked battery pieces, the positive current output part of one battery piece is connected with one end of the conductive adhesive, and the negative current output part of the other battery piece is connected with the other end of the conductive adhesive. In the thickness direction of the back contact photovoltaic module, the conductive adhesive covers part of the surfaces of the two adjacent stacked battery pieces, and the bottom of the conductive adhesive is in a step shape. The two adjacent stacked battery pieces are electrically connected through the conductive adhesive, and the conductive adhesive can be printed at a time through the adhesive printing screen printing plate, so that the production efficiency and the yield of the imbricate structure formed by the two adjacent battery pieces are improved, and the production cost is reduced. The conductive adhesive has softness and good adhesion, and can be tightly attached to two adjacent stacked battery pieces.

According to the manufacturing method, through a Roll to Roll continuous production mode, traditional 19 procedures are reduced to 12 procedures, the production speed is increased to 5 m / min, the dielectric constant of a composite PI film doped with nanometer aluminum oxide is smaller than or equal to 3.2 and is reduced by 15% compared with that of a traditional PI film, a micro-arc oxidation insulating layer of copper / magnesium alloy foil is combined, the signal loss of the antenna in the frequency band of 28-300 GHz is reduced by 30%, and the antenna performance is improved. The sheet resistance of the graphene / silver nanowire composite conductive adhesive is smaller than or equal to 0.1 omega / sq, the bending life is larger than or equal to 100,000 times, the performance is improved by 10 times compared with that of traditional silver paste, the long-term dynamic use requirement of wearable equipment is met, no chemical etching liquid is used in the whole process, waste is subjected to magnetic separation and low-temperature pyrolysis, waste discharge is reduced by 90% compared with a traditional process, and the graphene / silver nanowire composite conductive adhesive is environmentally friendly. The carbon-based particles generated through pyrolysis meet the RoHS standard and can be directly used for 3D printing consumables, the antenna produced through the method can adapt to the leading-edge fields of 6G base stations, flexible intelligent watches, implantable medical sensors and the like, and the technology of the Internet of Things and high-frequency communication is promoted.

The invention provides a composite photo-initiation system electronic adhesive as well as a preparation method and application thereof, and relates to the technical field of anisotropic conductive adhesive films. The adhesive comprises a thermoplastic resin solution, an acrylate monomer, epoxy resin, a polyfunctional oligomer solution containing a carbon-carbon double bond and an epoxy group, an insulating inorganic filler, conductive particles and a composite photoinitiator solution, wherein the composite photoinitiator is composed of a free radical photoinitiator and a cationic photoinitiator, and acrylate free radical chain polymerization and epoxy resin cationic ring opening polymerization are synchronously triggered through ultraviolet light; and the polyfunctional oligomer is used as a molecular bridge to bond the two-phase curing network to form an interpenetrating cross-linked structure. The electronic adhesive provided by the invention realizes low-temperature rapid curing for 1-15 seconds, the curing shrinkage rate is reduced to below 1%, the reliability defect caused by oxygen inhibition, high shrinkage rate and phase separation of a traditional single system is solved, and the electronic adhesive is suitable for low-temperature efficient packaging of high-precision electronic components.

The invention discloses conductive nickel powder, a preparation method and an electronic product, relates to the technical field of conductive materials, and aims to improve the conductivity of nickel powder while giving consideration to the electromagnetic shielding function of the conductive nickel powder. According to the preparation method, the nickel powder coating the surface of the carbon nano tube is prepared, so that the prepared nickel powder is easier to break through the infiltration phenomenon, and in order to further improve the application performance of the conductive nickel powder, a polyaniline chain segment introduced with a camphorsulfonic acid structure is further prepared and formed on the surface of the nickel powder; the conductivity of a polyaniline structure is improved, the surface polarity of the nickel powder is improved, and the compatibility with resin is improved; finally, the conductive nickel powder can have high dispersity and high compatibility while having high conductivity in the conductive adhesive, and the use performance of the conductive nickel powder is improved.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention provides an all-solid-state thin film lithium ion battery and a preparation method thereof, a high-insulativity and low-roughness material is used as an insulating substrate layer, and a positive electrode current collector layer, a positive electrode layer, a solid electrolyte layer, a negative electrode layer, a negative electrode current collector layer and an insulating packaging layer are sequentially deposited on the deposited insulating substrate layer from bottom to top through a patterning method. The electrochemical impedance of the battery is reduced as much as possible in structural design, and the performance of the battery can be fully exerted; secondly, the battery is packaged by adopting a graphical scheme, so that a relatively good packaging effect can be ensured, and the battery can stably run for a long time; meanwhile, an appropriate electrode leading-out scheme is adopted, the positive electrode current collector and the negative electrode current collector extend to the substrate, various electrode leading-out methods such as high-temperature welding or leading-out through a conductive adhesive tape are compatible, the risk of battery damage is avoided, and the packaging effect is not affected.

Disclosed are a stretchable microneedle adhesive patch (SNAP) capable of performing high-quality electrophysiological (EP) signal measurement without skin preparation, such as exfoliating the skin or removing sweat, a SNAP system, and an operating method thereof. The disclosed SNAP capable of performing skin preparation-free high-quality EP signal measurement includes an electrically conductive adhesive (ECA) layer configured to attach to a user's skin to obtain an EP signal regardless of the user's skin condition; a microneedle sensor including a microneedle array configured to penetrate the stratum corneum by passing through the ECA layer and to directly contact the skin epidermis of the user; and conductive wire-based stretchable interconnects having a serpentine structure that is electrically and mechanically connected to the microneedle sensor to dynamically adapt to skin deformation of the user.

The invention discloses a near-infrared light cured conductive adhesive and a preparation method thereof, and belongs to the field of micro-nano electronic packaging and semiconductor materials. The problems that an existing conductive adhesive is high in curing temperature, long in curing time and poor in curing effect are solved. Silver-coated copper powder and silver nanowires serve as conductive filler and are mixed with epoxy acrylate resin, a reactive diluent, a photoinitiator, a thermal initiator, a defoaming agent and a flatting agent, grinding, defoaming and near-infrared light curing are conducted, and the conductive adhesive is obtained. The thermal initiator and the photoinitiator are combined, the near-infrared light is adopted for irradiation, the high-energy density of the near-infrared light directly permeates into the conductive adhesive film layer, the conductive adhesive film layer is heated at the same time and is not absorbed by the substrate, rapid curing of the conductive adhesive can be achieved, and when the radiation power is 120-300 W, the radiation time is 30-600 s and the irradiation frequency is 1-10 times, the conductive adhesive can be rapidly cured. And the cured conductive adhesive is low in volume resistance and high in bonding strength.